Fe and Ti implants in In0.52Al0.48As

Single (200 keV) and multiple energy Fe implants in n-type and Ti implants in p-type material were performed in In_0.52Al_0.48As at both room temperature and 200°C. For the Fe implants, the secondary ion mass spectrometry profiles showed a severe out-diffusion for all rapid thermal annealing schemes used, independent of the implantation temperature. The Fe implant peaks observed after annealing, at 0.8Rp, Rp+ΔRp and 2Rp (where Rp and ΔRp are range and straggle, respectively) depth locations in other In-based compounds like InP and InGaAs were not observed here. On the contrary, Ti implants showed only a slight in- and out-diffusion for both room temperature and 200°C implants as in the case of InP and InGaAs. The Rutherford backscattering measurements on the annealed samples implanted at 200°C showed a crystal quality similar to that of the virgin material. The resistivity of all the samples after annealing was higher than 10⁶ Ω-cm.     

Evidence from spectral emissometry for conduction intraband transitions in the intrinsic regime for silicon

From emissometry measurements in lightly doped Si at elevated temperatures, we have observed an anomalous absorption band in the wavelength range of 1–5 μm. The wavelength at which the band peaks, λ≈2.3 μm, shows a negligible dependence on temperature while the peak intensity increases with temperature presumably as a result of the increasing intrinsic carrier concentration. Spitzer and Fan reported a similar absorption band in direct absorption measurements at room temperature for n-type Si with extrinsic electron concentrations of 10¹⁴ to 10¹⁹cm⁻³. No such structure was found in extrinsic p-type Si. Spitzer and Fan were unable to identify the mechanism for this anomalous absorption. In both the experiments, this absorption of free electrons is due to intraband transitions in the conduction band from the Δ₁ conduction band edge across an energy gap of E ∼ 0.5 eV to a higher lying Δ₂′ conduction band.     

Electrical Activation Studies of Silicon-Implanted Al<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Ga<Subscript>1−<Emphasis Type="Italic">x</Emphasis></Subscript>N with Aluminum Mole Fraction of 11% to 51%

Electrical activation studies of Si-implanted Al _x Ga_1−x N with an Al mole fraction of 11% to 51% have been carried out as a function of ion dose and annealing temperature. The Al _x Ga_1−x N samples were implanted at room temperature with Si ions at 200 keV in doses ranging from 1 × 10¹⁴ cm⁻² to 1 × 10¹⁵ cm⁻², and subsequently annealed from 1100°C to 1350°C for 20 min in a nitrogen environment. The maximum electrical activation efficiencies for the Al _x Ga_1−x N samples with an Al mole fraction less than 40% were obtained for samples implanted with the highest Si dose of 1 × 10¹⁵ cm⁻². On the other hand, for the Al _x Ga_1−x N samples with an Al mole fraction more than 40%, nearly perfect activation efficiencies of 99% and 100% were obtained for the samples implanted with the lowest Si dose of 1 × 10¹⁴ cm⁻². The mobility of the Si-implanted Al _x Ga_1−x N samples increased with increasing annealing temperature in spite of the increased number of ionized donors and thus increased impurity scattering, indicating that a greater amount of lattice damage is being repaired with each successive increase in annealing temperature. These results provide suitable annealing conditions for Si-implanted Al _x Ga_1−x N-based devices with an Al mole fraction from 11% to 51%.     

Overview of fatigue performance of Cu processed by severe plastic deformation

This study investigates discrepancies regarding cyclic softening of Cu processed by severe plastic deformation (SPD). All samples softened if the microhardnesses before and after fatiguing are compared. However, the effect decreases if the strain amplitude is small, Δε_p <1 × 10⁻³). Samples with equiaxed subgrains were more resistant to softening and thermal recovery. All samples had “persistent” shear bands except those tested at the highest amplitudes, Δε_p >1 × 10⁻². Cu processed by SPD exhibits an enhanced fatigue life at low amplitudes. However, low thermal stability, potential for softening, and poor low-cycle properties discredit this advantage.     

