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1.
《Intermetallics》2006,14(6):702-709
The work presents results of magnetometric, transport, XPS and neutron diffraction measurements performed on polycrystalline samples of Ce3Ag4X4 (X=Ge, Sn). The X-ray and neutron diffraction data indicate that these compounds crystallize in an orthorhombic structure of the Gd3Cu4Ge4-type. The magnetometric data reveal a ferromagnetic-like behaviour below 10 K in the case of Ce3Ag4Ge4 and a weak antiferromagnetic-like maximum at 9 K for Ce3Ag4Sn4. The neutron diffraction data do not evidence magnetic ordering in any of the two compounds. Temperature variations of the electrical resistivity and thermoelectric power suggest their metallic character. The Ce 3d X-ray photoemission spectra show that both compounds are mixed valence systems. Analysis of the f2 peak weight using the Gunnarsson–Schönhammer theory suggests a hybridization constant of 169 meV for Ce3Ag4Ge4 and 82 meV for Ce3Ag4Sn4. The valence band spectra are dominated by the Ag 4d states contributions. Broad and very weak peaks extending between 0 and 4 eV correspond to the Ce 5d6s2 states.  相似文献   

2.
A new compound Ba5Sn1.1Mn3.9O15 has been synthesized at 1300 °C by solid-state reaction. The structure was characterized by X-ray, electron and neutron diffraction methods. Ba5Sn1.1Mn3.9O15 crystallizes in hexagonal space group P63/mmc with a = 5.717 Å and c = 23.534 Å. The magnetic measurement reveals that Ba5Sn1.1Mn3.9O15 has a spin glass transition at 7 K.  相似文献   

3.
The intermetallic compound Cu6Sn5 is a significant microstructural feature of many electronic devices where it is present at the solder–substrate interfaces. The time- and temperature-dependent thermomechanical properties of Cu6Sn5 are dependent on the nature and stability of its crystal structure, which has been shown to exist in at least four variants (η, η′, η6 and η8). This research details an additional newly identified monoclinic-based structure in directly alloyed stoichiometric Cu6Sn5 using variable-temperature synchrotron X-ray diffraction (XRD) and transmission electron microscopy. The phase is associated with a departure from the equilibrium temperature of the polymorphic monoclinic–hexagonal transformation temperature. The new monoclinic phase can be treated as a modulation of four η8-Cu5Sn4 unit cells plus one η′-Cu6Sn5 unit cell. It has been labeled as η4+1 and has cell parameters of a = 92.241 Å, b = 7.311 Å, c = 9.880 Å and β = 118.95° determined from electron diffraction patterns. The XRD results could be fitted well to a Rietveld refinement using the new crystal parameters.  相似文献   

4.
We have synthesized the new intermetallic compound Th4Mn13Sn5: it crystallizes with the Th4Fe13Sn5 type structure, tetragonal tP44, space group P4/mbm, a = 8.423(1) Å and c = 11.972(2) Å. The Mn ions in Th4Mn13Sn5 order ferro/ferrimagnetically around 110 K. A low magnetization of 0.13 μB/Mn at 4.2 K in a field of 70 kOe and a large fractional temperature independent contribution to susceptibility in the paramagnetic regime suggest an appreciable itinerancy of the Mn 3-d state in this compound. The electrical resistivity shows an anomaly at the magnetic transition and varies as T2 below 30 K with a coefficient of 8.38 × 10?3 μΩ cm/K2. The low temperature heat capacity data furnish a Sommerfeld coefficient of 16.9 mJ/g atom K2. In the course of present work we have also identified the ThMn0.2Sn2 phase which adopts a defective CeNiSi2 type structure, orthorhombic oS16, space group Cmcm with a = 4.476(2) Å, b = 17.059(3) Å and c = 4.398(1) Å.  相似文献   

