Silicon-containing fluorenylacetylene resins with low curing temperature and high thermal stability

Silicon-containing arylacetylene resins (PSAs) are promising thermal stability polymers for many applications. However, the controllability of curing reaction limited their application because of the high curing temperature and enthalpy. In this study, Materials Genome Initiative was utilized to screen out a target monomer, 2,7-diethynyl-9H-fluorene (DEF), for design of new PSAs with low curing temperature and enthalpy. After incorporation of DEF, the obtained silicon-containing fluorenylacetylene resins (PSA-VBF) could be cured at a lower temperature of 149.2 °C with lower enthalpy (239.8 J g⁻¹) than the reported PSA-V (190.0 °C, 368.3 J g⁻¹). Moreover, the thermal curing behavior and mechanism were investigated by differential scanning calorimetry, Fourier transform infrared, and pyrolysis-gas chromatography–mass spectrometry. The results revealed that with the increased of DEF, the curing reaction of PSA-VBF became dominated by Diels–Alder reaction. And the formed aromatic fused rings endowed the cured PSA-VBF with excellent thermal stability, which were proved by thermogravimetric analysis results that the temperature at 5% weight loss (T_d5) of the cured copolymers ranged from 630 to 639 °C, and the char yield at 1000 °C was above 90%. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 48262.     

Study on the copolymers of silicon-containing arylacetylene resin and acetylene-functional benzoxazine

An acetylene-functional benzoxazine (AFBEN) which was used to modify poly(dimethylsilyleneethynylenephenyleneethynylene) (DMSEPE) was synthesized by a solventless procedure. The modified resins (DMSEPE/AFBEN) were obtained by blending DMSEPE and AFBEN in different amount. The thermopolymerization of DMSEPE/AFBEN resins were investigated by DSC technique. The dynamic mechanical analysis showed that the storage modulus (E) of the cured DMSEPE/AFBEN resin containing less than 30 wt% AFBEN did not decrease at the temperature lower than 500 °C. When the AFBEN loading increased from 20 to 100 wt%, a decrease in glass transition temperature from 523 to 342 °C was observed. The thermal stability of the cured DMSEPE/AFBEN resins was determined by thermogravimetric analysis (TGA) in N₂ and air. The TGA results showed the cured DMSEPE/AFBEN resins had good thermal stability. The carbon fiber (T700) reinforced DMSEPE/AFBEN composites exhibited excellent mechanical properties (flexural strength: 1,694 MPa) at room temperature and high strength remaining of 76% at 300 °C.     

Synthesis of novolac‐type phenolic resins using glucose as the substitute for formaldehyde

Novel Novolac type phenolic resins were prepared using glucose as the substitute for toxic formaldehyde (a carcinogenic chemical). The resins were synthesized with varying molar ratios of phenol to glucose, catalyzed by strong acid (such as sulfuric acid) at 120–150°C. Analysis of the resins using gel permeation chromatography (GPC) and proton nuclear magnetic resonance (¹H‐NMR) showed that they were broadly distributed oligomers derived from the Fridel‐Crafts condensation of phenol and glucose. Using hexamethylenetetramine (HMTA) as the curing agent, the phenol‐glucose resins could be thermally cured and exhibited exothermic peaks at 130–180°C, typical of thermosetting phenolic resins. The cured resins showed satisfactory thermal stability, e.g., they started to decompose at >280°C with residual carbon yields of above 58% at 600°C. Based on the thermal properties, phenol‐glucose resin with a molar ratio of 1 : 0.5 is promising as it could be cured at a lower temperature (147°C) and exhibited a satisfactorily good thermal stability: it started to decompose at >300°C with a residual carbon yield of >64% at 600°C. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Preparation of cardanol–formaldehyde resins from cashew nut shell liquid for the reinforcement of natural rubber

