Stability and high-frequency operation of amorphous In-Ga-Zn-O thin-film transistors with various passivation layers

The stability of amorphous In-Ga-Zn-O (a-IGZO) thin-film transistors (TFTs) was investigated focusing on the effects of passivation layer materials (Y₂O₃, Al₂O₃, HfO₂, and SiO₂) and thermal annealing. Positive bias constant current stress (CCS), negative bias stress without light illumination (NBS), and negative bias light illumination stress (NBLS) were examined. It was found that Y₂O₃ was the best passivation layer material in this study in terms of all the stability tests if the channel was annealed prior to the passivation formation (post-deposition annealing) and the passivation layer was annealed at ≥ 250 °C (post-fabrication annealing). Post-fabrication thermal annealing of the Y₂O₃ passivation layer produced very stable TFTs against the CCS and NBS stresses and eliminated subgap photoresponse up to the photon energy of 2.9 eV. Even for NBLS with 2.7 eV photons, the threshold voltage shift is suppressed well to − 4.4 V after 3 h of test. These results provide the following information; (i) passivation removes the surface deep subgap defects in a-IGZO and eliminates the subgap photoresponse, but (ii) the bulk defects in a-IGZO should be removed prior to the passivation process. The Y₂O₃-passivated TFT is not only stable for these stress conditions, but is also compatible with high-frequency operation with the current gain cut-off frequency of 91 kHz, which is consistent with the static characteristics.     

Paraffin wax passivation layer improvements in electrical characteristics of bottom gate amorphous indium–gallium–zinc oxide thin-film transistors

In this research, paraffin wax is employed as the passivation layer of the bottom gate amorphous indium–gallium–zinc oxide thin-film transistors (a-IGZO TFTs), and it is formed by sol–gel process in the atmosphere. The high yield and low cost passivation layer of sol–gel process technology has attracted much attention for current flat-panel-display manufacturing. Comparing with passivation-free a-IGZO TFTs, passivated devices exhibit a superior stability against positive gate bias stress in different ambient gas, demonstrating that paraffin wax shows gas-resisting characteristics for a-IGZO TFTs application. Furthermore, light-induced stretch-out phenomenon for paraffin wax passivated device is suppressed. This superior stability of the passivated device was attributed to the reduced total density of states (DOS) including the interfacial and semiconductor bulk trap densities.     

Effect of hafnium addition on the electrical properties of indium zinc oxide thin film transistors

This study reports the performance and stability of hafnium-indium zinc oxide (HfInZnO) thin film transistors (TFTs) with thermally grown SiO2. The HfInZnO channel layer was deposited at room temperature by a co-sputtering system. We examined the effects of hafnium addition on the X-ray photoelectron spectroscopy properties and on the electrical characteristics of the TFTs varying the concentration of the added hafnium. We found that the transistor on-off currents were greatly influenced by the composition of hafnium addition, which suppressed the formation of oxygen vacancies. The field-effect mobility of optimized HfInZnO TFT was 1.34 cm² V⁻¹ s⁻¹, along with an on-off current ratio of 10⁸ and a threshold voltage of 4.54 V. We also investigated the effects of bias stress on HfInZnO TFTs with passivated and non-passivated layers. The threshold voltage change in the passivated device after positive gate bias stress was lower than that in the non-passivated device. This result indicates that HfInZnO TFTs are sensitive to the ambient conditions of the back surface.     

Localization effect of a current-path in amorphous In-Ga-Zn-O thin film transistors with a highly doped buried-layer

The highly-doped buried layer (carrier concentration of ~ 10¹⁹ cm^− 3) in an amorphous indium-gallium-zinc oxide (a-IGZO) channel layer of thin film transistor (TFT) led to dramatic improvements in the performance and prolonged bias-stability without any high temperature treatment. These improvements are associated with the enhancement in density-of-states and carrier transport. The channel layer is composed of Ga-doped ZnO (GZO) and a-IGZO layers. Measurements performed on GZO-buried a-IGZO (GB-IGZO) TFTs indicate enhanced n-channel active layer characteristics, such as V_th, μ_FE, I_off, I_on/off ratio and S.S, which were enhanced to 1.2 V, 10.04 cm²/V·s, ~ 10⁻¹³A, ~ 10⁷ and 0.93 V/decade, respectively. From the result of simulation, a current path was well defined through the surface of oxide active layer especially in GB-IGZO TFT case because the highly-doped buried layer plays the critical role of supplying sufficient negative charge density to compensate the amount of positive charge induced by the increasing gate voltage. The mechanism underlying the high performance and good stability is found to be the localization effect of a current path due to a highly-doped buried layer, which also effectively screens the oxide bulk and/or back interface trap-induced bias temperature instability.     