5.
《Acta Materialia》2008,56(11):2649-2662
The morphologies and orientation relationships of Cu6Sn5 grains formed between Sn and (0 0 1), (0 1 1), (1 1 1) and (1 23) Cu single crystals under liquid- and solid-state aging conditions were systematically investigated. The regular prism-type Cu6Sn5 grains formed on (0 0 1) and (1 1 1) Cu single crystals are elongated either along two perpendicular directions or along three preferential directions with an angle of 60° between each pair of directions. The orientation relationships between Cu and Cu6Sn5 lattice structures were determined by electron backscatter diffraction and were explained in terms of their minimum misfit. However, on (0 1 1) and (1 2 3) Cu single crystal surfaces, the Cu6Sn5 grains were mainly scallop-type, with only a few regular prism-type grains. Furthermore, the regular prism-type Cu6Sn5 grains will change into scallop-type after long reflow or aging times. Meanwhile it is considered that the growth of the scallop-type grains is supplied by two fluxes: the flux of the interfacial reaction and the flux of ripening. However, the growth of the prism-type grains is only supplied by the flux of the interfacial reaction. The kinetics of IMCs growth between Sn and Cu single crystals was also investigated.  相似文献   

6.
Energy resolved neutron diffraction measurements were performed on Cu1.75Se and Cu1.98Se samples for both α- and β-phases. In-situ measurements of the Cu1.98Se compound during heating show that the β–α phase transition takes place at 420 K and has noticeable temperature hysteresis. In addition to Bragg reflections, the diffraction patterns of the α-Cu1.75Se at RT and α-Cu1.98Se at 435 K samples taken in conventional two-axis geometry show a broad maximum related to diffuse scattering. This diffuse background is suppressed in the energy resolved experiment which indicates a strong contribution from inelastic scattering coming from correlated thermal displacements of the ions in the super-ionic phase. On the other hand, the diffraction pattern of the non super-ionic β-phase shows only minor differences between spectra measured with and without the analyser crystal.  相似文献   

7.
《Intermetallics》2007,15(8):1027-1037
The isothermal section of the Sn–Sb–Cu ternary system at 260 °C has been determined in this study by experimental examination. Experimental results show no existence of ternary compounds in the Sn–Sb–Cu system. An extensive region of mutual solubility existing between the two binary isomorphous phases, Cu3Sn and Cu4Sb, was determined and labeled as δ. Intermetallic compounds (IMCs) Cu2Sb, SbSn, and Cu6Sn5 are in equilibrium with the δ solid solution. Up to about 6.5 at.%Sb can dissolve in the Cu6Sn5 phase, and the solubility of Sn in the Cu2Sb is approximately 6.2 at.%. Each of the Sb and SbSn phases has a limited solubility of Cu. Only one stoichiometric compound, Sb2Sn3, exists. Besides phase equilibria determination, the interfacial reactions between the Sn–Sb alloys and Cu substrates were investigated at 260 °C. Sb was observed to be present in the Cu6Sn5 and δ phases, and Sb did not form Sn–Sb IMCs in the interfacial reactions. Moreover, the addition of up to 7 wt% of Sb into Sn does not significantly affect the total thickness of IMC layers. It was found that the phase formations in the Sn–Sb/Cu couples are very similar to those in the Sn/Cu couples.  相似文献   

8.
《Intermetallics》2006,14(3):315-324
Magnetization, magnetic susceptibility, electrical resistivity, thermoelectric power, neutron diffraction and X-Ray photoemission spectroscopy measurements were performed on polycrystalline samples of PrAg2Ge2 and NdAg2Ge2, both crystallizing with a tetragonal structure of the ThCr2Si2-type. The data indicate that both compounds order magnetically at low temperatures, PrAg2Ge2 at 12 K and NdAg2Ge2 at 2 K. Neutron diffraction data for the latter indicate antiferromagnetic collinear structure described by the propagation vector k=(½, 0, ½) at 1.5 K. Both compounds exhibit metallic-like electrical behavior. The X-Ray photoemission data indicate that the valence bands are formed mainly by the Ag 4d bands. The spin-orbit splitting values determined from the XPS spectra of Pr and Nd, 3d5/2 and 3d3/2, equal 20.5 eV for the Pr compound and 22.7 eV for the Nd compound. The analysis of these spectra performed on the basis of the Gunnarsson-Schönhammer model indicates a weak hybridization of the 4f electrons with the conduction band.  相似文献   

