Effects of graphene nanosheets on the dielectric,mechanical, thermal properties,and rheological behaviors of poly(arylene ether nitriles)

Poly(arylene ether nitriles) (PEN) containing various contents of graphene nanosheets (GNs) was prepared via solution‐casting method and investigated for their dielectric, mechanical, thermal, and rheological properties. For PEN/GNs nanocomposite with 5 wt % GNs, the dielectric constant was increased to 9.0 compared with that of neat PEN (3.1) and dielectric losses of all nanocomposites were in the range of 0.019–0.023 at 1 kHz. The tensile modulus and strength were increased about 6 and 14% with 0.5% GNs, respectively. The fracture surfaces of the all PEN/GNs nanocomposites revealed that GNs had good adhesion to PEN matrix. The thermal properties of the nanocomposites showed significant increase with increasing GN loading. For 5 wt % GNs‐reinforced PEN nanocomposite, the temperatures corresponding to a weight loss of 5 wt % (T_d5%) and 30 wt % (T_d30%) increased by about 20 and 13°C, respectively. Rheological properties of the PEN nanocomposites showed a sudden change with the GN fraction and the percolation threshold was about 1 wt % of GNs. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Effect of Al2O3 addition on thermo‐electrical properties of polymer composites: An experimental investigation

To develop a new class of composites with adequately high thermal conductivity and suitably controlled dielectric constant for electronic packages and printed circuit board applications, polymer composites are prepared with microsized Al₂O₃ particle as filler having an average particle size of 80–100 μm. Epoxy and polypropylene (PP) are chosen as matrix materials for this study. Fabrication of epoxy‐based composite is done by hand lay‐up technique and its counterpart PP‐based composite are fabricated by compression molding technique with filler content ranging from 2.5–25 vol%. Effects of filler loading on various thermal properties like effective thermal conductivity (k_eff), glass transition temperature (T_g), coefficient of thermal expansion (CTE) and electrical property like dielectric constant (ε_c) of composites are investigated experimentally. In addition, physical properties like density and void fraction of the composites along with there morphological features are also studied. The experimental findings obtained under controlled laboratory conditions are interpreted using appropriate theoretical models. Results show that with addition of 25 vol% of Al₂O₃, k_eff of epoxy and PP improve by 482% and 498% respectively, T_g of epoxy increases from 98°C to 116°C and that of PP increases from −14.9°C to 3.4°C. For maximum filler loading of 25 vol% the CTE decreases by 14.8% and 26.4% for epoxy and PP respectively whereas the dielectric constants of the composites get suitably controlled simultaneously. POLYM. COMPOS., 36:102–112, 2015. © 2014 Society of Plastics Engineers     

Effect of nitrile functionalized graphene on the properties of poly(arylene ether nitrile) nanocomposites

In this study, novel nitrile functionalized graphene (GN‐nitrile)/poly(arylene ether nitrile) (PEN) nanocomposites were prepared by an easy solution‐casting method and investigated for the effect of surface modification on the dielectric, mechanical and thermal properties. Graphene (GN) was first functionalized by introduction of nitrile groups onto the GN plane, which was confirmed by scanning electron microscopy, differential scanning calorimetry, Fourier transform infrared spectroscopy, thermogravimetric analysis and dispersibility research. Compared with pure GN, the grafted nitrile groups on the GN‐nitrile can interact with nitrile groups in PEN and lead to flat but better dispersion and stronger adhesion in/to the PEN matrix. Consequently, GN‐nitrile had a more significant enhancement effect on the properties of PEN. The dielectric constant of the PEN/GN‐nitrile nanocomposite with 5 wt% GN‐nitrile reaches 11.5 at 100 Hz, which is much larger than that of the pure PEN matrix (3.1). Meanwhile, dielectric loss is quite small and stable and the dielectric properties showed little frequency dependence. For 5 wt% GN‐nitrile reinforced PEN composites, increases of 17.6% in tensile strength, 26.4% in tensile modulus and 21 °C in T_d5% were obtained. All PEN/GN‐nitrile nanocomposite films can stand high temperature, up to 480 °C. Hence, novel dielectric PEN/GN‐nitrile nanocomposite films with excellent mechanical and thermal properties can be used as dielectric materials under some critical circumstances such as high wear and temperature. Copyright © 2012 Society of Chemical Industry     

Improved dielectric and mechanical properties of Ti3C2Tx MXene/silicone rubber composites achieved by adding a few boron nitride nanoplates