Al+ and B+ implantations into 6H-SiC epilayers and application to pn junction diodes

Aluminum (Al) and boron (B) ion implantations at room temperature into n-type 6H-SiC epilayers have been investigated. Rutherford backscattering spectroscopy (RBS) channeling measurements revealed larger lattice damage in Al⁺ implantation at a given total implantation dose. A nearly perfect electrical activation ratio (>90%) could be attained by high-temperature annealing at 1600°C for Al⁺ and 1700°C for B⁺ implantations. Mesa pn junction diodes formed by either Al⁺ or B⁺ implantation with a 1×10¹⁴ cm⁻² dose exhibited high blocking voltages of 950∼1070 V, which are 80∼90% of the ideal value predicted for the diode structure. The forward current can clearly be divided into two components of diffusion and recombination currents. B⁺-implanted diodes showed higher breakdown voltage on average but poor forward conduction. Comparison of the performance of Al⁺ and B⁺-implanted diodes is discussed.     

Esr-spectrum of amorphous silicon

The ESR-linewidth of a-Si consists of a temperature-independent part ΔH_pp(O) and a temperature-dependent contribution 5Hpp(T), the latter being closely related to the hopping conductivity. δH_pp(O) is to a large part determined by a g-value spectrum as can be concluded from measurements at different magnetic fields H_o. Additionally in some cases exchange interaction is involved. Annealing of glow-discharge a-Si and the influence of hydrogen effusion on the ESR-spectrum is investigated. In the case of boron-doped a-Si a new line with g = 2.0038 can be resolved which is ascribed to a center with a dangling bond on a silicon atom with one Si-H bond.     

Capacitance-voltage profiling and thermal evolution of the conduction band-offset of unstrained Ga0.47In0.53As/InP single quantum well

We report the results of capacitance-voltage (C-V) and Deep Level Transient Spectroscopy (DLTS) measurements performed upon a Ga_0.47In_0.53As/InP quantum well structure. At room temperature, a conduction-band offset ΔE_c=(200±10)meV and charge densities σ_I=±(3±1)*10¹¹ times the electronic charge per cm² have been measured from C-V experiments. At lower temperature (T≤150K) we have observed an important decrease of the band-offset, considerably larger than a pure thermal effect. We have shown that the explanation lies in the presence of a high concentration of deep traps located at the well-barrier interfaces. Two species A and B have been detected through DLTS experiments with activation energies E_tA=90 meV and E_tB=195 meV, respectively. The filling of these trap levels at low temperature lowers the band offset from 200 to 120 meV, owing to band repulsion effects.     

High resistivity LT-In0.47Ga0.53P grown by gas source molecular beam epitaxy

Low-temperature (LT) growth of In_0.47Ga_0.53P was carried out in the temperature range from 200 to 260°C by gas source molecular beam epitaxy using solid Ga and In and precracked PH₃. The Hall measurements of the as-grown film showed a resistivity of ∼10⁶ Ω-cm at room temperature whereas the annealed film (at 600°C for 1 h) had at least three orders of magnitude higher resistivity. The Hall measurements, also, indicated activation energies of ∼0.5 and 0.8 eV for the asgrown and annealed samples, respectively. Double-crystal x-ray diffraction showed that the LT-InGaP films had ∼47% In composition. The angular separation, Δθ, between the GaAs substrate and the as-grown LT-InGaP film on (004) reflection was increased by 20 arc-s after annealing. In order to better understand the annealing effect, a LT-InGaP film was grown on an InGaP film grown at 480°C. While annealing did not have any effect on the HT-InGaP peak position, the LT-InGaP peak was shifted toward the HT-InGaP peak, indicating a decrease in the LT-InGaP lattice parameter. Cross-sectional transmission electron microscopy indicates the presence of phase separation in LT-InGaP films, manifested in the form of a “precipitate-like” microstructure. The analytical scanning transmission electron microscopy analysis of the LT-InGaP film revealed a group-V nonstoichiometric deviation of ∼0.5 at.% P. To our knowledge, this is the first report about the growth and characterization of LT-InGaP films.     