Effect of reactive sputtered SiOx passivation layer on the stability of InGaZnO thin film transistors

We fabricated the indium-gallium-zinc oxide (IGZO) thin film transistor (TFT) with reactive sputtered SiO_x as passivation layer, and investigated the role of the SiO_x passivation layer in the IGZO-TFT under gate bias stress. The bias stability of IGZO-TFT with passivation layer is much better than that of IGZO-TFT without passivation layer. After applying positive bias stress of 20 V for 10000s, the device without passivation layer shows a larger positive V_th shift of 7.3 V. However, the device with passivation layer exhibits a much smaller V_th shift of 1.3 V. It suggests that V_th instability is attributed to the interaction between the exposed IGZO back surface and oxygen in ambient atmosphere during the positive gate voltage stress. The results indicate that reactive sputtered SiO_x passivation layer can effectively improve the bias stability of IGZO-TFT.     

Present status of amorphous In–Ga–Zn–O thin-film transistors

Abstract

The present status and recent research results on amorphous oxide semiconductors (AOSs) and their thin-film transistors (TFTs) are reviewed. AOSs represented by amorphous In–Ga–Zn–O (a-IGZO) are expected to be the channel material of TFTs in next-generation flat-panel displays because a-IGZO TFTs satisfy almost all the requirements for organic light-emitting-diode displays, large and fast liquid crystal and three-dimensional (3D) displays, which cannot be satisfied using conventional silicon and organic TFTs. The major insights of this review are summarized as follows. (i) Most device issues, such as uniformity, long-term stability against bias stress and TFT performance, are solved for a-IGZO TFTs. (ii) A sixth-generation (6G) process is demonstrated for 32″ and 37″ displays. (iii) An 8G sputtering apparatus and a sputtering target have been developed. (iv) The important effect of deep subgap states on illumination instability is revealed. (v) Illumination instability under negative bias has been intensively studied, and some mechanisms are proposed. (vi) Degradation mechanisms are classified into back-channel effects, the creation of traps at an interface and in the gate insulator, and the creation of donor states in annealed a-IGZO TFTs by the Joule heating; the creation of bulk defects should also be considered in the case of unannealed a-IGZO TFTs. (vii) Dense passivation layers improve the stability and photoresponse and are necessary for practical applications. (viii) Sufficient knowledge of electronic structures and electron transport in a-IGZO has been accumulated to construct device simulation models.     

Influence of process steps on the performance of microcrystalline silicon thin film transistors

Bottom gate microcrystalline silicon thin film transistors (μc-Si TFT) have been realized with two types of films: μc-Si(1) and μc-Si(2) with crystalline fraction of 80% and close to 100% respectively. On these TFTs we applied two types of passivation (SiN_x and resist). μc-Si TFTs with resist as a passivation layer present a low leakage current of about 2.10^− 12 A for V_G = − 10 and V_D = 0.1V an ON to OFF current ratio of 10⁶, a threshold voltage of 7 V, a linear mobility of 0.1 cm²/V s, and a sub-threshold voltage of 0.9 V/dec. Microcrystalline silicon TFTs with SiN_x as a passivation present a new phenomenon: a parasitic current for negative gate voltage (− 15 V) causes a bump and changes the shape of the sub-threshold region. This excess current can be explained by and oxygen contamination at the back interface.     

Role of environmental and annealing conditions on the passivation-free in-Ga–Zn–O TFT

