相控阵天线集成技术

低成本、更高频段与可扩展是推动相控阵天线集成技术发展的主要动力。综述了砖 块式与瓦片式两种相控阵天线集成阵列结构,以及多功能芯片与射频晶圆集成技术的发展, 指出开发多功能芯片是当前发展毫米波相控阵天线的重要途径。     

W波段64通道相控阵微系统设计与实现

相控阵微系统的主要特征是电路与天线的高度融合集成,将三维微纳集成技术和微电子技术紧密地结合在一起,切合相控阵高频化、小型化和低成本的发展需求。本文设计了一款W波段的封装天线相控阵微系统,该相控阵采用硅基三维集成的方式将T/R多功能芯片、天线阵列集成在一个微系统模块中,并详细介绍了基于硅工艺的多功能收发芯片设计和相控阵封装天线设计。给出了相控阵微系统的测试结果。该微系统具有高集成度、高性能、低成本的特点,可以为高速无线通信、高精度探测和成像等应用提供一个较优的技术路径。     

一种Ka频段“瓦式”有源相控阵天线设计

在Ka频段,由于单元间距小和集成度高,采用"瓦式"结构集成,有源相控阵天线设计难度大。提出一种Ka频段"瓦式"有源相控阵天线设计方法。采用多功能集成芯片技术实现"瓦式"TR组件的设计,"瓦式"有源相控阵天线的整体架构采用模块化设计。最后设计了一种电控扫描的有源相控天线,采用软件仿真和数值分析设计,加工制造原理样机,测试性能指标,验证了提出方法的可行性。     

适用于小卫星的低成本相控阵天线技术研究

相控阵天线时卫星雷达天线的发展方向之一,但由于价格高昂,多年来制约了其在星载平台的发展.随着近年来新材料、新器件的面世及发展,如TR组件专用多功能芯片、MEMS移相器、SiGe芯片、CMOS芯片等技术在不断发展.采用这些先进技术,可有效降低相控阵天线的成本.     

相控阵天线T／R组件工艺及技术发展趋势

本文针对削减批量生产成本同时提高性能等级和可靠性等目标，提出了机载和天基相控阵天线下一代T／R组件的最新研制成果和前景（中远期）。 从物理结构上看，目前“砖块式”天线在相控阵天线领域仍占主导，但用于共形或多功能相控阵的“瓦片式”薄形天线概念已在研制中：一个3D结构的组件将导致天线尺寸和重量的大幅度削减。 MMIC一直是关键元器件，向多功能芯片、新工艺（如GaN、MEMS功率开关）方向发展。 关于封装，工艺路线图解释了不同的功能：厚膜多层陶瓷电路、基于LTCC或HTCC工艺的烧结陶瓷、印制板上表面贴装、高密度集成3D架构的集中式连线技术。 为满足微波组件（纤维按扣、挠性次微型连接器）所要求的与集成层兼容，互连技术领域也被提到了一个越来越重要的位置上。 泰勒斯公司所掌握的这些技术对于机载和天基组件的意义是双重的，随着机载应用的增多，天基组件的研制可从中获益。     

开放式有源相控阵天线系统

为适应新形势下的雷达探测需求,文中提出开放式有源相控阵天线系统架构。与传统意义上的相控阵天线架构相比,其在系统功能、技术研究范畴以及设计灵活性等方面都有很大扩展,可为未来涉及多学科融合的多功能、模块化、可重构及高集成数字化的相控阵天线设计提供系统级的集成环境。     

毫米波有源相控阵TR组件集成技术

通过分析有源相控阵技术发展趋势,提出集成技术是毫米波有源相控阵TR组件的关键技术,并按制造和装配层次将毫米波有源相控阵TR组件的集成分为芯片级、子阵级和全阵级等三级集成.分析了各级集成的关键技术及其发展趋势,提出关键集成技术发展路线,指出毫米波TR组件专用多功能芯片、垂直互联和高效小型化液冷器等三项技术是当前需重点突破...     

微波新技术在现代相控阵雷达中的应用与发展北大核心CSCD

随着应用需求的不断发展和变化,相控阵雷达朝着超宽带、多功能、高性能和高集成的方向发展。为了适应这些发展需求,微波技术作为相控阵雷达重要的技术基础,也必须不断向前发展。本文首先论述微波技术与相控阵雷达之间的关系;接着介绍微波新技术在现代相控阵雷达中的典型应用,涵盖新型相控阵天线技术、新型收发组件技术、高性能微波固态发射技术、高集成综合馈电网络技术、射频隐身技术和微波光电子技术等多个方面;最后分析微波新技术在相控阵雷达中的应用前景和发展趋势。     

毫米波多通道收发电路与和差网络一体化集成技术

相控阵天线的收发组件与和差网络通常是两个独立的模块,模块间通过接插件进行电连接,成本较高且集成度低。文中提出了毫米波多通道收发电路与和差网络一体化集成技术,将多通道收发组件与和差网络高密度集成在同一介质基板(PCB)上,芯片贴装界面与和差网络在不同层,射频和低频电路通过介质板层间和层内走线完成。最后制作8×16阵列进行无源测试验证,结果表明该一体化集成技术性能良好,具有小型化、轻量化、一体化高密度集成、制作成本低等特点,可广泛用于毫米波瓦式相控阵天线。     

一种小型化有源相控阵天线设计与测试

文章设计了一种小型化有源相控阵天线,阵元采用低剖面双馈圆极化技术,轴比性能优异;T/R组件采用片式组件表贴综合网络技术,与常规砖式或瓦式相控阵天线的多次封装和模块连接相比,该天线通过一次封装集成实现了相控阵天线的轻、薄、小目标。通过紧缩场暗室测试和对星测试,结果表明,天线工作稳定可靠,性能优异。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

A rigorous proof of MIMO channel capacity’s increase with antenna number

It is well known that adding more antennas at the transmitter or at the receiver may offer larger channel capacity in the multiple-input multiple-output（MIMO） communication systems. In this letter, a simple proof is presented for the fact that the channel capacity increases with an increase in the number of receiving antennas. The proof is based on the famous capacity formula of Foschini and Gans with matrix theory.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks