PP/滑石粉导热绝缘复合材料的制备与性能研究

采用聚丙烯(PP)为基体,不同粒径滑石粉为填料,通过双螺杆挤出机挤出制备导热绝缘的PP滑石粉复合材料。在滑石粉用量为3O%的条件下,探讨了粒径分别为3.6,6,12,30,50 μm的滑石粉对PP猾石粉复合材料的热导率、体积电阻率、力学性能和结晶性能的影响。结果表明,随着滑石粉粒径的减小,复合材料的拉伸强度和弯曲强度呈先增大后减小的变化趋势,而其热导率则呈先减小后增大的变化趋势。填充粒径为12μm的滑石粉时,复合材料的拉伸强度和弯曲强度达到最大值,分别为29.92MPa和52.58MPa,比纯PP分别提高了5.5%和12.8%。填充粒径为50μm的滑石粉时,复合材料的热导率最大,达到0.3237W/(m*K),比纯PP提高了32.7%。填充1:l的粒径为12μm和30μm滑石粉混合物时,PP复合材料的热导率为0.3184W/(m*K),高于相应的填充单一粒径滑石粉的PP复合材料。此外,所制备的PP滑石粉复合材料的体积电阻率均大于10^8Ω*cm     

Silicon Carbide Whisker‐Reinforced Ceramic Tape for High‐Power Components

An attempt to enhance both mechanical strength and thermal conductivity of glass‐based tapes is described. Flexural strength of ~420 MPa and thermal conductivity of ~10.3 W/m/K have been achieved in fully densified tape comprising calcium aluminoborosilicate glass, aluminum nitride, and silicon carbide whiskers. Silicon carbide whiskers aligned parallel to the casting direction contributed significantly to the reinforcement of the microstructure with accompanying extensive densification over a broad temperature range. These results are compared with the more typical alumina filler substituted for the aluminum nitride.     

Deposition of large area high quality diamond wafers with high growth rate by DC arc plasma jet

We have successfully developed a system for deposition of large area diamond films by a DC arc plasma jet operated in gas recycling mode. In the present paper, the influence of substrate temperature, methane concentration, flow rate of feeding gas and the input power of the jet for diamond film deposition is presented. Deposition of a large area of uniform thickness high quality diamond wafer of Φ65 mm in diameter at a growth rate of 15 μm/h is reported. The thickness of the wafer is 0.7 mm and the thermal conductivity can be 18.1 W/cm K.     

Thermal conductivity of diamond composites sintered under high pressures

Thermal conductivity at room temperature of diamond composites of two types: with a diamond skeleton and with diamond grains imbedded in a non-diamond matrix was evaluated in dependence of the diamond grain size (d) varied from a ten of microns to 500 μm. The thermal conductivity of the compacts with diamond skeleton obtained in the Cu–diamond system at high pressure of 8 GPa strongly increases with diamond particles size approaching the maximum value of 9 W/cm K at d ≈ 200 μm. The compacts sintered in the Cu–Ti–diamond, Al–Si–diamond and Si–diamond systems at lower pressure (2 GPa) are formed predominantly owing to the presence of the binder. It was found for these conditions that the thermal conductivity is less sensitive to the diamond grain size, reaching the value of 6 W/cm K for the composites with SiC–Si matrix.     

BN填充PA6基导热绝缘复合材料导热性能研究

以聚酰胺6（PA6）为基体, 氮化硼（BN）作为导热填料,经双螺杆挤出机熔融共混,模压成型制得导热绝缘复合材料。研究了BN含量、粒径、形状和不同BN粒径复配对复合材料导热性能的影响,并研究了BN含量和粒径对复合材料绝缘性能的影响。结果表明,在各种粒径下,复合材料热导率均随BN填充量的增加而增大;在BN粒径为5 μm、填充量为25 %（体积分数,下同）时,复合材料热导率达到1.2187 W/(m·K);在BN填充量相同时,填料粒径对复合材料热导率的影响不是简单的单调规律,呈现50、100 μm时较小,1、5、15 μm时较大,150 μm时最大的规律;片状BN填料比球状BN填料更有利于提高复合材料的热导率;2种不同粒径填料复配所填充的复合材料的热导率大于单一粒径填充的复合材料;5 μm与150 μm粒径BN复配,在填充量为20 %,配比为1:3时,复合材料的热导率最大,达到1.3753 W/(m·K),为纯PA6的4.9倍;在不同BN含量和粒径下,复合材料体积电阻率均能达到10000000000000 Ω·cm以上,满足绝缘性能。     

Effect of Vapor—Liquid—Solid and Vapor—solid Silicon Carbide Whiskers on the Effective Thermal Diffusivity/Conductivity of Silicon Nitride Matrix Composites

A study was conducted of the relative effect of vapor—liquid—solid (VLS) and vapor—solid (VS) SiC whiskers on the effective thermal diffusivity and conductivity of pressed-densified silicon nitride. It was found that VLS whiskers cause an increase in the thermal diffusivity/conductivity, whereas the opposite effect was found for the VS-SiC whiskers. Comparison with composite theory suggests that the VS-SiC whiskers have a thermal conductivity as low as 25 to 30 W/(m·K). In contrast the VLS-SiC whiskers appear to have a value for the thermal conductivity of at least about 100 W/(m·K) to as high as 250 W/(m·K). These large differences in thermal conductivity for these two types of SiC whiskers are attributed to the much larger density of structural defects in the VS-SiC whiskers, which act as phonon scatterers, thereby lowering the thermal conductivity.     

空心玻璃微球隔热保温板的制备及其理化特性

将空心玻璃微球（hollow glass microspheres,HGM）与饱和硝酸铝溶液混合,经520℃保温30min热处理后制备出刚性保温板。测试了保温板的导热系数、抗压强度和燃烧性能,讨论了HGM粒子密度和平均粒径对保温板导热系数的影响。结果表明：保温板的导热系数随HGM粒子密度的下降而降低,当粒子的粒子密度为0.18 g/cm3时,保温板的导热系数为0.072 W/（m.K）,抗压强度为2.2 MPa;当HGM的平均粒径小于30μm时,保温板的实测导热系数与Dul＇nev提出的预测方程的计算结果相接近,HGM保温板的燃烧性能达到A1级不燃材料要求,可满足建筑保温和防火的要求。     

水泥窑用特种硅莫砖的研制及应用

以高铝矾土熟料、90碳化硅、棕刚玉为主要原料,添加红柱石粉、广西白泥等外加剂,通过合理的颗粒级配,采用高压成型、高温烧成等方法,制备出水泥窑用特种硅莫砖,并研究了烧成后试样的体积密度、气孔率、强度、微观结构和耐磨性.结果表明:添加6％红柱石粉在1420℃制备的硅莫砖的性能最优,其体积密度为2.74 g/cm3,抗热震性30次,磨损量为1.06 cm3,热导率为1.65 W/(m·K),耐压强度高达159 MPa,在5000 t/d水泥回转窑过渡带上使用该产品,寿命可达一年以上,这是由于窑简体外表面温度比使用镁尖晶石砖平均降低80℃以上,极为有效地延长了该砖衬的使用寿命.     

Thermophysical Properties of ZrB2 and ZrB2–SiC Ceramics

Thermophysical properties were investigated for zirconium diboride (ZrB₂) and ZrB₂–30 vol% silicon carbide (SiC) ceramics. Thermal conductivities were calculated from measured thermal diffusivities, heat capacities, and densities. The thermal conductivity of ZrB₂ increased from 56 W (m K)⁻¹ at room temperature to 67 W (m K)⁻¹ at 1675 K, whereas the thermal conductivity of ZrB₂–SiC decreased from 62 to 56 W (m K)⁻¹ over the same temperature range. Electron and phonon contributions to thermal conductivity were determined using electrical resistivity measurements and were used, along with grain size models, to explain the observed trends. The results are compared with previously reported thermal conductivities for ZrB₂ and ZrB₂–SiC.     

甲基乙烯基硅橡胶导热复合材料的研究与制备

以甲基乙烯基硅橡胶为基体树脂,不同粒径碳化硅(SiC)和碳纤维(CF)复配作为填料,经开炼后模压硫化成型制得高导热复合材料。利用热流法导热系数测试仪(DRL-II)、扫描电子显微镜(SEM)对复合材料的导热性能、微观结构、力学性能进行了表征。结果表明：碳化硅和碳纤维能够均匀的分散在基体树脂中,不同粒径的碳化硅复配能使复合材料的导热性能进一步提高,导热系数达到1.28w/(m.k)。加入碳纤维不仅能使基体内部形成串联的导热网链,进一步提高基体树脂的导热性能,使复合材料的导热系数达到1.88w/(m.k),同时提高了复合材料的拉伸强度。     

高导热高介电BT/SiC/PA6复合材料的制备及性能研究

以聚酰胺(PA6)为基体,氮化硅(SiC)为导热填料,钛酸钡(BT)为介电填料,通过热压法制备出系列复合材料;研究了不同粒径填料的搭配对材料导热与介电性能的影响。结果表明:在填充量较低时,使用混合粒径导热填料能产生一定的级配效应,从而提高复合材料的导热性能。总填充量为26%时,以4∶1的比例,用粒径为0.5~0.7μm和3μm的SiC共同填充PA6,制备获得了最高导热系数为0.9198W/(m·K)的复合材料,而不同粒径、不同功能的混合功能填料还能产生协同效应,进一步提升材料的导热性能并使材料同时获得较好的介电性能,当SiC填充量为20%,BT填充量为20%时,复合材料的导热系数达到1.1110W/(m·K),介电常数到达16(100Hz),损耗保持在0.075(100Hz)左右。     

