Point Defect Engineering of High‐Performance Bismuth‐Telluride‐Based Thermoelectric Materials

Developing high‐performance thermoelectric materials is one of the crucial aspects for direct thermal‐to‐electric energy conversion. Herein, atomic scale point defect engineering is introduced as a new strategy to simultaneously optimize the electrical properties and lattice thermal conductivity of thermoelectric materials, and (Bi,Sb)₂(Te,Se)₃ thermoelectric solid solutions are selected as a paradigm to demonstrate the applicability of this new approach. Intrinsic point defects play an important role in enhancing the thermoelectric properties. Antisite defects and donor‐like effects are engineered in this system by tuning the formation energy of point defects and hot deformation. As a result, a record value of the figure of merit ZT of ≈1.2 at 445 K is obtained for n‐type polycrystalline Bi₂Te_2.3Se_0.7 alloys, and a high ZT value of ≈1.3 at 380 K is achieved for p‐type polycrystalline Bi_0.3Sb_1.7Te₃ alloys, both values being higher than those of commercial zone‐melted ingots. These results demonstrate the promise of point defect engineering as a new strategy to optimize thermoelectric properties.     

Nanograined Half‐Heusler Semiconductors as Advanced Thermoelectrics: An Ab Initio High‐Throughput Statistical Study

Nanostructuring has spurred a revival in the field of direct thermoelectric energy conversion. Nanograined materials can now be synthesized with higher figures of merit (ZT) than the bulk counterparts. This leads to increased conversion efficiencies. Despite considerable effort in optimizing the known and discovering the unknown, technology still relies upon a few limited solutions. Here ab initio modeling of ZT is performed for 75 nanograined compounds—the result of accurate distillation with electronic and thermodynamic filtering techniques from the 79 057 half‐Heusler entries available in the AFLOWLIB.org repository. For many of the compounds, the ZTs are markedly above those attainable with nanograined IV and III‐V semiconductors. About 15% of them may even outperform ZT ≈ 2 at high temperatures. This analysis elucidates the origin of the advantageous thermoelectric properties found within this broad material class. Machine learning techniques are used to unveil simple rules determining if a nanograined half‐Heusler compound is likely to be a good thermoelectric given its chemical composition.     

Atomic Disorders Induced by Silver and Magnesium Ion Migrations Favor High Thermoelectric Performance in α‐MgAgSb‐Based Materials

Thermoelectric devices can directly convert thermal energy to electricity or vice versa with the efficiency being determined by the materials’ dimensionless figure of merit (ZT). Since the revival of interests in the last decades, substantial achievements have been reached in search of high‐performance thermoelectric materials, especially in the high temperature regime. In the near‐room‐temperature regime, MgAgSb‐based materials are recently obtained with ZT ≈ 0.9 at 300 K and ≈1.4 at 525 K, as well as a record high energy conversion efficiency of 8.5%. However, the underlying mechanism responsible for the performance in this family of materials has been poorly understood. Here, based on structure refinements, scanning transmission electron microscopy (STEM), NMR experiments, and density function theory (DFT) calculations, unique silver and magnesium ion migrations in α‐MgAg_0.97Sb_0.99 are disclosed. It is revealed that the local atomic disorders induced by concurrent ion migrations are the major origin of the low thermal conductivity and play an important role in the good ZT in MgAgSb‐based materials.     

Enhancement of Thermopower of TAGS‐85 High‐Performance Thermoelectric Material by Doping with the Rare Earth Dy

Enhancement of thermopower is achieved by doping the narrow‐band semiconductor Ag_6.52Sb_6.52Ge_36.96Te₅₀ (acronym TAGS‐85), one of the best p‐type thermoelectric materials, with 1 or 2% of the rare earth dysprosium (Dy). Evidence for the incorporation of Dy into the lattice is provided by X‐ray diffraction and increased orientation‐dependent local fields detected by ¹²⁵Te NMR spectroscopy. Since Dy has a stable electronic configuration, the enhancement cannot be attributed to 4f‐electron states formed near the Fermi level. It is likely that the enhancement is due to a small reduction in the carrier concentration, detected by ¹²⁵Te NMR spectroscopy, but mostly due to energy filtering of the carriers by potential barriers formed in the lattice by Dy, which has large both atomic size and localized magnetic moment. The interplay between the thermopower, the electrical resistivity, and the thermal conductivity of TAGS‐85 doped with Dy results in an enhancement of the power factor (PF) and the thermoelectric figure of merit (ZT) at 730 K, from PF = 28 μW cm^?1 K^?2 and ZT ≤ 1.3 in TAGS‐85 to PF = 35 μW cm^?1 K^?2 and ZT ≥ 1.5 in TAGS‐85 doped with 1 or 2% Dy for Ge. This makes TAGS‐85 doped with Dy a promising material for thermoelectric power generation.     

