NH3-MBE生长极化场二维电子气材料

介绍了用ＮＨ３－ＭＢＥ技术在蓝宝石Ｃ面上外延的高质量的ＧａＮ单层膜以及ＧＮ／ＡｌＮ／ＧａＮ极化感应二维电子气材料。外延膜都是Ｎ面材料。形成的二维电子气是“倒置二维电子气”。ＧａＮ单层膜的室温电子迁移率为３００ｃｍ＾２／Ｖｓ。二维电子气材料的迁移率为６８０ｃｍ＾２／Ｖｓ（ＲＴ）和１７００ｃｍ＾２／Ｖｓ（７７Ｋ）,相应的二维电子气的面密度为３．２＊１０＾１３ｃｍ＾－２（ＲＴ）和２．６ｘ１０＾１３ｃｍ＾     

GaN的MOVPE生长和m－i－n型蓝光LED的试制

利用自行研制的常压ＭＯＶＰＥ设备和全部国产ＭＯ源，采用低温生长缓冲层技术，在蓝宝石（α－Ａｌ２Ｏ３）衬底上获得了高质量的ＧａＮ外延层。未掺杂的ＧａＮ外延层的室温电子迁移率已达１１４ｃｍ２／Ｖ．ｓ，载流于浓度为２×１０１８。７７Ｋ光致发光谱近带边发射峰波长为３６５ｎｍ，其线宽为４ＤｍｅＶ。Ｘ射线双晶衍射回摆曲线的线宽为３６０ａｒｃｓｅｃ。用Ｚｎ掺杂生长了绝缘的ｉ－ＧａＮ层。在此基础上研制了ｍ－ｉ－ｎ型ＧａＮ的ＬＥＤ，并在室温正向偏压下发出波长为４５５ｎｍ的蓝光。     

δ－掺杂GaAs／AlxGa_（1－x）As二维电子气结构材料的GSMBE生长与特性

本文用ＧＳＭＢＥ技术生长纯度ＧａＡｓ和δ－掺杂ＧａＡｓ／Ａｌ_ｘＧａ_（１－ｘ）Ａｓ结构二维电子气材料并对其电学性能进行了研究。对于纯度ＧａＡｓ的ＧＳＭＢＥ生长和研究，在低掺Ｓｉ时，载流子浓度为２×１０~（１４）ｃｍ~（－３），７７Ｋ时的迁移率可达８４，０００ｃｍ~２／Ｖ．ｓ。对于用ＧＳＭＢＥ技术生长的δ－掺杂ＧａＡｓ／Ａｌ_ｘＧａ_（１－ｘ）Ａｓ二维电子气材料，在优化了材料结构和生长工艺后，得到了液氮温度和６Ｋ迁移率分别为１７３，５８３ｃｍ~２／Ｖ．５和７．６７×１０~５ｃｍ~２／Ｖ．ｓ的高质量ＧａＡｓ／Ａｌ_ｘＧａ_（１－ｘ）Ａｓ二维电子气材料。     

GaN材料的GSMBE生长

在国内首次用ＮＨ３作氮源的ＧＳＭＢＥ方法在α－Ａｌ２Ｏ３衬底上生长出了ＧａＮ单昌外延膜。ＧａＮ生长速率可达０．５μｍ／ｈ。ＧａＮ外延膜的（０００２）双晶Ｘ射线衍射峰回摆曲线的半高宽最窄为８ａｒｃｍｉｎ。霍尔迁移率为５０ｃｍ＾２／Ｖ．ｓ。对质量好的ＧａＮ膜，室温阴性发光谱上只有一个强而锐的近岸边发光峰，谱峰位于３７２ｎｍ处，谱峰半高宽为１４ｎｍ（１２５ｍｅＶ）。     

调制掺杂AlxGa1-xN/GaN异质结磁输运研究

通过低温和高磁场下的磁输运测量,首次在Ａｌ０．２２Ｇａ０．７８Ｎ／ＧａＮ异质结中观察到了舒勃尼科夫－德哈斯振荡的双周期特性,发现在Ａｌ０．２２Ｇａ０．７８Ｎ／ＧａＮ异质结的三角势阱中产生了二维电子气（２ＤＥＧ）的第二子带占据,发生第二子带占据的阈值２ＤＥＧ浓度估算为７．２＊１０＾１２ｃｍ＾－２,在阈值２ＤＥＧ浓度下第一子带和第二子带能级的距离计算为７５ｍｅＶ。     

量子点激光器及其应用研究

报道了分子束外延生长出自组装垂直耦合ＩｎＡｓ／ＧａＡｓ大功率量子点激光器材料和器件。对腔长为８００μｍ,室温下和７７Ｋ下边续激射阈值电流密度分别为２１８Ａ／Ｃｃｍ＾２和４９Ａ／ｃｍ＾２,波长为９６０ｎｍ,最大输出功率大于１Ｗ。首次报道在０．５４Ｗ工作下,寿命超过３０００小时,功率仅下降０．４９display status０     

