Friction and adhesion properties of fluorocarbon polymer thin films prepared by magnetron sputtering

Fluorocarbon polymer thin films were deposited onto a SUS302 substrate with a poly(tetrafluoroethylene) (PTFE) target by three different types of r.f. magnetron sputtering systems with strong, weak and unbalanced magnetic fields. Friction and adhesion properties of these polymer thin films were evaluated.Friction coefficient of polymer thin films prepared with strong magnetic field, unbalanced magnetron and without magnetron (r.f. sputtering) was almost the same level, however, that prepared with the weak magnetic field was slightly lower than those of other thin films. Wear durability of polymer thin film increased with increase of the magnetic field.Adhesion strength between these thin films and SUS302 substrate and shear stress were measured by SAICAS. Both of the adhesion strength and shear stress of polymer thin films prepared with r.f. sputtering (without magnetron) were slightly higher than those prepared by magnetron sputtering systems.     

High conductivity and transparent ZnO:Al films prepared at low temperature by DC and MF magnetron sputtering

Aluminum-doped zinc oxide thin films have been deposited by DC and MF magnetron sputtering from a ceramic oxide target in argon atmosphere without direct heating of the substrates. The samples were prepared at different predetermined conditions of input power or discharge voltage and the influence upon electronic, optical, and microstructural properties has been investigated. The as-deposited layers show low resistivity, such as 9 × 10^− 4 Ω cm minimum for DC excitation and 1.2 × 10^− 3 Ω cm for MF mode, with growth rates up to 130 nm/min, and resulting substrate temperatures always below 200 °C. Low resistivity of the films is combined with high transmission, 85-90% in the visible wavelength range (400-800 nm). A strong (002) texture perpendicular to the substrate has been found, with lower strain for DC than for MF sputtering.     

Evaluation of hafnium nitride thin films sputtered from a hafnium nitride target

Hafnium nitride (HfN) thin films were prepared on Si (100) substrates by radio frequency magnetron sputtering with a compound target. Nitrogen composition, work function and electrical resistivity were investigated to evaluate thin film properties. Nitrogen composition and work function had little dependence on argon gas pressure and radio frequency power. Electrical resistivity showed strong correlation with the substrate temperature. When thin films were fabricated at room temperature, the electrical resistivity was 100 μΩ cm, and it became lower with an increase in the substrate temperature. When the films were fabricated at 600 °C, the resistivity became less than 50 μΩ cm.     

Preparation of anatase TiO2 thin films for dye-sensitized solar cells by DC reactive magnetron sputtering technique

Anatase titanium dioxide (TiO₂) thin films are prepared by DC reactive magnetron sputtering using Ti target as the source material. In this work argon and oxygen are used as sputtering and reactive gas respectively. DC power is used at 100 W per 1 h. The distance between the target and substrate is fixed at 4 cm. The glass substrate temperature value varies from room temperature to 400 °C. The crystalline structure of the films is determined by X-ray diffraction analysis. All the films deposited at temperatures lower than 300 °C were amorphous, whereas films obtained at higher temperature grew in crystalline anatase phase. Phase transition from amorphous to anatase is observed at 400 °C annealing temperature. Transmittances of the TiO₂ thin films were measured using UV-visible NIR spectrophotometer. The direct and indirect optical band gap for room temperature and substrate temperature at 400 °C is found to be 3.50, 3.41 eV and 3.50, 3.54 eV respectively. The transmittance of TiO₂ thin films is noted higher than 75%. A comparison among all the films obtained at room temperature showed a transmittance value higher for films obtained at substrate temperature of 400 °C. The morphology of the films and the identification of the surface chemical stoichiometry of the deposited film at 400 °C were studied respectively, scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS). The surface roughness and the grain size are measured using AFM.     