Magnetic Field‐Enhanced Thermoelectric Performance in Dirac Semimetal Cd3As2 Crystals with Different Carrier Concentrations

The magneto‐thermoelectric figure of merit (ZT) in crystals of the topological Dirac semimetal Cd₃As₂ with different carrier concentrations is studied. The ZTs for all the crystals increase with the temperature and show maxima at high temperatures. Meanwhile, the temperatures corresponding to the ZT maxima increase with the carrier concentration. The limit to the improvement in ZT(T) at high temperature could be related to the unusual large enhancement in thermal conductivity at elevated temperatures. The bipolar effect and Dirac liquid behavior are presented as processes possibly responsible for the peculiar behavior of the thermal conductivity. Applying a transverse magnetic field initially leads to a dramatic enhancement and, subsequently, to a slight reduction in ZT for all the crystals. The maximum ZT achieved in a magnetic field increases with the carrier concentration and reaches 1.24 at 450 K in a magnetic field of 9 T for the crystal with the highest carrier concentration. It is expected that this work will be beneficial to the current interests in optimizing the thermoelectric properties of quantum topological materials.     

Flexible Thermoelectric Devices of Ultrahigh Power Factor by Scalable Printing and Interface Engineering

Printing is a versatile method to transform semiconducting nanoparticle inks into functional and flexible devices. In particular, thermoelectric nanoparticles are attractive building blocks to fabricate flexible devices for energy harvesting and cooling applications. However, the performance of printed devices are plagued by poor interfacial connections between nanoparticles and resulting low carrier mobility. While many rigid bulk materials have shown a thermoelectric figure of merit ZT greater than unity, it is an exacting challenge to develop flexible materials with ZT near unity. Here, a scalable screen‐printing method to fabricate high‐performance and flexible thermoelectric devices is reported. A tellurium‐based nanosolder approach is employed to bridge the interfaces between the BiSbTe particles during the postprinting sintering process. The printed BiSbTe flexible films demonstrate an ultrahigh room‐temperature power factor of 3 mW m^?1 K^?2 and ZT about 1, significantly higher than the best reported values for flexible films. A fully printed thermoelectric generator produces a high power density of 18.8 mW cm^?2 achievable with a small temperature gradient of 80 °C. This screen‐printing method, which directly transforms thermoelectric nanoparticles into high‐performance and flexible devices, presents a significant leap to make thermoelectrics a commercially viable technology for a broad range of energy harvesting and cooling applications.     

High‐Performance N‐type Mg3Sb2 towards Thermoelectric Application near Room Temperature

Se‐doped Mg_3.2Sb_1.5Bi_0.5‐based thermoelectric materials are revisited in this study. An increased ZT value ≈ 1.4 at about 723 K is obtained in Mg_3.2Sb_1.5Bi_0.49Se_0.01 with optimized carrier concentration ≈ 1.9 × 10¹⁹ cm^?3. Based on this composition, Co and Mn are incorporated for the manipulation of the carrier scattering mechanism, which are beneficial to the dramatically enhanced electrical conductivity and power factor around room temperature range. Combined with the lowered lattice thermal conductivity due to the introduction of effective phonon scattering centers in Se&Mn‐codoped sample, a highest room temperature ZT value ≈ 0.63 and a peak ZT value ≈ 1.70 at 623 K are achieved for Mg_3.15Mn_0.05Sb_1.5Bi_0.49Se_0.01, leading to a high average ZT ≈ 1.33 from 323 to 673 K. In particular, a remarkable average ZT ≈ 1.18 between the temperature of 323 and 523 K is achieved, suggesting the competitive substitution for the commercialized n‐type Bi₂Te₃‐based thermoelectric materials.     