MXenes have attracted great attentions in the fabrication of dielectric polymer composites because of their excellent electrical conductivity. However, the high dielectric loss tangent would suppress the application of such polymer-based composites. Incorporating insulating fillers might be a solution. Herein, Ti₃C₂T_x MXene/silicone rubber (SR) composites incorporated with boron nitride (BN) nanoplates were prepared. The homogeneous distribution of fillers was obtained in the composites, which was also thermally stable up to 400 °C. Dielectric constant of 7.06 (2.54 times of pure SR) and dielectric loss tangent of 0.00131 were achieved when the filling contents of MXene and BN in SR composite were 1.2 wt% and 5 wt%, respectively. The improved dielectric constant can be ascribed to the enhanced interfacial polarization and the formation of conductive network, while the low dielectric loss tangent can be due to the insulating interlayers of BN which could inhibit the transfer of free electrons from conductive fillers to the insulating polymer matrices. BN/MXene/SR composites displayed improved mechanical properties (tensile stress of 671 kPa and elongation at break of 353%) and good flexibility (elastic modulus of 540 kPa) due to the low filling content of fillers. This work is promising for preparing dielectric polymer composites in applications of electronic devices.     

Crystallized polyarylene ether nitrile blends with improved thermal,mechanical, dielectric properties,and processability

In this work, the biphenol polyarylether nitrile (BP‐PEN) films with improved processability were prepared by blending low molecular weight (LMW) with high molecular weight (HMW) of BP‐PEN. The hybrid membrane exhibited excellent thermal stability and mechanical strength. The T_id values of the films were as high as 505°C–522°C. Melting behavior studies indicated that the crystallinity of LMW BP‐PEN was higher than that of HMW, which was confirmed by the X‐ray diffraction (XRD) patterns analysis as well. Scanning electron microscope (SEM) provided additional information on morphology and phase adhesion. Additionally, the polymer crystallinity dependent on dielectric properties of blends films is reported. Most importantly, it is found that the combination of LMW and HMW BP‐PEN would be an effective method to simultaneously increase the mechanical, thermal, dielectric properties, and polymer processability. POLYM. COMPOS., 38:126–131, 2017. © 2015 Society of Plastics Engineers     

Thermal and dielectric properties of the aluminum particle/epoxy resin composites

Microsized aluminum/epoxy resin composites were prepared, and the thermal and dielectric properties of the composites were investigated in terms of composition, aluminum particle sizes, frequency, and temperature. The results showed that the introduction of aluminum particles to the composites hardly influenced the thermal stability behavior, and decreased T_g of the epoxy resin; moreover, the size, concentration, and surface modification of aluminum particles had an effect on their thermal conductivity and dielectric properties. The dielectric permittivity increased smoothly with a rise of aluminum particle content, as well as with a decrease in frequency at high loading with aluminum particles. While the dissipation factor value increased slightly with an increase in frequency, it still remained at a low level. The dielectric permittivity and loss increased with temperature, owing to the segmental mobility of the polymer molecules. We found that the aluminum/epoxy composite containing 48 vol % aluminum‐particle content possessed a high thermal conductivity and a high dielectric permittivity, but a low loss factor, a low electric conductivity, and a higher breakdown voltage. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Effects of surface‐functionalized aluminum nitride on thermal,electrical, and mechanical behaviors of polyarylene ether nitrile‐based composites

Aluminum nitride (AlN) with high thermal conductivity was blended in polyarylene ether nitrile (PEN) to obtain a composite system. A ball milling process could provide AlN particles of smaller size with higher surface silylation for homogeneous particle distribution in polymeric matrix. Thermal, electrical, and mechanical behaviors of the produced composites were characterized to investigate the effects of particles on the performance of PEN‐based composites with functionalized AlN. The composite exhibited thermal conductivity of 0.779 W m⁻¹ K⁻¹, a dielectric constant of 7.7, dielectric loss of 0.032, electrical resistivity of 1.39 GΩ.cm, and break strength of 36 N when the fraction of functionalized AlN increased to 42.3 vol%. A fitted equation based on the improved Russell's model could effectively predict a trend for thermal conductivity of the composite systems with consideration of interfacial resistance between AlN and surrounding PEN. POLYM. COMPOS., 37:3033–3041, 2016. © 2015 Society of Plastics Engineers     

Effective thermal conductivity and thermal properties of phthalonitrile‐terminated poly(arylene ether nitriles) composites with hybrid functionalized alumina

