Piezoelectric bimorph microphone built on micromachined parylene diaphragm

This paper describes a novel bimorph piezoelectric microphone built on a micromachined parylene diaphragm with two ZnO films of opposite c-axis orientations. Both the sensitivity and signal-to-noise ratio (SNR) of the bimorph parylene-diaphragm microphone have been demonstrated to be much higher than those of a conventional unimorph silicon-nitride-diaphragm microphone.     

Fabricating capacitive micromachined ultrasonic transducers with wafer-bonding technology

Introduces a new method for fabricating capacitive micromachined ultrasonic transducers (CMUTs) that uses a wafer bonding technique. The transducer membrane and cavity are defined on an SOI (silicon-on-insulator) wafer and on a prime wafer, respectively. Then, using silicon direct bonding in a vacuum environment, the two wafers are bonded together to form a transducer. This new technique, capable of fabricating large CMUTs, offers advantages over the traditionally micromachined CMUTs. First, forming a vacuum-sealed cavity is relatively easy since the wafer bonding is performed in a vacuum chamber. Second, this process enables better control over the gap height, making it possible to fabricate very small gaps (less than 0.1 /spl mu/m). Third, since the membrane is made of single crystal silicon, it is possible to predict and control the mechanical properties of the membrane to within 5%. Finally, the number of process steps involved in making a CMUT has been reduced from 22 to 15, shortening the device turn-around time. All of these advantages provide repeatable fabrication of CMUTs featuring predictable center frequency, bandwidth, and collapse voltage.     

Optical properties of surface micromachined mirrors with etch holes

We have investigated the optical properties of surface-micromachined polycrystalline silicon reflectors within the visible spectral range at five different wavelengths. The measurement results of the reflectivity of various microreflectors at four different incident angles (20°, 30°, 45°, and 60°) are presented. Optical properties of microreflectors realized using the multiuser MEMS process (MUMPS) have been investigated. Our studies have found that etch holes, widely used in the surface micromachining process to reduce the time for releasing structures by sacrificial undercutting, have a great influence on the optical properties of micromachined mirrors. Diffraction patterns created by two-dimensional etch-hole arrays on micromachined mirrors have been investigated. The diffraction by etch holes obeys the Fraunhofer diffraction theory when a collimated light source (e.g., a laser beam) is incident. We have shown that when the dimension of etch holes increases, an increasing portion of the incident power will be diffracted and transmitted due to etch holes, leading to decreasing reflectivity of surface micromachined mirrors     

表面微机械MEMS温度传感器研究

提出一种基于表面微机械工艺的MEMS温度传感器,其基本原理是：由于材料热膨胀系数的差异,复合悬臂梁在热应力作用下发生弯曲,进而影响压阻单元中的应力分布,压阻变化通过惠斯登电桥读出,由电桥输出电压变化表征温度的变化。相比于其他温度传感器,这种微机械温度传感器的灵敏度高、尺寸小、精度高。针对提出的温度传感器结构,文中给出了传感器的设计原理、制备工艺以及信号检测电路的设计。经测试,传感器的灵敏度为9.2 mV/℃,具有良好的稳定性。     