We examined the characteristics of passivation-free amorphous In–Ga–Zn–O thin film transistor (a-IGZO TFT) devices under different thermal annealing atmospheres. With annealing at higher temperature, the device performed better at the above-threshold operation region, which indicated the film quality was improved with the decrease of defects in the a-IGZO active region. The mobility, threshold voltage and subthreshold swing of a-IGZO TFT annealed at 450 °C was 7.53 cm²/V s, 0.71 V and 0.18 V/decade, respectively. It was also observed that the a-IGZO was conductive after thermal annealing in the vacuum, due to the ease of oxygen out-diffusion from the a-IGZO back channel. The oxygen deficiency resultantly appeared, and provided leaky paths causing electrical unreliability when TFT was turned off. In contrast, the annealing atmosphere full of O₂ or N₂ would suppress the oxygen diffusion out of the a-IGZO back channel. The worst V_th degradation of a-IGZO TFT after positive gate bias stress and negative gate bias stress (NGBS) was about 2 V and ? 2 V, respectively. However, the V_th shift in the NGBS testing could be suppressed to ? 0.5 V in vacuum chamber. Material analysis methods including X-ray photoelectron spectroscopy and scanning electron microscopy were used to investigate the change of a-IGZO film after different thermal annealing treatments. The variation of O 1s spectra with different annealing atmospheres showed the consistence with our proposed models.     

Comprehensive studies on the stabilities of a-In-Ga-Zn-O based thin film transistor by constant current stress

Stability under constant current stress, along with hysteresis characteristics, was studied for a-In-Ga-Zn-O thin-film transistors (TFTs) in several atmospheres and at several temperatures. Unannealed TFTs showed rather large instability; i.e., large hysteresis in transfer curves (ΔV_G > 0.8 V) and large positive threshold voltage shift (ΔV_th > 10 V for 50 h tests at 5 µA) with deterioration of subthreshold voltage swing was observed. The instability for the unannealed TFT had a strong dependence on the stress atmosphere and the stress temperature, which suggests that trap states generated by the stress test is related to oxygen vacancy formed by breaking weak chemical bonds. Wet annealing improved stability; the hysteresis disappeared and the ΔV_th was reduced to < 2 V. The improvement is considered to be related to the reduction of weak chemical bonds by wet annealing with the strong oxidation power of water molecules.     

Transparent amorphous In-Ga-Zn-O thin film as function of various gas flows for TFT applications

The electrical and optical properties of amorphous indium gallium zinc oxide (a-IGZO) films, which can be used as a channel layer, deposited by radio frequency (rf) magnetron sputtering system at room temperature (RT), were investigated as function of various gas flows. The optical transmittance of films deposited under Ar, O₂ / Ar + O₂ and O₂ / Ar-4% H₂ + O₂ atmospheres in the visible wavelength was consistently above 90% at a wavelength of 550 nm at all gas flows, although the film deposited under Ar-4% H₂ atmosphere exhibited a transmittance of below 50%. The carrier concentration and mobility of the a-IGZO films fabricated under Ar and Ar-4% H₂ were observed slight decrease as a function of the flow, respectively. The thin film transistors (TFTs) with an a-IGZO channel deposited under Ar and Ar-4% H₂ atmosphere exhibited the following good characteristics: V_th of 0.34 V, µ_FE of 3.6 cm² V^− 1 s^− 1, on/off ratio of 10⁶, and S value of 0.04 V decade^− 1.     

Effects of low-temperature ozone annealing on operation characteristics of amorphous In-Ga-Zn-O thin-film transistors

Effects of low-temperature annealing were examined for amorphous In-Ga-Zn-O (a-IGZO) thin-film transistors (TFTs). In a previous study, we reported that O₂ annealing is effective to improve performances of a-IGZO TFTs when annealed at ≥ 300 °C, but causes large negative threshold voltage shift when annealed at ≤ 200 °C. Here, we examined effects of ozone (O₃) annealing on physical properties and TFT characteristics of a-IGZO in comparison with conventional O₂ annealing. We found little differences in chemical composition, band gap and photoemission spectra between the O₂ and the O₃ annealed films. On the other hand, free electron density was suppressed well by the O₃ annealing even at low temperatures ≤ 200 °C. Moreover, even at 150 °C, the TFTs characteristics were improved to the subthreshold voltage swing of 217 mV/decade, the saturation mobility of ~ 11.4 cm²(Vs)^− 1 and the threshold voltage of 0.1 V by the O₃ annealing. It was also found that the effects of the O₃ annealing is more effective for thicker channel TFTs, which would be due to stronger oxidation power and the larger diffusion constant of oxygen atoms produced from O₃ molecules than those of O₂. These results substantiate that the O₃ annealing is more effective to improve TFT characteristics in particular for low-temperature processes at ≤ 200 °C.     

