Studies of high-speed metal-semiconductor-metal photodetector witha GaAs/AlGaAs/GaAs heterostructure

A GaAs/AlGaAs/GaAs heterostructure metal-semiconductor-metal photodetector (HMSM) with an active area of 100 μm×100 μm was developed and studied. The measured risetime of the device is 30 ps. The measured falltime is as short as 23 ps. The observed ultrafast response is attributed to the reduction of both the carrier transit time and the device capacitance due to the incorporation of the AlGaAs barrier layer. The HMSM is found to have a smaller saturation capacitance and saturates at a much lower bias voltage in comparison with the conventional MSM photodetector (CMSM). At a bias of 10 V, the full width at half maximum (FWHM) of the temporal response of the HMSM is more than 20% smaller than that of the CMSM. In addition, it is found that the peak impulse response for the HMSM is substantially larger than that of the CMSM under the same operation condition. Two-dimensional and equivalent circuit analyses were carried out to interpret the observed phenomena and to provide insight into the underlying physics     

AlGaAs/GaAs多量子阱红外探测器暗电流特性

介绍了AlGaAs/GaAs多量子阱红外探测器(QWIP)暗电流与噪声的关系和降低暗电流的途径:基于湿法化学腐蚀工艺制作了300μm×300μm台面单元器件,并用变温液氦杜瓦测试系统在不同温度下对红外探测器暗电流进行了测试并分析.在温度小于40 K时,随着温度的改变暗电流没有明显的变化;当温度大于40 K时,暗电流随着温度的升高迅速变大,正、负偏压下QWIP暗电流具有不对称特性.     

Vertical integration of a GaAs/AlGaAs quantum-well laser and along-wavelength quantum-well infra-red photodetector

A short-wavelength (~0.8 μm) GaAs/AlGaAs graded-index separate-confinement heterostructure quantum-well laser has been monolithically integrated with a long-wavelength (~8 μm) GaAs/AlGaAs multiple-quantum-well infra-red photodetector on a semi-insulating GaAs substrate by molecular beam epitaxy. The vertical integration method is used and the combined structure is a pinin structure. Both the laser and detector exhibit excellent characteristics. At room temperature, the ridge waveguide laser has an extremely low threshold current of 25 mA and a differential quantum efficiency above 65% with a stripe width of 20 μm. The quantum-well detector has a peak response at 8 μm and a responsivity of 0.7 A/W     

Design study of AlGaAs/GaAs HBTs

The frequency performance of AlGaAs/GaAs heterojunction bipolar transistors (HBTs) having different layouts, doping profiles, and layer thicknesses was assessed using the BIPOLE computer program. The optimized design of HBTs was studied, and the high current performances of HBTs and polysilicon emitter transistors were compared. It is shown that no current crowding effect occurs at current densities less than 1×10⁵ A/cm² for the HBT with emitter stripe width S_E<3 μm, and the HBT current-handling capability determined by the peak current-gain cutoff frequency is more than twice as large as that of the polysilicon emitter transistor. An optimized maximum oscillation frequency formula has been obtained for a typical process n-p-n AlGaAs/GaAs HBT having base doping of 1×10 ¹⁹ cm^-3     

AlGaAs/GaAs HBT的设计研究

利用BIPOLE计算机程序,评价了具有不同版图、不同掺杂分布和不同层厚的AlGaAs/GaAs HBT的频率性能,研究了HBT的最佳化设计,并比较了HBT和多晶硅发射极晶体管的大电流性能。研究表明,对发射极条宽S_E<3μm的HBT来说,在电流密度小于1×10~5A/cm~2时,并未发现电流集聚效应,由最高f_T确定的HBT电流处理容量要比多晶硅发射极晶体管的大两倍多。对基区掺杂为1×10~(19)cm~(-3)的典型工艺n-p-n型AlGaAs/GaAs HBT,已获得了一个最佳化的最高振荡频率f_(mos(?))的方程式:f_(mosc)=337(W_(Bop)/S_E)~(1/2)GHz,式中,W_(Bop)是最佳基区宽度,S_E是发射极条宽,二者都以微米为单位。     

AlGaAs/GaAs quantum well infrared photodetector focal plane array based on MOCVD technology