Influence of Surface Treatment and Annealing Temperature on the Formation of Low-Resistance Au/Ni Ohmic Contacts to <Emphasis Type="Italic">p</Emphasis>-GaN

We have studied the influence of surface treatment and annealing temperature on the specific contact resistance of Au/Ni ohmic contacts to p-GaN with hole concentrations in the range of 10¹⁶ cm⁻³ to 10¹⁸ cm⁻³. The sample with a hole concentration of 1 × 10¹⁸ cm⁻³, treated with the surface treatment HCl:H₂O = 3:1 solution and annealed at 500°C in a 90% N₂ and 10% O₂ atmosphere, yielded the lowest specific contact resistance of ~4 × 10⁻⁵ Ω cm² and ~2 × 10⁻⁷ Ω cm² at room temperature and at 150°C, respectively. To investigate the roles of interdiffusion between layer interfaces and the formation of NiO and nickel gallides, we examined the metallization stacks before and after annealing using high-resolution x-ray diffraction. We conclude that the nickel-gallide formation and the deterioration of the NiO layer are together responsible for the large deviation in contact resistances observed for samples annealed at various temperatures.     

Exfoliation and blistering of Cd<Subscript>0.96</Subscript>Zn<Subscript>0.04</Subscript>Te substrates by ion implantation

As part of a series of wafer bonding experiments, the exfoliation/blistering of ion-implanted Cd_0.96Zn_0.04Te substrates was investigated as a function of postimplantation annealing conditions. (211) Cd_0.96Zn_0.04Te samples were implanted either with hydrogen (5×10¹⁶ cm⁻²; 40–200 keV) or co-implanted with boron (1×10¹⁵ cm⁻²; 147 keV) and hydrogen (1–5×10¹⁶ cm⁻²; 40 keV) at intended implant temperatures of 253 K or 77 K. Silicon reference samples were simultaneously co-implanted. The change in the implant profile after annealing at low temperatures (<300°C) was monitored using high-resolution x-ray diffraction, atomic force microscopy (AFM), and optical microscopy. The samples implanted at the higher temperature did not show any evidence of blistering after annealing, although there was evidence of sample heating above 253 K during the implant. The samples implanted at 77 K blistered at temperatures ranging from 150°C to 300°C, depending on the hydrogen implant dose and the presence of the boron co-implant. The production of blisters under different implant and annealing conditions is consistent with nucleation of subsurface defects at lower temperature, followed by blistering/exfoliation at higher temperature. The surface roughness remained comparable to that of the as-implanted sample after the lower temperature anneal sequence, so this defect nucleation step is consistent with a wafer bond annealing step prior to exfoliation. Higher temperature anneals lead to exfoliation of all samples implanted at 77 K, although the blistering temperature (150–300°C) was a strong function of the implant conditions. The exfoliated layer thickness was 330 nm, in good agreement with the projected range. The “optimum” conditions based on our experimental data showed that implanting CdZnTe with H⁺ at 77 K and a dose of 5×10¹⁶/cm² is compatible with developing high interfacial energy at the bonded interface during a low-temperature (150°C) anneal followed by layer exfoliation at higher (300°C) temperature.     