ZnO thin films prepared by atomic layer deposition and rf sputtering as an active layer for thin film transistor

Recently, the application of ZnO thin films as an active channel layer of transparent thin film transistor (TFT) has become of great interest. In this study, we deposited ZnO thin films by atomic layer deposition (ALD) from diethyl Zn (DEZ) as a metal precursor and water as a reactant at growth temperatures between 100 and 250 °C. At typical growth conditions, pure ZnO thin films were obtained without any detectable carbon contamination. For comparison of key film properties including microstructure and chemical and electrical properties, ZnO films were also prepared by rf sputtering at room temperature. The microstructure analyses by X-ray diffraction have shown that both of the ALD and sputtered ZnO thin films have (002) preferred orientation. At low growth temperature T_s ≤ 125 °C, ALD ZnO films have high resistivity (> 10 Ω cm) with small mobility (< 3 cm²/V s), while the ones prepared at higher temperature have lower resistivity (< 0.02 Ω cm) with higher mobility (> 15 cm²/V s). Meanwhile, sputtered ZnO films have much higher resistivity than ALD ZnO at most of the growth conditions studied. Based upon the experimental results, the electrical properties of ZnO thin films depending on the growth conditions for application as an active channel layer of TFT were discussed focusing on the comparisons between ALD and sputtering.     

Magnetron sputter deposition of low-stress, carbon-containing cubic boron nitride films using Ar―N2―CH4 gas mixtures

Cubic boron nitride (c-BN) films produced by PVD and plasma-assisted CVD techniques typically exhibit undesired high compressive stresses. One of the effective and feasible methods to reduce stress and hence improve film adhesion has been a controlled addition of a third element into the film during deposition. In the present study, BN films were grown on to silicon substrates using reactive magnetron sputtering with a hexagonal BN target. An auxiliary flow of methane was mixed into argon and nitrogen as the working gas. The deposition was conducted at various methane flow rates at 400 °C substrate temperature, 0.2 Pa total working pressure, and − 250 V r.f. substrate bias. The microstructure of the deposited films was then examined in dependence of the methane flow rate. With increasing methane flow rate from 0 to approx. 2.0 sccm, the fraction of the cubic BN phase in the deposited films decreased gradually down to approx. 75 vol.%, whereas the film stress was reduced much more rapidly and almost linearly in relation to the methane flow rate. At 2.1 sccm methane, the stress became approx. 3 times reduced. Owing to the significantly decreased film stress, adherent, micrometer thick, cubic-phase dominant films can be allowed to form on silicon substrate. The microstructure of the films will be illustrated through FTIR and XRR.     

The effect of substrate temperature on Al-doped ZnO characteristics for organic thin film transistor applications

The influence of substrate temperature on the structural, electrical, and optical properties of aluminum-doped zinc oxide (AZO) films fabricated by radio frequency (RF) magnetron sputtering was investigated. The AZO films were deposited at various substrate temperatures, and the effect of AZO gate electrode conductivity on organic thin film transistor (OTFT) performance was examined. While an increase in the substrate temperature from 100 °C to 300 °C led to an improvement in crystallinity, substrate temperatures over 300 °C caused degradation of the electrical and surface properties. We fabricated OTFTs using AZO films prepared at various substrate temperatures and obtained good device performance. Thus, the performance of an OTFT can be determined by the conductivity of the AZO gate electrode.     

Effect of post-deposition annealing on phase formation and properties of RF magnetron sputtered PLZT thin films

In this work, we report the preparation of lanthanum-modified lead zirconate titanate (PLZT) thin films by RF magnetron sputtering on platinized silicon (Pt/Ti/SiO₂/Si) substrate. Sputtering was done in pure argon at 100 W RF power without external substrate heating. X-ray diffraction studies were performed on the films to study the effect of post-deposition furnace annealing temperature and time on the perovskite phase formation of PLZT. Annealing at 650 °C for 2 h was found to be optimum for the preparation of PLZT films in pure perovskite phase. The effect of different annealing conditions on surface morphology of the films was examined using AFM. The dielectric, ferroelectric and electrical properties of these films were also investigated in detail as a function of different annealing conditions. The pure perovskite film exhibits better properties than the other films which have some fraction of unwanted pyrochlore phase. The remanent polarization for pure perovskite film was found to be ∼29 μC/cm² which is almost double compared to the films having mixed phases. The dc resistivity of the pure perovskite film was found to be 7.7 × 10¹⁰ Ω cm at the electric field of ∼80 kV/cm.     

