Design and performance of a microcantilever-based hydrogen sensor

This paper describes the design of, and the effects of basic environmental parameters on, a microelectromechanical (MEMS) hydrogen sensor. The sensor contains an array of 10 micromachined cantilever beams. Each cantilever is 500 μm wide×267 μm long×2 μm thick and has a capacitance readout capable of measuring cantilever deflection to within 1 nm. A 20-nm-thick coating of 90% palladium–10% nickel bends some of the cantilevers in the presence of hydrogen. The palladium–nickel coatings are deposited in ultra-high-vacuum (UHV) to ensure freedom from a “relaxation” artifact apparently caused by oxidation of the coatings. The sensor consumes 84 mW of power in continuous operation, and can detect hydrogen concentrations between 0.1 and 100% with a roughly linear response between 10 and 90% hydrogen. The response magnitude decreases with increasing temperature, humidity, and oxygen concentration, and the response time decreases with increasing temperature and hydrogen concentration. The 0–90% response time of an unheated cantilever to 1% hydrogen in air is about 90 s at 25 °C and 0% humidity.     

An uncooled optically readable infrared imaging detector

This paper presents a design and fabrication of bi-material micro-cantilever array (focal plane array, FPA) made of silicon nitride (SiN_x) and gold (Au) for uncooled optical readout infrared (IR) imaging system, in which silicon (Si) substrate is removed. Compared with the conventional thermal imaging detectors where the FPA must be put in high vacuum, IR thermal images can be obtained even though the cantilever array is placed in the atmosphere. The reason is the elimination of air gap (∼2 μm) between the cantilever beam and substrate, which introduces the air conduction of high temperature gradient. The preliminary experimental results with the micro-cantilever array of 140 × 98 elements and a 12-bit charge-coupled device (CCD) indicate that objects at temperature of higher than 120 °C can be detected and the noise-equivalent temperature difference (NETD) is ∼7 K. Also, the experimental results are well accordant with the thermomechanical analysis of designed micro-cantilever array.     

Fabrication and characterization of a thermal switch

The development of a thermal switch based on arrays of liquid–metal micro-droplets is presented. Prototype thermal switches are assembled from a silicon substrate on which is deposited an array of 1600 30-μm liquid–metal micro-droplets. The liquid–metal micro-droplet array makes and breaks contact with a second bare silicon substrate. A gap between the two silicon substrates is filled with either air at 760 Torr, air at of 0.5 Torr or xenon at 760 Torr. Heat transfer and thermal resistance across the thermal switches are measured for “on” (make contact) and “off” (break contact) conditions using guard-heated calorimetry. The figure of merit for a thermal switch, the ratio of “off” state thermal resistance over “on” state thermal resistance, R_off/R_on, is 129 ± 43 for a xenon-filled thermal switch that opens 100 μm and 60 ± 17 for an 0.5 Torr air-filled thermal switch that opens 25 μm. These thermal resistance ratios are shown to be markedly higher than values of R_off/R_on for a thermal switch based on contact between polished silicon surfaces. Transient temperature measurements for the liquid–metal micro-droplet switches indicate thermal switching times of less than 100 ms. Switch lifetimes are found to exceed one-million cycles.     

Design,simulation and validation of a novel uncooled infrared focal plane array

This paper describes a novel single-layer bi-material cantilever microstructure without silicon (Si) substrate for focal plane array (FPA) application in uncooled optomechanical infrared imaging system (UOIIS). The UOIIS, responding to the radiate infrared (IR) source with spectral range from 8 to 14 μm, may receive an IR image through visible optical readout method. The temperature distribution of the IR source could be obtained by measuring the thermal–mechanical rotation angle distribution of every pixel in the cantilever array, which is consisted of two materials with mismatching thermal expansion coefficients. In order to obtain a high detection to the IR object, gold (Au) film is coated alternately on silicon nitride (SiN_x) film in the flection beams of the cantilevers. And a thermal–mechanical model for such cantilever microstructure is proposed. The thermal and thermal–mechanical coupling field characteristics of the cantilever array structure are optimized through numerical analysis method and simulated by using the finite element simulation method. The thermal–mechanical rotation angle simulated and thermal–mechanical sensitivity tested in the experiment are 2.459 × 10⁻³ and 3.322 × 10⁻⁴ rad/K, respectively, generally in good agreement with what the thermal–mechanical model and numerical analysis forecast, which offers an effective reference for FPA structure parameters design in UOIIS.     

Photonic crystal slabs with hexagonal air holes fabricated by selective area metal organic vapor phase epitaxy

It is shown that the photonic crystal slab (PCS) with hexagonal air holes has band gaps in the guided mode spectrum, which can be compared to that of the PCS with circular air holes, thus it is also a good candidate to be used for the PC devices. The PC with hexagonal air holes and a = 0.5 μm and r = 0.15 μm was fabricated successfully by selective area metal organic vapor phase epitaxy (SA-MOVPE). The vertical and smooth sidewalls are formed and the uniformity is very good. The same process was also used to fabricate a hexagonal air hole array with the width of 0.1 μm successfully. The air-bridge PCS with hexagonal air holes and a = 0.3 μm and r = 0.09 μm was also fabricated successfully by SA-MOVPE. Further optimization of the growth conditions for the sacrificial layer and the selective etching of the GaAs cap layer is also needed. Our experimental results indicate that SA-MOVPE is a promising method for fabricating PC devices and photonic nanostructures.     

Micromachined quartz resonator based infrared detector array

We report the fabrication and performance of a micromachined Y-cut quartz resonator based thermal infrared detector array. 1 mm diameter and 18 μm thick (90 MHz) inverted mesa configuration quartz resonator arrays with excellent resonance characteristics have been fabricated by RIE etching of quartz. Temperature sensitivity of 7.2 kHz/K was experimentally measured. Infrared calibration tests on the resonator array even without the use of infrared absorbers gave a responsivity of 14.3 MHz/W and an NEP of 326 nW. In this first report on the performance of the Y-cut quartz resonator infrared thermal detector array, the response time measurements were found to be limited by the slow measurement time of the impedance scans and the undesired heating of the quartz substrate. Most importantly, this initial work demonstrates the possibility of realizing infrared detector arrays for room temperature thermal imaging applications that can rival current state of the art in the field.     

Design, fabrication, and characterization of thermally actuated probe arrays for dip pen nanolithography

In Dip Pen Nanolithography (DPN), arbitrary nanoscale chemical patterns can be created by the diffusion of chemicals from the tip of an atomic force microscope (AFM) probe to a surface. This paper describes the design, optimization, fabrication, and testing of an actuated multi-probe DPN array. The probe array consists of 10 thermal bimorph active probes made of silicon nitride and gold. The probes are 300 /spl mu/m long and the tips are spaced 100 /spl mu/m apart. An actuation current of 10 mA produces a tip deflection of 8 /spl mu/m, which is enough to remove individual tips from the surface independent of the adjacent probes. An analytical probe model is presented and used to optimize the design against several possible failure modes. The array is demonstrated by using it to simultaneously write 10 unique octadecanethiol patterns on a gold surface. Pattern linewidth as small as 80 nm has been created at a maximum write speed of 20 /spl mu/m/sec. By writing multiple, distinctly different patterns in parallel, this device provides a significant improvement in throughput and flexibility over conventional AFM probes in the DPN process.     

Electroactive polymer based microfluidic pump

A planar, valveless, microfluidic pump using electrostrictive poly(vinylidene fluoride-trifluoroethylene) [P(VDF-TrFE)] based polymer as the actuator material is presented. P(VDF-TrFE) thick films having a large electrostrictive strain ∼5–7% and high elastic energy density of 1 J/cm³ have been used in a unimorph diaphragm actuator configuration. The microfluidic pump was realized by integrating a nozzle/diffuser type fluidic mechanical-diode structure with the polymer microactuator. The P(VDF-TrFE) unimorph diaphragm actuator, 80 μm thick and 2.2 mm × 2.2 mm in lateral dimensions, showed an actuation deflection of 80 μm for an applied electric field of 90 MV/m. The microfluidic pump could pump methanol at a flow rate of 25 μl/min at 63 Hz with a backpressure of 350 Pa. The flow rate of this pump could be easily controlled by external electrical field. Two different sizes of nozzle/diffuser elements were studied and the pumping efficiency of these structures is 11 and 16%, respectively.     