Parabolic negative magnetoresistance in p-Ge/Ge1−x Six heterostructures

Quantum corrections for the conductivity due to the weak localization (WL) and the disorder-modified electron-electron interaction (EEI) are investigated for the high-mobility multilayer p-Ge/Ge_1−x Se_x heterostructures at T=(0.1–20) K in magnetic field B up to 1.5 T. Negative magnetoresistance with logarithmic dependence on T and linear in B ² is observed for B⩾0.1 T. Such a behavior is attributed to the connection between the classical cyclotron motion and the EEI effect. The Hartree part of the interaction constant is estimated (F _σ =0.44) and the WL and EEI contributions to the total quantum correction Δσ at B=0 are separated (Δσ _WL≈0.3Δσ; Δσ ^ee ≈0.7Δ σ). Fiz. Tekh. Poluprovodn. 33, 1073–1075 (September 1999) This article was published in English in the original Russian journal. Reproduced here with stylistic changes by the Translation Editor.     

Thermomigration of tellurium precipitates in CdZnTe crystals grown by vertical bridgman method

Te precipitates in CdZnTe have been characterized by x-ray diffraction at room and higher temperatures. From the x-ray results at room temperature, it has been confirmed that Te precipitates in CdZnTe have the same structural phase as observed in elemental Te under high pressure. The x-ray results at higher temperature indicate that Te precipitates melt around 440°C. CdZnTe samples containing Te precipitates have been annealed at temperatures below and above 440°C with thermal gradient of ∼70°C/cm. Results of the observation with infrared microscope before and after the annealings indicate distinct occurrence of thermomigration of Te precipitates in samples annealed at temperature above 440°C compared with ones annealed at temperature below 440°C. Thermomigration velocity obtained from these results is ∼50 μm/h. The average value for the effective diffusion coefficient of the metallic atoms in Te precipitates calculated by using the thermomigration velocity is ∼3 x 10⁻⁵ cm²/s.     

The influence of γ-ray radiation on electrical properties of CuGaSe<Subscript>2</Subscript>

The effect of γ-ray radiation on the conductivity of low-resistivity (10²2–10⁴ Ω cm) and high-resistivity (10⁵–10⁷ Ω cm) CuGaSe₂ single crystals has been studied in the temperature range 77–330 K. It is found that the resistivity of low-resistivity samples increases as the dose of γ-ray radiation is increased, while the resistivity of high-resistivity samples is practically independent of the radiation dose. It is assumed that a decrease in the conductivity of the low-resistivity samples occurs owing to scattering of free charge carriers at defects (charged centers) formed as a result of irradiation with γ-ray photons. It is found that the dose of the γ-ray irradiation does not affect the temperature dependence of resistivity in the low- and high-resistivity samples in the temperature range 77–300 K.     

Temperature-Dependent Studies of Si-Implanted Al<Subscript>0.33</Subscript>Ga<Subscript>0.67</Subscript>N with Different Annealing Temperatures and Times

Electrical activation studies were carried out on Si-implanted Al_0.33Ga_0.67N as a function of ion dose, annealing temperature, and annealing time. The samples were implanted at room temperature with Si ions at 200 keV in doses ranging from 1 × 10¹⁴ cm⁻² to 1 × 10¹⁵ cm⁻², and subsequently proximity-cap annealed from 1150°C to 1350°C for 20 min to 60 min in a nitrogen environment. One hundred percent electrical activation efficiency was obtained for Al_0.33Ga_0.67N samples implanted with a dose of 1 × 10¹⁵ cm⁻² after annealing at either 1200°C for 40 min or at 1300°C for 20 min. The samples implanted with doses of 1 × 10¹⁴ cm⁻² and 5 × 10¹⁴ cm⁻² exhibited significant activations of 74% and 90% after annealing for 20 min at 1300°C and 1350°C, respectively. The mobility increased as the annealing temperature increased from 1150°C to 1350°C, showing peak mobilities of 80 cm²/V s, 64 cm²/V s, and 61 cm²/V s for doses of 1 × 10¹⁴ cm⁻², 5 × 10¹⁴ cm⁻², and 1 × 10¹⁵ cm⁻², respectively. Temperature-dependent Hall-effect measurements showed that most of the implanted layers were degenerately doped. Cathodoluminescence measurements for all samples exhibited a sharp neutral donor-bound exciton peak at 4.08 eV, indicating excellent recovery of damage caused by ion implantation.     

Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy

Sn-3.5mass%Ag eutectic solder is selected as a candidate base alloy for replacing the eutectic Sn-Pb, and the effect of bismuth (2, 5, 10mass%) on the fatigue life of bulk Sn-3.5mass%Ag eutectic at room temperature has been studied over the total strain range from 0.3 to 3 percent in tension-tension mode. Fatigue life is defined as the number of cycles at which the load decreases to a half of the initial value. The fatigue life dramatically decreases with increasing contents of bismuth and adding this element over 2% makes fatigue life shorter than that of tin-lead eutectic alloy. Tensile strength of the alloy significantly increases with an increase in bismuth contents due to solid solution hardening (<5%Bi) or dispersion strengthning of fine bismuth particles, while ductility of this system dramatically decreases with increasing bismuth contents. Fatigue life of these alloys depends on ductility obtained by tensile test. The fatigue life of Bi containing Sn-3.5%Ag alloys can be described by, (Δε_p/2D)·N _f ^0.59 =0.66 where N_f is fatigue life defined by number of cycles to one-half load reduction, Δε_p is the plastic strain range for initial cycles, D is the ductility as measured by reduction in area.     

P-type doping of GaAs by carbon implantation

The electrical properties of C-implanted <100> GaAs have been studied following rapid thermal annealing at temperatures in the range from 750 to 950°C. This includes dopant profiling using differential Hall measurements. The maximum p-type activation efficiency was found to be a function of C-dose and annealing temperature, with the optimum annealing temperature varying from 900°C for C doses of 5 × 10¹³ cm⁻² to 800°C for doses ≥5 × 10¹⁴cm⁻². For low dose implants, the net p-type activation efficiency was as high as 75%; while for the highest dose implants, it dropped to as low as 0.5%. Moreover, for these high-dose samples, 5 × 10¹⁵ cm⁻², the activation efficiency was found to decrease with increasing annealing temperature, for temperatures above ∼800°C, and the net hole concentration fell below that of samples implanted to lower doses. This issue is discussed in terms of the amphoteric doping behavior of C in GaAs. Hole mobilities showed little dependence on annealing temperature but decreased with increasing implant dose, ranging from ∼100 cm²/V·s for low dose implants, to ∼65 cm²/V·s for high dose samples. These mobility values are the same or higher than those for Be-, Zn-, or Cd-implanted GaAs.     

Effects of Ca and Mn Additions on the Microstructure and Dielectric Properties of (Bi<Subscript>0.5</Subscript>Na<Subscript>0.5</Subscript>)TiO<Subscript>3</Subscript> Ceramics

Dielectric ceramics based on the solid solution (1 − x)Bi_0.5Na_0.5TiO₃ (BNT)-xCaTiO₃ (CT) were synthesized by the conventional solid-state route. BNT with various contents of CT formed a complete solid solution and exhibited a rhombohedral structure. CT in this solid solution with BNT was observed to decrease the dielectric constant at higher temperatures and raise the dielectric constant at lower temperatures. On the other hand, decreased ferroelectricity was observed with increasing CT concentration, resulting in a downward shift of the depolarization temperature and a decrease of the dissipation factor. With the addition of Mn²⁺ to 0.86BNT-0.14CT, the temperature characteristics of capacitance were improved (−55°C to 250°C, ΔC/C _25°C ≤ ±15%). By doping with 1.5 wt.% Mn²⁺, the dielectric constant at room temperature reached over 900, with a dielectric loss of less than 1%.     

