用于手术剪的超高频无源小型化RFID标签天线设计

为了加强对医疗器械的跟踪管理,尤其是对手术前后手术剪数量的有效监测,设计了一款可应用于手术剪的超高频(UHF)无源小型化射频识别(RFID)标签天线。该标签天线采用集总元件加载技术以及短路技术方法实现了天线的小型化设计。通过对电容容值以及天线结构尺寸的调整,可实现对标签天线谐振频率以及标签天线特性阻抗的调节。标签天线结构参数经仿真优化,最终设计尺寸为6 mm×3 mm×1 mm。标签嵌入手术剪中的最大读取距离为1.2 m。根据仿真结果对天线加工并对实物进行测试,测试结果与仿真结果吻合较好。     

小型化低剖面UHF RFID抗金属标签天线设计

针对超高频抗金属射频识别(RFID)标签的小型化和低剖面需求,提出了一种可用于金属表面的超高频RFID标签天线,其尺寸为50 mm×20 mm×0.9 mm。该设计采用CST MWS软件进行建模仿真,分析了嵌入式馈电结构尺寸变化和矩形开槽尺寸变化对标签天线输入阻抗的影响,并调整相应参数以达到标签天线输入阻抗与芯片阻抗的共轭匹配。实测结果表明,标签天线输入阻抗与芯片阻抗匹配良好,在910 MHz处有最大实测阅读距离为4.3 m,且具有小尺寸和低剖面,可应用于物流、医疗、零售等多种领域的金属场景。     

一种用于机载氧气瓶的小型化超高频抗金属RFID标签设计

为辅助民用飞机机载设备管理,跟踪管理飞机的关键零部件,针对普通标签无法在机载氧气瓶上工作的问题,设计了一种小型化的抗金属标签天线。首先,基于短路短截线馈电结构设计了一种抗金属标签,实现了天线与标签之间的阻抗匹配;其次,通过仿真优化,将天线放置在200 mm×200 mm金属环境下仿真,得到回波损耗小于-10 dB带宽为范围为750～970 MHz(220 MHz),仿真结果表明标签天线有在金属环境下能够完全覆盖标准工作频段902～928 MHz。天线的最终尺寸为42.7 mm×16 mm×2 mm。仿真距离为3.7 m,满足飞机机载环境使用条件、符合低成本、宽频带的设计要求。     

超薄高增益UHF 抗金属标签天线设计

设计了一款超薄的高增益UHF抗金属标签天线。标签天线以高介电常数的陶瓷为介质基板,由上层带有双T 型槽缝的金属贴片、介质基板和下层金属贴片组成,天线平面尺寸为80 mm×40 mm,厚度仅为0.8 mm。天线结构简单,不需要短路通孔、短路销钉或短路贴片将天线上层贴片与地板相连,通过改变天线上层贴片T 型槽缝的尺寸,可以对标签天线阻抗进行有效调节,并实现天线的低剖面。天线未加金属地板最大增益为3.4 dBi,加载金属地板最大增益为6.9 dBi,且加载金属地板前后天线的中心频率和阻抗带宽无明显变化。实际测试结果与仿真结果比较吻合,实测未加载金属地板状态下最大识别距离为4.5m,加载金属地板状态下实测最大识别距离为6.8 m。     

一种小型UHF RFID抗金属标签天线的设计

针对射频识别标签天线小型化、抗金属环境的实际需求,提出了一种可应用于金属环境的超高频射频识别标签天线.通过在矩形贴片上开槽来实现小型化,天线总尺寸为56 mm×50 mm×1.6 mm.通过改变槽的尺寸调节标签天线的输入阻抗,结合等效电路图分析抗金属标签天线的设计过程,从而方便地实现与标签芯片的共轭匹配.实验结果表明,实测和仿真结果比较吻合,标签阻抗匹配良好,实测最大读取距离达3.1m.与其他标签天线相比,该天线具有结构简单、成本低、易于实现和读取距离远等优势.     

一种紧凑的UHF RFID抗金属标签天线的分析和设计

提出了一种可应用于金属环境的超高频射频识别标签天线。通过在圆盘贴片上开槽来实现小型化,天线总尺寸为76 mm′76 mm′3.2 mm。设计的天线采用单层结构的FR4 基板,天线结构简单并不需要过孔及销钉。通过改变槽的尺寸可以有效地调节标签天线的输入阻抗,从而方便地实现与标签芯片的共轭匹配。实验结果表明:实测和仿真结果比较吻合,标签阻抗匹配良好,实测最大读取距离达6.8 m。与其他标签天线相比,该天线具有结构简单、成本低、易于实现和读取距离远等优势。     

可贴敷于人体的RFID 标签天线设计

设计了一款可贴敷于人体的超高频(UHF)射频识别(RFID)标签天线,该天线由矩形辐射单元、环形 馈电和匹配网络组成,其总体尺寸为54. 3 mm×40 mm×0. 8 mm。分析了人体不同部位、天线与人体间距以及天线自 身结构变化对天线辐射性能的影响。通过调节环形馈电和匹配网络尺寸可以实现天线与芯片之间的阻抗共轭匹 配。样品测试结果与仿真结果比较吻合,当标签天线贴敷在人体背部时,实际测量的最大读取距离可达4. 9 m。     

小型化UHF弯折偶极子抗金属RFID标签天线的设计

设计了一款可用于金属物体的超高频(UHF)射频识别(RFID)标签天线,该天线采用弯折偶极子的形式,辐射单元位于厚度仅0.508mm的Rogers 5880基片上,并且在馈电点两边使用两个对称的短路探针来达到小型化的目的。通过调整短路探针的位置和半径可以获得不同的频率响应。通过加工测试获得的该天线的数据与设计仿真结果比较符合,并且对该天线的用于非金属物体和金属物体时的阅读距离等参数作了实际测试。     

共面波导馈电的电小缝隙天线的设计

提出了一个共面波导馈电的电小缝隙天线，天线包括两个相同的终端短路的槽线缝隙辐射面及加载在馈线中间导带上的阻抗匹配网络，所述的阻抗匹配电路由终端开路的共面波导和并联的两个终端短路的槽线组成，通过引入的阻抗匹配网络与缝隙辐射面，在谐振频率5.8ＧＨｚ下，天线的尺寸减小到 9.05ｍｍ×12.08ｍｍ×0.8ｍｍ(电长度为0.9)，采用电磁仿真软件HFSS对提出的结构进行了仿真。结果显示，S11<－10ｄＢ的带宽为9.3％，且测试结果与仿真结果相吻合。     

一种新型的hilbert分形rfid标签天线

随着射频识别技术研究的迅速发展,寻求具有尺寸缩减特性的天线结构成为RFID设计的实际需要,Hilbert分形结构是天线小型化设计的一种有效解决方案.本文论述了Hilbert分形天线的基本原理,对弯折偶极子天线采用Hilbea分形结构进行小型化设计,并对实物进行仿真.经测试与仿真后结果表明:标签天线尺寸约为25.6mm*16.2mm,工作在中心频率915MHz处,增益达到2.19dB,相对阻抗带宽为90MHz.天线能保持较好的工作性能,可应用于酒瓶盖防伪RFID标签中.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

A rigorous proof of MIMO channel capacity’s increase with antenna number

It is well known that adding more antennas at the transmitter or at the receiver may offer larger channel capacity in the multiple-input multiple-output（MIMO） communication systems. In this letter, a simple proof is presented for the fact that the channel capacity increases with an increase in the number of receiving antennas. The proof is based on the famous capacity formula of Foschini and Gans with matrix theory.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks