A low spur,low jitter 10-GHz phase-locked loop in 0.13-μm CMOS technology

This paper presents a 10-GHz low spur and low jitter phase-locked loop(PLL).An improved low phase noise VCO and a dynamic phase frequency detector with a short delay reset time are employed to reduce the noise of the PLL.We also discuss the methodology to optimize the high frequency prescaler's noise and the charge pump's current mismatch.The chip was fabricated in a SMIC 0.13-μm RF CMOS process with a 1.2-V power supply.The measured integrated RMS jitter is 757 fs(1 kHz to 10 MHz);the phase noise is-89 ...     

A 4224 MHz low jitter phase-locked loop in 0.13-μm CMOS technology

A 4224 MHz phase-locked loop(PLL) is implemented in 0.13μm CMOS technology.A dynamic phase frequency detector is employed to shorten the delay reset time so as to minimize the noise introduced by the charge pump.Dynamic mismatch of charge pump is considered.By balancing the switch signals of the charge pump,a good dynamic matching characteristic is achieved.A high-speed digital frequency divider with balanced input load is also designed to improve in-band phase noise performance.The 4224 MHz PLL achieves...     

A 4224 MHz low jitter phase-locked loop in 0.13-μm CMOS technology

A 4224 MHz phase-locked loop (PLL) is implemented in 0.13 μm CMOS technology. A dynamic phase frequency detector is employed to shorten the delay reset time so as to minimize the noise introduced by the charge pump. Dynamic mismatch of charge pump is considered. By balancing the switch signals of the charge pump, a good dynamic matching characteristic is achieved. A high-speed digital frequency divider with balanced input load is also designed to improve in-band phase noise performance. The 4224 MHz PLL achieves phase noises of-94 dBc/Hz and -114.4 dBc/Hz at frequency offsets of 10 kHz and 1 MHz, respectively. The integrated RMS jitter of the PLL is 0.57 ps (100 Hz to 100 MHz) and the PLL has a reference spur of-63 dB with the second order passive low pass filter.     

A 7-GHz multiloop ring oscillator in 0.18-μm CMOS technology

A novel delay stage for ring oscillator utilizing multiloop technique is presented in this paper. Different conventional delay stages for the multiloop ring oscillators have been reviewed and analyzed in this work. By using push-pull inverter as the secondary input in its delay cell, the proposed oscillator demonstrates a frequency improvement of up to 17% when compared with conventional designs. The fabricated oscillator is measured to cover a frequency range of 6.24–7.04 GHz. Operating in 1.8-V power supply, the oscillator manifests itself a phase noise of ?107.7 dBc/Hz@10 MHz offset from a center frequency of 6.25 GHz. The proposed oscillator consumes a current of 40–51 mA from the 1.8-V supply and occupies an area of 440 μm ×  430 μm.     

A 5.25-GHz low-power down-conversion mixer in 0.18-μm CMOS technology

A 5.25 GHz low voltage, high linear and isolated mixer using TSMC 0.18 μm CMOS process for WLAN receiver was investigated. The paper presents a novel topology mixer that leads to better performance in terms of linearity, isolation and power consumption for low supply voltage. The measuring results of the proposed mixer achieve: 7.6 dB power conversion gain, 11.4 dB double side band noise figure, 3 dBm input third-order intercept point, and the total dc power consumption of this mixer including output buffers is 2.45 mW from a 1 V supply voltage. The current output buffer is about 2 mW, the excellent LO-RF, LO-IF and RF-IF isolation achieved up to 37.8, 54.8 and 38.2 dB, respectively.     

A 5-GHz programmable frequency divider in 0.18-μm CMOS technology

正A 5-GHz CMOS programmable frequency divider whose modulus can be varied from 2403 to 2480 for 2.4-GHz ZigBee applications is presented.The divider based on a dual-modulus prescaler(DMP) and pulse-swallow counter is designed to reduce power consumption and chip area.Implemented in the 0.18-μm mixed-signal CMOS process,the divider operates over a wide range of 1-7.4 GHz with an input signal of 7.5 dBm;the programmable divider output phase noise is -125.3 dBc/Hz at an offset of 100 kHz.The core circuit without test buffer consumes 4.3 mA current from a 1.8 V power supply and occupies a chip area of approximately 0.015 mm~2.The experimental results indicate that the programmable divider works well for its application in frequency synthesizers.     

A 5-GHz programmable frequency divider in 0.18-μM CMOS technology

A 5-GHz CMOS programmable frequency divider whose modulus can be varied from 2403 to 2480 for 2.4-GHz ZigBee applications is presented.The divider based on a dual-modulus prescaler (DMP) and pulse-swallow counter is designed to reduce power consumption and chip area.Implemented in the 0.18-μm mixed-signal CMOS process,the divider operates over a wide range of 1-7.4 GHz with an input signal of 7.5 dBm; the programmable divider output phase noise is -125.3 dBc/Hz at an offset of 100 kHz.The core circuit without test buffer consumes 4.3 mA current from a 1.8 V power supply and occupies a chip area of approximately 0.015 mm2.The experimental results indicate that the programmable divider works well for its application in frequency synthesizers.     