A polymer‐based thermal conductive composite has been developed. It is based on a dispersion of micro‐ and nanosized alumina (Al₂O₃) in the phthalonitrile‐terminated poly (arylene ether nitriles) (PEN‐t‐ph) via solution casting method. The Al₂O₃ with different particle sizes were functionalized with phthalocyanine (Pc) which was used as coupling agent to improve the compatibility of Al₂O₃ and PEN‐t‐ph matrix. The content of microsized functionalized Al₂O₃ (m‐f‐Al₂O₃) maintained at 30 wt % to form the main thermally conductive path in the composites, and the nanosized functionalized Al₂O₃ (n‐f‐Al₂O₃) act as connection role to provide additional channels for the heat flow. The thermal conductivity of the f‐Al₂O₃/PEN‐t‐ph composites were investigated as a function of n‐f‐Al₂O₃ loading. Also, a remarkable improvement of the thermal conductivity from 0.206 to 0.467 W/mK was achieved at 30 wt % n‐f‐Al₂O₃ loading, which is nearly 2.7‐fold higher than that of pure PEN‐t‐ph polymer. Furthermore, the mechanical testing reveals that the tensile strength increased from 99 MPa for pure PEN‐t‐ph to 105 MPa for composites with 30 wt % m‐f‐Al₂O₃ filler loading. In addition, the PEN‐t‐ph composites possess excellent thermal properties with glass transition temperature (T_g) above 184°C, and initial degradation temperature (T_id) over 490°C. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41595.     

Elaboration and dielectric property of modified PZT/epoxy nanocomposites

Composites of lead zirconate titanate (PZT) 50 nm nanoparticles and epoxy resins have been produced with various PZT contents from 0 to 20 wt%. The morphology and thermal properties of prepared composites were characterized using scanning electron microscopy and differential scanning calorimetry. The PZT nanoparticles were found to be well dispersed in the epoxy resin matrix. The glass transition temperature (T_g) value of the nanocomposites increases from 164 to 178°C with increasing the PZT weight fraction. The dielectric composites properties dependences were studied via a wide range of frequency from 10 Hz to 100 kHz. The dielectric constant of PZT/epoxy composite was increased from 5.56 to 6.29 (at f = 1 kHz, T = 30°C), respectively to the incorporated PZT amount, and these values are higher than that the dielectric constant of pure cured epoxy resin, ε = 4.86. POLYM. COMPOS., 37:455–461, 2016. © 2014 Society of Plastics Engineers     

Preparation and dielectric properties of (Ba0.5Sr0.4Ca0.1)TiO3/polystyrene composites

Polymer composites with polystyrene (PS) as matrix and (Ba_0.5Sr_0.4Ca_0.1)TiO₃ (BSCT) as fillers are prepared by solution casting method. It is found that the dielectric constant of the prepared BSCT/PS composites increases with increasing filler content over the frequency range from 100 Hz to 500 MHz. And the dielectric properties of the composites show a good temperature independency over the range of ?30°C to 80°C. For the composite with 50 vol % filler content, the dielectric constant and dielectric loss are comparable with the literature values reported for other PS composites used for microwave substrate. Several theoretical models are used to compare with the experimental data of the dielectric constant of the composites. The microstructure and thermal properties of the composites were also studied. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41398.     

Dielectric properties of epoxy/graphite flakes composites: Influence of loading and surface treatment

Epoxy-rich carbon-based composites are well recognized materials in industries owing to their good mechanical properties and thermal stability. Here, dielectric properties of composites based on bisphenol-A-epoxy resin loaded with 5, 6, 10, and 15 wt% of graphite flakes (GF) have been studied. The frequency and temperature dependence of the dielectric permittivity, dielectric loss, and ac conductivity have been examined in temperature (−103 to 97°C) and frequency (20 Hz–200 kHz) range. Influence of the filler surface chemistry have been studied for composites loaded with 5 wt% GF obtained: (i) under wet milling, without or with adding Triton-100x as a surfactant, or (ii) under dry milling in the presence of KOH. The composite made of epoxy loaded with 5 wt% exfoliated expanded graphite flakes (EEG), was also prepared. The surface treatment with KOH notably increased dielectric constant of the composite, keeping low dielectric loss, while treatment with Triton-100x significantly increased tanδ. The composite loaded with exfoliated expanded graphite shows higher ac conductivity than those obtained with flaky graphite, GF. Possibility to change dielectric properties of the composites without changing the loading content can be used as an approach in tailoring one with desired dielectric properties.     

Effect of surface functionalization on the properties (rheological,mechanical, and dielectric) and microtopography of PEN/CPEN‐f‐CNTs nanocomposites

Novel carboxylic poly(arylene ether nitrile)s (CPEN) functionalized carbon nanotubes (CPEN‐f‐CNTs) were successfully prepared by a simple and effective solvent–thermal route. The CPEN‐f‐CNTs were subsequently used as the novel filler for preparation of high performance poly(arylene ether nitrile)s (PEN) nanocomposites. The SEM characterization of the PEN nanocomposites revealed that the CPEN‐f‐CNTs present better dispersion and interfacial compatibility in the PEN matrix, which was confirmed by the linear rheological analysis (Cole–Cole plots) as well. Consequently, the improved thermal stability (increased initial and maximum decomposition temperature) and enhanced mechanical properties (tensile strength and modulus) were obtained from nanocomposites using CPEN‐f‐CNTs. More importantly, the PEN/CPEN‐f‐CNTs nanocomposites not only show a high dielectric constant but also have low dielectric loss. For example, a dielectric constant of 39.7 and a dielectric loss of 0.076 were observed in the PEN composite with 5 wt% CPEN‐f‐CNTs loading at 100 Hz. Therefore, the flexible PEN/CPEN‐f‐CNTs nanocomposites with outstanding mechanical, thermal and dielectric properties will find wide application in the high energy density capacitors. POLYM. COMPOS., 37:2622–2631, 2016. © 2015 Society of Plastics Engineers     

Mechanical and thermal properties of epoxy-POSS reinforced-(biphenyl diol formaldehyde/epoxy hybrid resin) composites

To enhance the properties of epoxy composites, the biphenyl diol formaldehyde resin (BPFR) and glycidyloxypropyl polyhedral oligomeric silsesquioxane (G-POSS) were synthesized and used for modification of fiber-glass reinforced composites of epoxy resin (ER). The BPFR was employed to cure epoxy resin with different G-POSS contents and the laminates of fiber-glass reinforced hybrid composites prepared from BPFR, ER and G-POSS. The dynamic mechanical properties, thermal properties, mechanical and electrical properties of the hybrid composites were characterized by dynamic mechanical analyzer, thermogravimetric analyzer and electroproperty detector. The results showed that the T _g of the composites is increased with the addition of G-POSS. When the content of G-POSS is 5 wt%, the tensile and impact strength of the hybrid composites are 249.87 MPa and 63.83 kJ/m², respectively, which are all 30 % higher than those of non-added composites. At G-POSS content of 7 wt%, T _g of the material is 9.6 °C higher than pure BPFR/ER composite, and the initial decomposition temperature, T _id, is enhanced by about 29 °C. Dielectric constant, ε, and dielectric loss, tanδ, of the hybrid composites are between 0.53–0.7 and between 0.004–0.012, respectively.     

Enhancement of thermal conductivity for epoxy laminated composites by constructing hetero-structured GF/BN networks

Due to the rapid development of multifunctional and miniaturized electronic devices, the demand for polymer composites with mechanical properties, high-thermal conductivity, and dielectric properties is increasing. Therefore, the heat dissipation capacity of the composite must be improved. To solve this problem, we report a glass fabric (GF)/boron nitride (BN) network with a highly thermally conductive hetero-structured formed using polyvinyl alcohol (PVA) as an adhesive. The GF and BN are furtherly modified by (3-aminopropyl)triethoxysilane (APTES) for better thermal conductivity enhancement. When the BN content is 30%, the thermal diffusion coefficient and thermal conductivity of obtained PVA-mBN@mGF (PBG) are 2.843 mm²/s and 1.394 W/(m K), respectively. Epoxy (EP) resin is then introduced to prepare PBG/mBN/EP laminated composites via the hot pressing method as applied as thermal conductive composites. A highest thermal conductivity of 0.67 W/(m K) of PBG/mBN/EP laminated composites is obtained, three times higher than that of pure EP. In addition, the PBG/mBN/EP laminated composites also present favorable mechanical, electrically insulating, and dielectric properties.     

Dielectric,Mechanical, and Thermal Properties of Low-Permittivity Polymer–Ceramic Composites for Microelectronic Applications

A new low-permittivity polymer–ceramic composite for packaging applications has been developed. The ceramic-reinforced polyethylene and polystyrene composites were prepared by melt mixing and hot molding techniques. Low-loss, low-permittivity Li₂MgSiO₄ (LMS) ceramics prepared by the solid-state ceramic route were used as the filler to improve the dielectric properties of the composites. The relative permittivity and dielectric loss were increased with the increase in the ceramic loading at radio and microwave frequencies. The mechanical properties and thermal conductivity of the Li₂MgSiO₄-reinforced polymer–ceramic composite were also investigated. The stability of the relative permittivity of polymer–ceramic composites with temperature and frequency was investigated. The experimentally observed relative permittivity, thermal expansion, and thermal conductivity were compared with theoretical models.     

Synthesis and properties of AlN/MAS/Si3N4 ternary glass-ceramic composites with in-situ grown rod-like β-Si3N4 crystals

The AlN/MAS/Si₃N₄ ternary composites with in-situ grown rod-like β-Si₃N₄ were obtained by a two-step sintering process. The microstructure analysis, compositional investigation as well as properties characterization have been systematically performed. The AlN/MAS/Si₃N₄ ternary composites can be densified at 1650 °C in nitrogen atmosphere. The in-situ grown rod-like β-Si₃N₄ grains are beneficial to the improvement of thermal, mechanical, and dielectric properties. The thermal conductivity of the composites was increased from 14.85 to 28.45 W/(m K) by incorporating 25 wt% α-Si₃N₄. The microstructural characterization shows that the in-situ growth of rod-like β-Si₃N₄ crystals leads to high thermal conductivity. The AlN/MAS/Si₃N₄ ternary composite with the highest thermal conductivity shows a low relative dielectric constant of 6.2, a low dielectric loss of 0.0017, a high bending strength of 325 MPa, a high fracture toughness of 4.1 MPa m^1/2, and a low thermal expansion coefficient (α_{25–300 °C}) of 5.11 × 10^?6/K. This ternary composite with excellent comprehensive performance is expected to be used in high-performance electronic packaging materials.     

Enhanced properties of phthalonitrile‐terminated polyarylene ether nitriles embedded with hybrid MWCNT–boehmite nanocomposites

The main motivation of the present work was to fabricate novel multifunctional polymer‐based nanocomposites. The nanocomposites embedded with multi‐walled carbon nanotube‐boehmite (MWCNT‐boehmite) were prepared via hot pressure casting technique. The MWCNT coated with boehmite were synthesized by hydrothermal synthesis. Subsequently, as‐prepared MWCNT‐boehmite was added into the phthalonitrile‐terminated polyarylene ether nitriles (PEN‐t‐CN) matrix in order to benefit from the synergetic effect of MWCNT and boehmite. Scanning electron microscopy (SEM), transmission electron microscopy (TEM) X‐ray diffraction (XRD), and Fourier transform infrared (FTIR) were employed to confirm the existence of MWCNT‐boehmite in our article. Furthermore, the structures, fracture morphologies, thermal, mechanical and dielectric properties of the nanocomposites were investigated, respectively. SEM images indicated that the MWCNT‐boehmite was homogeneously dispersed in the polymer, which acted as an essential factor to ensure good physical properties. The TGA analysis showed that the incorporation of MWCNT‐boehmite enhanced the thermal stability of the nanocomposites with initial degradation temperature (T_id) increasing from 458 to 492°C, while that of the pure PEN‐t‐CN was 439°C. The mechanical testing proved that significant enhancement of mechanical properties has been achieved. The tensile strength of PEN‐t‐CN/MWCNT‐boehmite composites with 3 wt% MWCNT‐boehmite reached the maximum (78.33 MPa), with a 41.7 % increase compared to the pure polymer. More importantly, the unique dielectric properties were systematically discussed and the results demonstrated that dielectric properties exhibited little dependency on frequency. For the incorporation of hybrid filler, the positive impact of MWCNT‐boehmite hybrid material resulted in polymer‐based nanocomposites with enhanced physical properties. POLYM. COMPOS., 36:2193–2202, 2015. © 2014 Society of Plastics Engineers     

