Electrical mechanism analysis of Al2O3 doped zinc oxide thin films deposited by rotating cylindrical DC magnetron sputtering

Cost efficient and large area deposition of superior quality Al₂O₃ doped zinc oxide (AZO) films is instrumental in many of its applications, including solar cell fabrication due to its numerous advantages over indium tin oxide (ITO) films. In this study, AZO films were prepared by a highly efficient rotating cylindrical direct current (DC) magnetron sputtering system using an AZO target, which has a target material utilization above 80%, on glass substrates in argon (Ar) ambient. A detailed analysis on the electrical, optical, and structural characteristics of AZO thin films was performed for the solar cell, as well as display applications. The properties of films were found to critically depend on deposition parameters, such as sputtering power, substrate temperature, working pressure, and film thickness. A low resistivity of ~ 5.5 × 10^− 4 Ω cm was obtained for films deposited at 2 kW, keeping the pressure, substrate temperature and thickness constant at 3 mTorr, 230 °C and ~ 1000 nm respectively. This was due to an increase in carrier mobility and large grain size. Mobility is found to be controlled by ionized impurity scattering within the grains, since the mean free path of carriers is much smaller than the grain size of the films. The AZO films showed a high transparency of ~ 90% in the long wavelength region. Our results offer a cost-efficient AZO film deposition method that can fabricate films with significant low resistivity and high transmittance that can be applied in thin-film solar cells, as well as thin film transistor (TFT) and non-volatile memory (NVM).     

Dielectric properties of DC reactive magnetron sputtered Al2O3 thin films

Alumina (Al₂O₃) thin films were sputter deposited over well-cleaned glass and Si < 100 > substrates by DC reactive magnetron sputtering under various oxygen gas pressures and sputtering powers. The composition of the films was analyzed by X-ray photoelectron spectroscopy and an optimal O/Al atomic ratio of 1.59 was obtained at a reactive gas pressure of 0.03 Pa and sputtering power of 70 W. X-ray diffraction results revealed that the films were amorphous until 550 °C. The surface morphology of the films was studied using scanning electron microscopy and the as-deposited films were found to be smooth. The topography of the as-deposited and annealed films was analyzed by atomic force microscopy and a progressive increase in the rms roughness of the films from 3.2 nm to 4.53 nm was also observed with increase in the annealing temperature. Al-Al₂O₃-Al thin film capacitors were then fabricated on glass substrates to study the effect of temperature and frequency on the dielectric property of the films. Temperature coefficient of capacitance, AC conductivity and activation energy were determined and the results are discussed.     

Electrical properties of AlNxOy thin films prepared by reactive magnetron sputtering

Direct current magnetron sputtering was used to produce AlN_xO_y thin films, using an aluminum target, argon and a mixture of N₂ + O₂ (17:3) as reactive gases. The partial pressure of the reactive gas mixture was increased, maintaining the discharge current constant. Within the two identified regimes of the target (metallic and compound), four different tendencies for the deposition rate were found and a morphological evolution from columnar towards cauliflower-type, ending up as dense and featureless-type films. The structure was found to be Al-type (face centered cubic) and the structural characterization carried out by X-ray diffraction and transmission electron microscopy suggested the formation of an aluminum-based polycrystalline phase dispersed in an amorphous aluminum oxide/nitride (or oxynitride) matrix. This type of structure, composition, morphology and grain size, were found to be strongly correlated with the electrical response of the films, which showed a gradual transition between metallic-like responses towards semiconducting and even insulating-type behaviors. A group of films with high aluminum content revealed a sharp decrease of the temperature coefficient of resistance (TCR) as the concentration ratio of non-metallic/aluminum atomic ratio increased. Another group of samples, where the non-metallic content became more important, revealed a smooth transition between positive and negative values of TCR. In order to test whether the oxynitride films have a unique behavior or simply a transition between the typical responses of aluminum and of those of the correspondent nitride and oxide, the electrical properties of the ternary oxynitride system were compared with AlN_x and AlO_y systems, prepared in similar conditions.     

Switching properties of vanadium doped TiO2 thin films prepared by magnetron sputtering

In the present work thin films of Ti-Me (where Me: V, Nb, Ta) were deposited onto glass substrates by magnetron sputtering of mosaic target in reactive oxygen plasma. The properties of the prepared thin films were studied by X-ray diffraction (XRD), electron dispersive spectroscopy, temperature-dependent electrical and optical transmission spectroscopy measurements. The structural investigations indicate that thin films were XRD-amorphous. Reversible thermoresistance effect, recorded at 52 ± 1 °C was found from electrical measurements. The prepared coatings were well transparent in the visible part of the light spectrum from ca. 350 nm.     

Nd-substituted SrBi2Ta2O9 ferroelectric thin films prepared by radio frequency magnetron sputtering

Nd-substituted SrBi₂Ta₂O₉ (SNBT) thin films are sputtered on Pt/Ta/SiO₂/Si substrates. X-ray diffraction and x-ray photoelectron spectroscopy studies indicate that Nd³⁺ is substituted into the bismuth layered perovskite structure, preferentially at the Sr²⁺ site. The annealed thin film is polycrystalline with plate/needle-like grain microstructure. Secondary ion mass spectrometry results show that elements in SNBT thin film homogeneously distribute along film depth and interfacial diffusion takes place during post annealing. The Nd substitution leads to enhanced remnant polarization (2P_r = 18 μC/cm²) and reduced coercivity (2E_c = 64 kV/cm) at 180 kV/cm measured at 25 °C. After 10¹⁰ switching cycles, around 9% remnant polarization is decreased.     

Ti2Al(O,N) formation by solid-state reaction between substoichiometric TiN thin films and Al2O3 (0001) substrates

Titanium nitride TiN_x (0.1 ≤ x ≤ 1) thin films were deposited onto Al₂O₃(0001) substrates using reactive magnetron sputtering at substrate temperatures (T_s) ranging from 800 to 1000 °C and N₂ partial pressures (pN₂) between 13.3 and 133 mPa. It is found that Al and O from the substrates diffuse into the substoichiometric TiN_x films during deposition. Solid-state reactions between the film and substrate result in the formation of Ti₂O and Ti₃Al domains at low N₂ partial pressures, while for increasing pN₂, the Ti₂AlN MAX phase nucleates and grows together with TiN_x. Depositions at increasingly stoichiometric conditions result in a decreasing incorporation of substrate species into the growing film. Eventually, a stoichiometric deposition gives a stable TiN(111) || Al₂O₃(0001) structure without the incorporation of substrate species. Growth at T_s 1000 °C yields Ti₂AlN(0001), leading to a reduced incorporation of substrate species compared to films grown at 900 °C, which contain also Ti₂AlN(101?3) grains. Finally, the Ti₂AlN domains incorporate O, likely on the N site, such that a MAX phase oxynitride Ti₂Al(O,N) is formed. The results were obtained by a combination of structural methods, including X-ray diffraction and (scanning) transmission electron microscopy, together with spectroscopy methods, which comprise elastic recoil detection analysis, energy dispersive X-ray spectroscopy, and electron energy loss spectroscopy.     

Formation process of Al2O3 thin film by reactive sputtering

Al and Al₂O₃ films were deposited by RF magnetron sputtering using a mixed gas of Ar and O₂. The surface of the Al target was changed from the metallic mode to the oxide mode at a critical O₂ flow ratio of 8%. The atomic ratio of sputtered Al atoms to supplied oxygen atoms was found to be approximately 2:3 at the critical O₂ flow ratio. The oxide layer thickness formed on the Al target was estimated to be 5-7 nm at an O₂ flow ratio of 100% by ellipsometry.     

