Improved thermal interface property of carbon nanotube–Cu composite based on supercritical fluid deposition

In this paper, we present a new synthesis method of carbon nanotubes (CNTs)-copper (Cu) composite on a silicon substrate using combination of supercritical fluid deposition (SCFD) and electrochemical plating (ECP) process. Deposition of a Cu layer onto CNTs is carried out under supercritical condition, and the CNTs–Cu composite with high-density Cu is synthesized by additional ECP process. The Cu layer deposited by SCFD functions as a seed layer for ECP, and spaces between neighboring CNTs are filled by Cu. The measured density of the CNTs–Cu composite is 8.2 ± 0.3 g/cm³, and the volume percentage of voids is 3–6%. The evaluated thermal resistance including the thermal interface resistance and bulk resistance of the composite is as low as 28.4 mm² K W⁻¹ at a contact pressure of 0.2 MPa. A CNT brush formed on the composite surface can reduce the thermal resistance to be 68.4 mm² K W⁻¹ at a contact pressure of 0.25 MPa. The CNTs–Cu composite shows the ability applicable to many microelectronics applications as a thermal interface material.     

Thermal analysis of submicron nanocrystalline diamond films

The thermal properties of sub-μm nanocrystalline diamond films in the range of 0.37–1.1 μm grown by hot filament CVD, initiated by bias enhanced nucleation on a nm-thin Si-nucleation layer on various substrates, have been characterized by scanning thermal microscopy. After coalescence, the films have been outgrown with a columnar grain structure. The results indicate that even in the sub-μm range, the average thermal conductivity of these NCD films approaches 400 W m^− 1 K^− 1. By patterning the films into membranes and step-like mesas, the lateral component and the vertical component of the thermal conductivity, k_lateral and k_vertical, have been isolated showing an anisotropy between vertical conduction along the columns, with k_vertical ≈ 1000 W m^− 1 K^− 1, and a weaker lateral conduction across the columns, with k_lateral ≈ 300 W m^− 1 K^− 1.     

Alkoxo- and carboxylato-bridged hexanuclear copper(II) complex: Synthesis,structure and magnetic properties

Reaction of copper(II) nitrate trihydrate with N,N-dimethylethanolamine (dmea) and pivalic acid in methanol led to the hexanuclear copper(II) complex Cu₆(η¹:μ₂-C₄H₁₀NO)₄(η¹:η¹:μ₂-C₅H₉O₂)₄(η¹:μ₁-C₅H₉O₂)₂(μ₃-OH)₂ (1). The crystal structure of 1 indicates that hexametallic centers are bridged by the μ₃-alkoxo, dmea oxygens, and the μ₂-dicarboxylato oxygen atoms of pivalate ions. Furthermore, in the asymmetric unit, three types of copper ions have been found labeled as Cu₁, Cu₂ and Cu₃. The Cu₂ takes a distorted octahedral shape, whereas Cu₁ and Cu₃ adopt square pyramidal geometries. The complex 1 shows strong antiferromagnetic interactions through the oxo groups within the dimeric units (J = − 82.6 to − 25.8 cm^− 1) and weak antiferromagnetic couplings between the dimers (J = − 10.9 and 0.8 cm^− 1).     

Visible light photocatalytic H2-production activity of epitaxial Cu2ZnSnS4/ZnS heterojunction

Novel visible light driven photocatalyst Cu₂ZnSnS₄/ZnS composites were prepared by two-step hydrothermal method. The two semiconductors in the composites are lattice-matched and form close contact between them. With 0.1% Cu₂ZnSnS₄ grew on ZnS surface, the composite exhibits a high and stable visible light photocatalytic H₂ generation of 432 μmolg^− 1 h^− 1. This excellent visible light activity could be attributed to the enhancement of visible light absorption by surfacial modification of ZnS with CZTS and the photoinduced interfacial charge transfer from the valence band of ZnS to Cu₂ZnSnS₄ in the close contact interface.     

