共查询到20条相似文献,搜索用时 46 毫秒
1.
2.
介绍了在同一金属零件(如纽扣)上局部镀红古铜、局部镀浅黑镍的双色电镀方法.其工艺流程主要包括:电镀酸铜底色,上油墨,二次电镀亮镍,退油墨,三次电镀枪色,捞色(即在滚筒中用涮色粉、茶籽粉等磨料磨去表面镀层),上保护膜.指出了操作过程中的注意事项.该新型双色电镀方法将挂镀与滚镀有效结合,做到了滚镀镀种的双色效果. 相似文献
3.
Jung‐Bae Jun Min‐Su Seo Seong‐Heun Cho Jin‐Gyu Park Jee‐Hyun Ryu Kyung‐Do Suh 《应用聚合物科学杂志》2006,100(5):3801-3808
In the electroless plating process, to omit a sensitizing process with SnCl2, we utilized amino‐functional groups on polymer particles. At first, highly monodisperse functional polymer particles could be prepared by a two‐step seeded polymerization of styrene, divinylbenzene, and glycidyl methacrylate. Then, surface epoxy‐functional groups were converted to amino‐functional groups by treating the particles with a diamine. By using these surface amino functionalities, we tried to prepare uniformly metal‐coated monodisperse polymer particles by electroless plating method. The constituents of an electroless nickel solution bath are nickel salt, a reducing agent, suitable complexing agents, and stabilizers. And the metal thickness was simply controlled by changing the loading amount of substrate polymer particles. Morphological observation of nickel‐plated polymer particles was conducted by using optical microscopy, scanning electron microscopy, and transmission electron microscopy. The structural composition of plated nickel was also investigated. Most of all, the function and the efficiency of the amino‐functional group of polymer particles as a polymeric ligand for metal binding was elucidated. From all observations, it was evident that in the electroless metal plating process without any sensitization step, the deposition of metal clusters on substrate particles is largely dependent upon the particle surface functionality. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 3801–3808, 2006 相似文献
4.
5.
6.
The initial nickel deposition for the direct electroless nickel plating on non-catalytically active magnesium alloy is critical. The surface morphology and composition of the initial nickel plating coating are obtained by means of the scanning electron microscopy (SEM) and the energy dispersive X-ray (EDS). In addition, the mass gain/loss in the initial nickel deposition process was measured by using the electrobalance. The results showed that the MgO coating was gradually corroded by the plating solution, at the same time, MgF2 produced by F , H and MgO was deposited on the substrate during the initial electroless plating process. The nickel of the initial electroless plating was mostly growing on the boundary between the MgF2 coating and the MgO coating of the activation substrate, and then came to two sides. After that, the Ni-P coating growth rate to cover with the MgF2 coating was prior to the MgO coating. The electroless plating was in company with the substrate corrosion, but the electroless plating rate catalyzed by the exchanged nickel was more than the substrate corrosion rate. 相似文献
7.
提出一种在玻璃纤维/环氧树脂复合材料表面化学镀镍的简化工艺,首先在复合材料表面引入含有镀镍短纤维的过渡层,复合材料与过渡层共固化成型。通过机械粗化、酸化、化学镀工艺成功地在玻璃纤维/环氧树脂复合材料表面沉积一层连续致密的Ni-P镀层。采用超景深显微镜观察化学镀后镀层的表面形貌,并采用SEM对镀层截面特征进行观测。系统地研究了化学镀时间、装载量对镀层表面形貌、镀层厚度与镀层沉积速度的影响规律,并测量了复合材料/镍镀层界面结合强度。试验结果表明,当化学镀时间为8 h、装载量为1.25 dm2/L时,镀层厚度能达到38.96μm,镀层结合强度达到8.45 MPa。 相似文献
8.
连续化泡沫镍双层化学镀,是在利用单层聚氨酯海绵作为基体进行化学镀的基础上进行的,能降低化学镀生产成本的方法。通过对实际泡沫镍生产条件的模拟,提出对化学镀镀槽进行简单的设备改进方法,以实现同槽双层镀的过程。 相似文献
9.
10.
对卫浴产品用PC/ABS塑料件的电镀工艺进行了改进:以酰胺类膨胀剂替代苯酚类膨胀剂进行预粗化,以改善镀层的完整性和外观;在催化前采用氨基甲酸盐类高分子有机物进行表面调整,以减少氯化钯催化剂的用量,提高表面沉钯的质量,缩短电镀时间。改进后的流程主要包括:预粗化,除油,亲水,粗化,回收,中和,表调,预浸,催化,加速,化学沉镍,活化,预镀铜,镀酸铜,镀半光镍,镀光镍,镀铬,烘干,包装。以改进后的工艺对德国拜耳Bayblend ABS+PC2953和台湾奇美Wonderloy PC/ABS PC-365塑料件进行批量电镀,镀层百格结合力测试全部合格,外观合格率达90%,每小时产值提高了约1200元。 相似文献
11.
