Formation of silicon reentrant cavity heat sinks using anisotropicetching and direct wafer bonding

A novel silicon reentrant cavity heat sink for enhanced liquid cooling of silicon multichip substances has been fabricated using a two-step anisotropic etching process followed by silicon direct wafer bonding. Cavity mouth openings ranging from 8 to 500 μm have been batch fabricated with the two-step process. The reentrant cavities suppress the temperature overshoot normally associated with the transition between the free convection and nucleate boiling regimes of liquid immersion cooling. Nucleate boiling has been observed to occur at heater fluxes below 2 W/cm² for both increasing and decreasing heat flux conditions. Specific thermal contact resistances (heater fluid) of less than 0.6 K-cm²/W have been measured in Freon-22, R-113, and FC-72     

Heterogeneous silicon integration by ultra-high vacuum wafer bonding

Heterogeneous integration of technologically important materials, such as SiC/Si, GaN/Si, Ge/Si, Si/nano-Si/Si, SiC-on-insulator (SiCOI), and ZrO₂/SiO₂/Si, was successfully made by ultra-high vacuum (UHV) wafer bonding. A unique, UHV bonding unit, especially designed to control interface structure, chemistry, and crystallographic orientation within narrow limits, was used to produce homophase and heterophase planar interfaces. In-situ thin-film-deposition capability in conjunction with the wafer bonding offered even more flexibility for producing integrated artificial structures. Prebonding surface preparation was critically important for the formation of strong bonded interfaces. The substrate-surface morphology was examined by atomic-force microscopy (AFM) prior to bonding. In-situ Auger spectroscopy measurements of surface chemistry were invaluable predictors of bonding behaviors. Plasma processing very effectively cleaned the substrates, achieving a near-perfect interfacial bond at the atomic scale. The integrity of the bonded interfaces was studied in the light of their structural and chemical characteristics analyzed by high-resolution, analytical electron microscopy.     

Room temperature wafer bonding of silicon, oxidized silicon, and crystalline quartz

The use of plasma immersion as preparation for room temperature wafer bonding has been investigated. Silicon wafers have been successfully bonded at room temperature after exposure to oxygen or argon plasma. Oxidized silicon wafers and crystalline quartz have been bonded after exposure to oxygen plasma. The bonded interfaces exhibit very high surface energies, comparable to what can be achieved with annealing steps in the range of 600–800°C using normal wet chemical activation before bonding. The high mechanical stability obtained after bonding at room temperature is explained by an increased dynamic in water removal from the bonded interface allowing covalent bonds to be formed. Electrical measurements were used to investigate the usefulness of plasma bonded interfaces for electronic devices.     

Microcavities with field emitters sealed by silicon wafer bonding

A method of fabricating micrometre-sized field emission diodes is described. The devices use silicon field emitters that have been grown by selective epitaxy into 0.9 mu m sized contact holes in a 1 mu m thick field oxide. The anode of the device structure is a silicon wafer directly bonded to the field oxide.<>     

Silicon layer transfer using wafer bonding and debonding

Two experiments were performed that demonstrate an extension of the ion-cut layer transfer technique where a polymer is used for planarization and bonding. In the first experiment hydrogen-implanted silicon wafers were deposited with two to four microns low-temperature plasma-enhanced tetraethoxysilane (TEOS). The wafers were then bonded to a second wafer, which had been coated with a spin-on polymer. The bonded pairs were heated to the ion-cut temperature resulting in the transfer of a 400 nm layer silicon. The polymer enabled the bonding of an unprocessed silicon wafer to the as-deposited TEOS with a microsurface roughness larger than 10 nm, while the TEOS provided sufficient stiffness for ion cut. In the second experiment, an intermediate transfer wafer was patterned and vias were etched through the wafer using a 25% tetramethylammonium hydroxide (TMAH) solution and nitride as masking material. The nitride was then stripped using dilute hydrofluoric acid (HF). The transfer wafer was then bonded to an oxidized (100 nm) hydrogen-implanted silicon wafer. After ion-cut annealing a silicon-on-insulator (SOI) wafer was produced on the transfer wafer. The thin silicon layer of the SOI structure was then bonded to a third wafer using a spin-on polymer as the bonding material. The sacrificial oxide layer was then etched away in HF, freeing the thin silicon from the transfer wafer. The result produced a thin silicon-on-polymer structure bonded to the third wafer. These results demonstrate the feasibility of transferring a silicon layer from a wafer to a second intermediate “transfer” or “universal” reusable substrate. The second transfer step allows the thin silicon layer to be subsequently bonded to a potential third device wafer followed by debonding of the transfer wafer creating stacked three-dimensional structures.     

Surface-related phenomena in the direct bonding of silicon and fused-silica wafer pairs

Direct bonding is the result of a complex interaction between chemical, physical and mechanical properties of the surfaces to be bonded and is therefore strongly correlated with the surface state of the materials. Phenomena characteristic of the actual bonding process are (a) the formation of an initial bond area, (b) bond energy, and (c) bond-front velocity. The effects of variations in surface state on these process characteristics have been investigated for silicon, oxidized silicon and fused-silica wafer pairs. The surface bond energy of hydrophilic wafers is in the range of 0.05–0.2 J/m² and is largely determined by the hydrogen bonds formed. The bond energy of hydrophobic wafers is a factor of 10 smaller and is determined by Van der Waals attractive forces. The bond-front velocity is determined by the surface state and the stiffness of the wafer. Both bond energy and bond-front velocity show ageing effects.     

Atomic scale engineering of nanostructures at silicon carbide surfaces

The atomic scale ordering and properties of cubic silicon carbide surfaces are investigated by room and high-temperature scanning tunneling microscopy. In this review, we will focus on the Si-terminated β-SiC(100) surfaces only. Self-formation of Si atomic lines and dimer vacancy chains on the β-SiC(100) surface is taking place at the phase transition between the 3×2 (Si-rich) and c(4×2) surface reconstructions. Using a rigorous protocol in surface preparation, it is possible to build very long, very straight and defect free Si atomic lines, forming a very large superlattice of massively parallel lines. These self-organized atomic lines are driven by stress. They have unprecedented characteristics with the highest thermal stability ever achieved for nanostructures on a surface (900 °C) and the longest atomic lines ever built on a surface (micrometer scale long). Investigating their dynamics, we learn that their dismantling at high-temperature results from collective and individual mechanisms including one-by-one dimer removal. Overall, this is a model system especially suitable for nanophysics and nanotechnologies.     

Vertically coupled microring resonators using polymer wafer bonding

A new technique is presented to make vertically coupled semiconductor microring resonators that eases the fabrication process with devices more robust to ring-to-waveguide misalignments. Single-mode microring optical channel dropping filters are demonstrated for the first time in this configuration with Qs greater than 3000 and an on-resonance channel extinction greater than 12 dB. A 1×4 multiplexer/demultiplexer crossbar array with second-order microrings was also made and exhibited channel-to-channel crosstalk lower than 10 dB     

低温阳极键合工艺研究

对低温阳极键合特性进行了研究.通过对硅片进行亲水、疏水和表面未处理3 种不同处理方式研究其对键合的影响,键合前将硅片浸入去离子水（DIW）中不同时间,研究硅表面H基和氧化硅分子数量对键合的影响.结果表明经亲水处理的硅片在水中浸泡1 h 的键合效果最佳.并设计了不同烘烤时间下的阳极键合实验,表明在100 °C 下烘烤30 min 可以有效减少气泡的数量和尺寸.由不同工艺条件下得到的键合形貌可知,通过控制硅片表面微观状态可以达到减小或消除键合气泡的目的.     

Comparison of diamond wire cut and silicon carbide slurry processed silicon wafer surfaces after acidic texturisation

Our work focuses on the acidic etching of silicon wafers, cut via diamond wire (DW) or silicon carbide slurry process (SP). The DW and SP as-cut wafer surface structures have a significant impact on the evolution of the two resultant and different etched morphologies. The time-dependent development of the surface morphology for mono- and multi-crystalline wafers is compared and analyzed via etch rates, reflectivity measurements and confocal microscopy. The as-cut structure of the differently sawn wafers defines a template where the etch attack preferentially occurs and predetermines the texturisation of the etched surface. Based on the experimental results it is possible to lower the reflectivity of the SP-sawn wafers by varying the acidic mixture. On the contrary, the DW-sawn wafers obtain only a small enlargement of the folded surface area during acidic texturisation and no influence of different acidic etch solutions on the reflectivity values was found. To create homogeneously texturized DW-sawn wafers of low reflectivity, an adaptation of the sawing process as well as the development of new etchants and new etch conditions is necessary.     

