硅微机械加工技术

微机械的全称为微电子机械系统，是以微电子技术和微加工技术为基础的一项新技术。目前主要应用的是硅微加工方法。本书着重介绍了硅微加工技术中应用的各种方法，包括各向异性湿法化学腐蚀、硅片键合、表面微机械加工、硅的各向同性湿法化学腐蚀、微机械加工技术中干法等离子刻蚀技术、远程等离子腐蚀、高深宽比沟槽腐蚀、微型结构的铸模等内容。     

电子工艺

Y98-61442-421 9907388微电子机械系统最新技术水平综述=Microelec-tromechanical systems(MEMS):an overview of currentstateof-the-art[会,英]/Madni,A.M.& Wan,L.A.//1998 IEEE Aerospace Conference Proceedings,Vol.1 of 5.—421～427(PV)讨论了微型电子机械系统(MEMS)的应用和基础。详细介绍了4种主要的硅微机械加工技术:块微机械加工、表面微机械加工、圆片-圆片键合和高纵横尺寸比微机械加工。还讨论了微型电子机械石英速率传感器。这些技术已用于航空航天、军事、工业、医学、电信和汽车工业,以便以成本合算的方式实现小型化高度集成 MEMS。参13     

新型MEMS致冷器研究

微机电系统(MEMS)与超大规模集成电路(ULIC)进一步微型化与集成化,急需微型冷却系统对其芯片等进行局部冷却。因此,基于硅微机械加工工艺的微型致冷器被提上研究日程,并有望发展成为无压缩机、无机械部件、低功耗的新型致冷器。着重介绍了微型MEMS致冷器的国内外研究动向与发展趋势,阐述并分析了几种典型致冷材料与器件的工作原理、技术可行性及应用前景。     

微型MEMS致冷器的研究新动向

微机电系统(MEMS)与超大规模集成电路(ULIC)进一步微型化与集成化,急需微型冷却系统对其芯片等进行局部冷却。因此,基于硅微机械加工工艺的微型致冷器被提上研究日程,并有望发展成为无压缩机、无机械部件的新型致冷器。着重介绍了微型MEMS致冷器的国内外研究动向与发展趋势,阐述并分析了几种典型致冷材料与器件的工作原理、技术可行性及应用研究前景。     

磁致伸缩薄膜和微驱动器

本文主要介绍日本东北大学电气通信研究所的荒井贤一教授和本田等人开展磁致伸缩薄膜驱动器的研究工作.他们把半导体集成电路制造技术应用于微机械加工中,试制成磁致伸缩型微驱动器.随着半导体集成电路技术发展起来的半导体微机械技术,实现微机械加工技术的研究正在广泛开展,最近已报道了在硅基片上制作成功微小发动机和各种微型机构的消息,在半导体以外的领域中也出现了很多微     

微电子机械系统技术及其应用

微电子机械系统技术的特点是可使制品微型化、集成化并以硅作为加工材料。该技术可分为体微机械加工、表面微机械加工、金属微机械加工和复合微机械加工四类。所采用的基础技术主要有:腐蚀技术、硅键合技术、多层无应力薄膜沉积技术、牺牲层技术、LIGA技术以及以上技术的复合,该项技术应用广泛。本文重点介绍在微传感器、微电机、机械滤波器和谐振滤波器等方面的应用,并探讨了发展方向。     

微机械加工的动向

所谓微机械加工就是制作微机械或者微型装置的微细加工技术。要实现既小型又具有高功能的装置，虽然主要利用制造半导体集成电路的光刻技术，但也需要立体微细加工技术。在材料方面，主要使用能与电路融为一体的硅，也使用晶体之类的压电材料或者其它各种材料。     

硅传感器的发展趋势

本文把硅传感器的发展趋势归纳为三个发展方向:集成化、多功能化和多维化。提出了集成化的三种发展模式:高集成度、中等集成度和低集成度的集成传感器。本文还讨论了硅传感器发展中的两项关键技术:微机械加工技术和封装技术。     

硅基微机械加工技术

阐明了微机电系统（MEMS）的学科内涵,概述了体微机械加工技术、表面微机械加工技术和复合微机械加工技术的特点,运用具体实例对三种硅基微机械加工技术的基本制作工艺过程进行了讨论。     

硅微机械惯性传感器技术及其应用

本文简述了MEMS技术及微机械传感器的技术含义，着重对硅微机械惯性传感器原理及研制硅微机械惯性传感器的关键技术进行描述，为开展硅微机械惯性传感器研究及应用作技术准备及必要的思考。     

Laser ablation and micromachining with ultrashort laser pulses

The mechanisms of ultrashort-pulse laser ablation of materials are discussed, and the differences to that of long laser pulses are emphasized. Ultrashort laser pulses offer both high laser intensity and precise laser-induced breakdown threshold with reduced laser fluence. The ablation of materials with ultrashort pulses has a very limited heat-affected volume. The advantages of ultrashort laser pulses are applied in precision micromachining of various materials. Some femtosecond laser pulse micromachining results, including comparison with long pulses, are presented. Ultrashort-pulse laser micromachining may have a wide range of applications where micrometer and submicrometer feature sizes are required     