钢铁件上薄层亮镍的孔隙及其封闭试验 总被引:1,自引:0,他引:1
阐述了亮镍镀层孔隙率的危害及影响因素(包括镀层厚度,基体缺陷和粗糙度,待镀表面的洁净度,以及镀液的维护).介绍了降低亮镍镀层孔隙率的主要措施.针对钢铁件上镀薄层亮镍高孔隙率的问题,测试了几种水基缓蚀剂及水溶性清漆的封闭效果,但结果令人失望.采用水溶性蜡封闭剂的效果则较好. 相似文献
12.
13.
14.
采用化学镀的方法在层状LiAl0.05Ni0.25Co0.70O2表面沉积一层镍,通过X-射线衍射、扫描电子显微镜及电化学测试研究其表面形貌、结构和电化学性质。结果表明,所制备的材料表面镀镍层均匀致密,有效地抑制了材料表面与电解液的相互作用。首次放电比容量达到121.51mA·h/g,经过30次循环后容量保持率为91.35%,其循环稳定性能得到明显提高。 相似文献
15.
16.
Vijaya Kumar Bulasara Oruganti Chandrashekar Ramgopal Uppaluri 《Chemical Engineering Research and Design》2011,89(11):2485-2494
Mass transfer enhanced electroless plating is a relatively new concept in the field of metal–ceramic composite membrane fabrication. In this article, we present the effect of substrate surface roughness along with various mass transfer enhancement techniques such as solution stirring, membrane stirring and sonication on metal conversion, plating efficiency, thickness, and percent pore densification using electroless plating of nickel on a porous disk shaped ceramic support with a nominal pore size of 700 nm. The plating characteristics were investigated for three different roughness values, stirrer speeds (0–300 rpm) and a loading ratio (defined as membrane area per unit volume of plating solution) value of 196 cm2/L. It was evaluated that stirring as well as sonication had a profound effect on sodium hypophosphite based electroless nickel baths. This led to a reduction in average membrane pore size by 100 nm for stirring and 130 nm for sonication when compared to the base case. Surface roughness was observed to influence the metal deposition characteristics for base case without mass transfer enhancement. Sonication, irrespective of surface roughness, provided the maximum values of selective conversion, densification and membrane thickness along with acceptable values of plating efficiency. 相似文献
17.
Lei Fan Qiang Wang Peng Yang Huahui Chen Haiping Hong Wanting Zhang Jie Ren 《Ceramics International》2018,44(10):11013-11021
With the aim to effectively improve the interface between ZrO2 toughened Al2O3 (ZTA) particles and metal matrix, nickel was deposited on the surface of ZTA particles by electroless plating method. Formation mechanism of nickel coating and effects of the solution pH, loading capacity of ZTA particles and temperature on the nickel deposition were investigated. Microstructures, thickness and element distributions of nickel coating were analyzed by X-ray diffraction (XRD), scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDS). The results showed that the nickel was successfully deposited on the surface of ZTA particles by electroless plating without noticeable defects. The process of electroless nickel plating could be explained by combination of atomic hydrogen and electrochemistry theories. The interfacial nucleation of nickel is easier to form than spontaneous nucleation in the solution. Deposited Nickel has priority on the surface of ZTA particles comparing to that in solution. The optimal conditions to coat nickel on the surface of ZTA particles are: solution pH 4.7–4.8, loading capacity 15–20?g/L, and electroless plating temperature 85?°C. The ZTA particle reinforced iron matrix composites prepared by powder metallurgy could have better interfacial bonding between ZTA particle and iron matrix because of the nickel coating on the surface of ZTA particle. Nickel diffuses into the iron matrix during the sintering preparation of composite materials. The interface between ZTA particle and iron matrix presents the evidence of non-chemical bonding. 相似文献
18.
The compatibility of using moisture‐curable polyurethane (MCPU) system as a thin undercoating layer with electroless plating process was evaluated. The characteristics of the MCPU before and after chemical etching treatment were analyzed using atomic force microscope (AFM), scanning electrode microscope (SEM), contact‐angle measurements, and (Fourier‐Transform Infrared) FTIR spectroscopy. We found that surface morphology and roughness of the MCPU is affected by curing period and etching times. A proper combination of curing period and etching times are critical for obtaining a fully metallized surface. All MCPU samples that were etched for 15 min show poor plating performance due to surface damage caused by mild etching treatment. A standard pull‐off testing method (ASTM 4541) was used to evaluate the adhesion strength of nickel–MCPU. Only samples that were postcured for 4 days show influence of surface roughness on adhesion strength. On average, samples that were postcured for 7 days before electroless plating showed better adhesion of nickel–MCPU compared with samples that were postcured for 2 or 4 days. The results show that MCPU system can be used as a thin undercoating layer for electroless plating. It also offers smooth metal–polymer interface and therefore has the potential to be exploited for use in many electroless plating applications including in the decorative such as ornaments and display items and also in electronic industries. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 1554–1565, 2007 相似文献
19.