浅谈金刚石绳锯在钢筋混凝土切割中的应用发展

金刚石绳锯是集金刚石高硬度与钢丝绳高柔性为一体的石材加工工具,其具有资源利用率高、环境影响小、施工简单等一系列优点,能实现各种异形面加工、大型土建拆迁和管道施工等工程领域的高效切割,发展潜能巨大。文章阐述了金刚石绳锯在钢筋混凝土切割领域的发展历史,并结合目前国内外相关基础理论研究以及实际切割应用,最后就金刚石绳锯在这一领域的应用前景提出自己的一定看法。     

超薄金刚石切割片的研究及应用现状

超薄金刚石切割片,由于具有超薄切割槽宽,切割断口平滑,废品率低,切割效率高等优点,已逐步得到人们的重视。文章综述了近10年来超薄金刚石切割片的主要制作方法的研究进展及应用现状,介绍了超薄金刚石切割片的制备方法,包括电镀法和固化树脂法,其中电镀法以其设备简单、绿色环保、可循环生产等优点成为最有可能大规模工业应用的制备方法,文章最后指出了其发展方向。     

浅述金刚石绳锯新领域应用

文章通过介绍金刚石绳锯在盐溶矿、纯钢切割的领域应用,概述了在盐溶矿、纯钢切割应用领域金刚石绳锯制备要求,配套设备情况以及应用情况,最后对金刚石绳锯在应用领域上提出建议.     

金刚石钎焊(上)

金刚石磨料主要靠机械夹持力把持在金属(烧结或电镀)胎体中。由于这一弱点,在切割过程中,金刚石不可避免地会从胎体中脱落或掉出。此外,金刚石突出高度较低,故金刚石工具的切割速度受到限制。而且,金属胎体和工作对象(被切割岩石)相互磨擦,将会导致金刚石和其它材料的热损伤,而且工作的功率消耗将增加。金刚石采用钎焊的办法牢固地把持在金属胎体中,可形成强力的化学结合,金刚石磨料的突出高度将成倍提高,而不会从胎体中脱落或碎裂。因此,金刚石工具的切割速度将会成倍提高。当钎焊料熔融时,碳化物形成物将向金刚石方向迁移而在界面上形成碳化物。这种反应可能过分而使金刚石质量明显下降。此时,可能需要对金刚石进行镀覆以便缓和与控制这种反应。当金刚石钎焊在基体的表面时,熔化趋向于将金刚石聚集在一起,可促使钎焊层局部加厚。这种金刚石晶粒的成簇聚集将降低金刚石工具的切割效率。一种金刚石矩阵有序排列设计(grid)是必要的,它可保持钎焊层具有均匀的厚度。因此钎焊合金可控熔融,可使每一粒金刚石晶体周围形成较缓的坡度。这种整体均匀焊层的支承可使金刚石工具高速有效切割,而功率消耗较低。     

金刚石钎焊(下)

金刚石磨料主要靠机械夹持力把持在金属(烧结或电镀)胎体中。由于这一弱点,在切割过程中,金刚石不可避免地会从胎体中脱落或掉出。此外,金刚石突出高度较低,故金刚石工具的切割速度受到限制。而且,金属胎体和工作对象(被切割岩石)相互磨擦,将会导致金刚石和其它材料的热损伤,而且工作的功率消耗将增加。金刚石采用钎焊的办法牢固地把持在金属胎体中,可形成强力的化学结合,金刚石磨料的突出高度将成倍提高,而不会从胎体中脱落或碎裂。因此,金刚石工具的切割速度将会成倍提高。当钎焊料熔融时,碳化物形成物将向金刚石方向迁移而在界面上形成碳化物。这种反应可能过分而使金刚石质量明显下降。此时,可能需要对金刚石进行镀覆以便缓和与控制这种反应。当金刚石钎焊在基体的表面时,熔化趋向于将金刚石聚集在一起,可促使钎焊层局部加厚。这种金刚石晶粒的成簇聚集将降低金刚石工具的切割效率。一种金刚石矩阵有序排列设计(grid)是必要的,它可保持钎焊层具有均匀的厚度。因此钎焊合金可控熔融,可使每一粒金刚石晶体周围形成较缓的坡度。这种整体均匀焊层的支承可使金刚石工具高速有效切割,而功率消耗较低。     

环形金刚石线锯切割蓝宝石试验研究

使用环形金刚石线直径为0.70毫米,长4米,切割直径53毫米的蓝宝石晶体,30分钟即可完成切割。论文研究切割线速度,进给速度等对蓝宝石切割面粗糙度的影响。通过试验找到环形金刚石线切割蓝宝石片的最佳工艺参数并对其切割机理进行了探讨。     

