铸态Ti40阻燃钛合金高温拉伸力学性能及断裂行为研究

研究了不同试验温度下铸态Ti40合金的高温拉伸力学性能变化规律,并采用光学显微镜和扫描电子显微镜对拉伸样断口形貌进行观测,确定其断裂机制。结果表明:合金的抗拉强度随着试验温度的升高而显著下降,而塑性则分别表现出两个塑性较优区和脆性区,即400℃以下低温和900~1000℃高温的较好塑性区以及500~800℃的热脆区和1000℃以上的高温脆性区。脆性区试样断口形貌均呈现为沿晶脆性断裂,这一断裂机制与合金粗大晶粒以及严重的氧化相关。高温塑性区断口形貌为穿晶韧性断裂,则合金具有较高的塑性和较低的变形抗力,可作为较好的热加工温度区间。     

温度对退火态6.5%Si—Fe热轧合金塑性的影响

本文研究了退火态6.5%Si-Fe热轧合金在不同温度下拉伸时的力学性能，并观察了拉伸断口形貌及退火态6.5%Si-Fe热轧合金的金相组织。结果表明，经750℃保温140min后，6.5%Si-Fe热轧合金的层状组织消除；其断裂模式随拉伸温度的升高迅速由理解断裂向韧性断裂转变；在200℃拉伸时，为纯解理断口，此时该合金即具有高达26%的延伸率；但是在200℃-400℃温区，延伸率未随温度的升高而显著增大，其断口形貌为解理 韧窝的混合断口；在500℃拉伸时，为纯韧窝断口，其延伸率可达43%。     

温度对退火态6.5%Si-Fe热轧合金塑性的影响

本文研究了退火态 6 .5 %Si Fe热轧合金在不同温度下拉伸时的力学性能 ,并观察了拉伸断口形貌及退火态 6 .5 %Si Fe热轧合金的金相组织。结果表明 ,经 75 0℃保温 140min后 ,6 .5 %Si Fe热轧合金的层状组织消除 ;其断裂模式随拉伸温度的升高迅速由解理断裂向韧性断裂转变 ;在 2 0 0℃拉伸时 ,为纯解理断口 ,此时该合金即具有高达 2 6 %的延伸率 ;但是在 2 0 0℃ - 40 0℃温区 ,延伸率未随温度的升高而显著增大 ,其断口形貌为解理 +韧窝的混合断口 ;在 5 0 0℃拉伸时 ,为纯韧窝断口 ,其延伸率可达 43 %     

温度对V-5Cr-5Ti合金拉伸性能及组织结构的影响

对真空自耗重熔制备的V-5Cr-5Ti合金进行了室温到1150℃温度范围的拉伸性能测试,获得了不同温度下的拉伸应力应变曲线,用SEM和光学显微镜对断口形貌和金相组织进行了观察,分析了温度对断口形貌和组织的影响。结果表明:V-5Cr-5Ti合金的屈服强度和极限强度总体上随温度升高而降低,但在300℃到700℃之间出现应变失效效应,断裂伸长率随温度升高而降低,断面收缩率随温度升高先增大再而降低,在400℃时断面收缩率最大;温度较低时塑性变形以滑移为主,温度较高时以晶界开裂为主,并伴随有晶界熔化的现象,高温断口表现为韧性断裂为主,具有韧性与脆性共存的现象。     

固溶态Ti-5Mo-5V-2Cr-3Al钛合金断口形貌与塑性关系分析

对Ti-5Mo-5V-2Cr-3Al钛合金Φ10mm棒材在不同固溶温度下的拉伸断口形貌进行分析,并研究了断口形貌特征与力学性能之间的关系。结果表明:按照传统的断口分析理论,该材料随着固溶温度升高,塑性下降,实际测试结果却相反,该材料随固溶温度升高,在相变点以下,塑性缓慢升高,在相变点以上,塑性迅速增大;该材料的力学性能受相组成的影响,β相含量越多,棒材的拉伸强度降低,塑性升高;当固溶温度为840℃时,该材料拉伸后的宏观断口平直光滑,微观断口出现尺寸约40μm形状规则的β晶粒,棒材塑性较好。     

Re对一种单晶高温合金蠕变断裂寿命的影响

在保持其它合金元素含量基本不变的情况下,分别加入２．２％、３．２％和４．２％的Ｒｅ浇注单晶高温合金试块,研究了Ｒｅ含量对单晶高温合金拉伸强度和蠕变断裂寿命等的影响。结果表明：随Ｒｅ含量增加,６４９℃条件下的拉伸强度下降但塑性升高;９８２℃／２４８．２ＭＰａ、１０３８℃／２０６．８ＭＰａ及１０７０℃／１７６．８ＭＰａ条件下的蠕变断裂寿命显著提高而塑性有所降低;在相同的试验条件下,随合金的Ｒｅ含量增加     

变形条件对C-Mn钢力学性能的影响机理

借助Gleeble 3500热模拟试验机和lnstron 8801试验机对一种C-Mn试验钢进行了高温和室温拉伸试验,测量和计算了试验钢的力学性能,观察了断口形貌和显微组织,分析其力学性能随拉伸温度和应变速率变化的规律及机理.结果表明:随拉伸温度的升高和应变速率的减小,试验钢的屈服强度和抗拉强度逐渐降低,屈强比呈上升趋势;而断面收缩率在720℃出现极小值,随应变速率的增加逐渐增大.温度和应力作用引发的杂质原子的非平衡晶界偏聚影响着试验钢的塑性.     

P92钢高温拉伸断口形貌的研究

采用热模拟法进行600~1300℃温度区间P92钢的高温拉伸实验。利用SEM,LSCM对不同拉伸温度下的断口形貌及近断口组织进行分析,并对P92钢的力学性能进行研究。结果表明:P92钢拉伸时,抗拉强度由467.32MPa下降到24.32MPa,屈服强度由56.88MPa下降到1.07MPa;不同拉伸温度下,断口表现以韧性断裂为主,韧性与脆性特征共存的现象。在600~900℃时,P92钢发生了动态回复过程,断口形貌表现为韧窝特征。冷却至室温,P92钢近断口处组织均为马氏体+残余奥氏体组织+M7C3+MC+M23C6+M6C+M3C型碳化物。随着温度升高,P92钢发生了动态再结晶,断口形貌以塑孔为主。P92钢近断口处组织为马氏体+残余奥氏体组织+MC+M6C型碳化物。     

用于制造堆内构件压紧弹簧的Z12CN13不锈钢大锻环国产化材料

通过材料成分控制和热处理制度优化掌握了主要合金元素、淬火和回火温度以及淬火冷却速度对压紧弹簧用国产Z12CN13不锈钢大锻环力学性能的影响规律。完成国产Z12CN13不锈钢大锻环的评定,达到了设计标准要求的各项性能。结果表明要同时达到技术条件规定的强度和韧性指标,主要合金元素应取中上限。随淬火温度的升高,国产Z12CN13不锈钢强度、塑性、韧性下降;随回火温度的升高,其强度下降,塑性、韧性升高;淬火冷却速度明显影响材料的抗拉强度和冲击韧性,提高淬火冷却速度可同时满足强度和冲击韧性指标要求。985℃淬火并快冷,640℃回火后国产Z12CN13不锈钢综合力学性能和强韧性配比最佳。     

Nb对PREP法制备内燃机用IN718粉末合金组织和温拉伸性能的影响

采用等离子旋转电极法制备了包含γ′相的镍基粉末高温合金,并对合金中含有不同Nb比例时显微组织结构的改变进行分析,同时对其处于650℃下力学性能进行了测试。研究结果表明:经过热处理后,在γ相内形成了γ′相,当Nb比例从0%提高至3.0%时,γ′相的微观形貌始终保持方形的结构,添加Nb之后形成了更加粗大的γ′相。相对于未加Nb,当在合金内添加Nb之后,试样拉伸强度增大了120MPa以上。试样拉伸强度随Nb含量增加而逐渐增加。Nb能够显著提升合金高温强度,存在一个最优Nb含量使试样获得最佳高温塑性。含3.0%Nb的合金组织发生了塑性断裂,合金中形成了明显延伸的断口,存在众多小尺寸等轴韧窝。当Nb含量增大后,合金发生了塑性降低。含3.0%Nb的合金在拉伸过程中形成了孪晶并降低了滑移带的数量,增加Nb含量后有助于生成层错组织。     

Probabilistic strength of {1 1 1} n-type silicon

The two-parameter Weibull strength distribution of {1 1 1} n-type silicon prismatic bars was determined in four-point bending and analyzed as a function of specimen size (width), loading rate, two different crystallographic orientations, and specimen orientation (polished or etched surface in tension). 100% fractography was performed to classify strength-limiting flaw types and to censor the strength data. All flaw types were extrinsic. Machining or cutting damage in the form of chipped edges (an edge-type flaw) was the dominant strength-limiting flaw when the polished surface was subjected to tensile stress, while a flat-bottomed etch pit (a surface-type flaw) was the dominant strength-limiting flaw when the etched surface was subjected to tensile stress. The censored Weibull strength distribution was independent of specimen width, loading rate (indicative of slow crack growth insusceptibility), and the two crystallographic orientations; however, it was dependent on specimen orientation. Pooling of the strength data was employed to tighten the confidence intervals about the censored parameters. The results from this study indicate that different extrinsic strength-limiting flaws and strength distributions will be operative depending on the manner in which a silicon component is stressed.     

