Equivalent circuit modeling of electrokinetically driven analytical microsystems

Equivalent circuit modeling of microfluidic chips accounts for the transport of fluid and electricity in the entire network of microchannels as a function of the applied pressure and electric potentials. For these calculations, each microchannel is represented by a set of conductance coefficients that relates to driving forces and conjugate flows. Theoretical expressions of the coefficients for rectangular microchannels with arbitrary values of the cross-sectional aspect ratio are derived from the fundamentals of electrokinetic phenomena. Particular emphasis is placed on the analysis of the conditions under which the equivalent circuit model can be accurately employed. Model predictions successfully match data on electrokinetically driven chips for immunoassays reported in the literature. A simulation example is also given to illustrate the capability of the technique for the design and manipulation of analytical microsystems.     

Standards for microsystems

Standardization is emerging as a very important element to be considered when larger computer systems are specified and designed. This article reviews some types of standard which might be applied and the effects of their application.     

Tactile metrology for active microsystems

Often active microsystems consist of hybrid structures. Usually tactile metrology is here the only possibility to check manufacturing tolerances in the sub-micrometer range and to guarantee a lasting quality assurance of the production. For characterizing microprobes with reference objects and for tactile measurements of micro-components a high precision 3d-positioning system was developed. The improvement of the probing system, which affects the measuring accuracy decisively, was the main topic of the research. First results of probing experiments are shown.     

CMOS readout circuitry for ISFET microsystems

CIMP (complementary ISFET/MOSFET pair)—a novel technique for implementation of readout interface in CMOS ISFET-based microsystems is described. This design technique allows body effect elimination, temperature compensation and design simplicity, while maintaining constant biasing of ISFET sensor. Several configurations of CIMP interface provide applicability for array-type sensors. The general concept presentation is followed by a detailed analysis, test results showing 0.1% accuracy and layout implementations in a standard 1.6 μm CMOS technology.     

Polycrystalline silicon-germanium films for integrated microsystems

Two approaches were demonstrated for fabricating microstructures after completion of CMOS circuits with aluminum metallization. The first approach employed n-type poly-Ge deposited at 400/spl deg/C as a structural material with an SiO/sub 2/ sacrificial layer and an HF release. The CMOS circuits were protected from the release etchant with an amorphous Si layer. Clamped-clamped lateral resonator test structures had quality factors in vacuum as high as /spl sim/30000. Following a 500/spl deg/C, 30 s RTA the poly-Ge stress was 200 MPa (tensile) and the resistivity was 5.3 m/spl Omega/-cm. In the second integration approach, p-type poly-Si/sub 0.35/Ge/sub 0.65/ deposited at 450/spl deg/C was the structural material with poly-Ge as the sacrificial material and H/sub 2/O/sub 2/ as the release etchant. The H/sub 2/O/sub 2/ did not significantly etch the p-type poly-SiGe structural layer and no protection of the underlying CMOS layers was needed. For the first time, the fabrication of LPCVD surface microstructures directly on top of standard electronics was demonstrated, providing dramatic reductions in both MEMS-CMOS interconnect parasitics and device area. A folded flexure lateral resonator had a quality factor in vacuum as high as /spl sim/15000. No stress or dopant-activation anneal was needed, since the in situ boron-doped poly-SiGe was found to have an as-deposited stress of only -10 MPa (compressive) and a resistivity of only 1.8 m/spl Omega/-cm.     

Germanium resistors for RF MEMS based microsystems

This paper introduces the use of germanium as resistive material in RF MicroElectroMechanical (MEMS) devices. Integrated resistors are indeed highly required into RF MEMS components, in order to prevent any RF signal leakage in the bias lines and also to be compatible with ICs. Germanium material presents strong advantages compared to others. It is widely used in microtechnologies, notably as an important semi-conductor in SiGe transistors as well as sacrificial or structural layers and also mask layer in various processes (Si micromachining especially). But it also presents a very high resistivity value. This property is particularly interesting in the elaboration of integrated resistors for RF components, as it assures miniaturized resistors in total agreement with electromagnetic requirements. Its compatibility as resistive material in MEMS has been carried out. Its integration in an entire MEMS process has been fruitfully achieved and led to the successful demonstration and validation of integrated Ge resistors into serial RF MEMS variable capacitors or switches, without any RF perturbations.     