Properties of zirconia thin films prepared by reactive magnetron sputtering

The search for alternative dielectric materials with high dielectric constant, thermodynamic stable on silicon substrate and low direct tunneling current leads to oxide based materials like zirconia. Zirconia thin films were prepared by reactive magnetron sputtering. The capacitance voltage, ac and dc electrical characteristics were investigated and the values like fixed oxide charges were calculated and compared among the samples with and without annealing. Films annealed at 700 °C showed a dielectric constant ∼ 26 with interface trap densities of 1.629 × 10¹² eV^− 1 cm^− 2.     

Photoluminescence of Eu-doped TiO2 thin films prepared by low pressure hot target magnetron sputtering

In this work Eu-doped TiO₂ thin films prepared by reactive magnetron co-sputtering of Ti-Eu metallic target have been studied. The results of photoluminescence (PL) and its correlation with microstructure have been described. Structural properties were examined by X-ray diffraction (XRD) and Atomic Force Microscopy (AFM). XRD studies have shown that thin films consisted of TiO₂-anatase and AFM images display their high quality and dense nanocrystalline structure. PL spectra, measured at room temperature, show a dominating strong red luminescence corresponding to ⁵D₀-⁷F₂ transition at ∼ 617 nm and ∼ 623 nm. The evolution of photoluminescence and microstructure of the thin films has been examined as they were additionally annealed in an air ambient.     

Charge trapping characteristics of Al2O3/Al-rich Al2O3/SiO2 stacked films fabricated by radio-frequency magnetron co-sputtering

A thin-film structure comprising Al₂O₃/Al-rich Al₂O₃/SiO₂ was fabricated on Si substrate. We used radio-frequency magnetron co-sputtering with Al metal plates set on an Al₂O₃ target to fabricate the Al-rich Al₂O₃ thin film, which is used as a charge storage layer for nonvolatile Al₂O₃ memory. We investigated the charge trapping characteristics of the film. When the applied voltage between the gate and the substrate is increased, the hysteresis window of capacitance-voltage (C-V) characteristics becomes larger, which is caused by the charge trapping in the film. For a fabricated Al-O capacitor structure, we clarified experimentally that the maximum capacitance in the C-V hysteresis agrees well with the series capacitance of insulators and that the minimum capacitance agrees well with the series capacitance of the semiconductor depletion layer and stacked insulator. When the Al content in the Al-rich Al₂O₃ is increased, a large charge trap density is obtained. When the Al content in the Al-O is changed from 40 to 58%, the charge trap density increases from 0 to 18 × 10¹⁸ cm^− 3, which is 2.6 times larger than that of the trap memory using SiN as the charge storage layer. The device structure would be promising for low-cost nonvolatile memory.     

Morphology of TiN thin films grown on SiO2 by reactive high power impulse magnetron sputtering

Thin TiN films were grown on SiO₂ by reactive high power impulse magnetron sputtering (HiPIMS) at a range of temperatures from 45 to 600 °C. The film properties were compared to films grown by conventional dc magnetron sputtering (dcMS) at similar conditions. Structural characterization was carried out using X-ray diffraction and reflection methods. The HiPIMS process produces denser films at lower growth temperature than does dcMS. Furthermore, the surface is much smoother for films grown by the HiPIMS process. The [200] grain size increases monotonically with increased growth temperature, whereas the size of the [111] oriented grains decreases to a minimum for a growth temperature of 400 °C after which it starts to increase with growth temperature. The [200] crystallites are smaller than the [111] crystallites for all growth temperatures. The grain sizes of both orientations are smaller in HiPIMS grown films than in dcMS grown films.     

Scaling behavior and structure transition of ZrO2 films deposited by RF magnetron sputtering

