共查询到20条相似文献,搜索用时 109 毫秒
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《电子科技文摘》1999,(6)
Y98-61442-421 9907388微电子机械系统最新技术水平综述=Microelec-tromechanical systems(MEMS):an overview of currentstateof-the-art[会,英]/Madni,A.M.& Wan,L.A.//1998 IEEE Aerospace Conference Proceedings,Vol.1 of 5.—421~427(PV)讨论了微型电子机械系统(MEMS)的应用和基础。详细介绍了4种主要的硅微机械加工技术:块微机械加工、表面微机械加工、圆片-圆片键合和高纵横尺寸比微机械加工。还讨论了微型电子机械石英速率传感器。这些技术已用于航空航天、军事、工业、医学、电信和汽车工业,以便以成本合算的方式实现小型化高度集成 MEMS。参13 相似文献
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新型MEMS致冷器研究 总被引:1,自引:0,他引:1
刘少波 《电子工业专用设备》2004,33(1):21-25
微机电系统(MEMS)与超大规模集成电路(ULIC)进一步微型化与集成化,急需微型冷却系统对其芯片等进行局部冷却。因此,基于硅微机械加工工艺的微型致冷器被提上研究日程,并有望发展成为无压缩机、无机械部件、低功耗的新型致冷器。着重介绍了微型MEMS致冷器的国内外研究动向与发展趋势,阐述并分析了几种典型致冷材料与器件的工作原理、技术可行性及应用前景。 相似文献
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本文主要介绍日本东北大学电气通信研究所的荒井贤一教授和本田等人开展磁致伸缩薄膜驱动器的研究工作.他们把半导体集成电路制造技术应用于微机械加工中,试制成磁致伸缩型微驱动器.随着半导体集成电路技术发展起来的半导体微机械技术,实现微机械加工技术的研究正在广泛开展,最近已报道了在硅基片上制作成功微小发动机和各种微型机构的消息,在半导体以外的领域中也出现了很多微 相似文献
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微电子机械系统技术及其应用 总被引:3,自引:0,他引:3
微电子机械系统技术的特点是可使制品微型化、集成化并以硅作为加工材料。该技术可分为体微机械加工、表面微机械加工、金属微机械加工和复合微机械加工四类。所采用的基础技术主要有:腐蚀技术、硅键合技术、多层无应力薄膜沉积技术、牺牲层技术、LIGA技术以及以上技术的复合,该项技术应用广泛。本文重点介绍在微传感器、微电机、机械滤波器和谐振滤波器等方面的应用,并探讨了发展方向。 相似文献
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本文把硅传感器的发展趋势归纳为三个发展方向:集成化、多功能化和多维化。提出了集成化的三种发展模式:高集成度、中等集成度和低集成度的集成传感器。本文还讨论了硅传感器发展中的两项关键技术:微机械加工技术和封装技术。 相似文献
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硅微机械惯性传感器技术及其应用 总被引:3,自引:0,他引:3
本文简述了MEMS技术及微机械传感器的技术含义,着重对硅微机械惯性传感器原理及研制硅微机械惯性传感器的关键技术进行描述,为开展硅微机械惯性传感器研究及应用作技术准备及必要的思考。 相似文献
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Laser ablation and micromachining with ultrashort laser pulses 总被引:13,自引:0,他引:13
The mechanisms of ultrashort-pulse laser ablation of materials are discussed, and the differences to that of long laser pulses are emphasized. Ultrashort laser pulses offer both high laser intensity and precise laser-induced breakdown threshold with reduced laser fluence. The ablation of materials with ultrashort pulses has a very limited heat-affected volume. The advantages of ultrashort laser pulses are applied in precision micromachining of various materials. Some femtosecond laser pulse micromachining results, including comparison with long pulses, are presented. Ultrashort-pulse laser micromachining may have a wide range of applications where micrometer and submicrometer feature sizes are required 相似文献
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Eijkel C.J.M. Branebjerg J. Elwenspoek M. Van de Pol F.C.M. 《Electron Device Letters, IEEE》1990,11(12):588-589
The sharp selectivity of HF anodic etching between p-Si and n-Si is used to realize monocrystalline silicon microstructures, in this case suspended beams, making use of masked implantation of phosphorous for the definition of the geometry. This technology offers opportunities in the field of micromachining of silicon for micromechanical applications. The technology is complementary to bulk micromachining (anisotropic KOH or EDP etching, or isotropic HF/HNO3 etching) and surface micromachining with sacrificial-layer techniques 相似文献
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Lalinsky T. Kuzmik J. Porges M. Hascik S. Mozolova Z. Grno L. 《Electronics letters》1995,31(22):1914-1915
The authors present the principle, technology and properties of a novel power sensor microsystem designed for very precise power measurement in a broad frequency range. Bulk micromachining technology on GaAs was implemented to obtain the desired parameters of the sensor 相似文献