9.
Several samples were prepared in the title systems, starting from the elements sealed under argon in Ta crucibles, melting in an induction fornace and annealing at 823 K. Six ternary phases were found: EuCu2Sn2, a = 11.100 (3), b = 4.307 (1), c = 4.824 (1) Å, β = 108.88 (1)°, and SrCu2Sn2, a = 11.197 (4), b = 4.322 (2), c = 4.859 (1) Å, β = 108.43 (1)°, C2/m, CaCu2Sn2-type, closely related to the BaAl4 structure; Sr3Cu8Sn4, a = 9.3280 (2), c = 7.8826 (4) Å, P63mc, Nd3Co8Sn4-type, ordered variant of the BaLi4-type; SrCu4Sn2, a = 8.176 (1), c = 7.799 (1) Å, I4/mcm, CaNi4Sn2-type; SrCu9Sn4, a = 8.663 (1), c = 12.457 (2) Å, and BaCu9Sn4, a = 8.717 (1), c = 12.545 (2) Å, I4/mcm, LaFe9Si4-type, ordered variant of the NaZn13 structure. The structure of the first compound was refined by the Rietveld method, while single crystal data were used for the others. Some remarks are given on the crystal chemistry of the encountered and related structure types.  相似文献   

10.
The crystallographic and magnetic structures of Er6Ni2Sn have been determined at low temperatures using neutron powder diffraction. It has been found that this system orders antiferromagnetically (AF) below TN = 17 K. Data taken at low temperatures and analyzed using symmetry group analysis suggest that Er6Ni2Sn forms a complex non-collinear commensurate AF structure with strongly reduced Er magnetic moments. The reason for the reduced moments is unclear and needs further studies. The magnetic phases below 7 K and in the temperature range 7–17 K differ only in the Er magnetic moment magnitudes and in the angle that the Er moments at the 8l site make with the c-axis. The extra reflections present in the powder diffraction patterns suggest presence of a secondary phase. The temperature evolution of the powder pattern indicates that the secondary phase orders AF at 35 K.  相似文献   

11.
《Synthetic Metals》2001,122(3):523-527
The photomagnetic effect of the mixed-valence compound Cu2II[MoIV(CN)8]·7.6H2O (CuII; 3d9, S=1/2, MoIV; 4d2, S=0) (1) was investigated. The UV–VIS spectra showed the intervalence transfer (IT) band between MoIV–CN–CuII and MoV–CN–CuI around 500 nm. When the paramagnetic compound 1 was irradiated by a filtered blue light (400–430 nm, 3 mW/cm2) of a Xe lamp at 5 K, the irradiated sample exhibited a spontaneous magnetization with a Curie temperature of 17 K. By annealing the irradiated sample above 200 K, the magnetic property of this sample returned to the initial state. This photo-induced magnetization is explained by the following mechanism. The excitation of the IT band causes the electron transfer from MoIV (S=0) to CuII (S=1/2), producing a mixed-valence isomer of MoV (S=1/2)–CN–CuI (S=0). However, half of the copper ions remain as CuII ions due to the stoichiometric limitation and hence the irradiated 1 is expressed as CuICuII[MoV(CN)8]·7.6H2O. The unpaired electrons on MoV (S=1/2) ions and those on CuII (S=1/2) ions in the irradiated compound interact ferromagnetically, giving rise to the spontaneous magnetization.  相似文献   

