从嵌入式系统角度研究交互电视Java应用(MHP)的设计

介绍了开发MHP Java应用及其所处的环境特点,探讨了MHP应用程序开发人员在设计MHP应用软件时应注意与考虑的基本问题.     

基于硅微加工工艺的微热板传热分析

针对常压和真空两种环境,通过三维有限元模拟分析了背面体硅加工型、正面体硅加工型和表面加工型三种微热板(MHP)的传热主渠道和加热功率.制作了背面体硅加工型和表面加工型MHP,并对两者在常压及13.3Pa气压下的加热功率进行了测试.实验值与有限元分析结果一致,表明虽然真空中表面加工型MHP热功耗小于背面体硅加工型MHP,但薄层空气导热使表面加工型MHP在大气中的功耗大幅增加,并大于背面体硅加工型MHP的热功耗.     

多媒体家庭平台的系统结构与应用

介绍了多媒体家庭平台（MHP）的基本概念，讨论了MHP对于数字电视和交互电视行业的意义和影响。给出了MHP的框架结构，分析了开发MHP应用的基本步骤。同时给出了Philips MHP原型软件栈和基于此原型开发的中文MHP应用。     

多媒体家庭平台系统结构及其接收机成本分析

介绍了多媒体家庭平台（MHP）的系统结构，讨论了MHP兼容的交互数字电视接收机软、硬件平台的基本构成，分析了影响MHP交互数字电视接收机成本的因素，最后讨论了影响中文MHP交互数字电视接收机成本的关键问题。     

一种符合MHP的数字电视中间件事件管理模式的设计

介绍符合MHP规范的中间件事件管理模式的设计.从事件管理的功能需求出发,介绍事件管理的整体架构和流程,同时讨论了MHP为事件管理定义的org.dvb.event API及如何用Java语言实现.     

基于硅微加工工艺的微热板传热分析

针对常压和真空两种环境，通过三维有限元模拟分析了背面体硅加工型、正面体硅加工型和表面加工型三种微热板(MHP)的传热主渠道和加热功率．制作了背面体硅加工型和表面加工型MHP，并对两者在常压及13.3Pa气压下的加热功率进行了测试．实验值与有限元分析结果一致，表明虽然真空中表面加工型MHP热功耗小于背面体硅加工型MHP，但薄层空气导热使表面加工型MHP在大气中的功耗大幅增加，并大于背面体硅加工型MHP的热功耗．     

多媒体家庭平台（MHP）

多媒体家庭平台(MHP：Multimedia Home Flatform)是向未来交互式多媒体应用迈进的一个重要步骤．本文主要介绍了MHP的基本构成和应用，并对MHP的一些关键技术作了详细的说明．     

MHP底层中间件及嵌入式设备驱动程序的研究

分析MHP中间件的结构,讨论MHP底层中间件的设计方法及与之相关的嵌入式设备驱动程序,并分别以PCI和USB总线为例说明嵌入式I/O总线驱动程序的设计方法.     

多媒体家庭平台

1 MHP应运而生 2002年7月3日,DVB执行委员会在其第37次会议上批准了MHP(Multimedia Home Platform,多媒体家用平台)测试组件版本V1.0.2a。这是MHP标准制订中最后一个批准的模块。     

论数字电视MHP的图形参考模型

数字电视系统的MHP(MultimediaHomePlatform:多媒体家庭平台最终呈现给终端用户的信息是人机交互的图形参考界面,图形显示在整个数字电视业务平台中起着十分重要的作用。本文从数字电视MHP的图形参考模型入手,就MHP的图形结构以及图形层次的重叠/组合,进行了论述。     

微热板阵列的热干扰

针对微热板阵列建立了热路模型,并对热干扰进行分析.结果表明,由于微热板悬窄结构的热阻比硅芯片的热阻高3个数量级.因此微热板阵列芯片的热干扰温度取决于封装对环境的热阻,而芯片上器件的间距对热干扰温度的影响可以忽略.研制了3种布局、T05和DIPl6两种封装形式的微热板阵列,并对阵列中的热干扰问题进行了实验测试.测试数据验证了热路模型的结论.因此,减小微热板阵列或集成芯片的热干扰的关键在于,尽可能增大微热板悬空结构的热阻以及选用热阻小的封装形式.     