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The successful demonstration of a 1:4 power divider using microstrip probes and a WR-430 rectangular waveguide is presented. The 15-dB return loss bandwidth of the nonoptimized structure is demonstrated to be 22% and its 0.5-dB insertion loss bandwidth 26%. While realized through conventional machining, such a structure is assembled in a fashion consistent with proven millimeter and submillimeter-wave micromachining techniques. Thus, the structure presents a potential power dividing and power combining architecture, which through micromachining, may be used for applications well above 100GHz. 相似文献
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T. Sheljaskov K. Niederer R. Lerch P. -C. Eccardt 《e & i Elektrotechnik und Informationstechnik》1998,115(7-8):370-377
Two new ultrasound array antennas for medical applications are presented. These antennas are developed utilizing finite element simulations and they are manufactured by micromachining techniques. The first antenna is based on the piezoelectric transducer principle and can be simultaneously used for imaging and tumor therapy. The second antenna consists of electrostatic transducers, which are manufactured by surface micromachining and which allow an integration of the driver and receiver electronics. 相似文献
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The current research and development activities in silicon radio-frequency (RF) technologies are first reviewed, accompanied by an illustration of the most pronounced shortcomings of conventional silicon technology in the integrability of RF functions at high GHz frequencies. In the discussion on active RF devices mainly CMOS is investigated due to great interest in this mass-production technology. Issues related to the integration of spiral inductors on silicon are addressed, stressing in particular the difficulty of RF substrate potential definition. Silicon micromachining techniques are highlighted as potential solutions to the integration of RF passives and to reduce substrate losses and cross-talk on silicon. It is explained that micromachining techniques are the best introduced to the silicon mainstream by using post-processing and minimum process complexity. 相似文献
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准分子激光微加工技术结合模塑技术加工微流控芯片 总被引:1,自引:0,他引:1
利用准分子激光微加工技术与模塑技术相结合的方法制造微流控芯片。用准分子激光在玻璃基胶层上刻蚀出加工质量较高的微流控生物芯片形貌,通过电铸技术对微流控芯片进行复制,得到反向金属模具。用金属模具通过注塑成型技术用聚碳酸酯注塑出微流控芯片。系统研究了准分子激光的能量密度和工作台移动速度对胶层微通道加工质量的影响;测量并分析了激光刻蚀加工出的微流控芯片原型、电铸的反向金属模板和注塑成型后的微流控芯片的轮廓精度和表面粗糙度,上表面尺度偏差不大于2μm,底面粗糙度小于20 nm。对注塑出的微流控芯片和激光直写刻蚀的几何结构相同的微流控芯片的流动性能进行比较测试。在流速较小时,用激光微加工技术与模塑技术相结合的方法加工的微通道比准分子激光直写法所加工的微通道流动性能更好。 相似文献
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The microfabrication techniques used to develop high-performance closed-loop-controlled microelectromechanical systems (MEMS) are discussed. A generalized MEMS could consist of mechanical components, sensors, actuators, and electronics, all integrated in the same environment. Bulk and surface micromachining, substrate bonding, and electroforming in conjunction with X-ray lithography, all integral components of silicon micromachining, are described. The development of a materials base for MEMS and a variety of physical phenomena for microactuator applications that have recently been demonstrated are reviewed. The applications and future trends of MEMS technologies are discussed 相似文献