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本文采用正交试验方法,对炭纤维化学镀铜进行了初步研究。找出了影响炭纤维化学镀铜的主要因素,得到了炭纤维化学镀铜的最佳配方及其工艺条件。 相似文献
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采用以甲醛为还原剂的化学镀铜液,用硝酸银作活化剂,在碳纤维布表面沉积出连续、均匀、有光泽的化学镀铜层。研究了不同前处理工艺对碳纤维布化学镀铜的影响。采用扫描电子显微镜表征了化学镀铜层的表面形貌,并用数字电压表测试了碳纤维布化学镀铜前后的导电性。 相似文献
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Design and achievement of a complete bottom-up electroless copper filling for sub-micrometer trenches 总被引:1,自引:0,他引:1
The bottom-up filling of electroless copper usually depends on inhibiting the Cu deposition at the surface or accelerating the Cu deposition in the bottom of trenches to achieve a relative high deposition rate of electroless copper in the bottom of trenches. In this paper, a complete bottom-up filling of electroless copper, in which the deposition rates of the electroless copper were not only inhibited at the surface of the substrate, but also were accelerated in the bottom of the trenched, was designed and achieved in the plating bath with an addition of bis (3-sulfopropyl) disulfide (SPS) and polyethylene glycol (PEG). The cross-sectional SEM observation of trenches indicated that all trenches with different widths ranging from 100 to 290 nm were filled completely by electroless copper, and no void was found. This was attributed to three factors, the electroless Cu deposition was accelerated markedly by an addition SPS only; but it was suppressed sharply by a combination addition SPS and PEG-4000; the large molecular weight and lower diffusion coefficient of PEG-4000 resulted in concentration gradient of PEG-4000 in the trenches. The effects of PEG-4000 and SPS on the polarization behaviors of the electroless copper plating bath were investigated by the linear sweep voltammetry method and mixed potential theory. 相似文献
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We investigated bottom-up electroless copper plating with addition of mercapto alkyl carboxylic acid (MACA) such as 3-mercapto-propionic acid (3-MPA), 11-mercapto-undecanoic acid (11-MUA), and 16-mercapto-hexadecanoic acid (16-MHA). The inhibition of copper plating deposition on the plane surface was observed with an addition of MACAs, and bottom-up fill was confirmed for MACAs with alkyl chain numbers of 3, 11, and 16. The bottom-up fill tendency was enhanced with increasing Alkyl chain number. This result strongly suggests that diffusion coefficient of inhibitor molecule plays an important role for bottom-up fill mechanisms, because MACA with longer alkyl chain has smaller diffusion coefficient than that with shorter alkyl chain. 相似文献
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Deposition of a thin electroless copper films on PVD copper seed layers in interconnect metallization was investigated for formation of a composite seed layer. Issues such as film stress, adhesion, electrical reliability, and hydrogen incorporation were addressed to determine feasibility of the process for the fabrication of real device structures. The formation of blisters between the copper films and underlying barrier layer were observed due to hydrogen incorporation and high level of compressive stress as a result of the electroless deposition process. Optimization of the electroless copper bath and process flow were investigated to minimize blister formation and improve fill enhancement effectiveness. Low temperature postelectroless anneal was found to remove incorporated hydrogen but also decreased overall fill effectiveness. Post-CMP electrical reliability of thin PVD/electroless/copper fill process was found to be equivalent to thick PVD/copper fill process. Potential reliability issues with electroless deposition on poorly seeded features were suggested by via yield degradation following final anneal. 相似文献
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研究了化学镀铜溶液中稳定剂对铜沉积速率的影响,着重考虑主配位剂、副反应的抑制剂、甲醛捕获剂对化学镀铜的影响。结果表明,在基本配方8 g/L CuSO4.5H2O,3 g/L HCHO2,8 g/L EDTA7,.5 g/L NaOH,工艺参数pH=12.5,温度50℃,时间40 min的基础上,各种稳定剂的适宜用量为6 mL/L CH3OH、8 mg/L K4Fe(CN)6、6 mg/L 22,’-bipy。在最佳工艺下得到的镀层外观红亮,表面平整,晶粒细致,化学镀铜液稳定。 相似文献
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化学镀镍-铜-磷三元合金工艺的研究 总被引:1,自引:2,他引:1
为提高化学镀镍-磷合金镀层的性能及获得多种性能的合金镀层以拓宽其应用范围。在化学镀镍-磷合金液中加入硫酸铜制得镍-铜-磷三元合金。研究了镀液中硫酸镍、次磷酸钠、柠檬酸钠、硫酸铜、稳定剂、光亮剂的含量以及pH值和温度等因素对合金镀层的外观、沉积速度及铜含量的影响。通过5%氯化钠溶液和10%硫酸溶液浸泡试验比较了所得镍-铜-磷合金镀层与镍-磷合金镀层以及前人制得的镍-磷合金镀层的耐蚀性,同时比较了上述镀层的其它性能。结果表明,所得镍-铜-磷合金镀层的耐蚀性、外观、结合力、孔隙率、沉积速度、硬度和耐磨性等性能优于镍-磷合金及前人制得的镍-铜-磷合金镀层。 相似文献
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影响化学镀铜液稳定性和镀速的因素 总被引:5,自引:0,他引:5
研究了影响化学铜镀速和镀液稳定性的诸因素,并根据实验确定了适宜的化学镀铜液配方及其工艺。硫铜,甲醛,氢氧化钠含量的增加均会提高化学镀铜的镀速,降低镀液稳定性; 相似文献
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用次磷酸钠取代传统化学镀铜中的甲醛作为还原剂,研究了化学镀铜的基本工艺,揭示了络合剂(酒石酸钾钠)用量、次磷酸钠用量对铜沉积速度的影响。确定了最佳工艺条件为酒石酸钾钠质量浓度15 g/L,次磷酸钠质量浓度30 g/L,镀液的pH值为11左右,温度65℃。 相似文献