12.
《Acta Materialia》2007,55(8):2805-2814
An efficient numerical method was developed to extract the diffusion and electromigration parameters for multi-phase intermetallic compounds (IMC) formed as a result of material reactions between under bump metallization (UBM) and solder joints. This method was based on the simulated annealing (SA) method and applied to the growth of Cu–Sn IMC during thermal aging and under current stressing in Pb-free solder joints with Cu-UBM. At 150 °C, the diffusion coefficients of Cu were found to be 3.67 × 1017 m2 s−1 for Cu3Sn and 7.04 × 1016 m2 s−1 for Cu6Sn5, while the diffusion coefficients of Sn were found to be 2.35 × 1016 m2 s−1 for Cu3Sn and 6.49 × 1016 m2 s−1 for Cu6Sn5. The effective charges of Cu were found to be 26.5 for Cu3Sn and 26.0 for Cu6Sn5, and for Sn, the effective charges were found to be 23.6 for Cu3Sn and 36.0 for Cu6Sn5. The SA approach provided substantially superior efficiency and accuracy over the conventional grid heuristics and is particularly suitable for analyzing many-parameter, multi-phase intermetallic formation for solder systems where quantitative deduction for such parameters has seldom been reported.  相似文献   

13.
The magnetic and magnetocaloric properties of Ho2Cu2Cd compound have been studied. The compound reveals two successive magnetic phase transitions at 30 K and 15 K which are corresponding to the paramagnetic to ferromagnetic transition and a spin reorientation, respectively. Two successive magnetic transitions in Ho2Cu2Cd resulting two peaks in the temperature dependence of magnetic entropy change curves, −ΔSM (T). Two peaks are partly overlapped and induced a large MCE in a wide temperature range, i. e., large refrigerant capacity (RC) and relative cooling power (RCP). For a magnetic field change of 0–7 T, the values of maximal −ΔSM, RC and RCP are 25.1 J/kg K, 527 J/kg and 732 J/kg for Ho2Cu2Cd, respectively.  相似文献   

14.
Intense green up-conversion (UC) emissions from 5F4/5S2  5I8 transitions of Ho3+ in Yb3+/Ho3+ co-doped CaIn2O4 have been observed with excitation at 980 nm. The optimal processing parameters were determined by investigating emission intensities as a function of annealing temperature, duration time and Ho3+/Yb3+ dopant concentrations. It has been confirmed that the green UC luminescence was generated via a two-photon process from the quadratic dependence of the emission intensity on the pump power. A UC mechanism was proposed and the lifetime of the green emission was measured to be ~204 μs. The infrared-to-visible UC efficiency of the optimized CaIn2O4: 0.005Ho3+, 0.1Yb3+ sample increases to ~5.5% with the excitation power and saturates at 1.5 W. The chromaticity coordinates (0.281, 0.708) of the samples are located in the green region and hardly changed due to the negligible red emission. The results indicate that CaIn2O4: Yb3+, Ho3+ could act as an effective UC green light emitter and CaIn2O4 is an ideal oxide host for UC luminescence.  相似文献   

15.
《Intermetallics》2006,14(8-9):957-961
In the present study, amorphous Ti50Cu28Ni15Sn7 and its composite powders reinforced with 4, 8, and 12 vol.% of W additions were prepared by mechanical alloying. After 5 h of milling, amorphous powders with homogeneously dispersed W nanoparticles were synthesized. The as-milled Ti50Cu28Ni15Sn7 and composite powders were then consolidated by vacuum hot pressing into disc compacts with a diameter and thickness of 4 and 10 mm, respectively.The structure of the as-milled powders and consolidated compacts was characterized by X-ray diffraction (XRD), scanning electron microscopy, and transmission electron microscopy. While the thermal stability was examined by differential scanning calorimeter (DSC). In addition, the mechanical property of the consolidated BMGs was evaluated by Vickers microhardness tests. The experimental results showed that W nanoparticles ranged from 20 to 200 nm were embedded within the amorphous matrix. The presence of W nanoparticles did not dramatically change the glass formation ability of amorphous Ti50Cu28Ni15Sn7 powders. While the thermal stability of amorphous powders differed from those of its composites. A significant hardness increase with W additions was noticed for consolidated composite compacts.  相似文献   