Natural rubber was reinforced with a high loading of a cardanol–formaldehyde resin prepared from cashew nut shell liquid. Cardanol–formaldehyde resins, both resoles and novolaks, were synthesized from cardanol, which was extracted from cashew nut shells. This was done by the condensation polymerization of cardanol and formaldehyde in the presence of base and acid catalysts. The cardanol–formaldehyde resole with the highest yield (ca. 75%) was prepared with a formaldehyde/cardanol molar ratio of 2.0 at pH 8.0 and 90°C for 8 h. The cardanol–formaldehyde novolak with the highest yield (ca. 80%) was prepared with a formaldehyde/cardanol molar ratio of 0.8 at pH 2.2 and 100°C for 7 h. Fourier transform infrared and ¹³C‐NMR were employed to characterize the chemical structures of the obtained cardanol–formaldehyde resins. The resins were compatible with natural rubber in various formulations. The cured behaviors of natural rubber blended with the cardanol–formaldehyde resole and novolak resins were investigated. The cured behaviors of cardanol–formaldehyde resole and cardanol–formaldehyde novolak samples were different, reflecting differences in their chemical reactivities. Furthermore, the incorporation of cardanol–formaldehyde resins into natural rubber provided significant improvements in mechanical properties such as the hardness, tensile strength, modulus at 100 and 300% elongation, and abrasion resistance. However, the elongation at break and compression set of the blends decreased as expected. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 1997–2002, 2007     

Star-shaped silicon-containing arylacetylene resin based on a one-pot synthesis using zinc powder catalysis with improved processing and thermal properties

Herein, reporting a simple, sustainable, and cost-effective chemical synthesis of a star-shaped silicon-containing arylacetylene (SSA) resin via a one-pot process using zinc powder as a catalyst. The as-prepared viscous liquid resins exhibited moderate rheological behavior. The thermal curing temperature was determined to be 203 °C using differential scanning calorimetry, which is much lower than that reported for polyimide and phthalonitrile (>300 °C), indicating the SSA resins are suitable for processing at a lower temperature. Thermogravimetric analysis also revealed the excellent thermal stability and extremely high carbon residue of the cured SSA resin (the temperature at 5% mass loss and residual yield at 800 °C under N₂ were 654 °C and 93%, respectively). The results showed the excellent processability and thermal stability of SSA resin. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 48248.     

Bio-based thermosetting bismaleimide resins using eugenol,bieugenol and eugenol novolac

5,5′-Bieugenol (BEG) and eugenol novolac (EGN) were synthesized by the oxidative coupling reaction of eugenol (EG) and the addition–condensation reaction of EG with formaldehyde, respectively. The EG, BEG and EGN were prepolymerized with 4,4′-bismaleimidediphenylmethane (BMI) at 180 °C and then compression-molded at finally 250 °C for 6 h to produce cured EG/BMI (EB), BEG/BMI (BB) and EGN/BMI (NB) resins with eugenol/maleimide unit ratios of 1/1, 1/2 and 1/3. The FT-IR analysis of EBs and ¹³C NMR analysis of the model reaction product of EG/N-phenylmaleimide (PMI) 1/3 at 200 °C for 12 h suggested that the ene reaction and subsequent Diels-Alder/ene reactions mainly occurred for EBs. The FT-IR analyses of BBs and NBs supported the occurrence of ene reaction and subsequent thermal addition copolymerization in a similar manner to the well-known curing reaction of 2,2′-diallylbisphenol A and BMI. The glass transition temperature (T_g) and 5% weight loss temperature (T₅) of the cured resin increased with increasing BMI content, and EB 1/3 showed the highest T_g 377 °C and T₅ 475 °C. The flexural strengths and moduli of EBs and NBs were higher than those of BBs, and EB 1/2 showed the most balanced flexural strength and modulus (84.5 MPa and 2.75 GPa). The FE-SEM analysis revealed that there is no phase separation for all the cured resins.     

Effect of the NCO/OH ratio on the properties of Mesua Ferrea L. seed oil‐modified polyurethane resins

A series of polyurethane resins with varying NCO/OH ratios (0.8–2.0) has been synthesized from the monoglyceride of Mesua Ferrea L. seed oil, poly(ethylene glycol) (M_n, 200 g mol^?1) and 2,4‐toluene diisocyanate in the presence of dibutyl tin dilaurate as the catalyst. The effects of the NCO/OH ratios of the synthesized resins on the physical properties, such as hydroxy values, acid values, saponification values, iodine values, specific gravities and isocyanate values have been studied. The formation of the polyurethane resins was confirmed by viscosity measurements, and FTIR, UV and ¹H NMR spectroscopic studies. Performance characteristics, such as impact resistance, flexibility, gloss, hardness, adhesive strength and chemical resistance, of the cured resins were investigated as a function of the varying NCO/OH ratios, with an influence of these ratios being observed for most of the above properties. Thermogravimetric analysis (TGA) demonstrated that the thermal stabilities of the cured resins increased with an increase in the NCO/OH ratios. The amounts of char residues at 550 °C were also found to be greater for higher NCO/OH ratios of the oil‐modified polyurethane resins. Copyright © 2005 Society of Chemical Industry     