Diffusion of clusters down (1 1 1) aluminum islands

The key factor determining nucleation processes and faceting in homoepitaxial growth as well as texture competition is the mobility of adatoms and small clusters across step edges and facets. Using a combination of molecular dynamics and ab initio calculations, we investigate the mechanisms of small clusters (dimer and trimer) diffusion down the aluminum (1 1 1) surface. In this paper we report results of molecular dynamics studies. Our study shows that the clusters dissociate at the step-edge of compact islands. As a result, the clusters diffuse down the step by an exchange mechanism with a small or medium Schwoebel barrier. The mechanism of this down-diffusion/dissociation is discussed and the corresponding energetics are calculated using the molecular statics method. We find a large anisotropy between the barriers at the two types of 1 1 0 oriented steps.     

1—3型压电复合材料圆柱形水听器

通过对圆柱形水听器在低频接收时的静态理论分析,得到了1－3型压电复合材料径向极化圆柱形水听器的自由场电压接收灵敏度计算公式;分析了不同背衬材料及不同厚度的复合材料对圆柱形水听器灵敏度的影响;实测了1－3型压电复合材料圆柱形水听器的自由场电压接收灵敏度。试验值与理论计算值基本吻合。     

Transmission electron microscope study of the topotactic reaction of (0 0 1), (0 1 1) and (1 1 1) Ag films and Te

The formation, structure and morphology of silver telluride was investigated in the reaction of (0 0 1), (0 1 1) and (1 1 1) single crystalline Ag films with vacuum deposited Te. Silver films 30–40 nm in thickness were deposited by thermal evaporation onto water- and chlorine-treated NaCl. Onto this silver 1–40 nm of tellurium were deposited at 100 and 200 °C. The Ag–Te reaction occurred during Te deposition. Accordingly, formation of the compound phase was investigated from the nucleation stage through complete tellurization on either side of the polymorphic phase transformation temperature (T_c=150 °C). Transmission electron microscope and selected area electron diffraction showed that monoclinic silver telluride (Ag₂Te) of different morphology and texture was always formed. The orientation of silver and monoclinic phase upon differently oriented monocrystalline Ag films and at deposition temperatures around T_c is discussed.     

Chemical etching of {1 1 1} and {1 0 0} surfaces of InP

The effects of a number of chemical etches on the III–V semiconductor InP were studied, using {1 0 0} and {1 1 1}-type faces. The (1 1 1) and (¯1¯1¯1) faces were found to behave differently, and this was attributed to the polarity of the zinc-blende lattice. Curves showing etching rate as a function of penetration were plotted, and it is noted that they demonstrate an enhanced etching rate close to the surface. This is attributed to the damaged surface layer associated with the cutting of a crystal slice. Photographs were taken at various stages of the etching using both the optical and scanning electron microscopes. Both etch pits and etch hillocks were observed. The shapes of the pits are compared to those described in previously published work, and possible reasons for these shapes are discussed. The conditions necessary for the production of an etch hillock are described and it is shown that the measured etching rates are consistent with hillock formation in the case of the 1 HCl1HNO₃ etch. The mechanisms of dissolution are discussed and it is suggested that both activation control of the dissolution process and diffusion control were observed in the work.     

Checking of DIIV-1, DINIR-1, and DINS-1 instruments

Conclusions As follows from what has been said, the amount of specific measurements during the checking of DINIR-1 and DINS-1 instruments is quite large. Taking into account the constant addition to the inventory of these instruments as they are being produced, it is desirable, in the authors' opinion, to consider the problem of developing and subsequently producing a special instrument intended for the checking of various types of time interval meters.Translated from Izmeritel'naya Tekhnika, No. 6, pp. 77–81, June, 1971.     

Electrical properties of some (1, 1, 1) intermetallic compounds

Many intermetallic compounds form with a gap in their density of states at the Fermi level, giving rise to relatively large Seebeck coefficients, on the order of –150 to –300 V/deg. at room temperature. Consequently, when combined with reasonable carrier mobilities in the range of 30 to 50 cm2/V-s, half-Heusler compounds, such as MNiSn where M = (Ti, Zr, Hf), become attractive candidates for intermediate temperature (300°C to 600°C) thermoelectric applications. Samples of TiNiSn were prepared by arc melting and homogenized by various heat treatments. The temperature dependence of the electrical resistivity, Seebeck coefficient, and thermal diffusivity of these samples was characterized between 22°C and 900°C. The electrical resistivity and thermopower both decrease with increasing temperature, consistent with semiconducting behavior. The electrical power factor, defined as S2/ where S is the Seebeck coefficient and is the resistivity, appears quite sensitive to the degree of homogenization in the microstructure and values in excess of 25 W/cm-°C2 were observed in nearly single phase alloys within the 300 to 600°C temperature range. A brief survey of other selected ternary intermetallic compounds is also presented.