Low-cost microelectrode array with integrated heater for extracellular recording of cardiomyocyte cultures using commercial flexible printed circuit technology

This article reports the use of commercial, flexible printed circuit technology for the fabrication of low-cost microelectrode arrays (MEAs) for recording extracellular electrical signals from cardiomyocyte cultures. A 36-electrode array has been designed and manufactured using standard, two-layer, polyimide-based flexible circuit technology, with electrode diameters of 75 and 100 μm. Copper structures defined on the backside of the array have been used for low-power thermal regulation of the culture. Electrical characterization of the gold-plated electrodes showed impedances below 250 kΩ at 1 kHz. Functional testing was conducted using HL-1 cardiac myocytes. The arrays proved biocompatible, and supported the formation of functional syncytia, as demonstrated by electrical recordings of depolarization waves across the array. A comparison with conventional, glass-based MEAs is presented, which reveals differences in signal strength (smaller for larger electrode) and variability (less for larger electrodes), but no effect of the substrate types on culture parameters such as beat rate or conduction velocity. The performance of the on-chip heating was evaluated, with typical temperature settling times (to ±0.1 °C) below 10 s, for a power consumption around 1 W (at 37 °C). Accuracy and stability are discussed. HL-1 cell responses to various temperature profiles enabled by the on-chip heating are presented, showing a remarkable correlation between temperature and beat rate.     

Ionic polymer–metal composite bending actuator loaded with multi-walled carbon nanotubes

Multi-walled carbon nanotube (M-CNT)/Nafion nanocomposites were prepared by the dispersion of treated M-CNTs in a Nafion solution; this procedure was done in order to evaluate the influence of M-CNT loading of up to 7 wt.% on the M-CNT distribution behavior, mechanical properties, and the related actuation performance of the composites. As the M-CNT loading rose above 1 wt.%, the uniformly distributed M-CNT bundles induced by the Nafion polymer were determined to be perturbed, resulting in an inhomogeneous distribution. The heterogeneously distributed M-CNT bundles may provide an undesired impact on the connectivity within the Nafion membrane, thus giving rise to the poor electrochemically-generated actuation properties. It is important to note that the nanocomposite having only a 1 wt.% of M-CNT loading exhibited the best actuation performance in terms of the blocking forces produced by the M-CNT nanocomposites in a cantilever form. It can be understood that the performance improvement is caused by the uniform distribution of the M-CNT bundles, which was confirmed by TEM, XRD and electromechanical actuation tests. It is concluded that the M-CNT distribution behavior, induced by interactions between the polymer matrix, Nafion and the M-CNTs and the related electromechanical performance of the composites, are mainly governed by the M-CNT content. Also, DMA testing was performed.     

A new discrete circuit for readout of resistive sensor arrays

In this paper, we present a method that simplifies the interconnect complexity of N × M resistive sensor arrays from N × M to N + M. In this method, we propose to use two sets of interconnection lines in row–column fashion with all the sensor elements having one of their ends connected to a row line and other end to a column line. This interconnection overloading results in crosstalk among all the elements. This crosstalk causes the spreading of information over the whole array. The proposed circuit in this method takes care of this effect by minimizing the crosstalk. The circuit makes use of the concept of virtual same potential at the inputs of an operational amplifier in negative feedback to obtain a sufficient isolation among various elements. We theoretically present the suitability of the method for small/moderate sized sensor arrays and experimentally verify the predicted behavior by lock-in-amplifier based measurements on a light dependent resistor (LDR) in a 4 × 4 resistor array. Finally, we present a successful implementation of this method on a 16 × 16 imaging array of LDR.     

Characterisation of PZT thin film micro-actuators using a silicon micro-force sensor

This paper reports on the measurements of displacement and blocking force of piezoelectric micro-cantilevers. The free displacement was studied using a surface profiler and a laser vibrometer. The experimental data were compared with an analytical model which showed that the PZT thin film has a Young's modulus of 110 GPa and a piezoelectric coefficient d_31,f of 30 pC/N. The blocking force was investigated by means of a micro-machined silicon force sensor based on the silicon piezoresistive effect. The generated force was detected by measuring a change in voltage within a piezoresistors bridge. The sensor was calibrated using a commercial nano-indenter as a force and displacement standard. Application of the method showed that a 700 μm long micro-cantilever showed a maximum displacement of 800 nm and a blocking force of 0.1 mN at an actuation voltage of 5 V, within experimental error of the theoretical predictions based on the known piezoelectric and elastic properties of the PZT film.     

Integrated SPM probes with NEMS technology

Two kinds of integrated scanning probe microscope (SPM) probes are developed. The first kind is AFM probes realized with a novel masked–maskless combined etching process. Both the nano-tips for scanning and the bending cantilevers are simultaneously formed with the masked–maskless combined anisotropic etching technique. The simultaneous formation method effectively avoids damage to the previously formed tips when the cantilever shaping is processed. The testing results for the probes show the imaging quality comparable with commercial probes. The second kind of probes is an integrated probe with both a piezoresistive sensor and an electric-heated tip. This kind of probe is used for thermal–mechanical data storage, with the pulse-heated tip for data writing and the piezoresistive sensor for data reading. Nano-sized bumps have been formed by probe scanning on PMMA thin film, resulting in a storage density beyond 30 GB/in.².     

Ultra high performance planar InGaAs PIN photodiodes for high speed optical fiber communication

This paper reports a front-illuminated planar InGaAs PIN photodiode with very low dark current, very low capacitance and very high responsivity on S-doped InP substrate. The presented device which has a thick absorption layer of 2.92 μm and a photosensitive area 73 μm in diameter exhibited the high performance of a very low capacitance of 0.47 pF, a very low dark current of 0.041 nA, a very high responsivity of 0.99 A/W (79% quantum efficiency) at λ = 1.55 μm, the 3 dB bandwidths of 6.89 GHz (−5 V), 7.48 GHz (−12 V) for bare chips and 4.48 GHz (−5 V), 5.02 GHz (−12 V) for the devices packaged in TO can, respectively. Furthermore, the developed PIN photodiodes possess high breakdown voltage of less than −25 V.     

Effect of micro-channel geometry on fluid flow and mixing

Understanding the flow fields at the micro-scale is key to developing methods of successfully mixing fluids for micro-scale applications. This paper investigates flow characteristics and mixing efficiency of three different geometries in micro-channels. The geometries of these channels were rectangular with a dimension of; 300 μm wide, 100 μm deep and 50 mm long. In first channel there was no obstacle and in the second channel there were rectangular blocks of dimension 300 μm long and 150 μm wide are placed in the flow fields with every 300 μm distance attaching along the channel wall. In the third geometry, there were 100 μm wide fins with 150° angle which were placed at a distance of 500 μm apart from each other attached with the wall along the 50 mm channel. Fluent software of Computational Fluid Dynamics (CFD) was used to investigate the flow characteristics within these microfluidic model for three different geometries. A species 2D model was created for three geometries and simulations were run in order to investigate the mixing behaviour of two different fluid with viscosity of water (1 mPa s). Models were only built to investigate the effect of geometry, therefore only one fluid with similar viscosity was used in these models. Velocity vector plots were used in the CFD analysis to visualise the fluid flow path. Mass fractions of fluid were used to analyse the mixing efficiency. Two different colours for water were used to simulate the effect of two different fluids. The results showed that the mixing behaviour strongly depended on the channel geometry when other parameters such as fluid inlet velocity, viscosity and pressure of fluids were kept constant. In two geometries lateral pressure and swirling vortexes were developed which provided better mixing results. Creation of swirling vortexes increased diffusion gradients which enhanced diffusive mixing.     

Investigation of Ni-based thermal bimaterial structure for sensor and actuator application

Thermal bimaterial structures made of Ni and Ni-diamond nanocomposite for sensor and actuator application are proposed, fabricated, and tested. Two deflection types of thermal bimaterial structures, including upward and downward bending types, can be easily fabricated by controlling electroplating sequence of Ni and Ni-diamond nanocomposite. According to thermal performance measurement, the tip deflection of upward and downward types can reach about 82.5 μm and ?22.5 μm for a temperature change of 200 °C, respectively. In the condition, the thermomechanical sensitivity and output force are 412.5 nm/K and 97.0 μN for upward type thermal bimaterial structure; and ?112.5 nm/K and ?26.5 μN for downward type one. Due to the low electroplating process temperature (～50 °C) for both Ni-based layers, diminutive pre-deformation of as-fabricated structure and strong interlaminar bonding strength are verified by SEM and vibrational test. The resonant frequency of the structure remains unchanged after 10⁹ cycles.     