Comparison of microwave and thermal cure of epoxy–anhydride resins: Mechanical properties and dynamic characteristics

The objective of this work was to compare the mechanical properties of epoxy resins cured by thermal heating and microwave heating. Epoxy–anhydride (100:80) resins were cured in a domestic microwave oven and in a thermal oven. The hardening agents included methyl tetrahydrophthalic anhydride and methyl hexahydrophthalic anhydride. Three types of accelerators were employed. Thermal curing was performed at 150°C for 20 and 14 min for resins containing 1 and 4% accelerator, respectively. Microwave curing was carried out at a low power (207 or 276 W) for 10, 14, and 20 min. All cured resins were investigated with respect to their tensile properties, notched Izod impact resistance, and flexural properties (three‐point bending) according to ASTM standards. The tan δ and activation energy values were investigated with dynamic mechanical thermal analysis, and the extent of conversion was determined with differential scanning calorimetry. The differences in the mechanical properties of the thermally cured and microwave‐cured samples depended on the resin formulation and properties. Equivalent or better mechanical properties were obtained by microwave curing, in comparison with those obtained by thermal curing. Microwave curing also provided a shorter cure time and an equivalent degree of conversion. The glass‐transition temperatures (tan δ) of the thermally and microwave‐cured resins were comparable, and their activation energies were in the range of 327–521 kJ/mol. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 97: 1442–1461, 2005     

Phosphorous‐containing epoxy resins from a novel synthesis route

The ? P(O)‐H in 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) was used as an active group to react with the carbonyl group in 4,4′‐dihydroxybenzophenone (DHBP) to result a novel phosphorous‐containing biphenol compound (DOPO‐2OH). Phosphorous‐containing epoxy resins were therefore obtained from reacting DOPO‐2OH with epichlorohydrin or with diglycidylether bisphenol A. The synthesized compounds were characterized with FTIR, ¹H and ³¹P NMR, elemental analysis, and epoxide equivalent weight titration to demonstrate the their chemical structures. Cured epoxy resins were prepared via thermal curing the epoxy resins with various curing agents. Thermal analysis results (differential scanning calorimetry and thermogravimetric analysis) revealed that these cured epoxy resins exhibited high glass transition temperatures and high thermal stability. High char yields at 700°C and high LOI (limited oxygen index) values were also found for the cured epoxy resins to imply that the resins were possessing high flame retardancy. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 1697–1701, 2002     

Phenolic‐epoxy matrix curable by click chemistry—synthesis,curing, and syntactic foam composite properties

Alkyne functional phenolic resin was cured by azide functional epoxy resins making use of alkyne‐azide click reaction. For this, propargylated novolac (PN) was reacted with bisphenol A bisazide (BABA) and azido hydroxy propyloxy novolac (AHPN) leading to triazole‐linked phenolic‐epoxy networks. The click cure reaction was initiated at 40–65°C in presence of Cu₂I₂. Glass transition temperature (Tg) of the cured networks varied from 70°C to 75°C in the case of BABA‐PN and 75°C to 80°C in the case of AHPN‐PN. DSC and rheological studies revealed a single stage curing pattern for both the systems. The cured BABA‐PN and AHPN‐PN blends showed mass loss above 300°C because of decomposition of the triazole rings and the novolac backbone. Silica fiber‐reinforced syntactic foam composites derived from these resins possessed comparable mechanical properties and superior impact resistance vis‐a‐vis their phenolic resin analogues. The mechanical properties could be tuned by regulating the reactant stoichiometry. These low temperature addition curable resins are suited for light weight polymer composite for related applications. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41254.     