Fabrication of AD/DA microfluidic converter using deep reactive ion etching of silicon and low temperature wafer bonding

The purpose of this work is to describe an original process that has been designed for the fabrication of a microfluidic converter. The fabrication is based on deep reactive ion etching of silicon and low temperature full wafer adhesive bonding. The technology development includes an improvement of the bonding process in order to produce an adaptive strength of SU-8 bond which not only ensures absence of debonding failures during the silicon deep etching procedure and the subsequent dicing procedure, but also avoids the potential SU-8 overflow leakage into channels due to the bonding step. Besides, the originality of the work is not only in the process but also in the design of the device. Common actuation method for microfluidic system is either based on closed-channel continuous-flow microfluidic (CMF) or droplet-based microfluidic (DMF). Both of them have advantages and disadvantages, and their integration on a single system is in dire need. In this paper, we briefly discuss the concept of microfluidic converter, integrating CMF with DMF, which can: (i) continuously preload reagents, (ii) independently manipulate several droplets, (iii) recombine and export samples into closed-channel continuous flow, making it ideal for interfacing to liquid-handling instruments and micro-analytical instruments.     

Long-wavelength two-dimensional WDM vertical cavity surface-emitting laser arrays fabricated by nonplanar wafer bonding

We demonstrate the first long-wavelength two-dimensional wavelength-division-multiplexed vertical cavity surface-emitting laser array. The eight-channel single-mode array covers the C-band from 1532 to 1565 nm. The devices are fabricated using two separate active regions laterally integrated using nonplanar wafer bonding. We achieved single-mode powers up to 0.8 mW, 2-dB output power uniformity across the array, and sidemode suppression ratios in excess of 43 dB. This fabrication technique can be used to maintain the gain-peak and cavity-mode alignment across wide-band arrays and, with the use of nontraditional mirrors, can be extended to the fabrication of arrays covering the entire C-, S-, and L-bands as well as the 1310-nm transmission band.     

Fabrication of monolithic photovoltaic arrays on crystalline silicon by wafer bonding and deep etching techniques

In this work, a novel technology to fabricate small (∼1 cm²) c‐Si photovoltaic mini‐modules is shown. This technology combines two main bulk micro‐machining techniques: fusion (or adhesive) bonding and anisotropic etching of silicon. Due to the fact that the photovoltaic cells are fabricated in the same wafer, it is mandatory to etch the whole substrate to ensure electrical isolation. Once the individual cells are bulk‐isolated they can be connected in series so as to scale up the output voltage of the mini‐array. A handling wafer is required to provide mechanical stability to the device wafer. Adhesive and fusion bonding are used to join the handling and the device wafer. First electrical results, under standard Air Mass 1·5 (AM 1·5) solar spectrum light (100 mW/cm²), using a 9‐cell series connected mini‐module fabricated by fusion bonding, leads to a total open‐circuit voltage of 4·11 V, a short‐circuit current of 2·45 mA, and a maximum delivered power of 3·8 mW for each mini‐module (1·4 cm²). A 16‐cell series‐connected mini‐module fabricated by adhesive bonding and wire bonding, yields an open‐circuit voltage of 7·45 V, a short‐circuit current of 390 µA, and maximum delivered power of 1·8 mW, with 1·1 cm² of mini‐module area. Copyright © 2005 John Wiley & Sons, Ltd.     