On Intensifying Carrier Impurity Scattering to Enhance Thermoelectric Performance in Cr‐Doped CeyCo4Sb12

The beneficial effect of impurity scattering on thermoelectric properties has long been disregarded even though possible improvements in power factor have been suggested by Ioffe more than a half century ago. Here it is theoretically and experimentally demonstrated that proper intensification of ionized impurity scattering to charge carriers can benefit the thermoelectric figure of merit (ZT) by increasing the Seebeck coefficient and decreasing the electronic thermal conductivity. The optimal strength of ionized impurity scattering for maximum ZT depends on the Fermi level and the density of states effective mass. Cr‐doping in Ce_yCo₄Sb₁₂ progressively increases the strength of ionized impurity scattering, and significantly improves the Seebeck coefficient, resulting in high power factors of 45 μW cm^?1 K^?2 with relatively low electrical conductivity. This effect, combined with the increased Ce‐filling fraction and thus decreased lattice thermal conductivity by charge compensation of Cr‐dopant, gives rise to a maximum ZT of 1.3 at 800 K and a large average ZT of 1.1 between 500 and 850 K, ≈30% and ≈20% enhancements as compared with those of Cr‐free sample, respectively. Furthermore, this study also reveals that carrier scattering parameter can be another fundamental degree of freedom to optimize electrical properties and improve thermal‐to‐electricity conversion efficiencies of thermoelectric materials.     

Stoichiometry Controlled,Single‐Crystalline Bi2Te3 Nanowires for Transport in the Basal Plane

Thermoelectric Bi₂Te₃ based bulk materials are widely used for solid‐state refrigeration and power‐generation at room temperature. For low‐dimensional and nanostructured thermoelectric materials an increase of the thermoelectric figure of merit ZT is predicted due to quantum confinement and phonon scattering at interfaces. Therefore, the fabrication of Bi₂Te₃ nanowires, thin films, and nanostructured bulk materials has become an important and active field of research. Stoichiometric Bi₂Te₃ nanowires with diameters of 50–80 nm and a length of 56 μm are grown by a potential‐pulsed electrochemical deposition in a nanostructured Al₂O₃ matrix. By transmission electron microscopy (TEM), dark‐field images together with electron diffraction reveal single‐crystalline wires, no grain boundaries can be detected. The stoichiometry control of the wires by high‐accuracy, quantitative enegy‐dispersive X‐ray spectroscopy (EDX) in the TEM instrument is of paramount importance for successfully implementing the growth technology. Combined electron diffraction and EDX spectroscopy in the TEM unambiguously prove the correct crystal structure and stoichiometry of the Bi₂Te₃ nanowires. X‐ray and electron diffraction reveal growth along the [110] and [210] directions and the c axis of the Bi₂Te₃ structure lies perpendicular to the wire axis. For the first time single crystalline, stoichiometric Bi₂Te₃ nanowires are grown that allow transport in the basal plane without being affected by grain boundaries.     

Mg3+δSbxBi2−x Family: A Promising Substitute for the State‐of‐the‐Art n‐Type Thermoelectric Materials near Room Temperature

The Bi₂Te_3?xSe_x family has constituted n‐type state‐of‐the‐art thermoelectric materials near room temperature (RT) for more than half a century, which dominates the active cooling and novel heat harvesting application near RT. However, the drawbacks of a brittle nature and Te‐content restricts the possibility for exploring potential applications. Here, it is shown that the Mg_3+δSb_xBi_2?x family ((ZT)_avg = 1.05) could be a promising substitute for the Bi₂Te_3?xSe_x family ((ZT)_avg = 0.9–1.0) in the temperature range of 50–250 °C based on the comparable thermoelectric performance through a synergistic effect from the tunable bandgap using the alloy effect and the suppressible Mg‐vacancy formation using an interstitial Mn dopant. The former is to shift the optimal thermoelectric performance to near RT, and the latter is helpful to partially decouple the electrical transport and thermal transport in order to get an optimal RT power factor. The positive temperature dependence of the bandgap suggests this family is also a superior medium‐temperature thermoelectric material for the significantly suppressed bipolar effect. Furthermore, a two times higher mechanical toughness, compared with the Bi₂Te_3?xSe_x family, allows for a promising substitute for state‐of‐the‐art n‐type thermoelectric materials near RT.     