Composite resins based on novel and highly reactive bisglycidyl methacrylate monomers

Three new bisglycidyl monomers; 1,4‐bis((2‐hydroxy‐3‐methacryloxypropoxy) methyl)benzene (MB‐Phe‐OH), 1,4‐bis(2‐hydroxy‐3‐methacryloxypropoxy)2‐cis‐butene (MB‐Cis‐OH), and 1,7‐bis(2‐hydroxy‐3‐methacryloxypropoxy)heptane (MB‐1,7‐OH); were synthesized and used as Bis‐GMA/TEGDMA (bisphenolglycidyl methacrylate/triethylene glycol dimethacrylate) composite resin additives. Flexural properties and double bond conversion of the dental resins composed of silanizated inorganic filler and organic matrices containing new monomers were evaluated. The composite resins formulated, using the monomers MB‐Cis‐OH and MB‐1,7‐OH, have mechanical properties and double bond conversion comparable with those of Bis‐GMA/TEGDMA composite resin used as control. The composite containing the new monomer MB‐Phe‐OH has better flexural properties (flexural strength 65.01 MPa and flexural modulus 5675.91 MPa) than the control composite resin (flexural strength 52.85 MPa and flexural modulus 4879.72 MPa); this could be attributed to the molecular structure of the monomer and its high double bond conversion level of 74.19%. The new bisglycidyl methacrylate monomer MB‐Phe‐OH could be potentially useful in the development of new organic matrices for dental composite resins with high double bond conversion and enhanced mechanical properties. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40971.     

Synthesis and properties of fluorinated biphenyl‐type epoxy resin

A novel fluorinated biphenyl‐type epoxy resin (FBE) was synthesized by epoxidation of a fluorinated biphenyl‐type phenolic resin, which was prepared by the condensation of 3‐trifluoromethylphenol and 4,4′‐bismethoxymethylbiphenyl catalyzed in the presence of strong Lewis acid. Resin blends mixed by FBE with phenolic resin as curing agent showed low melt viscosity (1.3–2.5 Pa s) at 120–122°C. Experimental results indicated that the cured fluorinated epoxy resins possess good thermal stability with 5% weight loss under 409–415°C, high glass‐transition temperature of 139–151°C (determined by dynamic mechanical analysis), and outstanding mechanical properties with flexural strength of 117–121 MPa as well as tensile strength of 71–72 MPa. The thermally cured fluorinated biphenyl‐type epoxy resin also showed good electrical insulation properties with volume resistivity of 0.5–0.8 × 10¹⁷ Ω cm and surface resistivity of 0.8–4.6 × 10¹⁶ Ω. The measured dielectric constants at 1 MHz were in the range of 3.8–4.1 and the measured dielectric dissipation factors (tan δ) were in the range of 3.6–3.8 × 10^?3. It was found that the fluorinated epoxy resins have improved dielectric properties, lower moisture adsorption, as well as better flame‐retardant properties compared with the corresponding commercial biphenyl‐type epoxy resins. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Novel cycloaliphatic epoxy resins. II. Curing reaction with BF3MEA and its cured properties

The BF₃MEA curing reaction and the cured properties of novel cycloaliphatic epoxy resins (CE-resins), which were derived from an octadienyl compound, were studied. Gelation time and the DSC scan of the CE resins, with BF₃MEA hardener, proved that the reactivity of the CE resins is intermediate among the reactivities of the conventional resins; it was found that the CE resins react faster than DGEBA, but slower than the conventional cycloaliphatic epoxy resins. The pot life of the CE- (III) resin with BF₃MEA hardener proved to be over 30 days at a temperature of 20°C. The thermal properties are affected by the amount of BF₃MEA used and the curing conditions. CE-(III) showed the highest HDT of over 200°C with 2–3 phr of BF₃MEA. The flexural properties of CE-(I) proved to be flexible and tough. CE-(II) exhibited the highest strength and elongation, while CE-(III) had the same flexural properties as DGEBA. Furthermore, the blending of CE-(II) with DGEBA produced greater flexural strength and greater elongation than each original resin had. The thermal stability at elevated temperature and the water resistance of the cured CE resins proved to be inferior to those of DGEBA and novolac epoxy resin, probably due to the use of BF₃MEA. These results suggest the CE resin will provide a new application for a one-component curing system for composites. © 1993 John Wiley & Sons, Inc.     

Renewable polyol‐based polycarbamates and polycarbamate–formaldehyde thermosetting resins

Several polycarbamates and polycarbamate–formaldehyde (CF) resins were synthesized, and their properties were investigated aiming at developing of useful thermosetting polymer materials from simple polyols including those derived from renewable resources. Polycarbamates synthesized from polyols using two‐step laboratory routes showed good storage stabilities making them suitable as large volume industrial chemicals. Furthermore, syntheses and ¹³C‐NMR studies of CF resins showed the formation of oligomeric resins having hydroxymethyl and methylene groups with thermosetting curing properties that are similar to those of current urea–formaldehyde (UF) resins. Dynamic mechanical analysis studies showed somewhat slower curing rates for CF resins compared to UF resins. Bonding of particleboard and internal bond and free formaldehyde content measurements indicated high‐bond strength values and very low‐formaldehyde emission potentials for CF resins. The higher functionalities of CF resins appear to be the basis of good performances. Further investigations on scalable synthesis methods for polycarbamates and on the expansion of CF resins' bonding capabilities would need to be investigated in the future. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Sustainable phenolic thermosets coatings derived from urushiol

The over-exploitation of finite fossil resources and/or the increased environmental and sustainable awareness inspire scientists and technologists to search for inexpensive alternatives from renewable chemicals. Phenol formaldehyde (PF) resins, the oldest type of synthetic polymers with good mechanical properties and heat resistance, are widely used in the production of coatings, laminates, molding compositions, and glues. Here, biobased urushiol-derived PF resins were synthesized from the alkali-catalyzed reaction between urushiol and formaldehyde. The chemical compositions and molecular structures of resole resins were characterized by carbon-13 nuclear magnetic resonance and Fourier transform infrared spectroscopy, and their curing behaviors were studied by differential scanning calorimetry. The as-prepared urushiol-derived resole resins had methylol (Ph−CH₂OH), ortho- and para-hemiformal groups (Ph−CH₂OCH₂OH), and the para−para/ortho−para/ortho−ortho links of methylene groups (Ph−CH₂−Ph), whereas the resole resins had low curing temperatures at about 100–113°C. Additionally, given the long side alkyl group moiety on the aromatic rings of urushiol, the films of cured urushiol-derived resole resins had low glass transition temperatures of 132 ± 2°C. Furthermore, the as-prepared urushiol-derived coatings exhibited excellent physical and mechanical properties.     

Synthesis and properties of an easy-processable bismaleimide thermoset resin

Reaction of methylenedianiline and maleic anhydride in acetone, followed by cyclodehydration in the presence of acetic anhydride and 1,4-diazabicyclo [2.2.2] octane as a catalyst, affords a mixture of compounds, Desbimid, with maleimide, isomaleimide, and acetamide groups. Dissolution of this mixture in styrene and 2-hydroxyethyl methacrylate results in clear liquid resins. The viscosity of the formulated resins ranges from 100–1700 mPas at 25°C depending on the concentration of Desbimid. These systems can be processed and cured at ambient temperatures until demoulding and postcured at temperatures up to 200 or 250°C. The flexural modulus, flexural strength, and elongation at break of a number of cured formulations are found between 3500–3800 N/mm², 90–115 N/mm², and 2.7–3.5%, respectively.     

Thermal and mechanical properties of tetra‐functional mesogenic type epoxy resin cured with aromatic amine

A novel tetra‐functional epoxy monomer with mesogenic groups was synthesized and characterized by ¹H‐NMR and FTIR. The synthesized epoxy monomer was cured with aromatic amine to improve the thermal property of epoxy/amine cured system. The glass transition temperature (T_g) and coefficient of thermal expansion (CTE) of the cured system were investigated by dynamic mechanical analysis and thermal mechanical analysis. The properties of the cured system were compared with the conventional bisphenol‐A type epoxy and mesogenic type epoxy system. The storage modulus of the tetra‐functional mesogenic epoxy cured systems showed the value of 0.96 GPa at 250 °C, and T_g‐less behavior was clearly observed. The cured system also showed a low CTE at temperatures above 150 °C without incorporation of inorganic components. These phenomena were achieved by suppression of the thermal motion of network chains by introduction of both mesogenic groups and branched structure to increase the cross linking density. The temperature dependency of the tensile property and thermal conductivity of the cured system was also investigated. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46181.     