金刚石锯片中金刚石粒度与切割瓷砖崩边效果的关系

金刚石锯片根据其不同切割需求采用不同粒度的金刚石。具体研究在使用相同胎体,不同粒度金刚石制成相同规格锯片,在相同切割条件下,湿切不同瓷砖的切割效果。由于使用不同粒度的金刚石锯片切割瓷砖后,瓷砖切割边缘的崩边情况明显不同,随着金刚石的粒度变细,崩边情况明显变好,但其切割速度也会明显降低,同时锯片的价格也会有所提高。因此,使用者可根据笔者的结论选用合适粒度的金刚石锯片。     

浅析电镀金刚石线在切割硅材料中的应用

电镀金刚石线在硅材料切割中应用广泛,但国内技术工艺尚不成熟。文章就电镀金刚石线锯的工艺技术、结构,切割后硅片的处理等方面进行了综述,分析了国内电镀金刚石线锯切割的应用现状和发展前景。     

金刚石细线锯的开发与加工性能

在硬脆材料切割工程中,金刚石线锯引人注目.目前,市场上销售的金刚石线锯大多使用粒径Φ20～40μm的金刚石磨粒,线锯直径为Φ250～300μm左右.本研究的目的则是开发金刚石细线锯,目标放在减少加工时的切割余量.具体说来,线锯芯线采用由两根Φ58μm的琴丝扭绞而成的绞线,在其表面沉积粒径Φ30～40μm的金刚石磨粒,制成直径Φ175μm的金刚石线锯.经一系列试验确定了金刚石细线锯的最佳制作条件,并用该线锯进行了切割加工试验,弄清了其加工性能与加工机理.     

金刚石浓度对金刚石锯片切割性能的影响研究

文中制做了Ф180、Ф230、Ф350mm的Cu—Ni—Fe基刀头型激光焊通用锯片和Ф180、Ф250、Ф350mm的Cu基热压陶瓷片。通过切割花岗石、水泥和瓷砖，考察了锯片中金刚石浓度对锯片的锋利度和切割寿命的影响。指出：在锯片能正常运转的情况下，金刚石浓度越高，锯片寿命越长；而锯片的最大切割速度则随着金刚石浓度的增加而呈抛物线规则变化，先增后减，有一最大值，并且对应这个最大切割速度的金刚石浓度随锯片直径、被加工材料的不同而不同。文中结论对于配方设计具有指导意义。     

Investigation of the material removal process in in-situ laser-assisted diamond cutting of reaction-bonded silicon carbide

Reaction-bonded silicon carbide (RB-SiC) is an important optical material used widely in the aerospace industry. The machining accuracy of RB-SiC optical elements must satisfy the requirements of high-performance system development. However, RB-SiC is typically hard and brittle, making precise machining difficult. Thus, the material removal and synergistic deformation mechanisms of SiC and silicon (Si) must be investigated for ultraprecision machining. In-situ laser-assisted diamond cutting is an effective method for the ultraprecision cutting of hard and brittle materials. In this research, we investigated the influence of temperature on the material deformation process in detail. Firstly, the physical properties of RB-SiC, including its hardness and depth of plastic deformation, were investigated through high-temperature nano-indentation experiments. Furthermore, grooving experiments were carried out to investigate the brittle-to-ductile transition under ordinary and in-situ laser-assisted diamond cutting, respectively. Finally, the deformation of the machined surface/subsurface was revealed via scanning electron microscopy and transmission electron microscopy observations.     

Experimental investigation on diamond wire sawing of Si3N4 ceramics considering the evolution of wire cutting performance

When diamond wire saw is used in machining silicon nitride ceramics (Si₃N₄ ceramics), the ultra-hardness of Si₃N₄ causes the saw wire to wear out, which leads to the saw wire cutting performance constantly changing during its life cycle, and thus the machined quality of Si₃N₄ ceramics is affected. Surface roughness and topography are important indicators of the quality of the machined surface. In this paper, the diamond wire saw cutting experiment of Si₃N₄ ceramics was carried out, the effect of the evolution of saw wire cutting performance on the surface roughness and topography of Si₃N₄ ceramics as-sawn slices was investigated based on the analysis of the changes of saw wire wear topography, breaking force, bow angle and kerf loss during the sawing process. The results show that the surface roughness along the saw wire motion direction and the workpiece feed direction tends to decrease and then increase with the evolution of the cutting performance of the saw wire, which accords well with the trend of the as-sawn slices surface morphology. The results of the study can provide experimental reference for the development of high precision diamond wire saw cutting technology for Si₃N₄ ceramics.     

