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电镀镍—二硫化钼复合电催化电极的研究 总被引:1,自引:0,他引:1
本文报道了 MoS_2与 Ni 共同电沉积形成复合镀层及 Ni—MoS_2复合镀层对氢在碱溶液中电解析出影响研究,结果表明,在普通镀镍溶液中,MoS_2与Ni 共同沉积的机理是非静电的,Ni—MoS_2复合电极对氢在30%KOH 溶液中析出的催化活性比纯镍电极的高得多,而且其催化活性随复合电极中MoS_2含量的增加而提高。由于 MoS_2 微粒弥散在Ni 基质中,镀层表面结构的改变及两种催化剂的联合作用造成 Ni—MoS_2复合电极对氢析出反应比纯 Ni 有更高的催化活性。 相似文献
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Ni-ZrO2复合镀层的腐蚀摩擦学性能研究 总被引:3,自引:0,他引:3
用电镀方法制得Ni-ZrO2复合镀层,研究电镀Ni-ZrO2复合镀层的结构以及其硬度、耐磨性、抗腐蚀性与电镀电流密度的关系。结果表明:复合镀层的显微硬度比纯镍镀层硬度成倍提高,复合镀层耐磨性比镍镀层提高20%以上;抗腐蚀性提高70%以上。X射线衍射结果显示,复合镀层由Ni及非晶ZrO2组成。Ni相为面心立方晶体结构,晶格常数为0.353nm,小于纯镍镀层,晶粒尺寸为23.8nm,大于纯镍镀层。 相似文献
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利用电刷镀技术制得了含纳米颗粒的复合镀层。测试了它们的显微硬度和接触疲劳寿命,考察了载荷和退火处理(400℃保温30min)对镀层疲劳寿命的影响,并与镍镀层进行了对比。结果表明,在镀液中加入纳米颗粒显著提高了镀层的显微硬度。载荷为60N和140N时,n—Al2O3纳米颗粒的加入提高镀层的疲劳寿命,而n—ZrO2纳米颗粒降低镀层寿命。镀层寿命随载荷的增加而降低。载荷为140N时.退火后的n—Al2O3/Ni和n—ZrO2/Ni镀层寿命高于镍镀层,n—Al2O3/Ni镀层的疲劳寿命降低,而n—ZrO2/Ni镀层寿命大幅度提高。失效分析表明,疲劳裂纹在滚道表面和亚表层同时萌生,并沿镀层内部扩展;镍镀层的断口有明显塑性变形特征,n—ZrO2/Ni镀层呈脆性剥落,退火后其断口塑性变形特征明显。 相似文献
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在45#钢基体上制备了n-Al2O3/Ni和n-SiC–Al2O3/Ni复合刷镀层,采用能谱仪(EDS)、X射线衍射仪(XRD)、扫描电镜(SEM)和T-11球盘式磨损试验机等设备对比研究了2种复合刷镀层的组织及性能。EDS分析结果表明,n–Al2O3/Ni复合刷镀层中纳米颗粒特征元素Al的质量分数为5.65%,n-SiC–Al2O3/Ni复合刷镀层中纳米颗粒特征元素Al的质量分数为5.63%,Si元素的质量分数为4.86%。SEM分析结果表明,与n-Al2O3/Ni复合刷镀层相比,n-SiC–Al2O3/Ni复合刷镀层的表面更加平整,组织更加细化。n-SiC–Al2O3/Ni和n-Al2O3/Ni复合刷镀层的显微硬度分别为587HV和555HV,n-SiC–Al2O3/Ni复合刷镀层的耐磨性是n-Al2O3/Ni复合刷镀层的1.7倍。 相似文献
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复合电镀是制备复合材料的一种常用方法。可以采用电沉积(电镀、电刷镀)或化学沉积的方法获得复合镀层。主要从沉积微粒、基质金属等方面对近几年国内外在耐磨复合镀层方面取得的研究成果进行了概述,并对今后复合镀层的研究重点提出了展望。 相似文献
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复合镀层由于具有优异的耐磨性、耐蚀性、自润滑等性能而受到广泛关注.采用电沉积或化学镀可以获得复合镀层,复合电镀也是制备复合材料的一种重要方法.本文主要对近几年国内外在镍基自润滑复合镀层方面取得的研究成果进行了概述. 相似文献
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S. T. Aruna M. Muniprakash V. K. William Grips 《Journal of Applied Electrochemistry》2013,43(8):805-815
In this paper, the effect of titania particles preparation on the properties of Ni–TiO2 electrocomposite coatings has been addressed. Titania particles were prepared by precipitation method using titanium tetrachloride as the precursor. The titanyl hydroxide precipitate was subjected to two different calcinations temperatures (400 and 900 °C) to obtain anatase and rutile titania particles. These particles along with commercial anatase titania particles were separately dispersed in nickel sulfamate bath and electrodeposited under identical electroplating conditions to obtain composite coatings. The electrodeposited coatings were evaluated for their microhardness, wettability, corrosion resistance, and tribological behavior. The variation of microhardness with current density exhibited a similar trend for all the three composite coatings. The composite coating containing anatase titania particles exhibited higher microhardness and improved wear resistance. However, the corrosion resistance of the composite coating containing commercial titania powder was superior to that of plain nickel, Ni–TiO2 composite coatings containing anatase and rutile titania particles. The poor corrosion resistance of these composite coatings was attributed to the higher surface roughness of the coatings. This problem was alleviated by incorporating ball-milled titania powders. The composite coatings with higher surface roughness were modified with a low surface energy material like fluoroalkyl silane to impart hydrophobic and superhydrophobic properties to the coatings. Among these coatings, Ni–TiO2–9C coating exhibited the highest water contact angle of 157°. 相似文献
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介绍了一种高耐蚀性三价铬黑铬镀层电镀工艺,包括在金属基体(如钢铁和锌合金)上制备预镀铜层、中间镀铜层、光亮镀铜层、镀镍层、高耐蚀性三价铬白铬镀层和三价铬黑铬镀层。这种三价铬复合镀层可耐中性盐雾试验96 h(无白锈),比普通三价铬黑铬镀层长一倍。 相似文献
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《Journal of the European Ceramic Society》2000,20(10):1469-1473
The major difficulty in fabricating ceramic coatings on metal substrates using the electrophoretic deposition process (EPD) is problems caused by the volume shrinkage during the sintering of the green form ceramic coatings produced by EPD. Numerous cracks normally form in the EPD coating during sintering. In this work, we have developed the reaction bonding process to fabricate crack-free and dense ceramic coatings, where the volume shrinkage is compensated by the volume expansion due to the oxidation of aluminium in the green form coatings during sintering in air. Both EPD and electroplating were used here to produce green form coatings which contain aluminium particles and, in some cases, an intermediate nickel layer. During the subsequent heat treatment, melting and oxidation of the metals in the green form coating promote densification during sintering. By these means, relatively dense composite coatings have been fabricated on metal substrates. 相似文献
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电子封装中电镀技术的应用 总被引:10,自引:4,他引:6
功能性镀层和精密电镀技术在半导体微电子产业当中应用十分广泛,且随着半导体集成电路向高密度、轻小型化发展,各种新型功能性电镀技术将会不断涌现举出了功能镀层及精密镀层在电子封装中的应用实例简要介绍了BGA型封装中的电镀技术系统地介绍了电子封装中所涉及的各种电子电镀技术,并阐述了IC引线框架及无铅化电镀技术方面的应用情况、存在问题及今后的发展趋势。 相似文献