微细电化学加工技术

介绍了微软电化学加工的原理及特点，详细介绍了基于电化学扫描探针显微镜进行的电化学微细加工技术，EFAB制作技术、刻蚀剂层技术（GELT）、超微细电极电化学加工技术等几种目前主要的微细电化学加工技术。     

Investigation into fabrication of microslot arrays by electrochemical micromachining

Maskless electrochemical micromachining (EMM) is a prominent and unique surface texturing method to fabricate the arrays of microslots. This article investigates the generation of microslot arrays using maskless EMM method. The developed prototype maskless EMM setup consists of EMM cell, power supply connections, electrode holding devices and constricted vertical cross flow electrolyte system for the fabrication of microslot arrays economically. One textured cathode tool with SU-8 2150 mask is used to produce 22 microslot arrays. Influences of EMM process parameters including voltage, electrolyte concentration, inter electrode gap, flow rate and machining time on the machining performance that is, width overcut, depth and surface roughness (R_a) of microslot arrays are investigated. For lower width overcut, controlled depth, and lower surface roughness, machining with lower voltage, lower electrolyte concentration, lower inter electrode gap, higher flow rate and lower machining time are recommended. From the analysis, it is observed that the best machining conditions including inter electrode gap of 50?μm, applied voltage of 6 V, electrolyte concentration of 20?g L^?1, flow rate of 5.35 m³ hr^?1 and machining time of 1?min fabricate regular microslot array with mean width overcut of 24.321?μm, mean machining depth of 10.7?μm and mean surface roughness of 0.0101?μm.     

Development of micropin fabrication process using tool based micromachining

A micropin fabrication process has been developed based on micromachining technology. One group of micromachining technology is microturning. It has the capability to produce three dimensional features on the micro scale. This paper deals with the CNC microturning process. Basically two types of microturning processes are used: straight microturning and taper microturning. Experiments were performed using a programmable multi-purpose miniature machine tool developed for tool based micromachining. NC codes were generated using Borland C++ Builder 6.0. Brass bars of 6 mm diameter have been machined to fabricate the micropin with carbide cutting tools. Work materials were clamped on the spindle which has the facility of three-axis movements. Unlike the conventional processes, the cutting tool has no movement. A step cutting process was applied to eliminate workpiece deflection in the microturning process. Finally a micropin was fabricated with 2 mm length. The larger and smaller diameter of the pin are 475 μm and 276 μm, respectively.     

用体硅微加工工艺实现的微纳电械系统

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Micro—nano electromechanical system by bulk silicon micromachining

MEMS(Micro ElectroMechanical System)based on semiconductor microfabrication plays im-portant roles for example in the periphery of IT systems.N EMS(Nano Elect roMechanical Sys-tem)contains nano-scale structures.Sop histicated and high performance systems based on the MEMS and the NEMS have been developed.Packaging and elect rical interconnection play an important role in realizing practically applicable systems.     

基于准分子激光的微结构与微器件加工制作研究

介绍了准分子激光微加工的机理,设计并研制了步进控制的二维微动扫描台,建立了一种基于准分子激光的微加工装置,通过计算机控制扫描路径,可实现点、线、面等基本微结构以及组合型微结构、微器件的加工制作。利用该准分子激光微加工装置,进行了微结构和微器件的加工实验,成功加工制作出齿轮形微结构和微型无芯薄膜变压器件。准分子激光微加工装置具有加工效率高、加工切口平整、可实现各种形状的微结构与微器件的加工等特点,可望在微机电系统（MEMS）及微纳米技术领域得到广泛应用。     

体硅工艺静电致动微夹持器的试验研究

对一种梳状静电致动微夹持器的特性进行了测试.采用显微镜-CCD-微机测试方案,微夹持器的状态信息通过数据采集及图像处理获取,得到"电压-位移"特性曲线并建立了数学方程.对特性方程的分析表明理论设计与试验结果的一致性与合理性.并分析了从设计、加工到测试过程中引起理论设计与实际器件性能差异的主要因素,表明现有的微机械设计理论与加工水平存在一定的不足.由试验结果中获取了相关微机械器件的设计经验.     