16.
《Intermetallics》2007,15(7):912-917
An alternative lead-free solder alloy In–48 at%Sn with a melting point of 120 °C and its implementation to bond Cu substrates in a diffusion soldering joining method are presented. According to the EPMA, TEM/EDX and electron diffraction analyses, two different behaviors were observed in the interconnection zone depending on the temperature range: (i) a single layer consisting of η phase below 200 °C; (ii) a Cu-poor region consisting of η phase and a Cu-rich layer formed by a mixture of thin alternate regions of ζ-Cu10Sn3 and δ-Cu7In3 phases perpendicular to the interconnection plane above 200 °C. The η layer shows two morphologies: large grains and fine grains at the η/In–48Sn (liquid) and at the η/Cu-rich interfaces, respectively. Additionally, the η region shows a gradual change in composition, suggesting a change from the Cu6Sn5 to the Cu2In structures. Thermal stability tests indicate that the thermal resistance of the bonds is about 750 °C.  相似文献   

17.
《Intermetallics》2007,15(11):1471-1478
Cu6−xNixSn5 is an important intermetallic compound (IMC), which was known to greatly improve the reliability of the solder joints in integrated circuits. However, the improvement mechanisms and even the crystal structure of the IMC were not fully understood. In this paper, the first-principles calculations were performed to determine the stable structure of Cu6−xNixSn5 IMC. The structural and electronic properties of Cu6−xNixSn5 (x = 0, 1, 2) IMCs have been calculated. The results show that Ni atoms preferentially occupied 8f sites (Cu2) and formed Cu4Ni2Sn5. The results of energy calculation and density of states demonstrate that this Cu4Ni2Sn5 IMC had a more stable structure than Cu6Sn5. These results are also expected to account for the improvement in the reliability of the solder joint.  相似文献   

18.
Crystal structure, and electrical conducting and magnetic properties of a radical cation salt of EDO-TTFVODS with magnetic FeCl4? ion, (EDO-TTFVODS)2FeCl4 (EDO-TTFVODS = ethylenedioxytetrathiafulvalenoquinone-1,3-diselenolemethide) are reported. In this salt, there are two independent donor molecules formed two different layers A and B, and the counter FeCl4? ions layer is sandwiched between two donor layers A and B along the b-axis. The donor molecules form the one-dimensional columns along the a-axis in both donor layers. This salt shows high conductivity at room temperature (σRT = 25 S cm?1) and a metallic behavior down to ca. 80 K, where a metal–insulator transition however occurs. The magnetic susceptibility obeys a Curie–Weiss law (Curie constant C = 4.42 emu K mol?1 and Weiss temperature Θ = ?1.5 K), without any magnetic ordering down to 1.8 K. This result suggests the weak antiferromagnetic interaction between the d spins of FeCl4? ions.  相似文献   

19.
The temperature stability of the Pr3Pt4 compound was investigated by isothermal annealing at different temperatures, X-ray diffraction (XRD) and differential thermal analysis (DTA). It was found that the decomposition reaction Pr3Pt4  PrPt + PrPt2 took place at temperatures ranging approximately from 360 °C to 830 °C and it was an exothermal reaction. After annealing at 500–750 °C for 7 days, the Pr3Pt4 compound decomposes completely into the two neighboring compounds PrPt and PrPt2.  相似文献   

20.
The results of the first comprehensive study of ferroic phase transitions as a function of temperature and compositions in the mixed multiferroic (1 ? x)Pb(Fe1/2Nb1/2)O3xPbTiO3 (PFN–xPT) system are reported. Temperature-dependent powder synchrotron X-ray diffraction studies confirm unambiguously an interferroelectric transition between monoclinic and tetragonal phases for x ? 0.10. The tetragonal phase of PFN–xPT for x ? 0.10 and x > 0.10 is found to transform to the cubic phase on heating above room temperature. All these transitions are accompanied by distinct anomalies in the temperature dependence of dielectric constant. Our magnetization studies reveal that the nature of the magnetic phase transition changes across the morphotropic phase boundary (MPB) composition of PFN–xPT such that for tetragonal compositions with x > 0.08 there is only one magnetic transition, whereas two antiferromagnetic transitions are observed for monoclinic compositions with x < 0.08. These studies have enabled us to construct a phase diagram of PFN–xPT for the first time.  相似文献   

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