Thermal Conductivity and Phonon Scattering Processes of ALD Grown PbTe–PbSe Thermoelectric Thin Films

This work studies the thermal conductivity and phonon scattering processes in a series of n‐type lead telluride‐lead selenide (PbTe–PbSe) nanostructured thin films grown by atomic layer deposition (ALD). The ALD growth of the PbTe–PbSe samples in this work results in nonepitaxial films grown directly on native oxide/Si substrates, where the Volmer–Weber mode of growth promotes grains with a preferred columnar orientation. The ALD growth of these lead‐rich PbTe, PbSe, and PbTe–PbSe thin films results in secondary oxide phases, along with an increase microstructural quality with increased film thickness. The compositional variation and resulting point and planar defects in the PbTe–PbSe nanostructures give rise to additional phonon scattering events that reduce the thermal conductivity below that of the corresponding ALD‐grown control PbTe and PbSe films. Temperature‐dependent thermal conductivity measurements show that the phonon scattering in these ALD‐grown PbTe–PbSe nanostructured materials, along with ALD‐grown PbTe and PbSe thin films, are driven by extrinsic defect scattering processes as opposed to phonon–phonon scattering processes intrinsic to the PbTe or PbSe phonon spectra. The implication of this work is that polycrystalline, nanostructured ALD composites of thermoelectric PbTe–PbSe films are effective in reducing the phonon thermal conductivity, and represent a pathway for further improvement of the figure of merit (ZT), enhancing their thermoelectric application potential.     

BiSbTe‐Based Nanocomposites with High ZT: The Effect of SiC Nanodispersion on Thermoelectric Properties

Thermoelectric materials have potential applications in energy harvesting and electronic cooling devices, and bismuth antimony telluride (BiSbTe) alloys are the state‐of‐the‐art thermoelectric materials that have been widely used for several decades. It is demonstrated that mixing SiC nanoparticles into the BiSbTe matrix effectively enhances its thermoelectric properties; a high dimensionless figure of merit (ZT) value of up to 1.33 at 373 K is obtained in Bi_0.3Sb_1.7Te₃ incorporated with only 0.4 vol% SiC nanoparticles. SiC nanoinclusions possessing coherent interfaces with the Bi_0.3Sb_1.7Te₃ matrix can increase the Seebeck coefficient while increasing the electrical conductivity, in addition to its effect of reducing lattice thermal conductivity by enhancing phonon scattering. Nano‐SiC dispersion further endows the BiSbTe alloys with better mechanical properties, which are favorable for practical applications and device fabrication.     

Influence of Group IV-Te Alloying on Nanocomposite Structure and Thermoelectric Properties of Bi<Subscript>2</Subscript>Te<Subscript>3</Subscript> Compounds

Thermoelectric compounds based on doped bismuth telluride and its alloys have recently attracted increasing interest. Due to their structural features they show increased values of the thermoelectric figure of merit (ZT). A promising approach to improve the thermoelectric properties is to manufacture nanocomposite materials exhibiting lower thermal conductivities and higher ZT. The ZT value of compounds can be shifted reasonably to higher values (>1) by alloying with IV-Te materials and adequate preparation methods to form stable nanocomposites. The influence of PbTe and Sn on the thermoelectric properties is studied as a function of concentration and preparation methods. Melt spinning and spark plasma sintering were applied to form nanocomposite materials that were mechanically and thermodynamically stable for applications in thermoelectric devices. The structural properties are discussed based on analysis by transmission electron microscopy and x-ray diffraction.     

Bulk Nanostructured Thermoelectric Materials: Preparation,Structure and Properties

Bulk nanostructured materials have recently emerged as a new paradigm for improving the performance of existing thermoelectric materials. Here, we fabricated two kinds of bulk nanostructured thermoelectric materials by a bottom-up strategy and an in situ precipitation method, respectively. Binary PbTe was fabricated by a combination of chemical synthesis and hot pressing. The grain sizes of the hot pressed bulk samples varied from 200 nm to 400 nm, which significantly contributed to the reduction of thermal conductivity due to the enhanced boundary phonon scattering. The highest figure of merit ZT of the binary PbTe sample reached 0.8 at 580 K. Mg₂(Si,Sn) solid solutions have shown great promise for thermoelectric application, due to good thermoelectric properties, non-toxicity, and abundantly available constituent elements. The nanoscale microstructure observation of the compounds showed the existence of nanophases formed in situ, which is believed to be related to the relatively low lattice thermal conductivity in this material system. The highest ZT of Sb-doped Mg₂(Si,Sn) samples reached 1.1 at 770 K.     

<Emphasis Type="Italic">ZT</Emphasis> Measurements Under Large Temperature Differences

All current techniques for ZT measurement are carried out under a small temperature difference, despite the fact that thermoelectric devices are likely to operate under a relatively large temperature difference. In this paper, we describe a new technique which enables ZT measurement under a large temperature difference. The principle of measurement is presented, followed by a proof-of-concept study. The results of this study show that ZT values obtained under a large temperature difference differ significantly from those obtained under small temperature differences. The technique provides a more realistic evaluation of thermoelectric materials and devices.     