Developing robust vision modules for microsystems applications

In this work, several robust vision modules are developed and implemented for fully automated micromanipulation. These are autofocusing, object and end-effector detection, real-time tracking and optical system calibration modules. An image based visual servoing architecture and a path planning algorithm are also proposed based on the developed vision modules. Experimental results are provided to assess the performance of the proposed visual servoing approach in positioning and trajectory tracking tasks. Proposed path planning algorithm in conjunction with visual servoing imply successful micromanipulation tasks.     

CAD tools for bridging microsystems and foundries

To move microsystems from research prototypes to an industrial market, CMP, the French multiproject wafer service, has adapted an existing commercial tool to the automated design of micromachined devices     

Tribology of microsystems

In this work the possibilities for the reduction of friction and wear in micro electro-mechanical systems (MEMS) are investigated. An improvement of the tribological behaviour of microsystems can be realized by optimizing the contact condition and by application of special coatings with low friction and low wear rates. For optimizing the contact condition a defined topography and surface profile is generated by photolithography. Furthermore tribological coatings with low friction and low wear rates are developed and investigated using nanoindentation and micro scratch experiments. Also novel results on micro structured surfaces coated with a-C:H and a-C films will be discussed. The results show the great potential of carbon-based coatings in combination with an optimized geometrical surface design.     

Integrating testability into microsystems

 The integration of sensors and actuators with microelectronics into either compact packages or onto a single silicon die is likely to be of major technological importance over the next decade. These systems are referred to as Microsystems or Micro-Electro-Mechanical-Systems (MEMS). One obstacle to mass-market introduction are difficulties with quality and reliability verification. This paper outlines the difficulties of testing microsystems, shows approaches of test generation and verification transferable from the mixed-signal Integrated-Circuit (IC) domain, and demonstrates an on-line test designed for bridge-type, micromachined accelerometer and pressure sensors [1]. Received: 31 October 1996 / Accepted: 14 November 1996     

Control of dynamic microsystems

This paper formulates and solves control problems for nonlinear microsystems which comprise micro-electromechanical devices, micromachined transducers and microelectronics. We perform a consistent dynamic analysis and coherent designs with a minimum level of simplifications using high-fidelity mathematical models. The proposed methodology enables practical implementation for multi-input/multi-output systems due to overall conceptual consistency, design coherence, computational efficiency, algorithmic effectiveness and hardware simplicity. Various issues in nonlinear analysis and control are examined and experimentally verified substantiating design concepts for high-performance microsystems. The reported findings are demonstrated for a proof-of-concept closed-loop electrostatic microactuator.     

Multilayer polyimide film substrates for interconnections in microsystems

 Currently there is a great interest in flexible substrates for their use in the packaging of semiconductors. They allow high packaging density and permit mechanical motion of the components, if necessary. This paper describes a new substrate material which possesses a high flexibility and which can be used for the realization of interconnection cables and MCM-D. These substrates are not only highly flexible but also mechanically stable, chemically inert and can be produced with the same processes as those for rigid substrates. Received: 14 December 1998 / Accepted: 28 December 1998     

Dynamic characteristics of micro air bearings for microsystems

This paper reports on the dynamic characteristics of micro air bearings that include thrust and journal air bearings for microsystems. The dynamic thrust air bearing employs a spiral groove configuration. Analysis shows that the motion stability and load capacity of a thrust air bearing imposes a contradictive requirement on the groove pattern of the air bearing. The dynamic journal air bearing is realized by using a plain circular trench with a narrow radial clearance of C, and a very small aspect ratio of bearing length versus diameter (L/D). Analysis on the shock tolerance of the journal air bearing shows that the shock tolerance increases with the bearing number, the bearing aspect ratio of L/D and its initial equilibrium eccentricity ratio ε ₀. The optimum values of the bearing parameters are explored and recommended. A prototype of turbine device has been designed based on the recommended bearing configurations and realized via microfabrication.