Ultrafast laser micromachining of 3C-SiC thin films for MEMS device fabrication

Femtosecond pulsed laser (800 nm, 120 fs) micromachining of thin films of 3C-SiC (β-SiC) semiconductor deposited on silicon substrate was investigated as a function of pulse energy (0.5 μJ to 750 μJ). The purpose is to establish suitable laser parametric regime for the fabrication of high accuracy, high spatial resolution and thin diaphragms for high-temperature MEMS pressure sensor applications. Etch rate, ablation threshold and quality of micromachined features were evaluated. The governing ablation mechanisms, such as thermal vaporization, phase explosion, Coulomb explosion and photomechanical fragmentation, were correlated with the effects of pulse energy. The results show that the etch rate is higher and the ablation threshold is lower than those obtained with nanosecond pulsed excimer laser ablation, suggesting femtosecond laser’s potential for rapid manufacturing. In addition, the etch rates were substantially higher than those achievable in various reactive ion and electrochemical etching methods. Excellent quality of machined features with little collateral thermal damage was obtained in the pulse energy range (1–10 μJ). The leading material removal mechanisms under these conditions were photomechanical fragmentation, ultrafast melting and vaporization. At very low pulse energies (<1 μJ), nanoscale material removal has occurred with the formation of nanoparticles that is attributed to Coulomb explosion mechanism. The effect of assist gas on the process performance at low and high energy fluences is also presented.     

Modeling and fabrication of microhole by electrochemical micromachining using retracted tip tool

Accurate microhole is a key feature for many kinds of micro parts widely used in diverse industries. But machining of microhole using traditional processes faces great challenges due to the thermal-mechanical effects. Electrochemical micromachining (EMM) is a potential technique to meet the requirement of high-quality microhole fabrication. However, the currently-used microtools suffer from some drawbacks such as stray dissolution, bell-mouth entrance and excess radial overcut. To overcome these limitations, a novel microtool with retracted tip structure is proposed in this work. A mathematical model has been developed to investigate the effect of retracted tip depth on machining accuracy. And an empirical formula is obtained based on the model to predict the diameter of the generated microhole. Experimental verification is performed on a home-made EMM system and reveals good correlation with the theoretical predictions. Using this novel microtool with optimum retracted tip depth, high-quality microholes have been fabricated on aluminum and 304 stainless steel sheets.     

The fabrication and preservation of nanostructures on silicon wafers with a native oxide layer

This study used nano‐oxidation lithography to create oxidized circular nanostructures on a silicon wafer with a native oxide layer (NOL). We also investigated the impact of wet etching on the size of circular oxidized nanostructures and examined how the method and duration of preservation affect them. Experimental results show that the height and width of oxidized circular nanostructures increase proportionally with applied voltage. After wet etching, an increase in applied voltage resulted in a marked increase in the width of the circular nanostructures, a decrease in the inner diameter, and little variation in height. We further demonstrated that in a moist environment, the oxidation process continues, resulting in a further increase in height and width. During the initial stages of preservation, these changes occurred rapidly; however, the increase was negligible after 30 days. We propose the concept of reaction area (RA) ratio to explain the above phenomenon and provide evidence to support these claims. Our results led us to a simple and yet effective method of preserving oxidized circular nanostructures, called the electrostatic patch preservation (EPP) method, to overcome problems associated with changes in size occurring during the preservation of silicon nanostructure molds. SCANNING 34: 347–356, 2012. © 2012 Wiley Periodicals, Inc.     

基于体硅工艺的定位平台制作工艺分析研究

介绍了一种基于体硅工艺的大尺寸、大深宽比的纳米级定位平台的制作工艺。对定位平台的制作中的关键工艺进行的分析，总结了导致器件失效的主要原因，探讨了减少失效的方法。同时介绍了一种可行的面内侧面压阻的加工方法。通过对深度反应离子刻蚀（DRIE）工艺参数的调整成功了刻蚀出了大尺寸、大深宽比的结构释放窗口，释放了最小线宽为2.5μm，厚度为50微米的梳齿结构。研制了一种良好性能的集成位移检测的纳米级定位平台。     