Ion beam sputter-deposition of LiCoO2 films

LiCoO₂ films, 200 nm in thickness, are produced by ion beam sputter-deposition. The structural, electrical and electrochemical properties of the films are studied by means of X-ray diffraction (XRD), electrical direct-current-measurements, and electron energy loss spectroscopy (EELS). The influence of preparation parameters like substrate temperature or oxygen partial pressure, are explored. While an oxygen deficiency was observed in films sputtered under pure argon atmosphere, the oxygen content of the thin films increases, significantly, in case of films sputtered under addition of O₂. At substrate temperatures below 300 °C, XRD measurements reveal a lattice structure similar to the low-temperature-phase, while the formation of the high-temperature-phase is clearly observed at temperatures above 500 °C and an Argon/Oxygen ratio of 3/2. Furthermore, the EELS technique is demonstrated to be a sensitive tool to characterize the lithiation state of the sputter-deposited thin films.     

Effects of sputtering power and pressure on properties of ZnO:Ga thin films prepared by oblique-angle deposition

The effects of power and pressure on radiofrequency (RF) diode sputtering in oblique-angle (80°) deposition arrangement are presented. Oblique-angle sputtering of ZnO:Ga (GZO) thin films resulted in a tilted columnar crystalline structure and inclination of the c-axis by an angle of approximately 9° with respect to the substrate. This improved their structural, electrical and optical properties in comparison with films deposited perpendicularly to the substrate. GZO films sputtered by an RF power of 600 W at room temperature of the substrate in Ar pressure 1.3 Pa showed strong crystalline (002) texture, lowest electrical resistivity 3.4 × 10^− 3 Ωcm, highest electron mobility 10 cm² V^− 1 s^− 1, high electron concentration 1.8 × 10²⁰ cm^− 3 and good optical transparency up to 88%. The small inclination angle of the film structure is caused by the high kinetic energy of sputtered species and additional energetic particle bombardment causes random surface diffusion, which is suppressing the shadow effect produced by oblique-angle sputtering.     

Substrate temperature dependence of electrical and structural properties of Ru films

Microstructures and resistivities of sputtered Ru films were investigated as a function of substrate temperature to obtain a single-layered Ru barrier without a Ta/TaN under layer. High resistivity Ru films with a high density of crevices, which enhances Cu diffusion along the crevices, were formed by the conventional sputtering process, i.e., sputtering at room temperature and annealing at 400 °C-700 °C for 30 min in Ar + 3%H₂. But, crevice-free and smooth Ru films with low resistivity, the same as that for the bulk phase, were formed when substrate temperature add sputtering was raised to 700 °C. Ru films formed by this process had (002) preferred orientation and then Cu (111) was formed by plating. This result corresponded to the tendency predicted by ab initio calculations.     

C-Ti nanocomposite thin films: Structure, mechanical and electrical properties

Carbon-titanium nanocomposite thin films were deposited by DC magnetron sputtering on oxidized silicon substrates in argon. The films were prepared at different deposition temperatures between 25 and 800 °C. Transmission electron microscopy was used to determine the structure of the films. All the C-Ti nanocomposites consisted of columnar TiC structure with average column width ∼10 and 20 nm and a thin carbon matrix. The thickness of the carbon matrix between adjacent TiC columns was ∼2-5 nm.Mechanical properties (hardness, reduced modulus) of C-Ti films showed a distinct variation depending on the deposition temperature. Films deposited at 200 °C had the highest hardness ∼18 GPa and the highest reduced modulus ∼205 GPa.Temperature dependence of the film resistance was measured between 80 and 330 K. C-Ti nanocomposites have a non-metallic conduction mechanism characterized by a negative temperature coefficient of resistivity (TCR). The most negative TCR was observed for films showing high hardness and reduced modulus of elasticity.     