128 × 128, 128 × 160 and 256 × 256 AlGaAs/ GaAs quantum well infrared photodetector (QWIP) focal plane arrays (FPA) as well as a large area test device are designed and fabricated. The device with n-doped back-illuminated AIGaAs/GaAs quantum structure is achieved by metal organic chemical vapor deposition (MOCVD) epitaxial growth and GaAs integrated circuit processing technology. The test device is valued by its dark current performance and Fourier transform infrared spectroscopy (FTIR) spectra at 77 K. Cut off wavelengths of 9 and 10.9 μm are realized by using different epitaxial structures. The blackbody detectivity DB* is as high as 2.6 × 109 cm· Hz1/2·W-1. The 128 × 128 FPA is flip-chip bonded on a CMOS readout integrated circuit with indium (In) bumps. The infrared thermal images of some targets under room temperature background have been successfully demonstrated at 80 K operating temperature. In addition, the methods to further improve the image quality are discussed.     

Electron mobility in a AlGaAs/GaAs/AlGaAs quantum well

An oscillatory dependence of the electron mobility on the quantum well (QW) thickness in a AlGaAs/GaAs/AlGaAs heterostructure with double-sided modulation doping has been observed experimentally. A steep decrease in mobility with increasing electron concentration in the QW is established. The conditions for an increase in mobility on introducing a thin barrier into the QW are determined. The first experimental observation of an increase in mobility by a factor of 1.3 in a QW of thickness L=26 nm upon introducing a thin (1–1.5 nm) AlAs barrier is reported.     

Growth and characterization of n-type GaAs/AlGaAs quantum well infrared photodetector on GaAs-on-Si substrate

We present in this article device characteristics of molecular beam epitaxy grown GaAs/AlGaAs quantum well infrared photodetectors (QWIP) on a semi-insulating GaAs substrate and on a GaAs-on-Si substrate grown by metalorganic chemical vapor deposition (MOCVD). Important issues for QWIP application such as dark current, spectral response, and absolute responsivity were measured. We find that the detector structure grown on a GaAs-on-Si substrate exhibits comparable dark current and absolute responsivity and a small blue shift in the spectral response. This is the first demonstration of long wavelength GaAs/AlGaAs quantum well infrared photodetector using MOCVD grown GaAs-on-Si substrate and the performance is comparable to a similar detector structure grown on a GaAs substrate.     

160×128元多量子阱长波红外焦平面探测器件研制

报道了新研制出的160×128元GaAs/AlGaAs多量子阱长波红外焦平面器件.使用MBE的方法在半绝缘的GaAs衬底上生长器件结构;开发了用普通光刻技术和离子束刻蚀法制备2D光栅技术,以及探测器芯片与读出电路互联技术.在77 K时测试,器件的平均峰值探测率D*λ=1.28×1010 cmW-1Hz1/2,峰值波长为λp=8.1μm,截止波长为λc=8.47μm.器件的非盲元率≥98.8%,不均匀性10%.     

超亚微米栅AlGaAs/GaAs HEMT

在分子束外延生长的外延晶片上,用电子束刻蚀技术制作了超亚微米栅AlGaAs/GaAs高电子迁移率晶体管(HEMT),其栅长分布为25～85nm。该器件表明,速度过冲和短栅几何效应对栅长小于100nm的器件起着重要的作用。栅长为30nm的HEMT的最大本征跨导为215mS/mm,有效饱和电子速度可达3×10~7cm/s。     

Ultra-submicrometer-gate AlGaAs/GaAs HEMTs

Ultra-submicrometer-gate AlGaAs/GaAs high-electron-mobility transistors (HEMTs) that have gate lengths ranging from 25 to 85 nm and were fabricated using electron-beam lithographic techniques on epitaxial wafers grown by molecular beam epitaxy are discussed. These devices show that velocity overshoot and short-gate geometry effects play an important role for the gate lengths less than 100 nm. The maximum intrinsic transconductance is 215 mS/mm, and the effective saturated electron velocity reaches 3×10⁷ cm/s for a 30-nm HEMT     

单量子阱GaAs/AlGaAs半导体激光器

本文介绍了用分子束外延法制作的梯度折射率分别限制式单量子阱GaAs/AlGaAs半导体激光器。该器件具有较低的阈值电流密度和单模运转特性,连续输出功率可达55mw。     