Improving thermal performance of miniature heat pipe for notebook PC cooling

A miniature heat pipe (MHP) with woven wire wick was used for cooling a notebook PC. The cross-sectional area of the pipe is reduced by about 30% of the original, when the diameter of the MHP is pressed from 4 to 2 mm for packaging in a notebook PC. In the present study, a test of the MHP has been performed in order to review the thermal performance by varying pressed thickness, total length of MHP, wall thickness, heat flux and inclination angle. New wick types were considered for overcoming low heat transfer limits, which occur when the MHP is pressed to a thin plate. Through a performance test, the limiting thickness of pressing is shown to be within the range of 2–2.5 mm. When the wall thickness of 0.4 mm is reduced to 0.25 mm for minimizing conductive thermal resistance through the wall of heat pipe, the heat transfer limit and thermal resistance of the MHP were improved about 10%. While the thermal resistance of the MHP with central wick type is lower than that of the MHP with circular oven wire wick, the thermal resistance of the MHP with composite wick of woven/straight wire is higher than that of the MHP with circular woven wire wick. From the performance test conducted on the MHP cooling modules with woven wicks, it is seen that the T_jc (junction temperature of the processor) satisfies a demand condition of being between 0 and 100 °C. This shows the stability of the MHP as a cooling system of notebook PCs.     

Secondary Ion Mass Spectrometry (SIMS) for Chemical Characterization of Metal Halide Perovskites

Metal halide perovskite (MHP) solar cells have attracted much attention due to the rapidly growing power conversion efficiency that has reached 25.2% in a decade, comparable to established commercial photovoltaic modules. Compositional engineering is one of the most effective methods to boost the performance of MHP solar cells. Further improving the efficiency and the stability of MHP solar cells necessitates good understanding of the chemical–efficiency correlation and the chemical evolution during the degradation of MHP solar cells. In this regard, time‐of‐flight secondary ion mass spectrometry (ToF‐SIMS) is a powerful tool to investigate the chemical aspect of MHPs and has played an important role in advancing the development of MHP optoelectronics. However, up to date, a review that can guide future utilization of ToF‐SIMS in the MHP development is missing. Herein, the capabilities of ToF‐SIMS in MHP investigations are summarized and analyzed from simple material synthesis and chemical distribution to more complicated device operation mechanism and stability. The strength of ToF‐SIMS in resolving important issues in this field, such as interface composition, ion migration, and degradation in MHP is highlighted. Finally, an outlook with an emphasis on making the utmost of ToF‐SIMS in developing MHP devices is provided.     

基于Hermite多项式的超宽带脉冲波形研究

基于Hermite多项式理论,给出了一种适合超宽带通信的窄脉冲函数,即修正的Hermite多项式.分析了脉冲形成因子和Hermite多项式的阶数对其脉冲波形及能量谱密度的影响.研究了跳时扩频脉冲位置调制的超宽带系统在加性高斯白噪声信道下使用该脉冲的系统性能.仿真结果表明,该系统中三阶修正Hermite多项式的性能要比其它阶好.     

The DVB Multimedia Home Platform (MHP) and Related Specifications

For some years, digital pay television services have been accompanied by software applications which are downloaded from the broadcast into the set-top boxes in the living room and executed there. The formats and protocols used for these are proprietary. In 2000, after a long and difficult development process, the DVB Project offered to the world an open standard specification to support the execution of such applications called the Multimedia Home Platform (MHP). It enables digital content providers and broadcast equipment suppliers to address MHP receivers, regardless of the manufacturer of the receiver or the developer of the MHP middleware implementation. Since the completion of version 1.0 of the MHP specification in January 2000, derivative specifications have been produced for non-DVB markets. One such derivative is the Open Cable Application Platform (OCAP) produced by CableLabs for cable TV in the United States. This removes completely those MHP features which are simply not applicable in that market. Other features are replaced with a U.S. equivalent. Extensions have been defined by CableLabs for additional requirements.     

MHP发展概况

介绍了多媒体家用平台(MHP)在一些国家和地区的应用情况,及其在各消费类电子厂商的实现情况,以及世界中间件技术标准的发展状况.     

MHP底层中间件及嵌入式设备驱动程序的研究

分析MHP中间件的结构,讨论MHP底层中间件的设计方法及与之相关的嵌入式设备驱动程序,并分别以PCI和USB总线为例说明嵌入式I/O总线驱动程序的设计方法。