High temperature stability of chromium boride ohmic contacts to p-type 6H-SiC

Ohmic contacts have been fabricated on p-type 6H-SiC using CrB₂. Two hundred nanometer thick films were sputter-deposited on substrates of doping concentration 1.3×10¹⁹ cm⁻³ in a system with a base pressure of 3×10⁻⁷ Torr. Specific contact resistances were measured using the linear transmission line method, and the physical properties of the contacts were examined using Rutherford backscattering spectrometry, x-ray photoelectron spectroscopy, and transmission electron microscopy. The as-deposited CrB₂ contacts exhibited rectifying characteristics and contained oxygen as a major contaminant. Ohmic behavior with linear current-voltage characteristics was observed following short anneals at 1100°C for 2 min at a pressure of 5×10⁻⁷ Torr. The oxygen in the CrB₂ films was removed by the annealing process, and the lowest value of the specific contact resistance (r_c) measured at room temperature was 8.2×10⁻⁵ Ω-cm². Longer anneals at 1100°C for 3.5 h and 1200°C for 2 h reduced the room temperature values of r to 1.4×10⁻⁵ Ω-cm². A thin reaction region has been identified at the CrB₂/SiC interface; however, the interface remains essentially stable. Thermal stressing at 300°C in vacuum for over 2200 h produced only a slight increase in the specific contact resistance. The low value of the specific contact resistance and the excellent high temperature stability of the CrB₂/SiC interface make this contact a candidate for high power/high temperature SiC device applications.     

Effect of a high-energy proton-irradiation dose on the electron mobility in <Emphasis Type="Italic">n</Emphasis>-Si crystals

n-Si single crystals produced by the floating zone method are studied. The concentration of electrons in the crystals is 6 × 10¹³ cm⁻³. The samples are irradiated with 25-MeV protons at 300 K. The irradiation dose is varied in the range (1.8–8.1) × 10¹² cm⁻². The measurements are carried out by means of the Hall technique in the range of temperatures T = 77−300 K. In samples irradiated with different proton doses, a sharp increase in the experimental effective Hall mobility μ_eff or a deep minimum in the dependence μ_eff(T) in the region of phonon scattering of electrons is observed immediately after irradiation or after aging of the samples, respectively. The observed effect is attributed to the formation of high-conductivity (metal-like) inclusions in the irradiated samples and to changes in the degree of screening of the inclusions by impurity-defect shells in relation to the irradiation dose, the time of natural aging, and the temperature of measurements. The impurity-defect shells are formed around metal-like inclusions during isochronal annealing or natural aging of the irradiated samples. It is suggested that metal-like inclusions formed in the n-Si crystals on irradiation with protons with the energy 25 MeV are atomic nanoclusters with an 80-nm radius.     

Nearly Perfect Electrical Activation Efficiencies from Silicon-Implanted Al<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Ga<Subscript>1−<Emphasis Type="Italic">x</Emphasis></Subscript>N with High Aluminum Mole Fraction

Electrical activation studies of Al _x Ga_1−x N (x = 0.45 and 0.51) implanted with Si for n-type conductivity have been made as a function of ion dose and anneal temperature. Silicon ions were implanted at 200 keV with doses ranging from 1 × 10¹⁴ cm⁻² to 1 × 10¹⁵ cm⁻² at room temperature. The samples were subsequently annealed from 1150°C to 1350°C for 20 min in a nitrogen environment. Nearly 100% electrical activation efficiency was successfully obtained for the Si-implanted Al_0.45Ga_0.55N samples after annealing at 1350°C for doses of 1 × 10¹⁴ cm⁻² and 5 × 10¹⁴ cm⁻² and at 1200°C for a dose of 1 × 10¹⁵ cm⁻², and for the Al_0.51Ga_0.49N implanted with silicon doses of 1 × 10¹⁴ cm⁻² and 5 × 10¹⁴ cm⁻² after annealing at 1300°C. The highest room-temperature mobility obtained was 61 cm²/V s and 55 cm²/V s for the low-dose implanted Al_0.45Ga_0.55N and Al_0.51Ga_0.49N, respectively, after annealing at 1350°C for 20 min. These results show unprecedented activation efficiencies for Al _x Ga_1−x N with high Al mole fractions and provide suitable annealing conditions for Al _x Ga_1−x N-based device applications.