基于体硅工艺的静电致动微夹持器制作工艺分析

介绍了一种基于体硅工艺的大尺寸、大深宽比梳状静电致动微夹持器的制作工艺。对微夹持器制作中的关键工艺进行分析,重点分析ICP蚀刻工艺的蚀刻时间对结构的影响,总结导致器件失效的原因,探讨了减少失效的方法。加工过程中采用分步加工的办法控制蚀刻时间,成功的释放了宽6μm,厚60μm,等效长度达5470μm的悬臂梁型微夹持臂。研制出一种良好性能的具有S形柔性结构夹持臂的梳状静电致动微夹持器。     

微细加工与装备技术进展

讨论微细加工与装备技术现状,介绍刻蚀技术、LIGA技术和准LIGA技术、微细特种加工等典型的微细加工工艺原理与技术特点,并指出各种加工方法的优缺点,分析微细加工技术的发展走向及装备技术的发展趋势。     

Nanostructure fabrication on germanium and silicon by nanocoining imprint technique

Germanium (Ge) and silicon (Si) material response to indentation with a nanostructured die is investigated. A diamond die attached to a high speed actuator previously used to create large arrays of nanofeatures on metallic surfaces was used to create nanofeatures on Ge and Si samples. The pressure induced transformation of Ge and Si from a diamond cubic brittle phase to a more ductile beta-tin metallic phase due to the nanofeatures on the die was investigated. Results using the dynamic nanocoining method showed chip-like deformation around the individual nanofeatures indicative of the beta-tin phase transformation at the nanofeature level. Micro-Raman measurements confirmed the metallic transition from evidence including metastable and amorphous phases after indentation. Indents created using a common linear indentation method exhibited similar behavior. The Si nanofeature deformation was compared to electroless (EL) nickel and the deformation differed as dictated by the mechanism of material flow. Although not observed in Si, fracture occurred in some Ge indents at higher loads as a result of the lower fracture toughness compared to Si.     

二维硅薄膜光子晶体波导的设计及制作

为了制作可用于通信波段的二维硅光子晶体波导,研究了光子晶体波导的设计方法及制作工艺。应用平面波展开法计算了两种空气孔型光子晶体结构的TE波禁带,经筛选采用了三角晶格空气孔结构。同样利用平面波展开法计算了引入缺陷后二维三角晶格空气孔型光子晶体波导结构的TE波禁带,经对比发现归一化频率为0.295 7的缺陷态最适宜用来制备光子晶体波导,并据此设计了用于1.55μm波长的二维三角晶格空气孔型光子晶体波导,其晶格周期为458nm,空气孔直径为339 nm。对设计的结构参数进行了容差计算,结果表明误差在-3.95~5.65 nm方能满足设计要求。最后使用聚焦离子束刻蚀工艺,制作了所设计的波导结构,并进行了测试。测试结果表明,样品实际晶格周期为463nm,空气孔直径为344 nm,比设计值大5 nm,在容差允许范围内,满足设计要求。     

Some aspects of fabrication of micro devices by electrochemical micromachining (ECMM) and its finishing by magnetorheological fluid

Electrochemical micromachining (ECMM) is an advanced machining process for machining of electrically conducting materials. In the present work, a micro nozzle and a fluidic mixer having complex structures are made using masking technique by ECMM process. Mask is made of 50-μm transparent sheet and the micro nozzle and micro mixer are fabricated on an 800-μm thick copper sheet. The resulting rough inner walls and bottom surface of micro nozzle are finished using magnetorheological fluid-based finishing process. Surface finish of the nozzle is significantly improved after finishing. A comparison of width, depth, and surface roughness of the micro nozzle is also carried out before and after finishing. The mixing behavior of two fluids is visualized by microscope in micro mixer. The rough inner walls of the mixer’s channels act as obstructions and result in zigzag path of flowing fluid. Hence, mixing occurs at microscopic level because of rapid molecular diffusion.     

特种微型机械加工技术

综述微型机电系统/微型机械的三维形状加工及极限尺寸加工的研究开发现状.相对硅微细加工和LIGA工艺,不采用掩膜版的特种微细加工技术,如微细激光成型、微细电火花加工以及微细机械加工等近年来取得较大进展,在三维微小机械结构成型上有独到优势;同时扫描隧道显微加工技术的开发将微型机械向极限尺寸领域推进.微型机电系统/微型机械的长足发展有赖于融合已有先进技术和交叉学科思想的微型机械加工技术的进一步研究开发.