离子注入H13钢注入层微观结构的研究

本文利用ＴＥＭ研究了Ｓｉ，Ｔｉ离子注入Ｈ１３钢注入层微观结构。结果表明：Ｓｉ离子注入后，导致表面注入层微晶化及部分非晶化，内注入层多晶化；Ｔｉ离子注入后，表面注入层则完全非晶化，内注入层微晶化。     

固相外延CoSi_2薄膜作为扩散源形成n~＋p浅结技术研究

通过Ａｓ＋离子注入到由ＴｉＮ／Ｃｏ／Ｔｉ／Ｓｉ多层结构因相反应得到的外延ＣｏＳｉ２层中，利用外延硅化物作为扩散源（ＥＳＡＤＳ），形成了０．１μｍ的浅ｎ＋ｐ结．研究了Ｃｏｓｉ２外延薄膜离子注入非晶化后的再结晶特性、注入杂质退火时的再分布特性和形成的ｎ＋ｐ浅结特性．实验结果表明：外延ＣｏＳｉ２层在非晶化后能有效地再结晶；Ａｓ原子在多晶ＣｏＳｉ２／Ｓｉ结构和单晶ＣｏＳｉ２／Ｓｉ结构中有着不同的再分布特性；同相应的以多晶ＣｏＳｉ２作为扩散源形成的结相比，以外延ＣｏＳｉ２作为扩散源形成的结反向漏电小１～２个数量级，     

Si~＋、As~＋双离子注入半绝缘GaAs的研究

本文采用Ｓｉ＋和Ｓｉ＋、Ａｓ＋单、双离子多重注入半绝缘砷化镓［ＨＢ－ＳＩＧａＡｓ（Ｃｒ）］．研究发现，双离子注入层经无包封快速热退火后，激活率和电子迁移率较单Ｓｉ＋注入样品明显提高．Ｒａｍａｎ谱显示结构完整性好，并且有好的载流子剖面分布．文中从化学计量比角度出发分析了激活率提高的原因和从注入离子增强扩散系数分布来解释了多重Ｓｉ＋、Ａｓ＋双注入的载流子浓度剖面分布．     

N~＋离子注入和退火后热生长SiO_2层的干法和湿法腐蚀特性

Ｎ~＋离子注入和退火后热生长ＳｉＯ_２层的干法和湿法腐蚀特性＝Ｄｒｙａｎｄｗｅｔｅｔｃｈｉｎｇｐｒｏｐｅｒ－ｔｉｅｓｏｆｔｈｅｒｍａｌｌｙｇｒｏｗｎｓｉｌｉｃｏｎｄｉｏｘｉｄｃｌａｙｅｒａｆｔｅｒ．Ｎ￣＋ｉｏｎｉｍｐｌａｎｔａｔｉｏｎａｎｄａｎｎｅａｌ...     

Fe~＋和H~＋注入引起的Si／SiO_2界面重构现象

针对Ｓｉ－ＳｉＯ２过渡区对于离子注入较为敏感的特点，用１．２ＭｅＶ，剂量１×１０１０ｃｍ－２的Ｆｅ＋和Ｈ＋先后注入ＳｉＯ２－Ｓｉ样品，并用ＸＰＳ技术重点分析了Ｓｉ－ＳｉＯ２界面附近硅的化学结构、组分的变化。结果表明，在界面附近，除了Ｓｉ４＋，Ｓｉ０价态，还存在明显的Ｓｉ２＋价态。这和注入Ｈ＋产生的高温退火以及Ｓｉ—Ｓｉ键或Ｓｉ—Ｈ键的形成有关。     

GeSi／Si应变超晶格退火及离子注入研究

用深能级瞬态谱（ＤＬＴＳ）研究退火及离子注入对分子束外延生长的ＧｅＳｉ／Ｓｉ应变超晶格性质的影响，观察到３个与位错有关的深中心和１个表层内的深中心，退火和离子注入都使得这些深中心的浓度增加数倍，说明ＧｅＳｉ／Ｓｉ应变超晶格不适应做过多的热处理．同时测定Ｐｄ＋注入在ＧｅＳｉ／Ｓｉ超晶格的杂质能级为ＥＣ＝０．２８ｅＶ，与体Ｓｉ中的Ｐｄ杂质能级一致．     

砷离子注入的GeSi合金中沉淀相的研究

砷离子注入的ＧｅＳｉ合金中沉淀相的研究范缇文（中国科学院半导体材料科学实验室，北京１０００８３）杂质在ＧｅＳｉ合金中的扩散和沉淀过程仍是目前尚待进一步研究的课题。比如，作为ＧｅＳｉ合金的主要掺杂剂的元素砷以离子形态注入ＧｅＳｉ合金再经热退火，发现其中...     

GaAs低能Si^＋及SiF^＋离子注入研究

本文对３０ｋｅｖ Ｓｉ＾＋和分子离子ＳｉＦ＾＋注入半绝缘ＧａＡｓ的行为进行了研究对比。注入Ｓｉ＾２＋样品的Ｓｉ原子纵向分布与相同条件下用ＳＩＣＴ模拟程序理论计算出的分布相一致。经灯光９００℃１０″ＲＴＡ，电激活率可达６０％，电化学Ｃ－Ｖ测得的载流子纵向分布与注入态ＳＩＭＳ结果相同，可以获得近０．２μｍ的ＧａＡｓ有源层。而注入分子离子ＳｉＦ＾＋样品，虽注入层较浅，但灯光退火后，电激活率很低。因此，用     

透射电镜原位研究Ni纳米晶粒成核生长

离子注入能够精确地控制能量和剂量 ,能够注入几乎所有的元素 ,甚至同位素 ,而且注入离子形成的纳米晶粒镶嵌在衬底里 ,使得形成的纳米颗粒得到了很好的保护。近年来 ,离子注入绝缘衬底材料形成量子点结构成为研究的热点。随着离子注入技术和工艺的不断改善 ,该方法在工业应用中成本越来越低 ,相信会在今后的材料制备中得到更广泛的应用。本研究在法国核谱质谱中心 (ＣＮＳＮＭ)的离子注入机和透射电镜联机装置上进行[1] ,衬底材料是用电子束蒸发沉积而形成的非晶ＳｉＯ2 薄膜 ,厚度在 90～ 10 0ｎｍ。选取适当的注入能量使注入离子的投影射…     

Ge_(0.1)Si_(0.9)/Si近红外探测器的结构设计与试验

设计了一种新结构的Ｇｅ_ｘＳｉ_（１－ｘ）／Ｓｉ近红外探测器，它是在ｐ－Ｓｉ衬底上分子束外延生长２μｍ厚的Ｇｅ_（０．１）Ｓｉ_（０．９）本征层，再在其表面离子注入形成一薄层ｎ＋层，腐蚀成台面后，构成Ｇｅ_（０．１）Ｓｉ_（０．９）／Ｓｉｐ－ｉ－ｎ型的近红外探测器。试验表明，它具有良好的Ｉ－Ｖ特性和光电特性。     

离子注入浅结制备技术

根据近年来的文献资料总结报道几种离子注入浅结制备技术，即：大角度偏转注入、分子离子注入、双离子注入，通过介质掩膜注入，注入固体源驱入扩散再分布、等离子体浸没离子注入（ＰＩＩＩ）和反冲离子注入等。     

脉冲钨离子注入4Cr5MoV1Si钢改善其耐磨性的研究

采用由金属蒸汽真空弧（MEVVA）离子源引的强束流脉冲金属钨离子对4Cr5MoV1Si(H13)钢进行了离子注入表面改性研究,用针盘式磨损机测得样品的耐磨性提高两部左右,使用卢瑟福背散射谱（RBS）测量了钨在样品中的浓度深度分布,采用X射线衍射考察了注入样品的表面微结构,按照非线性碰撞理论,讨论了样品的耐磨性,表面成分,结构与注入参数（主要是注入能量和注入束流密度）的关系。     

离子辐照纳米Si3N4量子点的表面分析与蓝光增强机理研究

本文对Ｎ十离子辐照纳米氮化硅量子点的表面特性进行了测试、分析，对离子辐照后量子点蓝光发射显著增强这一现象给出了解释．ＦＴＩＲ测试发现，辐照使Ｓｉ－Ｎ键结合峰增强，说明辐照后Ｓｉ－Ｎ 键合数增加，而其它峰未发生变化．ＸＰＳ全谱表明，量子点中的氧主要集中在其表面，辐照使量子点表面的氧含量增加，进一步通过ＸＰＳ芯态能谱测试发现，辐照使表面的氧、硅由吸附态转化成结合态．我们认为ＳｉＯ２／Ｓｉ３Ｎ４界面中的激子模型可以解释量子点蓝光增强现象，界面层激子效应是蓝光发射增强效应产生的根源．     

Improvement of Vthcontrol for GaAs FET's by shallow-channel ion implantation

Fluctation of a net electrical activity of implanted impurities is thought to be the main origin of fluctuation of the threshold voltage (Vth) of GaAs FET's which have a channel layer formed by ion implantation directly into semi-insulating substrates. Net electrical activity is affected by several factors such as implantation damage and the nature of the substrate. Calculation of Vthpredicts that a shallow channel is advantageous to reduce the fluctuation of Vthwhen the fluctuation of the net activity of implantated impurities predominates in that of Vth. The advantage of the shallow channel was verified experimentally by a through-film implantation technique, which was one of the ways to realize the shallow-channel FET.     

Effects of ion implantation on deep levels in GaAs

We have studied the effects of ion implantation in GaAs using the techniques of deep-level transient spectroscopy. Samples included an unimplanted epitaxial buffer layer, a sample implanted directly into that buffer layer and then capped with Si3N4, a sample implanted into that buffer layer through a similar cap, and a sample implanted directly into a semi-insulating substrate and then capped. All implants were with Si29 and both types of implant were annealed at 860°C for fifteen minutes. We find that the total density of deep levels is not changed significantly by direct implantation, capping and annealing but that implantation through a cap greatly in creases the total deep-level concentration. Deep levels found in implanted layers after capping and annealing are primarily characteristic of the substrate or buffer layer into which the implantation is made, unless the implant is through a cap in which case contaminants from the capping process may be evident at high densities.     

离子注入半绝缘GaAs电激活效率与电激活均匀性的研究

研究了Ｓｉ＾＋和Ｓｉ＾＋／Ａｓ＾＋注入到Ｈｏｒｉｚｏｎｔａｌ Ｂｒｉｄｇｍａｎ（ＨＢ）和Ｌｉｑｕｉｄ Ｅｎｃａｐｓｕｌａｔｅｄ Ｃｚｏｃｈｒａｌｓｋｉ（ＬＥＣ）方法制备的半绝缘ＧａＡｓ衬底电激活效率与均匀性。结果发现：在相同条件下（注入与退火）,不同生长方法的半绝缘ＧａＡｓ衬底电激活不同,通常电激活ＨＢ〉ＬＥＣ,ＨＢ ＳＩ－－ＧａＡｓ（Ｃｒ）（１００）Ａ面〉（１００）Ｂ面,Ｓｉ＾＋／Ａｓ＾＋双离子     

Diffusion and trapping of implanted hydrogen in a Si/Si:B/Si structure

H implantation in Si/Si:B/Si structures is a promising route to improve the Smart Cut™ process and transfer thin Si layers of reduced roughness and controlled thickness onto regular Si wafers. However, the mechanisms driving this process are unknown and thus difficult to model or optimize. For this reason, we have experimentally studied the redistribution of H which takes place in such structures after implantation and during annealing using SIMS and TEM. We show that the Si:B layer already traps H during implantation and form platelets parallel to the wafer surface. During annealing, the H atoms implanted in the Si regions are slowly transferred toward the Si:B layer where they are trapped on large platelets which grow further during annealing. Routes to optimize this process go through the minimization of H precipitation in the pure Si regions. This can probably be achieved by optimizing the implantation conditions.     

Mo＋C双注入纯铁纳米相结构的形成和改性机理研究

Mo C双注入H13钢可明显地改善钢表面的抗腐蚀特性，然而改性机理却很少报道，我们对Mo C双注入纯铁微观结构变化进行了分析，用透射电子显微镜首次发现三元FeMo2C相，这种相在较低的束流密度和注入量下首先形成，随着束流密度和注入量的增加，碳化钼和碳化铁相形成。这些FeMo2C和MoC相均匀地弥散在注入层中，其尺寸在10－30nm，当束流密度增加到0.5A.m^-2，这些纳米相的密度和尺寸增加，形成了均匀的弥散强化结构，并且发现MoC相均匀分布在晶界间，这种结构形成了抗磨损的优化表面层和抗腐蚀的印化层，明显改善了材料表面抗磨损，抗疲劳和抗腐蚀特性。     

采用离子注入N~+层和质子隔离的12GHz 200mW功率GaAs MESFET

本文报导了采用质子隔离和Si~+离子注入N~+接触层技术,提高了功率GaAa MESFET的微波性能和可靠性.已经制成栅长1μm,总栅宽600μm的GaAs功率MESFET,12GHz下最大输出功率210mW,经严格考核表明器件具有较高的可靠性.     

Effect of fluorine incorporation on the thermal stability ofPtSi/Si structure

It was observed that the fluorine incorporation from ion implantation improved the high-temperature stability of a PtSi/Si structure. The optimum implantation energy was determined to be the energy at which the maximum percentage of the as-implanted fluorine ion locates at the PtSi/Si interface region. SIMS analysis shows that the fluorine atom piles up at the PtSi/Si interface. XPS analysis indicates that the fluorine atoms at the PtSi/Si interface are bonded to the silicon atoms in a form of SiF₂ or SiF₃. A fluorine-buffer model is proposed to explain the effect of fluorine incorporation. It is postulated that the Si-F layer acts as a buffer layer to change the PtSi/Si interface energy and preserve the integrity of the silicide layer at high temperature. Fluorinated Schottky junctions were fabricated and the electrical characteristics show that the sustainable process temperature can be improved from 650°C for the unfluorinated junctions to higher than 800°C for the fluorinated junctions