半导体加工用金刚石工具现状

总结分析了国内半导体加工用金刚石工具的发展现状.指出了国产与进口半导体加工用金刚石工具的差距,分析了产生差距的主要原因.认为需要国内企业从人员、设备、原料、环境、工艺等多个角度系统性提高产品质量和稳定性,也需要加强半导体产业上下游企业的沟通、配合,加强产学研合作,逐步提高我国半导体产业金刚石工具的整体技术水平,突破半导...     

Effect of Y2O3 additive on nitridation of diamond wire silicon cutting waste

The effect of Y₂O₃ additive on the nitridation of diamond wire silicon cutting waste (DWSCW) was studied by using X-ray diffraction, thermo gravimetry, differential thermal analysis, scanning electron microscope equipped with energy-dispersive spectrometry, and an equivalent alternative method, and the individual particles of DWSCW were simulated using cubic polycrystalline silicon blocks. The results showed that the native SiO₂ film on the surface of DWSCW can be disrupted at low temperature (1300°C) by adding Y₂O₃ additive, which provide good channels for the diffusion of SiO and N₂ and improve the overall conversion of DWSCW. Y₂O₃ additive can also reduce the initial nitriding temperature of cutting waste, change the nitriding kinetic behavior, and promote the formation of β-Si₃N₄ through accelerating the nitridation of cutting waste at high temperature (≥1500°C). In addition, when 8 wt% Y₂O₃ additive is added to the cutting waste, the complete nitridation is achieved, at 1350°C, and ω_α + ω_β reaches a maximum of 83.6 wt%.     

金刚石环形带锯条试验研究（上）

提高切割效率、延长锯条使用寿命、减少锯口硅料损失,综合各种因素降低加工成本是光伏企业细化管理的关键。文章依照优化的试验参数和独特的电沉积工艺严格控制、精细制作的带锯条进行硅材料切割试验,结果表明：所选用的金刚石经处理后适合带锯条切割应用;提出的维氏硬度范围兼顾了带锯条切割时对刚性和柔韧性的双重需要;确定的镰刀弯和几何尺寸精度控制标准提高了锯条切割的稳定性。     

硅切割用电镀金刚石线锯的研究现状

文章综述了硅切割用电镀金刚石线锯的构造和特点,以及制备工艺过程,并对其应用情况进行了简要介绍,对目前存在的问题进行初步的探讨,并就未来的发展趋势进行了展望。     

多晶硅金刚线切割废料制备Al-Si合金过程中的热力学和动力学分析

通过X射线衍射仪、X射线荧光光谱分析仪、傅里叶变换红外光谱仪分析了金刚线切割多晶硅废料的组分及其体系中存在的硅氧化物，研究了铝与切割废料合金化过程中可能存在的化学反应过程，采用HSC Chemistry 6.0软件对其反应体系进行了热力学分析，利用差热分析法研究了铝热还原切割废料中SiO2的动力学过程，对金刚线切割多晶硅废料进行了掺铝制备铝硅合金的实验研究。结果表明，金刚线切割多晶硅废料和铝粒按不同铝硅摩尔比兑掺后，在电磁搅拌的作用下，合金化的温度范围为800~1600℃，铝热反应可将废料中少量的SiO2杂质还原成单质Si，铝热还原二氧化硅的活化能为364.1 kJ/mol，反应级数为0.91，实验样品的EPMA和XRD等表征结果表明合金成分和渣相与热力学分析完全吻合，合金化效果明显。     

Effect of grit shape and crystal structure on damage in diamond wire scribing of silicon

Fundamental understanding of the fixed abrasive slicing of photovoltaic silicon wafers is crucial for producing low‐cost wafers with superior surface quality and mechanical strength. With the goal of understanding the diamond wire sawing process, this paper investigates the scribing of mono‐ and multi‐crystalline silicon by the abrasive grits on an actual diamond wire. Specifically, the effects of grit shape and silicon crystal structure on the resulting surface morphology, subsurface damage, and the critical depth of cut at which ductile‐to‐brittle transition occurs are investigated. Results show that surface cracking depends on the grit shape. Scribing across the grain and twin boundaries in multi‐crystalline silicon impacts the resulting surface morphology, with grit shape producing a greater effect than crystallographic orientation in the grain interior relative to the grain boundary. Subsurface damage depends on the grit shape and crystal structure. Differences in the critical depth of cut for ductile‐to‐brittle transition in scribing of mono‐crystalline silicon are explained via analysis of the stress state produced by idealized grit shapes.     

金刚石线锯技术问题探讨

探讨金刚石线锯的技术问题,包括母线的材质、规格、强度、连接方法和结构形式;金刚石磨料的拉度、某些物理特性以及金刚石磨料在母线上的电镀固着方法和树脂粘结法及其改进措施.文章还提出了有待探索研究的课题,包括复合固着法、母线精细喷砂处理、金刚石磨料表面织构化处理以及微水刀激光技术应用于晶片切割的可行性.