Synthesis,crystal structure and magnetic properties of a new cyanide-bridged mixed-valence copper(I)/copper(II) clathrate

A unique cyanide-bridge mixed-valence Cu^I/Cu^II clathrate of formula [Cu^I₂(CN)₃][{Cu^II(tren)}₂(μ-CN)](CF₃SO₃)₂ [tren = tris(2-aminoethyl)amine] containing cyanide-bridged [{Cu^II(tren)}₂(μ-CN)]^3 + binuclear cations stacked between anionic honeycomb layered copper(I) cyanide networks, was synthesized and structurally characterized by single crystal X-ray diffraction. Variable-temperature magnetic susceptibility studies showed that the cyanide bridge mediates a strong antiferromagnetic interaction between the copper(II) centers (J = − 160 cm^− 1, the spin Hamiltonian being defined as H = −J S_A⋅S_B).     

Synthesis,crystal structure,and magnetic property of a stepped tetranuclear copper(II) complex of 3,5-diisopropylpyrazole-1-methoxide

Reaction of copper(II) chloride dihydrate in methanol with deprotonated 3,5-diisopropylpyrazole-1-methanol (dippmOH) led to the tetranuclear copper(II) complex [(dippmO)CuCl]₄ (1). The crystal structure of 1 indicates that two copper(II) ions connect via the oxygen atoms of dippmO⁻ ligands each other in which two dimeric units are formed. Furthermore, one of the coordinated oxygen atoms in a dimer is bonded to an adjacent copper(II) ion positioned other dimer, which gives rise to a stepped tetranuclear structure. 1 shows strong antiferromagnetic interactions through the oxo groups within the dimeric units (J₁ = − 239 cm^− 1) and weak antiferromagnetic couplings between the dimers (J₂ = − 15 cm^− 1).     

Graphite foam from pitch and expandable graphite

Graphite foams were prepared from a coal tar pitch that was partially converted into mesophase. Expandable graphite was used instead of an inert gas to “foam” the pitch. The resulting foam was subjected to a series of heat treatments with the objective of first crosslinking the pitch, and thereafter carbonizing and graphitizing the resulting foam. XRD confirmed that the graphitization at 2600 °C resulted in a highly graphitic material. The porosity of this foam derives from the loose packing of the vermicular exfoliated graphite particles together with their internal porosity. During the foaming process the pitch tends to coat the outside surface of the expanding graphite flakes. It also bonds them together. The graphite foam prepared with 5 wt.% expandable graphite had a bulk density of 0.249 g cm⁻³, a compressive strength of 0.46 MPa and a thermal conductivity of 21 W m⁻¹ K⁻¹. The specific thermal conductivity (thermal conductivity divided by the bulk density) of this low-density carbon foam was 0.084 W m² kg⁻¹ K⁻¹ which is considerably higher than that of copper metal (0.045 W m² kg⁻¹ K⁻¹) traditionally used in thermal management applications.     

Preparation by tape casting and hot pressing of copper carbon composites films

During this last decade, the use of metal matrix composites (MMCs) such as AlSiC or CuW for heat dissipation in microelectronic devices has been leading to the improvement of the reliability of electronic power modules. Today, the continuous increasing complexity, miniaturization and density of components in modern devices requires new heat dissipating films with high thermal conductivity, low coefficient of thermal expansion (CTE), and good machinability. This article presents the original use of copper carbon composites, made by tape casting and hot pressing, as heat dissipation materials. The tape casting process and the sintering have been adapted and optimised to obtain near fully dense, flat and homogeneous Cu/C composites.A good electrical contact between carbon fibres and copper matrix and a low porosity at matrix/copper interfaces allow obtaining a low electrical resistivity of 3.8 μΩ cm⁻¹ for 35 vol.% carbon fibre (electrical resistivity of copper = 1.7 μΩ cm⁻¹). The CTE and the thermal conductivity are strongly anisotropic due to the preferential orientation of carbon fibres in the plan of laminated sheets. Values in the parallel plan are, respectively, 9 × 10⁻⁶ °C⁻¹ and 160–210 W m⁻¹ K⁻¹ for 40 vol.% fibres. These CTE and thermal conductivity values are in agreement with the thermo-elastic Kerner's model and with the Hashin and Shtrikman model, respectively.     

Low thermal conductivity of atomic layer deposition yttria-stabilized zirconia (YSZ) thin films for thermal insulation applications

Thermal insulation applications have long required materials with low thermal conductivity, and one example is yttria (Y₂O₃)-stabilized zirconia (ZrO₂) (YSZ) as thermal barrier coatings used in gas turbine engines. Although porosity has been a route to the low thermal conductivity of YSZ coatings, nonporous and conformal coating of YSZ thin films with low thermal conductivity may find a great impact on various thermal insulation applications in nanostructured materials and nanoscale devices. Here, we report on measurements of the thermal conductivity of atomic layer deposition-grown, nonporous YSZ thin films of thickness down to 35 nm using time-domain thermoreflectance. We find that the measured thermal conductivities are 1.35–1.5 W m⁻¹ K⁻¹ and do not strongly vary with film thickness. Without any reduction in thermal conductivity associated with porosity, the conductivities we report approach the minimum, amorphous limit, 1.25 W m⁻¹ K⁻¹, predicted by the minimum thermal conductivity model.     

Enhanced thermoelectric properties and electronic structures of p-type BiCu1−xAgxSeO ceramics

The thermoelectric properties and electronic structures were investigated on p-type BiCu_1-xAg_xSeO (x=0, 0.02, 0.05, 0.08) ceramics prepared using a two-step solid state reaction followed by inductively hot pressing. All the samples consist of single BiCuSeO phase with lamella structure and no preferential orientation exists in the crystallites. Upon replacing Cu⁺ by Ag⁺, maximum values of electrical conductivity of 36.6 S cm⁻¹ and Seebeck coefficient of 350 μV K⁻¹ are obtained in BiCu_0.98Ag_0.02SeO and BiCu_0.92Ag_0.08SeO, respectively. Nevertheless, a maximum power factor of 3.67 μW cm⁻¹K⁻² is achieved for BiCu_0.95Ag_0.05SeO at 750 K owing to the moderate electrical conductivity and Seebeck coefficient. Simultaneously, this oxyselenide exhibits a thermal conductivity as low as 0.38 W m⁻¹ K⁻¹ and a high ZT value of 0.72 at 750 K, which is nearly 1.85 times as large as that of the pristine BiCuSeO. The enhancement of thermoelectric performance is mainly attributed to the increased density of states near the Fermi level as indicated by the calculated results.     

Thermal properties of silicon carbide composites fabricated with chopped Tyranno® SiAlC fibres

Thermal diffusivity, a, and thermal conductivity, κ, between room temperature and 600 K were investigated for SiC composites containing 0–50 mass% of Tyranno^® SiAlC (SA) fibre (mean length: 394 μm) hot-pressed at 1800 °C for 30 min under a pressure of 31 MPa. The monolithic SiC specimen possessed κ of 32.1 W m⁻¹ K⁻¹ at room temperature; no significant changes were found for the SiC composite containing ≤20 mass% of SA fibre addition. However, further increases in the amount of SA fibre to 50 mass% improved κ to a maximum of 56.3 W m⁻¹ K⁻¹. The value of a for the SiC composite containing 40 mass% of SA fibre was 0.185 cm² s⁻¹ at room temperature and decreased to 0.120 cm² s⁻¹ at 600 K. In addition, SiC composites using 40 mass% of SA fibre with a carbon interface of approximately 100 nm were fabricated. The effect of this interface on a and κ was marginal.     