Diffusion and oxide viscous flow mechanism in SDB process and silicon wafer rapid thermal bonding

A relationship between bonding strength and bonding area has been found which suggests that the increase in bonding strength is caused by the bonding area increase in the oxidised silicon wafer direct bonding (SDB) process. The bonding area shows a saturation property with bonding time. Diffusion of various species existing in bonding interface region plays a key role in SDB process over different temperature. Viscous flow of the oxides completes bonding at T>1050 degrees C. A rapid thermal bonding (RTB) at 1200 degrees C for 2 min following 800 degrees C for 2 hr annealing realises complete bonding with little doping profile change in the system.<>     

采用界面薄层氧化硅的硅片直接键合技术研究

本文研究了采用界面薄层氧化硅的硅片直接键合技术。利用原子力显微镜（AFM）和剪切力测试分别表征表面粗糙度和键合强度随着薄层氧化硅厚度的变化情况。对比了采用热氧化和等离子体增强化学气相沉积法（PECVD）两种方法对晶片粗糙度及键合强度的影响。结果表明采用热氧化和PECVD沉积薄层氧化硅做硅片直接键合,键合强度分别可以达到18MPa和8MPa,键合强度随着薄层界面氧化硅厚度的增加而下降,这对于MEMS器件制备及其他硅片直接键合的应用都具有十分重要的指导意义。     

A quasi-SOI power MOSFET for radio frequency applications formed byreversed silicon wafer direct bonding

A quasi-SOI power MOSFET for radio frequency (RF) applications was fabricated by reversed silicon wafer direct bonding (RSDB). Its breakdown voltage was more than twice that of the conventional SOI power MOSFET and its other dc characteristics were almost the same. Its maximum oscillation frequency was about 15% higher than that of the conventional SOI power MOSFET. The power-added efficiency (PAE) of the quasi- SOI power MOSFET was higher than the SOI one. It showed excellent PAE of 68% at a drain bias of 3.6 V     

Microstructure examination of copper wafer bonding

The microstructure morphologies and oxide distribution of copper bonded wafers were examined by means of transmission electron microscopy (TEM) and energy dispersion spectrometer (EDS). Cu wafers exhibit good bond properties when wafer contact occurs at 400°C/4000 mbar for 30 min, followed by an anneal at 400°C for 30 min in N₂ ambient atmosphere. The distribution of different defects showed that the bonded layer became a homogeneous layer under these bonding conditions. The oxidation distribution in the bonded layer is uniform and sparse. Possible bonding mechanisms are discussed.     

Intermediate wafer level bonding and interface behavior

The paper presents a new silicon wafer bonding technique. The high-resolution bonding pad is defined through photolithography process. Photosensitive materials with patternable characteristics are served as the adhesive intermediate bonding layer between the silicon wafers. Several types of photosensitive materials such as SU-8 (negative photoresist), AZ-4620 (positive photoresist), SP341 (polyimide), JSR (negative photoresist) and BCB (benzocylbutene) are tested and characterized for their bonding strength. An infrared (IR) imaging system is established to examine the bonding results. The results indicate that SU-8 is the best bonding material with a bonding strength up to 213 kg/cm² (20.6 MPa) at bonding temperature less than 90 °C. The resolution of bonding pad of 10 μm can be achieved. The developed low temperature bonding technique is particularly suitable for the integration of microstructures and microelectronics involved in MEMS and VLSI packaging processes.     

Use of direct wafer bonding of silicon for fabricating solar cell structures with vertical p-n junctions

A technology based on ion implantation and the direct wafer bonding of p ⁺-p-n ⁺ structures has been developed for multijunction silicon solar cells. The internal quantum efficiency of such structures is close to unity in the wavelength range 350–900 nm. Fiz. Tekh. Poluprovodn. 32, 886–888 (July 1998)     

InP and Si metal-oxide semiconductor structures fabricated using oxygen plasma assisted wafer bonding

In this paper, InP metal-oxide-semiconductor (MOS) structures are fabricated by transferring thermally grown SiO₂ to InP from oxidized Si wafers using oxygen plasma assisted wafer bonding followed by annealing at either 125°C or at 400°C. Well-defined accumulation and inversion regions in recorded capacitance-voltage (C-V) curves were obtained. The long-term stability was comparable to what has been previously reported. The structures exhibited high breakdown fields, equivalent to thermally grown SiO₂-Si MOS structures. The transferring process was also used to fabricate bonded Si MOS structures.