Characterization of surface micromachined metallic microneedles

The purpose of the paper is to provide quantitative characterization of metallic microneedles. Mechanical and fluid flow experiments were performed to evaluate the buckling force, the penetration force, and the pressure versus flow rate characteristics of the microneedles. The microneedle design variations characterized included varying the shaft lengths, varying the tip taper angles/geometries, and the inclusion of micromechanical barbs. The penetration force was found to range from 7.8 gF for a microneedle of shaft length 500 /spl mu/m, to 9.4 gF for a length of 1500 /spl mu/m, both with a tip taper angle of 30/spl deg/. Microneedles with a linear tip taper angle of 30/spl deg/ penetrated 95 +% of the time without failure. The microneedles with a 15/spl deg/ and 20/spl deg/ linear tip taper penetrated 10% and 25% of the time, respectively. The buckling force was found to be 98.4 gF for a 500 /spl mu/m long microneedle shaft, 72.3 gF for a needle of shaft length 1000 /spl mu/m, and 51.6 gF for a 1500 /spl mu/m long shaft. The results demonstrate that the penetration force was 7.9% of the buckling force for 500 /spl mu/m long shafts, 11.6% for a 1000 /spl mu/m long shaft, and 18.2% for a 1500 /spl mu/m long microneedle shafts. The microneedle fluid flow characteristics were studied. An inlet pressure of 49.0 Pa was required for a flow rate of 1000 /spl mu/L/h and 243.0 Pa for a flow rate of 4000 /spl mu/L/h using air as the fluid medium. For water, an average pressure of 30.0 kPa was required for a flow rate of 1000 /spl mu/L/h and 106.0 kPa for a flow rate of 4000 /spl mu/L/h.     

Solid-based CAPP for surface micromachined MEMS devices

Process planning for a MEMS device is almost always conducted manually by the designer to date. As the structures of MEMS devices become more and more complicated, in order to release the designers from the hard and tedious work and speed up the development of MEMS products, such a situation should be changed. In this study, a solid based CAPP method for surface micromachined MEMS device is presented. With this method, a MEMS device is designed with a traditional CAD system, and its process planning is conducted automatically based on the solid model created. The process features with engineering semantics are extracted first. Then, the process layer model is constructed with each process layer of the model being coincident with the fabrication layer of surface micromachining. Finally, the masks are synthesized and the fabrication process is generated. Furthermore, to guarantee the manufacturability of the designed MEMS device, a systematic evaluation method is proposed. The proposed design and CAPP methods enable designers to concentrate on functional and shape design of MEMS devices.     

Tunable Fabry-Perot surface micromachined interferometer-experiments and modeling

We present an optical tunable Fabry-Perot micromachined interferometer. The device is monolithically integrated with a p⁺-n photodiode on a silicon substrate, providing an adequate positioning of the photonic and microoptical components. The Fabry-Perot micro-interferometer consists of two parallel mirrors and lets the light with a particular wavelength pass through. The wavelength depends on the gap between the mirrors. We can change the gap of the micro-mechanical Fabry-Perot interferometer by applying a voltage to the mirrors, an electrostatic force inducing an attraction between the substrate and the top mirror. A simulation of the mechanical behavior was performed based on finite elements, using CoventorWare software. The method included an electro-mechanical simulation for a square parallel plate actuation with four connecting beams. The finite elements method (FEM) simulations of the device (the Fabry-Perot tunable filter) are performed for optimizing the design parameters in order to model the overall system performance, both the steady-state behavior and dynamic response.     

压电微固体模态陀螺的安装技术

压电微固体模态陀螺（ PMMG）利用压电PZT长方体的某高阶共振模态作为参考振动,是一种抗冲击、抗震动能力强的新型全固态陀螺。获得优化的参考振动振型对提高陀螺性能至关重要,但是大多数文献都没有涉及到封装对参考振动的影响。利用有限元方法（ FEM）分析了压电振子安装时支撑点位置与接触面积对参考振动的影响,分析结果表明：相对于接触面积的变化,支撑点位置的变化对陀螺参考模态的影响更大。该研究结果为压电微固体模态陀螺的安装方法提供了理论基础。     

Die separation and packaging of a surface micromachined piezoresistive pressure sensor

The processing steps required to obtain a useful single medical sensor assembly are discussed, starting from an entire silicon wafer with thousands of surface micromachined sensors. Experiences concerning dicing and packaging of a piezoresistive pressure sensor are described, together with proposals for solutions. Problems with fracture of essential sensor structures are solved by use of a wafer protection tape. Existing solutions for flip–chip bonding and design of substrate for electrical interconnection are pushed to their limits due to the very small size of the novel sensor. As many of the processes can be simplified by an improved MEMS design, critical points related to the design are addressed.     