碳纳米管-膨胀石墨/环氧树脂复合材料的导热性能

在环氧树脂中添加多壁碳纳米管和膨胀石墨作为填料,以提高环氧树脂的导热性能. 结果表明,添加0.5wt%多壁碳纳米管时,环氧树脂的最佳导热系数为0.3448 W/(m?K),比不添加时提高30%;添加0.75wt%羧基改性多壁碳纳米管时,环氧树脂的最佳导热系数为0.3813 W/(m?K),比添不加时提高40%;同时添加多壁碳纳米管和膨胀石墨后,环氧树脂导热系数可进一步提高到0.4039 W/(m?K),表明在环氧树脂中添加混合填料,二者可在环氧树脂中形成有效的导热网络,能进一步提高聚合物的导热性能.     

碳纳米管材料导热性能的实验研究

本文对碳纳米管与环氧树脂(Epoxy-EP)复合材料的导热性能进行了定量的研究,探索了CNTs/EP复合材料的制备方法,运用Hotdisk热常数分析仪研究了CNTs/EP复合材料的导热系数;利用CNTs/EP两相复合材料的导热理论模型得到了室温下单壁碳纳米管(Single-Wall Carbon Nanotubes-SWCNTs)的导热系数为3980 W/(m.K),双壁碳纳米管的导热系数(Double-Wall Carbon Nanotubes-DWCNTs)为3580 W/(m.K),以及多壁碳纳米管(Multi-Wall Carbon Nanotubes-MWCNTs)的导热系数为2860 W/(m.K)。     

Characterization of B4C-SiC ceramic composites prepared by ultra-high pressure sintering

Additive-free boron carbide (B₄C) – silicon carbide (SiC) ceramic composites with different B₄C and β-SiC powders ratio were densified using the high-pressure “anvil-type with hollows” apparatus at 1500 °C under a pressure of 4 GPa for 60 s in air. The effect of starting powders ratio on the composites sintering behavior, relative density, microstructural development, and thermomechanical properties was studied. The sintered samples hardness was found to be in the range from 24 to 31 GPa. The thermal conductivity measurements, conducted in the temperature range from room temperature to 1000 °C, showed that the thermal diffusivity of sintered samples was between 6 and 9.5 mm²/s whereas the thermal conductivity was in the range from 16 to 28 W/(m K). The results of this study show that the high-pressure sintering can be a very effective low-temperature densification method for the obtainment of additive-free B₄C - β-SiC ceramic composites.     

高热导率聚丙烯/石墨复合材料的制备与性能

为了提高聚丙烯(PP)的导热性能,扩大其使用范围,采用价格低廉的商用石墨对PP进行改性,利用转矩流变仪制备了PP/石墨导热复合材料。研究了粒径为2μm和20μm的石墨及其复配对复合材料热导率及力学性能的影响。结果表明,复合材料的热导率随着石墨用量的增加而显著增大,20μm石墨填充的复合材料热导率高于2μm石墨填充的复合材料;由于石墨的各向异性,层内热导率远高于层间热导率;将两种粒径的石墨复配,固定石墨总质量分数为40%,当2μm石墨与20μm石墨质量比为1︰5时,复合材料层间和层内热导率达到最大,分别为1.125 W/(m·K)和2.897 W/(m·K),比相同用量下单一2μm石墨填充PP分别提高了121%和61%,比单一20μm石墨填充PP分别提高了3.6%和20%。随石墨用量增加,单一粒径石墨填充的复合材料拉伸强度和弯曲强度呈现先减小后增大的趋势,随复配填料中20μm石墨用量增加,复配填料填充复合材料的力学性能呈下降趋势,但弯曲强度变化不大,拉伸强度也在10 MPa以上。     

Flexible graphite modified by carbon black paste for use as a thermal interface material

Polyol-ester-based carbon black pastes are used to either coat or penetrate flexible graphite, thereby increasing the thermal contact conductance of flexible graphite between copper surfaces. Paste penetration by up to an effective paste thickness (the volume of the penetrated paste divided by the geometric area of the flexible graphite) of 5 μm increases the conductance by up to 350%, 98% and 36% for thicknesses of 50, 130 and 300 μm, respectively. Paste coating up to 10 μm increases the conductance by up to 200%, 120% and 65% for thicknesses of 50, 130 and 300 μm, respectively. The paste penetration is more effective than the paste coating in enhancing the conductance, when the thickness is below 130 μm. At thickness ?130 μm, paste penetration and paste coating are similarly effective. These results stem from the relatively low interfacial thermal resistivity provided by paste penetration and the relatively high through-thickness thermal conductivity provided by paste coating. Paste penetration decreases the thermal conductivity of flexible graphite, but paste coating does not affect the conductivity. Both penetration and coating decrease the interfacial resistivity. The highest thermal contact conductance is 1.4 × 10⁵ W/m² K, as provided by paste-penetrated flexible graphite of thickness 26 μm.     