GaAs/AlGaAs and InGaAs/AlGaAs MODFET inverter simulations

Although MODFET's have exhibited the fastest switching speed for any digital circuit technology, there is as yet no clear consensus on optimal inverter design rules. We therefore have developed a comprehensive MODFET device model that accurately accounts for such high gate bias effects as transconductance degradation and increased gate capacitance. The device model, which agrees with experimental devices fabricated in this laboratory, is used in the simulation of direct-coupled FET logic (DCFL) inverters with saturated resistor loads. Based on simulation results, the importance of large driver threshold voltage not only for small propagation delay times but for wide logic swings and noise margins is demonstrated. Furthermore, minimum delay times are found to occur at small supply voltages as seen experimentally. Both of these results are attributed to the reduction of detrimental high gate bias effects. The major effect of reducing the gate length on delay time is to decrease the load capacitance of the gate. Using 0.25-µm gates, delay times of 5 and 3.6 ps at 300 and 77 K, respectively, are predicted. Finally, the recently introduced In-GaAs/AlGaAs MODFET's are shown to have switching speeds superior to those of conventional GaAs/AlGaAs MODFET's.     

Demonstration of a p-channel GaAs/AlGaAs BICFET

The p-channel bipolar inversion-channel field-effect transistor (BICFET) is a bipolar transistor which utilizes an inversion layer induced by planar doping using molecular beam epitaxy. A current gain of ~8 is obtained at a current density of ~8×10³ A/cm². The results agree well with previous theoretical predictions of current gain, output conductance, and collector offset voltage. There is no base transit time in the BICFET and thus the speed of the device will be determined by transit-time-limited transport in the collector     

AlGaAs/GaAs/AlGaAs DHBT's for high-temperature stable circuits

High-temperature devices are required for a large number of industrial applications. In order to demonstrate the feasibility of a high temperature operating circuit on GaAs an operational amplifier was designed and fabricated. A corresponding technology for transistors and circuits for operation up to 300°C with AlGaAs/GaAs/AlGaAs DHBT's is presented. For the amplifier circuit an open loop gain of 49.5 dB at room temperature and 35.8 dB at 200°C was measured, which is in good agreement with the circuit simulation. High temperature stability has been proven by a storage test at 400°C over 1000 h for the ohmic contact metallization and 200 h for the transistors     

Analysis of a resonant-cavity enhanced GaAs/AlGaAs MSMphotodetector

The authors have developed a 2-D device simulator for heterostructure metal-semiconductor-metal (MSM) photodetectors. They have incorporated a model of multilayer optics into the simulator and used it to analyze the temporal response of a resonant-cavity enhanced heterostructure with a confining buffer layer and a distributed Bragg reflector (DBR). The authors show that through fine tuning the layer thicknesses, optical resonance enhancement of the light absorption can be obtained     

Millimeter-wave AlGaAs/GaAs p-n-p HBT

The total emitter-to-collector delay for a p-n-p AlGaAs/GaAs heterojunction bipolar transistor (HBT) has been reduced to 5.7 ps by extending the cutoff frequency for these devices to the millimeter-wave range. A total charging delay of 1.2 ps was obtained by a lightly doped emitter and by reducing the collector resistance. Low transit delays totaling 4.5 ps were achieved with a thin (440 Å) uniformly doped base and a thin (2800 Å) collector. The reduction in these delays permitted a non-self-aligned (1-μm emitter mesa/base contact separation) device with two emitters (2.6×10 μm² each) and a single base contact to exhibit an f_t of 28 GHz     

AlGaAs/GaAs HBT linearity characteristics

Communication systems require linear power amplifiers with high efficiency and very low intermodulation distortion. AlGaAs/GaAs heterojunction bipolar transistors (HBT's) were found to have very low intermodulation distortion in power operation. Two-tone tests were carried out on both common-emitter (CE) and common-base (CB) power HBT's. At 7 GHz, the CE HBT showed -20 dBc IM₃ (third-order intermodulation ratio) and 12% power added efficiency (PAE) per tone at the 1 dB gain compression point; IM₃ dropped to -30 dBc at 1.5 dB output power backoff. The CE HBT has lower intermodulation distortion than CB HBT. Load pull data were collected to aid the understanding of the intermodulation. Parameters of the Gummel-Poon model (as used in SPICE) were derived for HBT's based on dc data and small-signal S parameters at various bias points. The accuracy and validity of the model were confirmed by comparison to experimental two-tone results. SPICE predicts that the emitter and base resistances linearize the HBT and reduce the third-order intermodulation distortion. The excellent third-order intermodulation performance of the CE HBT makes it a very attractive choice for linear power amplifiers