Synthesis and characterization of melt‐processable polyimides derived from 1,4‐bis(4‐amino‐2‐trifluoromethylphenoxy)benzene

A series of molecular‐weight‐controlled imide resins end‐capped with phenylethynyl groups were prepared through the polycondensation of a mixture of 1,4‐bis(4‐amino‐2‐trifluoromethylphenoxy)benzene and 1,3‐bis(4‐aminophenoxy)benzene with 4,4′‐oxydiphthalic anhydride in the presence of 4‐phenylethynylphthalic anhydride as an end‐capping agent. The effects of the resin chemical structures and molecular weights on their melt processability and thermal properties were systematically investigated. The experimental results demonstrated that the molecular‐weight‐controlled imide resins exhibited not only meltability and melt stability but also low melt viscosity and high fluidability at temperatures lower than 280°C. The molecular‐weight‐controlled imide resins could be thermally cured at 371°C to yield thermoset polyimides by polymer chain extension and crosslinking. The neat thermoset polyimides showed excellent thermal stability, with an initial thermal decomposition temperature of more than 500°C and high glass‐transition temperatures greater than 290°C, and good mechanical properties, with flexural strengths in the range of 140.1–163.6 MPa, flexural moduli of 3.0–3.6 GPa, tensile strengths of 60.7–93.8 MPa, and elongations at break as high as 14.7%. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2008     

Thermosetting bismaleimide resins generating covalent and multiple hydrogen bonds

Prepolymerizations of 4,4′‐bismaleimidodiphenylmethane (BMI), diallyl isocyanurate (DAIC), and melamine (ML) at 160–170°C and subsequent compression molding at 200–280°C yielded cured BMI/DAIC/ML resins with feed molar ratios of 4/1/1, 3/1/1, and 2/1/1 (BMI‐DAIC‐ML411, 311, and 211). Similarly, cured BMI/DAIC 1/1 and BMI/ML 3/1 resins (BMI‐DAIC11 and BMI‐ML31) were prepared. The FT‐IR analysis revealed that the maleimide and allyl groups were almost consumed for all the cured resins, and the hydrogen bonding interaction became stronger with decreasing BMI contents for BMI‐DAIC‐MLs. Based on the cured structures elucidated from the FT‐IR result, the numbers of multiple hydrogen bonds and cross‐linking covalent bonds (N_MHB and N_CB), and total cross‐linking bond energy (E_TB) were evaluated to be 0, 7.92, and 618 for BMI‐DAIC‐ML411, 0.71, 7.81, and 627 for BMI‐DAIC‐ML311, and 0.95 mol kg^?1, 7.61 mol kg^?1, and 617 kcal kg^?1 for BMI‐DAIC‐ML211, respectively. A higher order of glass transition and 5% weight loss temperatures for BMI‐DAIC‐MLs was 411 > 311 > 211 in accordance with a higher order of N_CB. BMI‐DAIC‐MLs displayed a weak tan δ peak at 70–150°C due to dissociation of the hydrogen bonds. The flexural strength and modulus of BMI‐DAIC‐ML311 were higher than those of BMI‐DAIC‐ML411 in accordance with the difference of E_TB. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 43121.     

Improvement of the oxidation resistance of silicon-containing arylacetylene resins upon the introduction of carbazoles

Silicon-containing arylacetylene resins (PSAs) can be used in high temperature environment due to their excellent thermal stability. However, their high temperature oxidation is still bottle-neck for further application. Herein, Materials Genome Initiative (MGI) was utilized to identify a target monomer, 3,6-diethynylcarbazole (DEC), to design new PSAs with enhanced antioxidant properties and heat resistance. After incorporation of DEC, the thermal curing behavior observed using differential scanning calorimetry (DSC), fourier transform infrared (FTIR) and thermogravimetric analysis (TGA) revealed that obtained silicon-containing carbazolylacetylene resins (PSA-VBC) can exhibit hydroamination reaction to decrease the initial curing temperature. And the temperature at 5% weight loss (T_d5) occurred in cured copolymers ranged from 665°C to 691°C, which showed excellent heat resistance. Moreover, the oxidation behavior of cured resins was investigated by thermogravimetric/derivative thermogravimetry (TG/DTG), X-ray photoelectron spectroscopy (XPS) and scanning electron microscope (SEM). Upon the incorporation of DEC, the thermal oxidation decomposition temperature of PSA-VBC were 100°C higher than those observed for PSAs, which also proved by XPS analysis results that the oxygen content of PSA-VBC solidified oxide was lower than that of PSAs. In addition, the surface morphology of cured PSA-VBC resins still maintained integrity after oxidation at 400°C for 2 hr, which showed excellent oxidation resistance.