Improvement of the performance of microphones with a silicon nitride diaphragm and backplate

The performance of a single-wafer fabricated silicon condenser microphone has been improved by increasing the stress and the acoustic hole density of the backplate and by decreasing the diaphragm thickness. The best microphones show a sensitivity of 5.0 mV Pa⁻¹, which corresponds to an open-circuit sensitivity of 10 mV Pa⁻¹ for a microphone capacitance of 6.6 pF. The measured frequency response is flat within ±2 dB from 100 Hz to 14 kHz, which is better than the requirements for a hearing-aid microphone. The operating voltage of these microphones is only 5.0 V, which is about 60% of the collapse voltage. The measured noise level of the microphones is 30 dBA SPL, which is approximately as low as required for a hearing-aid microphone ( <29.5 dBA SPL).     

A new measurement microphone based on MEMS technology

This paper presents a new type of measurement microphone that is based on MEMS technology. The silicon chip design and fabrication are discussed, as well as the specially developed packaging technology. The microphones are tested on a number of key parameters for measurement microphones: sensitivity, noise level, frequency response, and immunity to disturbing environmental parameters, such as temperature changes, humidity, static pressure variations, and vibration. A sensitivity of 22 mV/Pa (-33 dB re. 1 V/Pa), and a noise level of 23 dB(A) were measured. The noise level is 7 dB lower than state-of-the-art 1/4-inch measurement microphones. A good uniformity on sensitivity and frequency response has been measured. The sensitivity to temperature changes, humidity, static pressure variations and vibrations is fully comparable to the traditional measurement microphones. This paper shows that high-quality measurement microphones can be made using MEMS technology, with a superior noise performance.     

Low-cost surface micromachined microhotplates for chemiresistive gas sensors

Microsystem Technologies - Microhotplate (MHP) based gas sensors have gained significant attention recently due to their small size, low power and feasibility for integration of electronics on the...     

Design and modeling of a frog-shape MEMS capacitive microphone using SOI technology

Microsystem Technologies - In this paper, a novel micro electro mechanical systems (MEMS) capacitive microphone is designed and modeled using SOI technology. We present static linear spring...     

A fully integrated surface micromachined magnetic microactuatorwith a multilevel meander magnetic core

A fully integrated magnetic microactuator using surface micromachining techniques is presented. To achieve this device, low-resistance meander conductors located in a single plane were interwoven with multilevel meander magnetic cores. This `wrapped' solenoid (with the core wrapped around the conductor) was fabricated in a fully integrated fashion. A magnetic microactuator was realized by incorporating a surface micromachined nickel-iron cantilever beam as part of the magnetic circuit of the core. The nickel-iron cantilever beam was 2.5 μm thick, 25 μm wide, and 780 μm long, and the magnetic circuit contained seventeen turns of meander-type solenoid coils. Cantilever beam tip deflection of 6 μm in the vertical direction was achieved when a DC voltage less than 1 V (and resulting drive current of 800 mA) was applied to the coils. This fully integrated multilevel topology offers advantages in a variety of micromagnetic applications, where actuators can be fabricated on the same substrate with an integrated circuit and actuated with low voltages     

A two-dimensional optical cross-connect with integrated waveguides and surface micromachined crossbar switches

The design, fabrication and test results of an all-optical cross-connect, which uses electrostatically actuated micromechanical digital mirrors to steer optical signals in a network of planar waveguides, are presented. The substrate consists of a network of spliced planar waveguides on silica substrates. The switches, located at the waveguide intersections, are formed with an electroplated T-structure consisting of a horizontal perforated square plate suspended by four elastic beams. When operated, the horizontal plate is pulled up making the mirror move out of the optical path thus steering the beam. An 8×8 switch array has been fabricated and tested. Actuation and relaxation switching times near 3 ms have been demonstrated with an actuation voltage of 120 V. The optical insertion loss for the array typically varied from 2.3 dB for a single trench in the optical path (shortest optical path) to 8 dB for 15 trenches in the optical path (longest optical path).     