Effect of gallium content on bias stress stability of solution-deposited Ga-Sn-Zn-O semiconductor transistors

We generated solution-processed thin film transistor (TFTs) using gallium tin zinc oxide (GTZO, Ga-Sn-Zn-O) layers as the channel that exhibit improved bias-stress stability during device operation under ambient conditions. The cause of the bias-stress stability was investigated through comparisons with zinc tin oxide (ZTO, Zn-Sn-O)-based TFTs, which suffer red from bias stress instability. Based on in-depth analysis of the electrical characteristics and chemical structure of both GTZO and ZTO layers, it was discovered that the GTZO layers had a significantly lower oxygen vacancy concentration than did the ZTO layer, which influenced the electrical performance of the GTZO transistors as well as their bias-stress stability. When 5 mol% gallium was added, a bias stress-stable transistor was obtained, exhibiting typical semiconductor behavior with a field-effect mobility of 1.2 cm² V^− 1 s^− 1, on/off ratio of 10⁶, off-current of 1 × 10^− 10 A, and threshold voltage of 19.6 V. Further doping of Ga deteriorated the device performance, which was found to be associated with decreased carrier concentration and segregation of an insulating secondary phase.     

The influence of fabrication process on top-gate thin-film transistors

Amorphous indium zinc oxide (a-IZO) thin-film transistors (TFTs) with bottom- and top-gate structures were fabricated at room temperature by direct current (DC) magnetron sputter in this research. High dielectric constant (κ) hafnium oxide (HfO₂) films and a-IZO were deposited for the gate insulator and the semiconducting channel under a mixture of ambient argon and oxygen gas, respectively. The bottom-gate TFTs showed good TFT characteristics, but the top-gate TFTs did not display the same characteristics as the bottom-gate TFTs despite undergoing the same process of sputtering with identical conditions. The electrical characteristics of the top-gate a-IZO TFTs exhibited strong relationships with sputtering power as gate dielectric layer deposition in this study. The ion bombardment and incorporation of sputtering ions damaged the interface between the active layer and the gate insulator in top-gate TFTs. Hence, the sputtering power was reduced to decrease damage while depositing HfO₂ films. When using 50 W DC magnetron sputtering, the top-gate a-IZO TFTs showed the following results: a saturation mobility of 5.62 cm²/V-s; an on/off current ratio of 1 × 10⁵; a sub-threshold swing (SS) of 0.64 V/decade; and a threshold voltage (V_th) of 2.86 V.     

High-performance amorphous indium-gallium-zinc oxide thin-film transistors with polymer gate dielectric

The fabrication of amorphous indium-gallium-zinc oxide (a-IGZO) thin-film transistors (TFTs) with a spin-coated polymer gate dielectric on a glass substrate is reported. The interface state density at the poly(4-vinylphenol)/a-IGZO interface is only around 4.05 × 10¹¹ cm^− 2. The TFTs' threshold voltage, subthreshold swing, on-off current ratio, and carrier mobility are 2.6 V, 1.3 V/decade, 1 × 10⁵, and 21.8 cm²/V s, respectively. These characteristics indicate that the TFTs are suitable for use as nonvolatile memory devices and in flexible electronic applications.     

Effect of oxygen partial pressure on electrical characteristics of amorphous indium gallium zinc oxide thin-film transistors fabricated by thermal annealing

We report the fabrication and electrical characteristics of high-performance amorphous indium gallium zinc oxide (a-IGZO) thin-film transistors (TFTs) with a polymer gate dielectric prepared by spin coating on a glass substrate at different oxygen partial pressure values. The transmittance of the deposited polymer film was greater than 90% at 600 nm a-IGZO thin films were deposited on glass substrates using RF magnetron sputtering at different oxygen partial pressure values. The a-IGZO TFTs were prepared by rapid thermal annealing at 350 °C for 10 min at a 0.2% oxygen partial pressure. It was observed that a-IGZO TFTs with an active channel layer exhibited enhanced mode operation, a threshold voltage of 1 V, an on-off current ratio of 10³, and a field-effect mobility of 18 cm²/Vs.     