调制掺杂AlxGa1-xN/GaN异质结中二维电子气的光致发光

研究了调制掺杂ＡｌｘＧａ１－ｘＮ／ＧａＮ异质结中与二维电子气（２ＤＥＧ）有关的光致发光,发现温度４０Ｋ时Ａｌ０．２２Ｇａ０．７８Ｎ／ＧａＮ异质结中２ＤＥＧ与光激发空穴复合形成的发光峰位于３．４４８ｅＶ,低于ＧａＮ自由激子峰４５ｍｅＶ。由于ＡｌｘＧａ１－ｘＮ／ＧａＮ界面极强的压电极化场的影响,光激发空穴很快扩散进ＧａＮ平带区,导致２ＤＥＧ与光激发空穴复合几率很低,在ＧａＮ中接近Ａｌ０．２２Ｇａ０．７     

国产金属有机化合物TMGa,TMAl,TMIn和TMSb的MOVPE鉴定

利用我们研制的常压ＭＯＶＰＥ设备对国产ＴＭＧａ、ＴＭＡｌ、ＴＭＩｎ和ＴＭＳｂ进行了鉴定，为此分别生长了ＧａＡｓ、ＡｌＧａＡｓ、ＩｎＰ、ＧａＳｂ外延层和ＧａＡｓ／ＡｌＡｓ、ＧａＳｂ／ＩｎＧａＳｂ超晶格和ＧａＡｓ／ＡｌＧａＡｓ量子阱结构。表征材料纯度的７７Ｋ载流予迁移率分别达到ＧａＡｓ：μ＿ｎ＝５６６００ｃｍ￣２／Ｖ·ｓ，Ａｌ＿（０．２５）Ｇａ＿（０．７５）Ａｓ：μ＿ｎ＝５１６０ｃｍ￣２／Ｖ·ｓ，ＩｎＰ：μ＿ｎ＝６５３００ｃｍ￣２／Ｖ·ｓ，ＧａＳｂ：μ＿ｐ＝５０７６ｃｍ￣２／Ｖ·ｓ。由１０个周期的ＧａＡｓ／ＡｌＡｓ超晶格结构组成的可见光区布拉格反射器已观测到很好的反射光谱和双晶Ｘ射线回摆曲线上高达±２０级的卫星峰。ＧａＡｓ／Ａｌ＿（０．３５）Ｇａ＿（０．６５）Ａｓ量子阱最小阱宽为１０，在ｌｉＫ下由量子尺寸效应导致的光致发光峰能量移动为３９０ｍｅＶ，其线宽为１２ｍｅＶ。这些结果表明上述金属有机化合物已达到较高质量。     

n型GaSb,InGaAsSb的MBE生长和特性研究

本文报导了非故意掺杂ＩｎＧａＡｓＳｂ本底浓度的降低和掺Ｔｅｎ型ＧａＳｂ和ＩｎＧａＡｓＳｂ的ＭＢＥ生长与特性的研究结果。结果表明，通过生长工艺的优化，ＧａＳｂ和ＩｎＧａＡｓＳｂ的背景空穴浓度可分别降至１．１×１０~（１６）ｃｍ~（－３）和４×１０~（１６）ｃｍ~（－３），室温空穴迁移率分别为９４０ｃｍ２／ｖ．ｓ和２６０ｃｍ~２／ｖ．ｓ。用Ｔｅ作ｎ型掺杂剂，可获得载流子浓度在１０~（１６）～１０~（１８）ｃｍ~（－３）的优质ＧａＳｂ和ＩｎＧａＡｓＳｂ外延层，所研制的材料已成功地制备出Ｄ_λ~＊＝４×１０~（１０）ｃｍＨｚ~（１／２）／Ｗ的室温ＩｎＧａＡｓＳｂ红外探测器和室温脉冲ＡｌＧａＡｓＳｂ／ＩｎＧａＡｓＳｂ双异质结激光器。     

AlGaN／GaN异质结2DEG载流子输运

本言语采用雷－丁平衡方程理论,考虑杂质散射、声学波形变势散射、声学波压电散射、极化光学波散射等散射机制,计算了ＡｌＧａＮ／ＧａＮ异质结二维电子气（２ＤＥＧ）在０－３００Ｋ温度范围内的低场迁率以及电子漂移速度和电子温度随外加电场的变化关系,同时本文计算了有隔离层的调制掺杂异质结构（ＭＤＨ）中低温下（Ｔ＝４Ｋ）低场迁移率随隔离层厚度的变化关系。计算结果表明在低温下ＡｌＧａＮ／ＧａＮ异质结构的低场迁移率     