体微加工技术在MEMS中的应用

微机电系统(MEMS)技术的基础是由微电子加工技术发展起来的微结构加工技术，包括表面微加工技术和体微加工技术。其中体微加工技术是微传感器、微执行器制造中最重要的加工技术。该文主要介绍以加工金属、聚合物以及陶瓷为主的LIGA技术，先进硅刻蚀技术(ASE)和石英晶体深槽湿法刻蚀技术。最后给出用LIGA技术和牺牲层技术制作微加速度传感器的例子。     

微型压力传感器薄膜凹槽的制造技术

压力薄膜及凹槽是微型压力传感器中的关键部分,其制造方法主要有两种:1)对体硅进行选择性移除的体加工;2)对表面淀积的牺牲层进行选择性移除的表面加工.针对薄膜凹槽的制作,介绍了几种典型的体加工和表面加工技术,分析了其中的某些关键步骤及其优缺点,为薄膜凹槽的制作提供指导性意见.     

A new technology for micromachining of silicon: dopant selective HFanodic etching for the realization of low-doped monocrystalline siliconstructures

The sharp selectivity of HF anodic etching between p-Si and n-Si is used to realize monocrystalline silicon microstructures, in this case suspended beams, making use of masked implantation of phosphorous for the definition of the geometry. This technology offers opportunities in the field of micromachining of silicon for micromechanical applications. The technology is complementary to bulk micromachining (anisotropic KOH or EDP etching, or isotropic HF/HNO₃ etching) and surface micromachining with sacrificial-layer techniques     

Monolithic GaAs MESFET power sensor microsystem

The authors present the principle, technology and properties of a novel power sensor microsystem designed for very precise power measurement in a broad frequency range. Bulk micromachining technology on GaAs was implemented to obtain the desired parameters of the sensor     

A planar probe double ladder waveguide power divider

The successful demonstration of a 1:4 power divider using microstrip probes and a WR-430 rectangular waveguide is presented. The 15-dB return loss bandwidth of the nonoptimized structure is demonstrated to be 22% and its 0.5-dB insertion loss bandwidth 26%. While realized through conventional machining, such a structure is assembled in a fashion consistent with proven millimeter and submillimeter-wave micromachining techniques. Thus, the structure presents a potential power dividing and power combining architecture, which through micromachining, may be used for applications well above 100GHz.     

Ultraschall-Arrayantennen in Mikrotechnik

Two new ultrasound array antennas for medical applications are presented. These antennas are developed utilizing finite element simulations and they are manufactured by micromachining techniques. The first antenna is based on the piezoelectric transducer principle and can be simultaneously used for imaging and tumor therapy. The second antenna consists of electrostatic transducers, which are manufactured by surface micromachining and which allow an integration of the driver and receiver electronics.     

Status and trends of silicon RF technology

The current research and development activities in silicon radio-frequency (RF) technologies are first reviewed, accompanied by an illustration of the most pronounced shortcomings of conventional silicon technology in the integrability of RF functions at high GHz frequencies. In the discussion on active RF devices mainly CMOS is investigated due to great interest in this mass-production technology. Issues related to the integration of spiral inductors on silicon are addressed, stressing in particular the difficulty of RF substrate potential definition. Silicon micromachining techniques are highlighted as potential solutions to the integration of RF passives and to reduce substrate losses and cross-talk on silicon. It is explained that micromachining techniques are the best introduced to the silicon mainstream by using post-processing and minimum process complexity.     

准分子激光微加工技术结合模塑技术加工微流控芯片

利用准分子激光微加工技术与模塑技术相结合的方法制造微流控芯片。用准分子激光在玻璃基胶层上刻蚀出加工质量较高的微流控生物芯片形貌,通过电铸技术对微流控芯片进行复制,得到反向金属模具。用金属模具通过注塑成型技术用聚碳酸酯注塑出微流控芯片。系统研究了准分子激光的能量密度和工作台移动速度对胶层微通道加工质量的影响;测量并分析了激光刻蚀加工出的微流控芯片原型、电铸的反向金属模板和注塑成型后的微流控芯片的轮廓精度和表面粗糙度,上表面尺度偏差不大于2μm,底面粗糙度小于20 nm。对注塑出的微流控芯片和激光直写刻蚀的几何结构相同的微流控芯片的流动性能进行比较测试。在流速较小时,用激光微加工技术与模塑技术相结合的方法加工的微通道比准分子激光直写法所加工的微通道流动性能更好。     

Silicon micromechanics: sensors and actuators on a chip

The techniques used to fabricate micromechanical structures are described. Bulk micromachining is routinely used to fabricate microstructures with critical dimensions that are precisely determined by the crystal structure of the silicon wafer, by etch-stop layer thicknesses, or by the lithographic masking pattern. Silicon fusion bonding has been used to fabricate micro silicon pressure sensor chips. Surface micromachining, based on depositing and etching structural and sacrificial films, allows the designer to exploit the uniformity with which chemical vapor deposition (CVD) films coat irregular surfaces as well as the patterning fidelity of modern plasma etching processes. Silicon accelerometers, resonant microsensors, motors, and pumps made by these techniques are discussed. Measuring the mechanical properties of silicon, which are important to these applications, is examined