Toward High Thermoelectric Performance of Thiophene and Ethylenedioxythiophene (EDOT) Molecular Wires

The design of thermoelectric materials for the efficient conversion of waste heat into electricity requires simultaneous tuning of their electrical and thermal conductance. A comparative theoretical study of electron and phonon transport in thiophene and ethylenedioxythiophene (EDOT) based molecular wires is performed. It is shown that modifying thiophene by substituting ethylenedioxy enhances the thermoelectric figure of merit ZT for molecules of the same length. Furthermore, it is demonstrated that the electrical conductance of EDOT‐based wires decays more slowly with length than that of thiophene‐based wires and that their thermal conductance is lower. The room‐temperature ZT of undoped EDOT is found to be rather low. However, doping of EDOT by the electron acceptor tolunenesulfunate increases the Seebeck coefficient and electrical conductance, while decreasing the thermal conductance, leading to a thermoelectric figure of merit as high as ZT = 2.4.     

Effect of Electric Current on the Performance of Bi<Subscript>1.2</Subscript>Sb<Subscript>4.8</Subscript>Te<Subscript>9</Subscript> Thermoelectric Material Prepared by a Field-Activated Pressure-Assisted Sintering Process

Field-activated pressure-assisted sintering (FAPAS) was applied to sinter Bi_1.2Sb_4.8Te₉ thermoelectric materials under different conditions, including no-current sintering (NCS), low-density current sintering (LCS), and high-density current sintering (HCS). The effect of the current density on the final thermoelectric performance of the products was investigated. Applying a higher-density electric current and shorter dwell time can improve the thermoelectric performance of the sample by increasing its electric conductivity and decreasing its thermal conductivity. The maximum figure of merit ZT values of the NCS, LCS, and HCS samples were 0.46, 0.48, and 0.57, respectively. Therefore, applying a high-density electric current in the sintering process may be an effective way to obtain Bi_1.2Sb_4.8Te₉ thermoelectric material with high ZT value.     

Design of High‐Performance Disordered Half‐Heusler Thermoelectric Materials Using 18‐Electron Rule

Ternary half‐Heusler (HH) alloys display intriguing functionalities ranging from thermoelectric to magnetic and topological properties. For thermoelectric applications, stable HH alloys with a nominal valence electron count (VEC) of 18 per formula or defective HH alloys with a VEC of 17 or 19 are assumed to be promising candidates. Inspired by the pioneering efforts to design a TiFe_0.5Ni_0.5Sb double HH alloy by combining 17‐electron TiFeSb and 19‐electron TiNiSb HH alloys, both high‐performance n‐type and p‐type materials based on the same parent TiFe_0.5Ni_0.5Sb are developed. First‐principles calculation results demonstrate their beneficial band structure having a high band degeneracy that contributes to their large effective mass and thereby maintains their high Seebeck coefficient values. Due to the strong Fe/Ni disorder effect, TiFe_0.5Ni_0.5Sb exhibits a much lower lattice thermal conductivity than does TiCoSb, consistent with very recently reported results. Furthermore, tuning the ratio of Fe and Ni leads to achieving both p‐ and n‐types, and alloying Ti by Hf further enhances the thermoelectric performance significantly. A peak ZT of ≈1 and ≈0.7 at 973 K are achieved in the p‐type and n‐type based on the same parent, respectively, which are beneficial and promising for real applications.     

Improved Thermoelectric Performance of Eco‐Friendly β‐FeSi2–SiGe Nanocomposite via Synergistic Hierarchical Structuring,Phase Percolation,and Selective Doping

A β‐FeSi₂–SiGe nanocomposite is synthesized via a react/transform spark plasma sintering technique, in which eutectoid phase transformation, Ge alloying, selective doping, and sintering are completed in a single process, resulting in a greatly reduced process time and thermal budget. Hierarchical structuring of the SiGe secondary phase to achieve coexistence of a percolated network with isolated nanoscale inclusions effectively decouples the thermal and electrical transport. Combined with selective doping that reduces conduction band offsets, the percolation strategy produces overall electron mobilities 30 times higher than those of similar materials produced using typical powder‐processing routes. As a result, a maximum thermoelectric figure of merit ZT of ≈0.7 at 700 °C is achieved in the β‐FeSi₂–SiGe nanocomposite.