A new estimation method for the intrinsic thermal conductivity of nonmetallic compounds: A case study for MgSiN2, AlN and β-Si3N4 ceramics

A new method for estimating the maximum achievable thermal conductivity of non-electrically conducting materials is presented. The method is based on temperature dependent thermal diffusivity data using a linear extrapolation method enabling discrimination between phonon-phonon and phonon-defect scattering. The thermal conductivities estimated in this way for MgSiN₂, AlN and β-Si₃N₄ ceramics at 300 K equal 28, 200 and 105 W m⁻¹ K⁻¹, respectively in favourable agreement with the highest experimental values of 23, 266 and 106–122 W m⁻¹ K⁻¹. This suggests the general applicability of the proposed estimation method for non-metallic compounds. It is expected that when optic phonons contribute to the heat conduction (as is the case for AlN) the intrinsic thermal conductivity at lower temperatures (e.g. 300 K) is underestimated. However, the reliability and accuracy of the presented ‘easy to use’ estimation method seems to be much better than several other estimation methods. Furthermore the needed input for this method can provide information about which processing parameters should be optimised to obtain the highest thermal conductivity.     

Thermal,mechanical and electrical properties of hard B4C,BCN, ZrBC and ZrBCN ceramics

We study the thermal, mechanical and electrical properties of B₄C, BCN, ZrBC and ZrBCN ceramics prepared in the form of thin films by magnetron sputtering. We focus on the effect of Zr_x(B₄C)_1−x sputter target composition, the N₂+Ar discharge gas mixture composition, the deposition temperature and the annealing temperature after the deposition. The thermal properties of interest include thermal conductivity (observed in the range 1.3–7.3 W m⁻¹ K⁻¹), heat capacity (0.37–1.6×10³ J kg⁻¹ K⁻¹ or 1.9–4.1×10⁶ Jm⁻³ K⁻¹), thermal effusivity (1.6–4.5×10³ J m⁻² s^−1/2 K⁻¹) and thermal diffusivity (0.38–2.6×10⁻⁶ m² s⁻¹). We discuss the relationships between materials composition, preparation conditions, structure, thermal properties, temperature dependence of the thermal properties and other (mechanical and electrical) properties. We find that the materials structure (amorphous×crystalline hexagonal ZrB₂-like×nanocrystalline cubic ZrN-like), more than the composition, is the crucial factor determining the thermal conductivity and other properties. The results are particularly important for the design of future ceramic materials combining tailored thermal properties, mechanical properties, electrical conductivity and oxidation resistance.     

Porous Ca3Co4O9 with enhanced thermoelectric properties derived from Sol–Gel synthesis

Highly porous Ca₃Co₄O₉ thermoelectric oxide ceramics for high-temperature application were fabricated by sol–gel synthesis and subsequent conventional sintering. Growth mechanism of misfit-layered Ca₃Co₄O₉ phase, from sol–gel synthesis educts and upcoming intermediates, was characterized by in-situ X-ray diffraction, scanning electron microscopy and transmission electron microscopy investigations. The Ca₃Co₄O₉ ceramic exhibits a relative density of 67.7%. Thermoelectric properties were measured from 373 K to 1073 K. At 1073 K a power factor of 2.46 μW cm⁻¹ K⁻², a very low heat conductivity of 0.63 W m⁻¹ K⁻¹ and entropy conductivity of 0.61 mW m⁻¹ K⁻² were achieved. The maintained figure of merit ZT of 0.4 from sol–gel synthesized Ca₃Co₄O₉ is the highest obtained from conventional, non-doped Ca₃Co₄O₉. The high porosity and consequently reduced thermal conductivity leads to a high ZT value.     

Effect of seeding on the thermal conductivity of self-reinforced silicon nitride

Thermal conductivity of Si₃N₄ containing large β-Si₃N₄ particles as seeds for grain growth was investigated. Seeds addition promotes growth of β-Si₃N₄ grains during sintering to develop the duplex microstructure. The thermal conductivity of the material sintered at 1900 °C improved up to 106 W m⁻¹ K⁻¹, although that of unseeded material was 77 Wm⁻¹ K⁻¹. Seeds addition leads to reduction of the sintering temperature with developing the duplex microstructure and with improving the thermal conductivity, which benefits in terms of production cost of Si₃N₄ ceramics with thermal conductivity. ©     