Dopant-free GaN/AlN/AlGaN radial nanowire heterostructures as high electron mobility transistors

We report the rational synthesis of dopant-free GaN/AlN/AlGaN radial nanowire heterostructures and their implementation as high electron mobility transistors (HEMTs). The radial nanowire heterostructures were prepared by sequential shell growth immediately following nanowire elongation using metal-organic chemical vapor deposition (MOCVD). Transmission electron microscopy (TEM) studies reveal that the GaN/AlN/AlGaN radial nanowire heterostructures are dislocation-free single crystals. In addition, the thicknesses and compositions of the individual AlN and AlGaN shells were unambiguously identified using cross-sectional high-angle annular darkfield scanning transmission electron microscopy (HAADF-STEM). Transport measurements carried out on GaN/AlN/AlGaN and GaN nanowires prepared using similar conditions demonstrate the existence of electron gas in the undoped GaN/AlN/AlGaN nanowire heterostructures and also yield an intrinsic electron mobility of 3100 cm(2)/Vs and 21,000 cm(2)/Vs at room temperature and 5 K, respectively, for the heterostructure. Field-effect transistors fabricated with ZrO(2) dielectrics and metal top gates showed excellent gate coupling with near ideal subthreshold slopes of 68 mV/dec, an on/off current ratio of 10(7), and scaled on-current and transconductance values of 500 mA/mm and 420 mS/mm. The ability to control synthetically the electronic properties of nanowires using band structure design in III-nitride radial nanowire heterostructures opens up new opportunities for nanoelectronics and provides a new platform to study the physics of low-dimensional electron gases.     

AlGaN/GaN-heterostructures on (111) 3C-SiC/Si pseudo substrates for high frequency applications

We present the realization of high electron mobility transistors (HEMTs) based on AlGaN/GaN heterostructures, which were grown on silicon substrates using an ultrathin SiC transition layer. The growth of AlGaN/GaN heterostructures on 3C-SiC(111)/Si(111) was performed using metalorganic chemical vapour deposition (MOCVD). The 3C-SiC(111) transition layer was realized by low pressure CVD and prevented Ga-induced meltback etching and Si-outdiffusion in the subsequent MOCVD growth. The two-dimensional electron gas (2DEG) formed at the AlGaN/GaN interface showed an electron sheet density of 1.5 × 10¹³ cm^− 3 and a mobility of 870 cm²/Vs. The HEMTs DC and RF characteristics were analysed and showed a peak cut-off frequency as high as 29 GHz for a 250 nm gate length.     

Multilayer AlN/AlGaN/GaN/AlGaN heterostructures for high-power field-effect transistors grown by ammonia MBE

The results of the optimization of the ammonia MBE technology of AlN/AlGaN/GaN/AlGaN heterostructures for high-power microwave field-effect transistors (FETs) are presented. The creation of technological systems of the EPN type for the deposition of group III nitrides by ammonia MBE, in combination with the development of optimum growth and postgrowth processes, make it possible to obtain AlN/AlGaN/GaN/AlGaN based heterostructures for high-power microwave FETs with the output static characteristics on the world best level. One of the main fields of application of the semiconductor heterostructures based on group III nitrides is the technology of high electron mobility transistors (HEMTs). Most investigations in this field have been devoted to the classical GaN/AlGaN structures with a single heterojunction. An alternative approach based on the use of double heterostructures with improved two-dimensional electron gas (2DEG) confinement offers a number of advantages, but such structures are usually characterized by a lower carrier mobility as compared to that in the single-junction structures. We succeeded in optimizing the double heterostructure parameters and growth conditions so as to obtain conducting channels with a 2DEG carrier mobility of 1450, 1350, and 1000 cm²/(V s) and a sheet electron density of 1.3 × 10¹³, 1.6 × 10¹³, and 2.0 × 10¹³ cm^?2, respectively. Experimental HEMTs with 1-μm-long gates based on the obtained multilayer heterostructure with a doped upper barrier layer exhibit stable current-voltage characteristics with maximum saturation current densities of about 1 A/mm and a transconductance of up to 180 mS/mm.     

Thermionic emission from the 2DEG assisted by image-charge-induced barrier lowering in AlInN/AlN/GaN heterostructures

The effect of image charges on current transport mechanisms investigated at the nanoscale in Al(1-x)In(x)N/GaN heterostructures was studied. Current-voltage (I-V) measurements were performed locally using a conductive AFM-tip as a nanoprobe and the conduction mechanism was modeled to explain the observed behavior. This model suggests that current transport is controlled by thermionic emission (TE) of the two-dimensional electron gas (2DEG) across the potential barrier at the heterointerface, where the image charges generated by the 2DEG induce a barrier lowering at the Al(1-x)In(x)N/GaN interface, enhancing electron transport. This barrier lowering depends on the 2DEG characteristics, such as 2DEG density n(2D), first subband energy E? and the average distance x? of the 2DEG from the interface. By fitting the experimental I-V curves with the present model the 2DEG density was evaluated. The obtained results were in very good agreement with the Hall measurements.     