A transformer-loaded receiver front end for 2.4 GHz WLAN in 0.13μm CMOS technology

A 2.4 GHz radio frequency receiver front end with an on-chip transformer compliant with IEEE 802.11b/g standards is presented.Based on zero-IF receiver architecture,the front end comprises a variable gain common-source low noise amplifier with an on-chip transformer as its load and a high linear quadrature folded Gilbert mixer.As the load of the LNA,the on-chip transformer is optimized for lowest resistive loss and highest power gain.The whole front end draws 21 mA from 1.2 V supply,and the measured results show a double side band noise figure of 3.75 dB,-31 dBm IIP3 with 44 dB conversion gain at maximum gain setting.Implemented in 0.13μm CMOS technology,it occupies a 0.612 mm~2 die size.     

A 1.0 V differential VCO in 0.13 μm CMOS technology

A differential complementary LC voltage controlled oscillator(VCO) with high Q on-chip inductor is presented.The parallel resonator of the VCO consists of inversion-mode MOS(I-MOS) capacitors and an on-chip inductor.The resonator Q factor is mainly limited by the on-chip inductor.It is optimized by designing a single turn inductor that has a simulated Q factor of about 35 at 6 GHz.The proposed VCO is implemented in the SMIC 0.13μm 1P8M MMRF CMOS process,and the chip area is 1.0×0.8 mm~2.The free-running frequency is from 5.73 to 6.35 GHz.When oscillating at 6.35 GHz,the current consumption is 2.55 mA from a supply voltage of 1.0 V and the measured phase noise at 1 MHz offset is -120.14 dBc/Hz.The figure of merit of the proposed VCO is -192.13 dBc/Hz.     

A 10-bit 2.5-MS/s SAR ADC with 60.46 dB SNDR in 0.13-μm CMOS technology

This paper presents a 10-bit 2.5-MS/s successive-approximation-register (SAR) analog- to-digital-converter (ADC) design for micro controller unit of signal process system. Because of the proposed new segmented architecture of 7 MSBs-plus-3 LSBs capacitor–resistor hybrid digital-to-analog-converter using a thermometer decoder for the most significant 5 MSBs, this design achieves superior static nonlinearity and dynamic performance of SNDR, SFDR. Utilizing the proposed deviation calibration technique, the discharging and charging via substrate resulting from deviation of the comparator’s common-mode voltage is cancelled. The ADC is fabricated in a standard 1P5M 0.13-μm CMOS technology. The peak DNL and INL are +0.18/?0.20-LSB, +0.30/?0.25 LSB respectively while the ENOB is 9.52-bit around all process–voltage–temperature corner analysis. At a 2.3-V supply voltage and a 2.5-MS/s sampling rate, the ADC achieves a SNDR of 60.46 dB, SFDR of 75.32 dB while the power dissipation is 0.191-mW, that resulting in a figure of merit of 98.45 fJ/c-s. The die of ADC measures 0.51 × 0.20 mm² resulting in area efficiency of 122.6 μm²/code and compared with the benchmark SAR ADCs, this work is the most area efficient design.     

A 10-bit 50-MS/s reference-free low power SAR ADC in 0.18-μm SOI CMOS technology

正A 10-bit 50-MS/s reference-free low power successive approximation register(SAR) analog-to-digital converter(ADC) is presented.An energy efficient switching scheme is utilized in this design to obtain low power and high frequency operation performance without an additional analog power supply or on-chip/off-chip reference. An on-chip calibration DAC(CDAC) is implemented to cancel the offset of the latch-type sense amplifier(SA) to ensure precision whilst getting rid of the dependence on the pre-amplifier,so that the power consumption can be reduced further.The design was fabricated in IBM 0.18-μm 1P4M SOI CMOS process technology.At a 1.5-V supply and 50-MS/s with 5-MHz input,the ADC achieves an SNDR of 56.76 dB and consumes 1.72 mW,resulting in a figure of merit(FOM) of 61.1 fJ/conversion-step.     

Design of a 40-GHz LNA in 0.13-μm SiGe BiCMOS

A low-noise amplifier(LNA)operated at 40 GHz is designed.An improved cascode configuration is proposed and the design of matching networks is presented.Short-circuited coplanar waveguides(CPWs)were used as inductors to achieve a high Q-factor.The circuit was fabricated in a 0.13-μm SiGe BiCMOS technology with a transistor transit frequency fT of 103GHz.The chip area is 0.21mm2.The LNA has one cascode stage with a-3dB bandwidth from 34 to 44GHz.At 40GHz,the measured gain is 8.6dB;the input return loss,S11,is...     

Design of a 40-GHz LNA in 0.13-μm SiGe BiCMOS

A low-noise amplifier (LNA) operated at 40 GHz is designed. An improved cascode configuration is proposed and the design of matching networks is presented. Short-circuited coplanar waveguides (CPWs) were used as inductors to achieve a high Q-factor. The circuit was fabricated in a 0.13-μm SiGe BiCMOS technology with a transistor transit frequency fT of 103 GHz. The chip area is 0.21 mm2. The LNA has one cascode stage with a-3 dB bandwidth from 34 to 44 GHz. At 40 GHz, the measured gain is 8.6 dB; the input return loss, S11, is-16.2 dB; and the simulated noise figure is 5 dB. The circuit draws a current of only 3 mA from a 2.5 V supply.     