Microstructural dependence of the thermal and mechanical properties of monazite LnPO4 (Ln = La to Gd)

In this work are given some thermal and mechanical properties of monazite, related to the microstructure. This compound is a poor thermal conductive (λ < 5 W m⁻¹ K⁻¹), with a thermal expansion in between 9 and 10 × 10⁻⁶ K⁻¹ according to the considered crystallographic direction, and a relatively high specific heat (C_p ≈ 110 J mol⁻¹ K⁻¹). Mechanical properties of monazite are characteristic of a brittle behavior: bending strength is of about 100 MPa and fracture toughness is close to 1 MPa m^1/2. Porosity plays a large role on both thermal and mechanical properties pointing out the importance of controlling the whole elaboration process.     

Exceptional thermal interface properties of a three-dimensional graphene foam

We have uncovered some unusual thermal interface properties of a three-dimensional, flexible and interconnected graphene foam (GF). The thermal interfacial resistance of GF at Si–Al interface is as low as 0.04 cm²K W⁻¹, which is one order of magnitude lower than conventional thermal grease and thermal paste-based thermal interfacial material (TIM). The thermal contact resistance was found to dominate the overall interfacial resistance of GF-based TIM, in as much as the bulk thermal conductivity of GF is rather high. The contact pressure-dependent thermal interfacial resistance of GF exhibits an asymptotic behavior, which converges into a plateau value at an ultralow contact pressure (∼0.1 MPa). Significantly, the GF-based TIM has shown a superior performance to vertically aligned carbon nanotubes currently held as the gold standard (at least ∼75% improvement in thermal interfacial resistance at Si–Al interface), thus providing a strong candidate for the next generation of high-performance carbon-based TIM.     

Effect of promoters on hydrogenation of diethyl malonate to 1,3-propanediol over nano copper-based catalysts

Copper-based catalysts were prepared via ammonia evaporation co-precipitation method. Structure evolutions of the catalysts were systematically characterized by XRD, FTIR, TG, SEM, N₂-physisorption, ICP-AES, N₂O chemisorption and XPS focusing on the influence of promoters on the catalytic behavior in the hydrogenation of diethyl malonate to 1,3-propanediol. The results showed that diethyl malonate conversion and 1,3-propanediol selectivity could reach 96.71% and 29.76% respectively at 473 K with 2.0 MPa and 1.8 h^− 1 with boron as promoter. The improved catalytic performance of Cu-B/SiO₂ catalyst could be attributed to more Cu⁰ formed with the inhibition of copper phyllosilicate and better dispersion of copper species.     

Photocatalytic hydrogen production from methanol aqueous solution under visible-light using Cu/S–TiO2 prepared by electroless plating method

Cu was loaded on the S-doped TiO₂ by electroless plating method. The prepared Cu/S–TiO₂ exhibited high photocatalytic activity for hydrogen generation, and the yield is up to 7.5 mmol h^− 1 g^− 1cat in methanol solution. Their physical structure and chemical properties were characterized by UV–Vis, XRD, XPS and EXAFS. The copper species were CuO and Cu₂O, and the sample showed excellent visible light absorption ability. Comparing with the sample prepared by chemical reducing method, the electroless plated copper on S–TiO₂ was highly dispersed, which could facilitate photo-generated charges capture, transfer and separation.     

Improving the POM performance of YBa2Cu3O7−δ membrane reactor by Co doping

The performance of Co doped YBa₂Cu₃O_7−δ (YBCO) membrane reactor have been investigated in a process of the partial oxidation of methane (POM) to syngas. The results shows that doping YBCO membrane with a little Co can enhance its oxygen permeation flux and improve its stability in reducing atmosphere noticeably. At 900 °C, with feed flow at 50 ml/min, CH₄ 6.0 v%, SV = 12,000 h⁻¹, and Ni/ZrO₂ catalyst, CH₄ conversion rate, CO selectivity, and oxygen permeation flux can reach to 98%, 92% and 1.41 ml min⁻¹ cm⁻² respectively.