超声无磨料抛光机理研究

介绍了超声抛光的优缺点,重点从超声无磨料抛光脉冲特点和能量集中效应、工艺系统的刚化、工件表层金属的变形及超声振动改变抛光过程的摩擦性质四个方面探讨了超声无磨料抛光机理。并与常规挤压抛光进行了对比分析。     

KDP晶体无磨料潮解抛光技术研究

综述了KDP晶体无磨料潮解抛光技术的研究现状,介绍了KDP晶体无磨料潮解抛光原理及优势,详细阐述了"油包水"型无磨料潮解抛光KDP晶体和"乙醇—水"型无磨料潮解抛光KDP晶体的研究进展,并对其前景进行了展望,提出了今后的重点研究方向。     

微磨料汽雾超声抛光加工技术及实验研究

提出了一种新型精密抛光加工方法,即用含有微磨料的抛光液经超声振动使之雾化形成汽雾流,用此含有微磨料的汽雾流冲蚀工件表面而去除工件材料。通过产生汽雾流的超声振动分析和实验对这一微磨料汽雾超声抛光加工技术进行了研究。结果表明:这一方法可以实现对工件表面的抛光处理,而且比传统的抛光加工方法具有加工冲蚀力更柔软、加工质量更好,并且没有喷嘴损耗等优点。     

磨料水射流抛光技术的研究现状

磨料水射流抛光是新出现的一种精密加工技术。本文综述了国内外学者对磨料水射流抛光技术的研究情况,介绍了磨料水射流抛光机理和各工艺参数对抛光效果的影响,指出了目前磨料水射流抛光加工中存在的问题。     

微磨料超声汽雾流抛光加工技术及实验研究

提出了一种新型精密抛光加工方法,即微磨料超声汽雾流抛光加工。它是用含有微磨料的抛光液经超声振动使之雾化形成汽雾流,用此含有微磨料的汽雾流进行冲蚀工件表面而去除工件材料的加工方法。通过对此方法的技术分析和实验研究,认为这一新型的抛光方法在精密加工上是可行的,能够达到去除工件材料,提高表面质量的目的。     

超声振动辅助磨料流抛光技术研究综述

抛光加工是实现高性能零件最终表面质量要求的重要的方法.超声振动辅助磨料流抛光是磨料流抛光与超声振动相结合的复合抛光技术,在光学玻璃、蓝宝石、单晶硅、陶瓷等硬脆性材料抛光和金属材料零件复杂表面的抛光加工中具有独特的优势,可以有效地提高表面质量和抛光效率.对近年来的技术发展进行了总结,对抛光加工基本原理研究、材料去除微观机理研究、抛光工艺方法分类及应用等方面进行了系统的论述和分析.指出了这一技术当前的研究热点和需要解决的关键问题,对今后的研究、应用和发展给出了建议和展望.     

流体二维振动超精密抛光实验研究#

基于流体二维振动超精密抛光方法对石英玻璃进行了抛光实验研究,将超声波作为振动源,驱动抛光液在水平和垂直两个方向耦合振动实现对工件的抛光。测试了振动场中的声强,讨论了不同输入电压对声强的影响。分析了不同流场状态、工件装夹方式、磨料粒度以及抛光时间对抛光效果的影响,并得出了一些基本规律。     

光学材料无磨料低温抛光的试验研究

将无磨料抛光与低温抛光结合起来,首次提出一种可获得原子级超光滑表面的新方法——无磨料低温抛光。这种新工艺可使光学材料获得Ra<1nm的原子级超光滑表面,通过大量的试验,系统研究了抛光盘水质、抛光前修盘时间、抛光压力和偏心等对已加工表面粗糙度的影响规律。结果表明,这种抛光工艺能获得原子级的超光滑表面。     