耐高温导热绝缘粘接涂层的研究

以丙烯酸酯单体、乙烯基硅油等为主要原料,合成出一种有机硅改性丙烯酸酯乳液;然后将表面处理过的氮化硼(BN)和助剂等加入到上述乳液中,制成导热绝缘型水性粘接涂层。结果表明:该粘接涂层既有利于电气场合的绝缘导热,又解决了传统粘接涂层的溶剂污染问题;当w(BN)=15%时,材料的综合性能较好,其导热性能[热导率为0.955 W/(m·K)]优于不含BN体系[0.210 W/(m·K)]、体积电阻率和表面电阻率分别为1.57×1013Ω.cm和0.75×1013Ω、拉伸强度为72 MPa、断裂伸长率为380%、水中浸泡120 h后的吸水率仅为10.88%且可在200℃以下长期使用。     

Microstructure and thermal conductivity of fully ceramic microencapsulated fuel fabricated by spark plasma sintering

Fully ceramic microencapsulated pellet (FCM), consisting of tristructural isotropic (TRISO) particles embedded in silicon carbide (SiC) matrix, was fabricated using spark plasma sintering. The parameters affecting the densification of SiC matrix were first investigated, and then FCM pellets were prepared using TRISO particles with/without outer pyrolytic carbon (OPyC) layer. Effects of thermal exposure on the TRISO particles during SPS were evaluated. In addition, the thermal condcutvitities of FCM pellet, as well as the SiC matrix, were measured using laser flash. It was revealed that the TRISO particles with OPyC layers significantly lower the thermal conductivity of FCM pellet. Based on Maxwell‐Eucken model, the predicted effective thermal conductivities of TRISO particles with/without OPyC layers were 14.4 W/m K and 25.2 W/m K, respectively. Finite elements simulation indicated that the SiC layer in TRISO particle plays a dominant role on the thermal conductivity of FCM. The presence of OPyC layers would generate gaps/porous SiC near the interface and resist the heat flows, leading to a lower thermal conductivity of FCM.     

高导热苯乙烯丙烯酸树脂复合材料制备及导热性能

苯乙烯丙烯酸树脂为墨粉主要组分,其导热性能提升可显著提高墨粉导热性能,进而延长打印、复印机使用寿命。通过在苯乙烯丙烯酸树脂中添加碳纳米管、石墨烯高导热单一或复合填料,在苯乙烯丙烯酸树脂构建连通导热网络以提高其导热性能。当苯乙烯丙烯酸树脂中添加0.75wt%多壁碳纳米管时,其导热系数可提高至0.1644 W/(m?K),增幅为31.31%;添加1.0wt%羧基改性多壁碳纳米管时,苯乙烯丙烯酸树脂导热系数可提高至0.1751 W/(m?K),增幅为39.86%;在苯乙烯丙烯酸树脂添加多壁羧基改性碳纳米管和石墨烯混合填料时,苯乙烯丙烯酸树脂导热系数可提升至0.2093 W/(m?K),增幅达到67.17%。表明碳纳米管和石墨烯混合填料可在苯乙烯丙烯酸树脂中形成有效的导热网络,从而显著提高苯乙烯丙烯酸树脂导热性能。     

Thermal and electrical properties of a high entropy carbide (Ta,Hf, Nb,Zr) at elevated temperatures

The thermal and electrical properties were measured for a high entropy carbide ceramic, consisting of (Hf, Ta, Zr, Nb)C. The ceramic was produced by spark plasma sintering a mixture of the monocarbides and had a relative density of more than 97.6%. The resulting ceramic was chemically homogeneous as a single-phase solid solution formed from the constituent carbides. The thermal diffusivity (0.045–0.087 cm²/s) and heat capacity (0.23–0.44 J/g•K) were measured from room temperature up to 2000°C. The thermal conductivity increased from 10.7 W/m•K at room temperature to 39.9 W/m•K at 2000°C. The phonon and electron contributions to the thermal conductivity were investigated, which showed that the increase in thermal conductivity was predominantly due to the electron contribution, while the phonon contribution was independent of temperature. The electrical resistivity increased from 80.9 μΩ•cm at room temperature to 114.1 μΩ•cm at 800°C.