Effects of post-deposition surface treatment on the optical, structural and hydrogen sensing properties of TiO2 thin films

TiO₂ thin films were prepared by DC reactive magnetron sputtering in a mixture of oxygen and argon on glass and oxidized silicon substrates. The effect of post-deposition annealing (300 °C, 500 °C and 700 °C for 8 h in air) on the structural and morphological properties of TiO₂ thin films is presented. In addition, the effect of Pt surface modification (1, 3 and 5 nm) on hydrogen sensing was studied. XRD patterns have shown that in the range of annealing temperatures from 300 °C to 500 °C crystallization starts and the thin film structure changes from amorphous to polycrystalline (anatase phase). In the case of samples on glass substrate, optical transmittance spectra were recorded. TiO₂ thin films were tested as sensors of hydrogen at concentrations 10,000-1000 ppm and operating temperatures within the 180-200 °C range. The samples with 1 nm and in particular with 3 nm of Pt on the surface responded to hydrogen fast and with high sensitivity.     

Comparative study of resistivity characteristics between transparent conducting AZO and GZO thin films for use at high temperatures

This paper compares in detail the resistivity behavior of transparent conducting Al-doped and Ga-doped ZnO (AZO and GZO) thin films for use in an air environment at high temperatures. AZO and GZO thin films with thicknesses in the range from approximately 30 to 100 nm were prepared on glass substrates at a temperature of 200 °C by rf superimposed dc or conventional dc magnetron sputtering deposition, pulsed laser deposition or vacuum arc plasma evaporation techniques. In heat-resistance tests, the resistivity was measured both before and after heat tests for 30 min in air at a temperature up to 400 °C. The resistivity stability of AZO thin films was found to be always lower than that of GZO thin films prepared with the same thickness under the same deposition conditions, regardless of the deposition technique. However, the resistivity of all AZO and GZO thin films prepared with a thickness above approximately 100 nm was stable when heat tested at a temperature up to approximately 250 °C. It was found that the resistivity stability in both GZO and AZO thin films is dominated by different mechanisms determined by whether the thickness is below or above approximately 50 nm. With thicknesses above approximately 100 nm, the increase in resistivity found in GZO and AZO films after heat testing at a temperature up to 400 °C exhibited different characteristics that resulted from a variation in the behavior of Hall mobility.     

The influence of annealing temperature on the structural, electrical and optical properties of ion beam sputtered CuInSe2 thin films

CuInSe₂ (CIS) thin films were prepared by ion beam sputtering deposition of copper layer, indium layer and selenium layer on BK7 glass substrates followed by annealing at different temperatures for 1 h in the same vacuum chamber. The influence of annealing temperature (100-400 °C) on the structural, optical and electrical properties of CIS thin films was investigated. X-ray diffraction (XRD) analysis revealed that CIS thin films exhibit chalcopyrite phase and preferential (112) orientation when the annealing temperature is over 300 °C. Both XRD and Raman show that the crystalline quality of CIS thin film and the grain size increase with increasing annealing temperature. The reduction of the stoichiometry deviation during the deposition of CIS thin films is achieved and the elemental composition of Cu, In and Se in the sample annealed at 400 °C is very near to the stoichiometric ratio of 1:1:2. This sample also has an optical energy band gap of about 1.05 eV, a high absorption coefficient of 10⁵ cm⁻¹ and a resistivity of about 0.01 Ω cm.     

Effect of high temperature post-annealing of La0.7Sr0.3MnO3 films deposited by radio frequency magnetron sputtering on SiO2/Si substrates heated at low temperature

La_0.7Sr_0.3MnO₃ thin films were deposited on SiO₂/Si substrates by RF magnetron sputtering under different oxygen gas flow rates with a sputtering power of 100 W. During deposition, the substrate was heated at 623 K. To investigate post-annealing effects, the as-deposited La_0.7Sr_0.3MnO₃ thin films were thermal-treated at 973 K for 1 h. The effects of oxygen gas flow rate and post-annealing treatment on the physical properties of the films were systematically studied. X-ray diffraction results show that the growth orientation and crystallinity of the films were greatly affected by the oxygen gas flow rate and substrate heating during deposition. The sheet resistance of the films gradually decreased with increasing oxygen gas flow rate, while the post-annealed films showed the opposite behavior. The temperature coefficient of resistance at 300 K of La_0.7Sr_0.3MnO₃ thin films deposited at an oxygen gas flow rate of 40 sccm decreased from − 2.40%/K to − 1.73%/K after post annealing. The crystalline state of the La_0.7Sr_0.3MnO₃ thin films also affected its electrical properties.     