The control of two-dimensional-electron-gas density and mobility in AlGaN/GaN heterostructures with Schottky gate

The effects of Schottky gate on behavior of two-dimensional electron gas (2DEG) density and two-dimensional electron mobility (2DEM) in AlGaN/GaN heterostructures with different Al mole fraction in AlGaN barrier and its different thickness have been studied. The sheet carrier concentration, NS, was determined self-consistently from the coupled Schrödinger and Poisson equations, by assuming a real model for heterostructures and by using Numerov's method.The most dominant scattering mechanisms have been considered to calculate 2DEM with using more accurate numerical calculation and considering all intra-subband, inter-sub-band scattering.The results of our analysis clearly indicate that increasing the gate voltage leads to an increase in the 2DEG density and 2DEM. Also it shows that increasing the gate voltage for higher positive voltage; decrease the 2DE Mobility where the 2DEG density is saturated. These behaviors depend on barrier thickness and Al mole fraction.     

Influence of thermal treatment on the formation of ohmic contacts based on Ti/Al/Ni/Au metallization to n-type AlGaN/GaN heterostructures

Interfacial reactions between Ti/Al/Ni/Au metallization and GaN(cap)/AlGaN/GaN heterostructures at various annealing temperatures ranging from 715 to 865 °C were studied. Electrical current-voltage (I?CV) characteristics, van der Pauw Hall mobility measurements and surface topography measurement with atomic force microscopy (AFM) were performed. The ohmic metallizations were annealed at various temperatures in a rapid thermal annealing system and the annealing time of 60 seconds was kept for all samples. To study the influence of the parameters of annealing process on the properties of the 2 dimensional electron gas (2DEG) the van der Pauw Hall mobility measurement was used. Interfacial reactions between the contact metals and heterostructures were analyzed through depth profiles of secondary ion mass spectroscopy. It was observed that transition from nonlinear to linear I-V behavior occurred after the annealing at 805 °C. For the studied samples, the most promising results were obtained for the annealing temperature of 805 °C. This temperatue ensured not only low contact resistance but also made possible to preserve the 2DEG.     

Multilayer AIN/AlGaN/GaN/AlGaN heterostructures with quantum wells for high-power field-effect transistors grown by ammonia MBE

High-power field-effect transistors (FETs) are among the main applications of heterostructures based on group III metal nitrides, which in most cases implement the classical GaN/AlGaN structure with a single junction. An alternative approach based on the use of double heterostructures with imporved two-dimensional electron gas (2DEG) confinement offers a number of advantages, but such structures are usually characterized by a lower carrier mobility and density (in GaN layers of reduced thickness) as compared to the values in the single-junction structures. Optimization of the heterostructure design and ammonia MBE growth conditions allowed us to obtain multilayer AlN/AlGaN/GaN/AlGaN heterostructures with quantum wells, which are characterized by a 2DEG carrier mobility of 1100–1300 cm²/(V s) and a sheet electron density of (1.1–1.3) × 10¹³ cm^-2. Experimental FETs based on the obtained multilayer heterostructures in a static regime exhibit working current densities up to 0.6 A/mm at a transconductance of up to 150 mS/mm and a breakdown voltage above 100 V.     

Employing Al buffer layer with Al droplets-distributed surface to obtain high-quality and stress-free GaN epitaxial films on Si substrates

Al buffer layers with Al droplets-distributed surface have been employed to grow high-quality and stress-free GaN epitaxial films on Si substrates. The Al droplets are proved to efficiently improve the quality of as-grown GaN. On the one hand, they can act as nucleation seeds to facilitate the epitaxial growth, improving the crystalline quality and surface morphology of as-grown GaN epitaxial films. On the other hand, they also can compensate the huge compressive stress produced by Al buffer layer during the cooling process, achieving stress-free film. The density and volume of Al droplets greatly impact the properties of as-grown GaN epitaxial films. The GaN epitaxial film grown on the Al buffer layer with many small Al droplets uniformly distributed on it shows the best crystalline quality with the full-width at half maximum (FWHM) of GaN(0002) and GaN(10–12) as 0.5° and 0.7°, respectively, and flat surface with the smallest surface root-mean-square roughness of 3.8 nm. In addition, it also exhibits relatively better photoelectric properties with an FWHM of near band gap emission peak of 18 nm, carrier concentration of 2.0 × 10¹⁷ cm^?3, and mobility of 137.1 cm²/Vs. This work has revealed the advantages of Al buffer layer and the important effects of buffer layer surface on achieving high-quality GaN by PLD, which is of significance for various applications of GaN-based devices.