超声辐射醇水体系制备纳米CeO2粉体及其抛光性能研究

在超声辐射条件下,使用正丁醇/水反应体系通过均相沉淀法制备了纳米CeO2粉体;将所制备的纳米CeO2粉体作为磨料对硅晶片进行抛光,用原子力显微镜观察抛光表面的微观形貌并测量表面粗糙度;研究了超声场以及醇/水反应体系对纳米CeO2粉体粒径和团聚情况的影响,考察了纳米CeO2磨料对硅晶片的抛光效果。结果表明:超声辐射以及醇/水反应体系均有利于制备出粒径更小,且分散性更好的纳米CeO2粉体;使用纳米CeO2磨料抛光的硅晶片表面最终在2μm×2μm范围内的微观粗糙度值为Ra0.108nm,而且抛光表面非常平整。     

电解磨料喷射复合抛光工艺的研究与应用

研究了电解磨料喷射复合抛光新工艺及抛光特点，并应用于模具抛光。     

脉冲磁场辅助磁性复合磨粒化学机械抛光技术及其加工试验研究

提出一种脉冲磁场辅助新型磁性复合磨粒化学机械抛光技术。该技术利用磁性聚合物微球与SiO2磨粒组成的复合磨粒抛光液,在脉冲磁场辅助作用下,实现磨粒尺寸对硬质抛光盘微观形貌依赖性小、磨粒易进入抛光区域、材料去除率较高的抛光。设计了“之”字形的对位式结构电磁铁,模拟计算表明其磁感应强度沿抛光平面分布均匀,磁性微球受到的磁力一致性好。磁性微球在抛光系统中的受力分析表明：磁性微球受磁力作用时有利于复合磨粒从近抛光区进入抛光区,以二体磨损的方式去除加工表面;磁性微球不受磁力作用时,复合磨粒随抛光液的流动而移动,避免大量聚集形成磁链。以表面粗糙度Ra=1.1μm的硬质抛光盘进行硅片抛光试验,施加不同频率和占空比的脉冲磁场前后,硅片的去除率从137nm/min提高到288nm/min,频率5Hz、占空比50%时获得最大值,硅片表面粗糙度由抛光前Ra=405nm减小到Ra=0.641nm。     

MECHANOCHEMICAL POLISHING OF ENGINEERING CERAMICS

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电流变抛光工艺研究

研究了电流变抛光工艺参数对工件表面粗糙度的影响。用SiC和Al2O3磨料分别对硬质合金和光学玻璃进行了抛光试验，考察了抛光时间、工具电极转速、电源电压、磨料浓度等工艺参数影响工件表面粗糙度的规律。试验结果表明，随着抛光时间、工具电极转速、电源电压的增加，工件表面粗糙度逐渐降低。随着磨料浓度增加，工件表面粗糙度先降低后升高。对于表面粗糙度而言，磨料浓度存在一个最佳值。     

Precise mechanical polishing of brittle materials with free diamond abrasives dispersed in micro–nano-bubble water

We have studied the effects of using water containing micro–nano-bubbles (MNB water) as the solution in which the diamond abrasives with a mean diameter of 0.5 μm are dispersed for the polishing slurry used in the precise mechanical polishing (PMP) of brittle material of GaN. While the formation of small number of clusters of abrasives was seen in the MNB water, the abrasives were basically well dispersed, which were almost comparable to that in pure water with a dispersion agent such as ethylene glycol. Since flocculation was observed for dispersion in pure-water without the addition of the dispersion agent, it was found that MNBs have dispersion effect for micro-sized abrasive particles. Regarding the polishing properties of GaN substrate with the MNB water based polishing slurry, we observed a remarkable increase in the removal rate with no additional surface or subsurface degradation. Additionally, we observed a significantly reduced subsurface damage (SSD) for chemically weak N-face of GaN substrate. It was suggested that these observed effects were most probably a result of the cluster formation in the MNB water and the chemical effect in relation to high energy generation through bubble collapse, respectively.     