ZrO₂ thin films were deposited onto Si wafers and glass slides by reactive rf magnetron sputtering with varying conditions of substrate temperature (T_s). Structural analysis was carried out using high-resolution transmission electron microscopy (HRTEM) and atomic force microscopy (AFM). The scaling behavior of the AFM topographical profiles was analyzed using one-dimensional power spectral density method (1DPSD). Morphological and structural evolution of ZrO₂ films have been studied in relation to T_s. With substrate temperatures ranging from RT to 550 °C, the structural transition of the films is a-ZrO₂ (below 250 °C) → m-ZrO₂ with a little a-ZrO₂ (450 °C) → m-ZrO₂ with a little t-ZrO₂ (550 °C). The roughness exponent α is 1.53 ± 0.02, 1.04 ± 0.01, 1.06 ± 0.05, 1.20 ± 0.03 for ZrO₂ thin films deposited at RT, 250 °C, 450 °C, and 550 °C, respectively. Quantitative surface characterization by spatially resolved 1DPSD analyses identified three different growth mechanisms of surface morphology for ZrO₂ thin films deposited at RT, 250∼450 °C and 550 °C. The evolution and interactions of surface roughness and microstructure are discussed in terms of surface diffusion, grain growth, and flux shadowing mechanisms.     

Al-Mg-B thin films prepared by magnetron sputtering

Hard, nanocomposite aluminum magnesium boride thin films were prepared on Si (100) substrates with a three target magnetron sputtering system. The films were characterized by X-ray diffraction, atomic force microscope, electron micro-probe, Fourier transform infrared spectroscopy and nanoindentation. The results show that the maximum hardness of the as-deposited films is about 30.7 GPa and these films are all X-ray amorphous with smooth surfaces. The influences of substrate temperature and boron sputtering power on the quality of the films are discussed. From the results of this work, magnetron sputtering is a promising method to deposit Al-Mg-B thin films.     

Conductivity of nanometer TiO2 thin films by magnetron sputtering

The conductivity of nanometer TiO₂ thin films was presented in this paper. The dependence of the conductivity of TiO₂ thin films on the thickness of the film and the substrate material were educed. The TiO₂ films were deposited by reactive magnetron sputtering of a Ti targets in an Ar+O₂ mixture in a conventional sputtering reactor. The thickness of the films deposited on Ti varied in the range from 15 to 225 nm. The resistivity of the films was measured at room temperature in the air. It was found that the conductivity of TiO₂ thin films varies in the range from conductor, semiconductor to nonconductor. This was attributed to electrons transfer at the interface between the TiO₂ and substrates, and the depth of electrons transfer was determined by the difference of work function.     

Comparison of the developed thermal stresses in Al2O3–SG, ZrO2–12%Si+Al and ZrO2–SG coating systems subjected to thermal loading

In this investigation, thermal and structure finite element analysis has been employed to analyse the thermal stresses developed in Al₂O₃–SG, ZrO₂–12%Si+A1 and ZrO₂–SG.coatings subjected to thermal loading. Systems with 0.4 mm coating thickness and 4 mm substrate material thickness were modelled. Zirconia–spherical cast iron (SG) coatings with NiAl, NiCrAlY and NiCoCrAlY interlayers were also modelled. Nominal and shear stresses at the critical interface regions (film/interlayer/substrate) were obtained. The results showed that the lowest stress levels are in ZrO₂–SG coatings. Furthermore, the interlayer thickness and material combinations have a significant influence on the level of the developed thermal stresses. It is also concluded that the finite element technique can be used to optimise the design and the processing of ceramic coatings.     

Texture and microstructure of Cr2O3 and (Cr,Al)2O3 thin films deposited by reactive inductively coupled plasma magnetron sputtering

Cr₂O₃ and (Cr,Al)₂O₃ films were grown using reactive dc and inductively coupled plasma magnetron sputtering at substrate temperatures of 300-450 °C. For pure chromia, α-Cr₂O₃ films with fiber texture were grown; the out-of-plane texture could be controlled from < 0001> to < 101?4>. The former texture was obtained as a consequence of competitive growth with no applied bias or inductively coupled plasma, while the latter was obtained at moderate bias (− 50 V), probably due to recrystallization driven by ion-bombardment-induced strain. By reactive codeposition of Cr and Al, a corundum-structured metastable solid solution α-(Cr,Al)₂O₃ with Cr/Al ratios of 2-10 was grown with a dense, fine-grained morphology. Hardness and reduced elastic modulus values were in the ranges 24-27 GPa and 190-230 GPa, respectively.     