Percolation phenomena in polymers containing dispersed iron

Metal‐polymer composites based on polyethylene (PE), polyoxymethylene (POM), polyamide (PA) and a PE/POM blend as matrix and dispersed iron (Fe) as filler have been prepared by extrusion of the appropriate mechanical mixtures, and their electrical conductivity, dielectric properties and thermal conductivity have been investigated. The filler spatial distribution is random in the PE‐Fe, POM‐Fe and PA‐Fe composites. In the PE/POM‐Fe composite the polymer matrix is two‐phase and the filler is contained only in the POM phase, resulting in an ordered distribution of dispersed Fe in the volume of polymer blend. The transition through the percolation threshold ?_c is accompanied by a sharp increase of the values of conductivity σ, dielectric constant ε′ and dielectric loss tangent tan δ. The critical indexes of the equations of the percolation theory are close to the theoretical ones in the PE‐Fe and POM‐Fe composites, whereas they take unusually high values in the PE/POMFe composite. Thus, t in the equation σ ～ (φ – φ_c)^t is 2.9–3.0 in the systems characterized by random distribution of dispersed filler and 8.0 in the PE/POM‐Fe system. The percolation threshold φ_c depends on the kind of polymer matrix, becoming 0.21, 0.24, 0.29 and 0.09 for the composites based on PE, POM, PA and PE/POM, respectively. Also the thermal parameters of the PE/POM‐Fe composite are different from those of all other composites. A model explaining the unusual electrical characteristics of the composite based on the polymer blend (PE/POM‐Fe) is proposed, in agreement with the results of optical microscopy.     

Positive temperature coefficient to resistively characteristics of polystyrene/nickel powder/multiwall carbon nanotubes composites

Positive temperature coefficient to resistivity (PTCR) characteristics of polystyrene (PS)/Ni‐powder (40 wt%) composites in the presence of multiwall carbon nanotubes (MWCNTs) has been investigated with reference to PS/carbon black (CB) composites. The PS/CB (10 wt%) composites showed a sudden rise in resistivity (PTC trip) at ≈110°C, above the glass transition temperature (T_g) of PS (T_g ≈95°C). Interestingly, the PTC trip temperature of PS/Ni‐powder (40 wt%)/MWCNT (0.75 phr) composites appeared at ≈90°C (below T_g of PS), indicating better dimensional stability of the composites at PTC trip temperature. The PTC trip temperature of the composites below the T_g of matrix polymer (PS) has been explained in terms of higher coefficient of thermal expansion (CTE) value of PS than Ni that led to a disruption in continuous network structure of Ni even below the T_g of PS. The dielectric study of PS/Ni‐powder (40 wt%)/MWCNT (0.75 phr) composites indicated possible use of the PTC composites as dielectric material. Dynamic mechanical analysis (DMA) and thermogravimetric analysis studies revealed higher storage modulus and improved thermal stability of PS/Ni‐powder (40 wt%)/MWCNT (0.75 phr) composites than the PS/CB (10 wt%) composites. POLYM. COMPOS., 33:1977–1986, 2012. © 2012 Society of Plastics Engineers     

Thermal,mechanical, and dielectric properties of aluminum silicate fiber reinforced aluminum phosphate–poly(ether sulfone) layered composites

In this study, a novel aluminum phosphate (AlPO₄) heat‐resistant layer reinforced with aluminum silicate fiber (ASF) was successfully compounded on a poly(ether sulfone) (PES) matrix via the preparation process of high‐temperature heat treatment and vacuum hot‐pressing sintering technique. The influence of the ASF content on the morphology, thermal, mechanical, and dielectric properties of the as‐fabricated aluminum silicate fiber reinforced aluminum phosphate–poly(ether sulfone) (ASF/AlPO₄–PES) layered composite was investigated. The results reveal that the incorporation of aluminum silicate fiber/aluminum phosphate (ASF/AlPO₄) heat‐resistant layer can significantly improve the thermal stability and mechanical performances of the PES matrix composites. Compared with the pristine PES, the ASF/AlPO₄–PES layered composite containing 8.0 wt % ASF exhibited better high‐temperature resistance properties (300 °C) and a lower thermal conductivity (0.16 W m^?1 K^?1). Furthermore, the dielectric constant and dielectric loss tangent of this PES matrix composite decreased to 2.16 and 0.007, respectively. Meanwhile, the frequency stability of the dielectric properties for the ASF/AlPO₄–PES layered composites was remarkably enhanced with increasing ASF addition at frequencies ranging from 10² Hz to 5 MHz. This was attributed to the existence of microscopic pores within the ASF/AlPO₄ layer and the strong interfacial bonding between the ASF/AlPO₄ layer and the PES matrix. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134 , 45542.