CMP behavior of alumina/metatitanic acid core–shell abrasives on sapphire substrates

The abrasive is one of the important influencing factors during the chemical mechanical polishing (CMP) process. Although α-alumina is one of the most commonly used sapphire polishing abrasives due to its high hardness, it often results in surface damage. To receive lower surface roughness and high material removal rate, a common approach is to modify the surface of alumina. In this work, a series of alumina/metatitanic acid composite abrasives with core–shell structure were synthesized. The CMP performances of the pure alumina and alumina/metatitanic acid core–shell abrasives on sapphire substrates were investigated after polishing under the same conditions. Experimental results indicate that the alumina/metatitanic acid core–shell abrasives can not only improve the surface quality, but also further enhance the material removal rate. Furthermore, through the X-ray photoelectron spectroscopy test, this study investigated the chemical effect mechanism of the alumina/metatitanic acid core–shell abrasives in sapphire CMP. The results show that solid-state chemical reactions occur between metatitanic acid shell and sapphire surface during CMP process. We also investigated the mechanical friction mechanism through abrasive wear and adhesive wear.     

Polishing of Ultra-clean Inner Surfaces Using Magnetic Force

In this study, an internal polishing system using magnetic force was developed for the production of ultra-clean tubes with average surface roughness ranging from 0.02 _m to 0.05 _m or less, and the application of magnetic abrasives composed of WC/Co powder was developed. After finding the optimal conditions, machining characteristics using newly developed abrasives ware analysed. From the results obtained by the experimental design method, optimal polishing conditions were analysed.     

凝胶结合剂磨粒工具制备及其磨抛性能研究

提出基于溶胶凝胶原理制备大面积细粒度磨削与抛光工具的方法。比较了凝胶结合剂工具与烧结式金属结合剂工具在分散细粒度磨粒方面的效果,并将所制备的凝胶工具用于单晶硅片和天然石材的磨抛加工。结果表明,凝胶工具中磨粒分散的均匀性较烧结式工具有明显改善。与游离磨料加工相比,采用凝胶工具的磨抛加工能够更加高效率地获得更低粗糙度的单晶硅片表面。凝胶工具在加工硬质花岗石材时的材料去除能力不足。但是,在加工大理石材料时能够获得满意的表面光泽度。在初期磨抛阶段,凝胶工具磨损以磨粒磨损方式为主,随着加工过程的进行,会出现一定程度的磨料脱落。     

PERFORMANCE CHARACTERIZATION OF CERIUM OXIDE ABRASIVES FOR CHEMICAL-MECHANICAL POLISHING OF GLASS

Investigation of the nature of chemomechanical polishing (CMP) for glass requires an in-depth knowledge of the influences of abrasive physical properties and slurry chemistry. In the present work, eight cerium oxide abrasives were used to polish fused silica on a polyurethane pad. Results from pre-polished surfaces re-polished in aqueous and non-aqueous suspensions and from corrosion testing of solutions recovered from abrasive suspensions were used to discern chemical, chemomechanical, and mechanical equivalents for each abrasive. Performance indices (i.eabrasive quality values) were generated from the equivalents and related to conventional polishing of lapped surfaces. Optimally performing abrasives were found to require a balance of equivalents (i.eset ratio) as dictated by inherent chemical activities, heat treatments, and milling. From solution chemistry testing, particle/workpiece attraction via surface charge was found to increase the chemomechanical effect. The CMP mechanism is concluded to be a chemical reaction at the particle/workpiece interface promoted primarily by mechanical interactions such as abrasion, with both cerium oxide and rare-earth oxyfluoride constituents promoting the reaction.     

不锈钢电解—机械复合抛光新工艺的研究

在电解加工和机械研磨的基础上，把电解阳极溶解与合成纤维无纺布上所粘结磨料的研磨有机地结合起来，试验了一种新的不锈钢电解机械复合抛光法，并总结了较合理的工艺参数，不锈钢表面的短时间的抛光加工后，表面光洁度可接近镜面。     

集成电路制造中的固结磨料化学机械抛光技术研究

经过对传统化学机械抛光技术的研究与分析，指出了目前ULSI制造中使用的传统化学机械抛光技术的缺点，通过对固结磨料化学机械抛光中的抛光垫结构、抛光机原理及抛光液的分析，得出了固结磨料化学饥械抛光技术的优点，同时还对硅片固结磨料化学机械抛光的缺陷进行了研究。