A low power high gain UWB LNA in 0.18-μm CMOS

A low power high gain differential UWB low noise amplifier (LNA) operating at 3-5 GHz is presented.A common gate input stage is used for wideband input matching; capacitor cross coupling (CCC) and current reuse techniques are combined to achieve high gain under low power consumption. The prototypes fabricated in 0.18-μm CMOS achieve a peak power gain of 17.5 dB with a -3 dB bandwidth of 2.8-5 GHz, a measured minimum noise figure (NF) of 3.35 dB and -12.6 dBm input-referred compression point at 5 GHz, while drawing 4.4 mA from a 1.8 V supply. The peak power gain is 14 dB under a 4.5 mW power consumption (3 mA from a 1.5 V supply). The proposed differential LNA occupies an area of 1.01 mm~2 including test pads.     

A novel design of ultra-broadband,high-gain and high-linearity variable gain distributed amplifier in 0.13 μm CMOS technology

A high-gain, high-linearity and ultra-broadband variable gain distributed amplifier (VGDA) based on employing multiple techniques is presented to substantially increase the gain. The complete design is composed of two major parts including a VGDA part followed by a single stage distributed amplifier (SSDA) part. The VGDA part makes it possible to achieve different gain settings. For high gain considerations, the SSDA part cascades with the VGDA part that takes the benefits of the multiplicative gain mechanism. A theory is presented to enhance the linearity without imposing further DC power consumption. This idea has been validated by simulation results as expected. The design is analysed and simulated in the standard 0.13 μm CMOS technology. It presents the large gain tuning range of 35 dB, from –5 dB attenuation gain up to +30 dB maximum amplification gain, in relation to the control voltage (V_ctr) that varies between 0.42 and 1.1 V. At the maximum amplification gain setting, it presents a DC up to 16 GHz 3 dB bandwidth, an average noise figure of 3.2 dB and an IIP3 of –2 dB m. Furthermore, it dissipates 46.42 mW from 0.7 and 0.9 V power supplies of the drain lines of VGDA and SSDA parts, respectively. Additionally, the Monte Carlo (MC) simulation has been performed to predict an estimate of the accuracy of performance of the proposed design under various conditions.     

A 1.1-mW 10-bit 50-MSample/s hybrid two-step ADC in 0.13-µm CMOS technology

This paper presents a hybrid two-step analog-to-digital converter (ADC) that employs a successive approximation register (SAR) ADC and a time-to-digital converter (TDC)-based ADC as coarse and fine converters, respectively. By exploiting the respective advantages of the SAR and TDC architectures, the two-step ADC is realized without a high-gain amplifier for high linearity of a multiplying digital-to-analog converter. Thus, the proposed architecture can implement a low-power ADC without compromising operational speed. In addition, two digital error corrections are used to compensate for TDC error and the final ADC output, respectively. A 10-bit 50 MS/s ADC is fabricated in a 0.13-μm complementary metal–oxide–semiconductor process and occupies a 0.12-mm² die area. Furthermore, it consumes only 1.1 mW and achieves a signal-to-noise distortion ratio and spurious-free dynamic range of 53.67 and 60 dB, respectively, resulting in a 53.7 fJ/conversion-step at a 25-MHz full-scale input.     

A 3-5 GHz TH-UWB transmitter in 0.18-μm RF CMOS technology

5 mV at a 50 Ω load from a 1.8-V supply, the return loss (S11) at the output port is less than -10 dB, and the chip size is 0.7 × 0.8 mm2, with a power consumption of 12.3 mW.     

A 0.35μm CMOS Mixer for 2.45-GHz RFID Application

A RF mixer with both low noise and high linearity is designed,operating at 2.45-GHz ISM band for RFID application.The designed mixer uses an optimal input matching network and the carefully chosen sizes of transistors,also with the appropriate bias point,to improve the noise figure(NF).Also,with a resonant LC loop as the current source and a parallel PMOS-resistor as the load,the mixer has a high linearity.The post simulation results show that the single side- band noise figure of 8.57 dB,conversion gain of 10.02 dB,input 1-dB compression point(P-1dB)of-8.33 dBm,and input third-order intercept point(IIP3)of 5.35 dBm.     

0.13μm超高性能CMOS晶体管

据日本《电子材料》2 0 0 0年第 2期报道 ,三菱电机公司开发了超高性能的 0 .1 3μm CMOS晶体管。该产品栅长为 0 .1 3μm,在电源电压 1 .8V下达到了目前最高的电流驱动能力 ( n沟道晶体管为 81 0 μA/μm,p沟道晶体管为 42 0 μA/μm)。此外 ,实现了每 1单位电路 1 2 ps的迟延速度 (电路中包含晶体管自身的寄生电容 )。这一器件的开发成功将大大推进大容量数据高速处理系统 L SI的规模生产。0.13μm超高性能CMOS晶体管@孙再吉