Effect of oxygen partial pressure on electrical characteristics of amorphous indium gallium zinc oxide thin-film transistors fabricated by thermal annealing

We report the fabrication and electrical characteristics of high-performance amorphous indium gallium zinc oxide (a-IGZO) thin-film transistors (TFTs) with a polymer gate dielectric prepared by spin coating on a glass substrate at different oxygen partial pressure values. The transmittance of the deposited polymer film was greater than 90% at 600 nm a-IGZO thin films were deposited on glass substrates using RF magnetron sputtering at different oxygen partial pressure values. The a-IGZO TFTs were prepared by rapid thermal annealing at 350 °C for 10 min at a 0.2% oxygen partial pressure. It was observed that a-IGZO TFTs with an active channel layer exhibited enhanced mode operation, a threshold voltage of 1 V, an on-off current ratio of 10³, and a field-effect mobility of 18 cm²/Vs.     

Comparison of a-Si TFTs fabricated by Cat-CVD and PECVD methods

We investigate the characteristics of amorphous silicon thin film transistors (a-Si TFTs) fabricated by plasma-enhanced chemical vapor deposition (PECVD) and catalytic CVD (Cat-CVD), and their stability under bias and temperature (BT) accelerated stress. The Cat-CVD a-Si TFTs have off-leak current as small as 10^− 14 A, and a smaller threshold voltage shift under the BT stress. The superiority in off-leak current and stability is observed in the Cat-CVD a-Si TFTs fabricated at both 320 °C and 180 °C. The high performance and stability of the Cat-CVD a-Si TFTs will enable to use low-cost glass substrates and result in a cost reduction of TFT fabrication.     

Characteristics of a-IGZO/ITO hybrid layer deposited by magnetron sputtering

Transparent a-IGZO (In-Ga-Zn-O) films have been actively studied for use in the fabrication of high-quality TFTs. In this study, a-IGZO films and a-IGZO/ITO double layers were deposited by DC magnetron sputtering under various oxygen flow rates. The a-IGZO films showed an amorphous structure up to 500 degrees C. The deposition rate of these films decreased with an increase in the amount of oxygen gas. The amount of indium atoms in the film was confirmed to be 11.4% higher than the target. The resistivity of double layer follows the rules for parallel DC circuits The maximum Hall mobility of the a-IGZO/ITO double layers was found to be 37.42 cm2/V x N s. The electrical properties of the double layers were strongly dependent on their thickness ratio. The IGZO/ITO double layer was subjected to compressive stress, while the ITO/IGZO double layer was subjected to tensile stress. The bending tolerance was found to depend on the a-IGZO thickness.     

Wet etching rates of InGaZnO for the fabrication of transparent thin-film transistors on plastic substrates

The wet etch process for amorphous indium gallium zinc oxide (a-IGZO or a-InGaZnO) by using various etchants is reported. The etch rates of a-IGZO, compared to another indium-based oxides including indium gallium oxide (IGO), indium zinc oxide (IZO), and indium tin oxide (ITO), are measured by using acetic acid, citric acid, hydrochloric acid, perchloric acid, and aqua ammonia as etchants, respectively. In our experimental results, the etch rate of the transparent oxide semiconductor (TOS) films by using acid solutions ranked accordingly from high to low are IZO, IGZO, IGO and ITO. Comparatively, the etch rate of the TOS films by using alkaline ammonia solution ranked from high to low are IGZO, IZO, IGO and ITO, in that order.Using the proposed wet etching process with high etch selectivity, bottom-gate-type thin-film transistors (TFTs) based on a-IGZO channels and Y₂O₃ gate-insulators were fabricated by radio-frequency sputtering on plastic substrates. The wet etch processed TFT with 30 µm gate length and 120 µm gate width exhibits a saturation mobility of 46.25 cm² V^− 1 s^− 1, a threshold voltage of 1.3 V, a drain current on-off ratio > 10⁶ , and subthreshold gate voltage swing of 0.29 V decade^− 1. The performance of the TFTs ensures the applicability of the wet etching process for IGZO to electronic devices on organic polymer substrates.     

Investigation on indium concentration dependence of solution processed indium tin oxide thin film transistors

The effect of the indium content in indium tin oxide (ITO) films fabricated using a solution-based process and ITO channel thin film transistors (TFTs) was examined as a function of the indium mole ratio. The carrier concentration and resistivity of the ITO films could be controlled by the appropriate treatments. The TFTs showed an increase in the off-current due to the enhanced conductivity of the ITO channel layer with increasing indium mole ratios, producing an increase in the field effect mobility. The characteristics of the a-ITO channel TFT showed the best performance (μ_FE of 3.0 cm² V^− 1 s^− 1, V_th of 2.0 V, and S value of 0.4 V/decade) at In:Sn = 5:1.