Overview of optical properties of Al2O3 films prepared by various techniques

We study optical properties of Al₂O₃ films prepared by various techniques using spectroscopic ellipsometry. The film preparation techniques include conventional pulsed magnetron sputtering in various gas mixtures, high power impulse magnetron sputtering, annealing of as-deposited Al₂O₃ in an inert atmosphere and annealing of as-deposited Al in air. We focus on the effect of the preparation technique, deposition parameters and annealing temperature on the refractive index, n, and extinction coefficient, k, of stoichiometric Al₂O₃. At a wavelength of 550 nm we find n of 1.50-1.67 for amorphous deposited Al₂O₃, 1.65-1.67 for amorphous Al₂O₃ obtained by Al annealing, 1.46-1.69 for γ-Al₂O₃ and decreasing n for Al₂O₃ annealing temperature increasing up to 890 °C. The results facilitate correct interpretation of optical characterization of Al₂O₃, as well as selection of a preparation technique corresponding to a required Al₂O₃ structure and properties.     

Effects of process parameters on the LaNiO3 thin films deposited by radio-frequency magnetron sputtering

LaNiO₃ thin films were deposited by radio-frequency magnetron sputtering on both (100) Si and platinized Si substrates. The effects of relative oxygen ratio, substrate and annealing temperatures on the microstructure and the electrical properties of the films were investigated. The La/Ni ratio was found to be influenced by the relative oxygen ratio. On the other hand, the orientation of LaNiO₃ was significantly influenced by the substrate temperature. Highly (100)-oriented LaNiO₃ thin films were obtained on SiO₂/Si(100) and Pt/Ti/SiO₂/Si substrates when the substrates temperature was 300 °C with the relative oxygen ratio below 33%. In addition, the (100)-oriented LaNiO₃ showed the lower resistivity than that of random-oriented LaNiO₃.     

The selective growth of rutile thin films using radio-frequency magnetron sputtering

Using unbalanced radio-frequency (RF) magnetron sputtering crystalline rutile films were synthesised on glass substrates at (combined Ar and O₂) pressures of 0.4 Pa or less, at RF powers of 500 and 600 W with substrate to magnetron distances of 40 mm or longer. Anatase films were deposited at the greater pressure of 1.2 Pa (substrate to magnetron distance of 40 mm) or shorter substrate to magnetron distance of 20 mm (at 0.4 Pa). A mixture of anatase and rutile was formed at 0.5 Pa with all other conditions being as for those required for rutile or the power was reduced along with the substrate to magnetron distance (500 W and 20 mm). The crystallite sizes of rutile obtained were 1 - 3 nm. It is proposed that the greater the energy imparted to the substrate surface by the impinging positive species the greater the activation energy to crystalline phase formation that can be overcome. Hence the formation of rutile over anatase is favoured at greater power, longer magnetron to substrate distances and decreased pressure. Moreover, not only is it possible to control the phase of TiO₂ formed it appears to be possible to control the degree of oxygen non-stoichiometry in the rutile films formed. Smaller O₂ partial pressures, shorter substrate to magnetron distances and greater RF power are believed to produce an environment of reduced reaction of sputtered Ti species with O₂ and to result in the formation of non-stoichiometric rutile structures resulting in increased band gap energies and decreased refractive indices.     

Thickness dependent properties of nickel oxide thin films deposited by dc reactive magnetron sputtering

Nickel oxide thin films of various thicknesses were grown on glass substrates by dc reactive magnetron sputtering technique in a pure oxygen atmosphere with sputtering power of 150 W and substrate temperature of 523 K. Crystalline properties of NiO films as a function of film thickness were investigated using X-ray diffraction. XRD analysis revealed that (200) is the preferred orientation and the orientation of the films changed from (200) to (220) at film thickness of 350 nm. The maximum optical transmittance of 60% and band gap of 3.82 eV was observed at the film thickness of 350 nm. The lowest electrical resistivity of 5.1 Ω cm was observed at a film thickness of 350 nm, thereafter resistivity increases with film thickness.