Identifying plant species using mid-wave infrared (2.5–6 μm) and thermal infrared (8–14 μm) emissivity spectra

Plant species discrimination using remote sensing is generally limited by the similarity of their reflectance spectra in the visible, NIR and SWIR domains. Laboratory measured emissivity spectra in the mid infrared (MIR; 2.5 μm–6 μm) and the thermal infrared (TIR; 8 μm–14 μm) domain of different plant species, however, reveal significant differences. It is anticipated that with the advances in airborne and space borne hyperspectral thermal sensors, differentiation between plant species may improve. The laboratory emissivity spectra of thirteen common broad leaved species, comprising 3024 spectral bands in the MIR and TIR, were analyzed. For each wavelength the differences between the species were tested for significance using the one way analysis of variance (ANOVA) with the post-hoc Tukey HSD test. The emissivity spectra of the analyzed species were found to be statistically different at various wavebands. Subsequently, six spectral bands were selected (based on the histogram of separable pairs of species for each waveband) to quantify the separability between each species pair based on the Jefferies Matusita (JM) distance. Out of 78 combinations, 76 pairs had a significantly different JM distance. This means that careful selection of hyperspectral bands in the MIR and TIR (2.5 μm–14 μm) results in reliable species discrimination.     

Spin-valve planar Hall sensor for single bead detection

The planar Hall effect (PHE) sensor with a junction size of 3 μm × 3 μm for a single micro-bead detection has been fabricated successfully using a typical spin-valve thin film Ta(5)/NiFe(16)/Cu(1.2)/NiFe(2)/IrMn(15)/Ta(5) nm. The PHE sensor exhibits a sensitivity of about 7.2 μV Oe^?1 in the magnetic field range of ±7 Oe approximately. We have performed an experiment to illustrated the possibility of single micro-bead detection by using a PHE sensor. A single micro-bead of 2.8 μm diameter size is secluded from 0.1% dilute solution of the Dynabeads^® M-280 dropped on the sensor surface and is located on the sensor junction by using a micro magnetic needle. The comparison of the PHE voltage profiles in the field range from 0 to 20 Oe in the absence and presence of a single micro-bead identifies a single Dynabeads^® M-280, the maximal signal change as large as ΔV ～ 1.1 μV can be obtained at the field ～6.6 Oe. The results are well described in terms of the reversal of a basic single domain structure.     

Mechanical design and characterization of a resonant magnetic field microsensor with linear response and high resolution

A resonant magnetic field microsensor based on Microelectromechanical Systems (MEMS) technology including a piezoresistive detection system has been designed, fabricated, and characterized. The mechanical design for the microsensor includes a symmetrical resonant structure integrated into a seesaw rectangular loop (700 μm × 450 μm) of 5 μm thick silicon beams. An analytical model for estimating the first resonant frequency and deflections of the resonant structure by means of Rayleigh and Macaulay's methods is developed. The microsensor exploits the Lorentz force and presents a linear response in the weak magnetic field range (40–2000 μT). It has a resonant frequency of 22.99 kHz, a sensitivity of 1.94 V T^?1, a quality factor of 96.6 at atmospheric pressure, and a resolution close to 43 nT for a frequency difference of 1 Hz. In addition, the microsensor has a compact structure, requires simple signal processing, has low power consumption (16 mW), as well as an uncomplicated fabrication process. This microsensor could be useful in applications such as the automotive sector, the telecommunications industry, in consumer electronic products, and in some medical applications.     

Ferroelectric properties of direct-patterned half-micron thick PZT film

Ferroelectric properties of direct-patterned PZT(PbZr_0.52Ti_0.48O₃) films with 460 μm × 460 μm size and 510 nm thick were analyzed for applying to micro-detecting devices. A photosensitive solution containing ortho-nitrobenzaldehyde was used for the preparation of direct-patterned PZT film. PZT solution was coated on Pt(1 1 1)/Ti/SiO₂/Si(1 0 0) substrate for three times to obtain half-micron thick film and three times of direct-patterning process were repeated to define a pattern on multi-layer PZT film. Through intermediate and final anneal procedure of direct-patterned PZT film, any shrinkage along horizontal direction was not observed within this experimental condition, i.e., the size of the pattern was preserved after annealing, only a thickness reduction was observed after each annealing treatment. Ferroelectric properties of direct-patterned PZT film with 460 μm × 460 μm size and 510 nm thick were compared with those of un-patterned conventional PZT film and shown to be almost the same. Through this work, the high potentiality of direct-patternable PZT film for applying to micro-devices without the introduction of physical damages from dry-etching could be confirmed.