Si(111)衬底上多层石墨烯薄膜的外延生长

利用固源分子束外延(SSMBE)技术, 在Si(111)衬底上沉积碳原子外延生长石墨烯薄膜, 通过反射式高能电子衍射(RHEED)、红外吸收谱(FTIR)、拉曼光谱(RAMAN)和X射线吸收精细结构谱(NEXAFS)等手段对不同衬底温度(400、600、700、800℃)生长的薄膜进行结构表征. RAMAN和NEXAFS结果表明: 在800℃下制备的薄膜具有石墨烯的特征, 而 400、600和700℃生长的样品为非晶或多晶碳薄膜. RHEED和FTIR结果表明, 沉积温度在600℃以下时C原子和衬底Si原子没有成键, 而衬底温度提升到700℃以上, 沉积的C原子会先和衬底Si原子反应形成SiC缓冲层, 且在800℃沉积时缓冲层质量较好. 因此在Si衬底上制备石墨烯薄膜需要较高的衬底温度和高质量的SiC缓冲层.     

GaN/Al_2O_3(0001)上Ge薄膜的CVD外延生长

本工作采用化学气相淀积方法,以GcH4为反应气源,以InN/CaN/Al2O3(0001)复合衬底作陪片,在CaN/Al2O3(0001)复合衬底上外延生长了Ge薄膜,并对生长机理进行了探讨.研究结果表明直接在N2气氛下外延得到了多晶Ge薄膜,表面较平整,由吸收光谱得出其带隙宽度为0.78 eV;经过H2预处理,CaN/Al2O3复合衬底表面出现金属In的沉积,外延Ge薄膜沿(111)方向择优生长,晶体质量较高.     

Ge基GaAs薄膜和InAs量子点MBE生长研究

采用分子束外延(MBE)法,在优化Ge衬底退火工艺的基础上,通过对比在(001)面偏<111>方向分别为0°、2°、4°和6°的Ge衬底上生长的GaAs薄膜,发现当Ge衬底的偏角为6°时有利于高质量GaAs薄膜的生长;通过改变迁移增强外延(MEE)的生长温度,发现在GaAs成核温度为375℃时,可在6°偏角的Ge衬底上获得质量最好的GaAs薄膜。通过摸索GaAs/Ge衬底上InAs量子点的生长工艺,实现了高效的InAs量子点光致发光,其性能接近GaAs衬底上直接生长的InAs量子点的水平。     

生长参数对Si1-xGex:C合金薄膜中元素分布的影响

用化学气相淀积方法在Si(100)衬底上外延生长Ge组分渐变的Si1-xGexC合金薄膜.本文通过能量色散谱仪乔(EDS)和扫描电子显微镜(SEM)对合金薄膜的元素深度分布和表面形貌进行了表征,分析研究了外延层的生长温度、生长时间对Si1-xGexC合金薄膜性质的影响.结果表明,Si1-xGexC外延层生长温度和生长时间一定范围内的增加加强了岛与岛之间的合并,促进了衬底Si原子向表面扩散、表面Ge原子向衬底扩散,且生长温度比生长时间对Si、Ge原子互扩散的影响大.     

PLD方法生长ZnO/Si异质外延薄膜的研究

用脉冲激光沉积法在Si(111)衬底上制备了ZnO薄膜。RHEED和XRD测试表明,直接沉积在Si衬底上的ZnO薄膜为多晶薄膜,且薄膜的结晶质量随衬底温度的升高而下降。相比之下,生长在一低温同质缓冲层上的ZnO薄膜则展现出规则的斑点状RHEED图像,说明它们都是外延生长的高质量ZnO薄膜。XRD与室温PL谱分析表明,外延ZnO薄膜的质量随衬底温度的升高得到明显的改善。在650℃生长的样品具有最好的结构和发光特性,其(002)衍射峰的半高宽为0.185°,UV峰的半高宽仅为86meV。     

SiO2/Si(111)表面Ge量子点的生长研究

Si衬底用化学方法清洗后,表面大约残余1.0 nm厚SiO2薄膜.利用原子力显微镜(AFM)和反射高能电子衍射(RHEED)来研究温度和Ge蒸发厚度对在SiO2薄膜表面生长的Ge量子点的影响.实验结果表明,当衬底温度超过500 ℃时,SiO2开始与Ge原子发生化学反应,并形成与Si(111)表面直接外延的Ge量子点.在650 ℃时,只有Ge的厚度达到0.5nm时,Ge量子点才开始形成.     

SiO2/Si(111)表面Ge量子点的生长研究

Si衬底用化学方法清洗后,表面大约残余1.0 nm厚SiO2薄膜.利用原子力显微镜(AFM)和反射高能电子衍射(RHEED)来研究温度和Ge蒸发厚度对在SiO2薄膜表面生长的Ge量子点的影响.实验结果表明,当衬底温度超过500 ℃时,SiO2开始与Ge原子发生化学反应,并形成与Si(111)表面直接外延的Ge量子点.在650 ℃时,只有Ge的厚度达到0.5nm时,Ge量子点才开始形成.     

衬底温度对Si(111)衬底上MBE异质外延3C-SiC薄膜的影响

利用固源分子束外延(SSMBE)技术, 在Si(111)衬底上异质外延生长3C-SiC单晶薄膜, 通过RHEED、XRD、AFM、XPS等实验方法研究了衬底温度对薄膜结构、形貌和化学组分的影响. 研究结果表明, 1000℃生长的样品具有好的结晶质量和单晶性. 在更高的衬底温度下生长, 会导致大的孔洞形成, 衬底和薄膜间大的热失配使降温过程中薄膜内形成更多位错, 从而使晶体质量变差. 在低衬底温度下生长, 由于偏离理想的化学配比也会导致薄膜的晶体质量降低.     

衬底温度对钇稳定氧化锆薄膜择优生长的影响

使用脉冲激光沉积(PLD)技术在Si(100)衬底上沉积钇稳定的氧化锆(YSZ)薄膜,用XRD分析薄膜的结晶取向,SEM和AFM观测薄膜表面形貌,研究了在200-650℃的不同衬底温度下薄膜的择优生长.结果表明:衬底温度较低的YSZ薄膜为非晶组织,衬底温度为300-500℃时YSZ晶粒以表面能低的(111)面首先择优生长,衬底温度超过550℃后晶粒活化能提高而使表面能较高的(100)晶粒择优生长.YSZ薄膜是典型的岛状三维生长模式,较高的衬底温度有利于原子在衬底表面迁移和重排结晶长大.同其它沉积技术相比,用PLD技术能在比较低的衬底温度下在Si(100)表面原位外延生长出较高质量的YSZ薄膜.     

生长参数对Si_(1-x)Ge_x∶C合金薄膜中元素分布的影响

用化学气相淀积方法在Si(100)衬底上外延生长Ge组分渐变的Si1-xGex∶C合金薄膜。本文通过能量色散谱仪(EDS)和扫描电子显微镜(SEM)对合金薄膜的元素深度分布和表面形貌进行了表征,分析研究了外延层的生长温度、生长时间对Si1-xGex∶C合金薄膜性质的影响。结果表明,Si1-xGex∶C外延层生长温度和生长时间一定范围内的增加加强了岛与岛之间的合并,促进了衬底Si原子向表面扩散、表面Ge原子向衬底扩散,且生长温度比生长时间对Si、Ge原子互扩散的影响大。     

Molecular beam epitaxial growth of germanium and silicon films: Surface structure,film defects and properties

Germanium and silicon films were grown on substrates of silicon (germanium and silicon films) and gallium arsenide (germanium films). Reflection high energy electron diffraction was used to investigate superstructure reconstructions on the growth surface as a function of the growth temperature and the film thickness. The greatest number of superstructures was observed during epitaxy of germanium films on Si(111): Si(7 × 7)Ge, Si,Ge(5 × 5), Ge(8 × 2), Ge(7 × 7)Si and Ge(1 × 1). The defects were studied in Ge/Si and Ge/GaAs heterosystems. The surface diffusion was found to have a marked effect on the film surface morphology and as a result of this on the type of misfit dislocations at the interface and on the density of threading dislocations. Electrophysical properties of the films are also discussed.     

One-step Ge/Si epitaxial growth

Fabricating a low-cost virtual germanium (Ge) template by epitaxial growth of Ge films on silicon wafer with a Ge(x)Si(1-x) (0 < x < 1) graded buffer layer was demonstrated through a facile chemical vapor deposition method in one step by decomposing a hazardousless GeO(2) powder under hydrogen atmosphere without ultra-high vacuum condition and then depositing in a low-temperature region. X-ray diffraction analysis shows that the Ge film with an epitaxial relationship is along the in-plane direction of Si. The successful growth of epitaxial Ge films on Si substrate demonstrates the feasibility of integrating various functional devices on the Ge/Si substrates.     

Surface nano-structured silicon carbide thin film produced using hot filament decomposition of ethylene at low temperature on silicon wafer

The structure and spectroscopic properties of nano-structured silicon carbide (SiC) thin films were studied for films obtained through deposition of decomposed ethylene (C₂H₄) on silicon wafers via hot filament chemical vapor deposition method at low temperature followed by annealing at various temperatures in the range 300-700 °C. The prepared films were analyzed with focus on the early deposition stage and the initial growth layers. The analysis of the film's physics and structural characteristics was performed with Fourier transform infrared spectroscopy and Raman spectroscopy, scanning electron microscopy with energy dispersive X-ray spectroscopy, and X-ray diffraction. The conditions for forming thin layer of cubic SiC phase (3C-SiC) are found. X-ray diffraction and Raman spectroscopy confirmed the presence of 3C-SiC phase in the sample. The formation conditions and structure of intermediate SiC layer, which reduces the crystal lattice mismatch between Si and diamond, are essential for the alignment of diamond growth. This finding provides an easy way of forming SiC intermediate layer using the Si from the substrate.     

ZnO/SiC/Si异质结构的特性

用MOCVD方法在p型单晶Si（100）基片上外延SiC层,再用直流溅射在SiC层上生长ZnO薄膜,制备出ZnO／SiC／Si异质结构,用XRD和AFM分析了ZnO／SiC／Si和ZnO／Si异质结构中表层ZnO的结构和形貌的差别,研究了这种异质结构的特性．结果表明,在Si（100）基片上外延生长出的是高取向、高结晶质量的SiC（100）层．这个SiC层缓冲层使在Si基片上外延生长出了高质量ZnO薄膜,因为ZnO与SiC的晶格失配比ZnO与Si的晶格失配更低．     

Kinetic lattice Monte Carlo simulations of silicon and germanium epitaxial growth on the silicon (100) surface

We present kinetic lattice Monte Carlo simulations of epitaxial growth of Si and Ge films on the Si (100) surface. Our simulations take into account surface reconstruction, in particular, how it makes the diffusion properties of ad-dimers and adatoms on the surface depend on the direction of motion and whether they are moving over a row or a trough. In the case of Ge expitaxial growth, when dealing with growth of Ge films, we incorporated the effect of Ge-Si exchange through a mechanism involving the ad-dimers. This results in a significant fraction of the first epitaxial layer containing Si, with an abrupt increase at one monolayer of coverage.     

Structural and optical properties of high quality ZnO thin film on Si with SiC buffer layer

ZnO thin films are grown on Si substrates with SiC buffer layer using ion plasma high frequency magnetron sputtering. These substrates are fabricated using a technique of solid phase epitaxy. With this technique SiC layer of thickness 20-200 nm had been grown on Si substrates consisting pores of sizes 0.5-5 μm at SiC and Si interface. Due to mismatching in lattice constants as well as thermal expansion coefficients, elastic stresses have been developed in ZnO film. Pores at the interface of SiC and Si are acting as the elastic stress reliever of the ZnO films making them strain free epitaxial. ZnO film grown on this especially fabricated Si substrate with SiC buffer layer exhibits excellent crystalline quality as characterized using X-ray diffraction. Surface topography of the film has been characterized using Atomic Force Microscopy as well as Scanning Electron Microscopy. Chemical compositions of the films have been analyzed using Energy Dispersive X-ray Spectroscopy. Optical properties of the films are investigated using Photoluminescence Spectroscopy which also shows good optical quality.     

Ge/SiO2和Ge/ZnO/SiO2薄膜的磁控溅射制备及电学性能

采用射频磁控溅射方法以石英玻璃为衬底分别沉积制备出了Ge/SiO2和Ge/ZnO/SiO2薄膜。X射线衍射表明薄膜展示了明显的ZnO衍射峰和较弱的Ge衍射峰;傅里叶变换红外光谱曲线证明薄膜均具有各自的特征吸收峰;扫描电镜结果显示薄膜为颗粒状团簇结构,并且加入ZnO中间层可以有效的改善Ge层的质量。同时,对所得薄膜材料的电流-电压性能进行了研究,结果发现,Ge/SiO2薄膜的I-V曲线拟合后为斜线,相当于电阻;ZnO/SiO2薄膜为直线,可以认为是绝缘体;Ge/ZnO/SiO2薄膜在-10～10V之间电流电压呈线性关系,其电阻比Ge/SiO2薄膜小,当电压值超过15V之后,电流急剧增加而迅速使薄膜击穿,薄膜导通。     

Effects of SiC buffer layer growth temperature on the residual strain of GaN/SiC/Si thin films

Effects of SiC buffer layers were studied on the residual strain of GaN films grown on 3C-SiC/Si (111) substrates. It was clearly observed by Raman scattering measurement that the residual strain of the GaN/Si is reduced by inserting the SiC intermediate layer. Furthermore, residual strain within the GaN/SiC/Si films decreased when the growth temperature of the SiC buffer layer decreased. It was proposed that the irreversible creep phenomenon occurs during the high temperature growth of SiC, affecting nature of the residual strain within the SiC and the GaN layers.     

Growth and characterisation of SiC films deposited on a-SiO2/Si (100) substrates

Abstract

The growth of polycrystalline SiC films has been carried out by low pressure chemical vapour deposition in a horizontal quartz reaction chamber using tetramethylsilane and H2 as the precursor gas mixture. Silicon (100) wafers were used as substrates. A thin Si O₂ amorphous layer of ~6 nm was formed before SiC deposition to reduce the strain induced by the 8% difference in thermal expansion coefficients between SiC and Si. Samples were. analysed by X-ray diffraction, scanning electron microscopy, transmission electron microscopy, and infrared reflectivity. The structure of films grown at temperatures between 950 and 1150°C varies from amorphous to polycrystalline SiC. Preferential [111] orientation and columnar growth of polycrystalline films develops with increasing temperature.

MST/3317