Asymmetric surface roughness measurements and meniscus modeling of polysilicon surface micromachined flaps

Polycrystalline silicon (polysilicon) films are primary structural materials for microelectromechanical systems (MEMS). Due to relatively high compliance, large surface-to-volume ratio, and small separation distances, micromachined polysilicon structures are susceptible to surface forces which can result in adhesive failures. Since these forces depend on surface properties especially surface roughness, three types of microhinged flaps were fabricated to characterize their roughness and adhesive meniscus properties. The flaps enabled access to both the top and bottom surfaces of the structural polysilicon layers. Roughness measurements using an atomic force microscope revealed that MEMS surfaces primarily exhibit non-Gaussian surface height distributions, and for the release procedures studied, the bottom surface of the structural layers was significantly smoother and prone to higher adhesion compared to the top surface. A non-symmetric surface roughness model using the Pearson system of frequency curves was coupled with a capillary meniscus adhesion model to analyze the effects of surface roughness parameters (root-mean-square, skewness, and kurtosis), relative humidity, and surface contact angle on the interfacial adhesion energy. Using the measured roughness properties of the flaps, four different surface pairs were simulated and compared to investigate their effects on capillary adhesion. It was found that since the base polysilicon layer (poly0) was rougher than the base silicon nitride and the structural layer on poly0 was also rougher than that on silicon nitride, depositing MEMS devices on poly0 layer rather than directly on silicon nitride will reduce the adhesion energy.     

基于显微镜图像的三维场景重建技术研究

描述了一种基于显微镜图像下的二维融合图的三维重建技术,该技术可以还原出二维融合图像的三维特征。在分析原理的基础上,使用Direct3D在VC环境下实现了三维重建技术。     

基于CDC技术的电容式水平位移传感器

对矿井井壁变形引起的水平位移进行测量,采用基于电容数字转换器(CDC)技术的芯片AD7745进行电容测量,设计了能够对水平位移进行非接触测量的电容式传感器和测量电极的结构,硬件上采用外壳屏蔽等措施提高抗干扰能力,软件上通过对AD7745内部可编程寄存器的合理设置实现高精度测量.实验结果表明:该传感器在量程为±10 mm时,可达到0.1 mm的测量精度.     

Linearization of electrostatically actuated surface micromachined2-D optical scanner

This paper presents an effective method of linearizing the electrostatic transfer characteristics of micromachined two-dimensional (2-D) scanners. The orthogonal scan angles of surface micromachined polysilicon scanner are controlled by using quadrant electrodes for electrostatic actuation. By using a pair of differential voltages over a bias voltage, we could improve the distortion of projected images from 72% to only 13%. A theoretical model has been developed to predict the angle-voltage transfer characteristics of the 2-D scanner. The simulation results agree very well with experimental data. Differential voltage operation has been found to suppress the crosstalk of two orthogonal scan axes by both experiment and theoretically. We have found that a circular mirror is expected to have the lowest angular distortion compared with square mirrors. Perfect grid scanning pattern of small distortion (0.33%) has been successfully obtained by predistorting the driving voltages after calibration     

A monolithically integrated surface micromachined touch mode capacitive pressure sensor

A monolithically integrated surface micromachined touch mode capacitive pressure sensor and its interface circuits are presented. The device includes the capacitance to voltage, and capacitance to frequency converters on the same chip. The sensor is fabricated using a surface micromachining technology, which is processed simultaneously with a conventional 2.0-μm double-poly, double-metal n-well CMOS process. The performance of the integrated sensor meets the design specifications of good linearity and good stability. Evaluation results on the completed ‘sensor and circuit' chip are presented.