Investigation of thin solid ZnO films prepared by sputtering

Zinc oxide (ZnO) thin films have attracted great attention in recent years due to their unique piezoelectric and piezooptic properties, making them suitable for various microelectronics and optoelectronics applications, such as surface acoustic wave devices, optical fibers, solar cells etc. ZnO is a semiconductor with a band gap of 3.3 eV and a large exciton binding energy of 60 meV. Undoped ZnO exhibits intrinsic n-type conductivity and it enables achieving high electron concentration. However, it may be doped to obtain low resistivity p-type thin films. Among group V of the periodic table, nitrogen is used as a popular p-type dopant due to its small atomic size. However, it is difficult to achieve p-type conduction in ZnO films due to the low solubility of nitrogen and its high intensity in self compensating process upon doping.Sputtering techniques enable us to form dense and homogeneous films due to the relatively high energy of the sputtered atoms. Thus we can grow high quality ZnO films with c-axis orientation, low growth temperature, high deposition rate, large area deposition, and availability in various growths ambient. In this work, the zinc oxide films were prepared using various DC sputtering methods in an atmosphere of pure argon and an atmosphere of mixed argon with nitrogen. Optical and electrical properties of the films were investigated.     

Effect of nitrogen ion implantation on the sprayed ZnSe thin films

The ZnSe thin films were deposited onto glass substrates by the spray pyrolysis method using mixed aqueous solutions of ZnCl₂ and SeO₂ at the substrate temperature 430 °C. These films were implanted with 130 keV nitrogen ions to various doses from 1 × 10¹⁶ to 1 × 10¹⁷ ions/cm². We have analysed the properties of the nitrogen ion-implanted ZnSe thin films using X-ray diffraction and optical transmittance spectra. The values of optical bandgap have been determined from the absorption spectra. The bandgap of the N⁺ doped films decreased from 2.70 eV for undoped film to 2.60 eV for maximum doping probably due to band-tailing, whereas the absorption coefficient values increased with the increase of the implantation dose.     

Deposition of Al-doped ZnO films on polyethylene naphthalate substrate with radio frequency magnetron sputtering

100 nm Al-doped ZnO (AZO) thin films were deposited on polyethylene naphthalate (PEN) substrates with radio frequency magnetron sputtering using 2 wt.% Al-doped ZnO target at various deposition conditions including sputtering power, target to substrate distance, working pressure and substrate temperature. When the sputtering power, target to substrate distance and working pressure were decreased, the resistivity was decreased due to the improvement of crystallinity with larger grain size. As the substrate temperature was increased from 25 to 120 °C, AZO films showed lower electrical resistivity and better optical transmittance due to the significant improvement of the crystallinity. 2 wt.% Al-doped ZnO films deposited on glass and PEN substrates at sputtering power of 25 W, target to substrate distance of 6.8 cm, working pressure of 0.4 Pa and substrate temperature of 120 °C showed the lowest resistivity (5.12 × 10^− 3 Ω cm on PEN substrate, 3.85 × 10^− 3 Ω cm on glass substrate) and high average transmittance (> 90% in both substrates). AZO films deposited on PEN substrate showed similar electrical and optical properties like AZO films deposited on glass substrates.     

Enhanced electrochromism in cerium doped molybdenum oxide thin films

Cerium (5-15% by weight) doped molybdenum oxide thin films have been prepared on FTO coated glass substrate at 250 °C using sol-gel dip coating method. The structural and morphological changes were observed with the help of XRD, SEM and EDS analysis. The amorphous structure of the Ce doped samples, favours easy intercalation and deintercalation processes. Mo oxide films with 10 wt.% of Ce exhibit maximum anodic diffusion coefficient of 24.99 × 10⁻¹¹ cm²/s and the change in optical transmittance of (ΔT at 550 nm) of 79.28% between coloured and bleached state with the optical density of (ΔOD) 1.15.