Simulation and optimization of a 6H-SiC metal-semiconductor-metal ultraviolet photodetector

Based on thermionic emission theory,a model of a 6H-SiC metal-semiconductor-metal (MSM) ultraviolet photodetector is established with the simulation package ISE-TCAD.A device with 3μm electrode width (W) and 3μm electrode spacing (L) is simulated.The findings show that the MSM photodetector has quite a low dark current of 15 pA at 10 V bias and the photocurrent is two orders of magnitude higher than the dark current.The influences of different structures on dark and illuminated current-voltage characteristics of the MSM photodetector are investigated to optimize the device parameters.Simulation results indicate that the maximum photocurrent and the highest ratio of photocurrent to dark current at 15 V bias are 5,3 nA and 327 with device parameters of W = 6μm,L=3μm and W =3μm,L = 6μm,respectively.     

一维阵列MSM 4H-SiC紫外光电探测器的研制

采用Ni/Au作为肖特基接触制备了一维阵列MSM 4H-SiC紫外光电探测器,并测量和分析了阵列器件的Ⅰ-Ⅴ、光谱响应特性.结果表明,阵列探测器性能均匀性好,击穿电压均高于100V.阵列中单器件暗电流小,在偏压为20V的时候,最大暗电流均小于5pA(电流密度为5nA/cm2),光电流比暗电流高3个数量级以上.其光谱响应表明,单器件在电压为20V时的响应度约为0.09A/W,比400nm时的比值均大5000倍,说明探测器具有良好的紫外可见比.     

4H-SiC金属-半导体-金属结构紫外探测器的模拟与分析

用MEDICI软件对金属-半导体-金属(MSM)结构4H-SiC紫外(UV)探测器的I-V特性以及光谱响应等特性进行了模拟与分析,并探讨了金属电极的宽度、电极间距以及外延层厚度对探测器响应度的影响.结果表明,室温下该探测器的暗电流线性密度达到10-13A/μm,且在不同电压下光电流至少比暗电流大两个数量级;探测器的光谱响应范围为200~400 nm,在347 nm处响应度达到极大值;增大指宽或者减小指间距可以提高探测器的响应度;当波长小于峰值波长时外延层厚度对探测器的响应度基本没影响,而当波长大于峰值波长时随着外延层厚度的增大探测器的响应度有所增大.     

金属-半导体-金属(MSM)结构4H-SiC紫外光电探测器的研制

MSM结构探测器具有结构与工艺简单、制备成本低、量子效率高等特点而在探测器应用中得到重视。本文制备了采用镍作为肖特基接触形成的MSM4H—SiC紫外光电探测器，并测量和分析了在不同的偏压下其光电特性。结果表明，该探测器的暗电流非常小，在偏压为15V的时候，漏电流密度约为70nA／cm^2，光电流比暗电流高约2个数量级，其光谱响应表明，其最高光谱响应与380nm的比值约为1000倍，说明该探测器具有良好的紫外可见比。     

High Detection Sensitivity of Ultraviolet 4H-SiC Avalanche Photodiodes

We report 4H-SiC p-i-n avalanche photodiodes (APDs) with very low dark current. When biased for a photocurrent gain M of 1000, a 100-mum-diameter device exhibits dark current of 5 pA (63 nA/cm²), corresponding to primary multiplied dark current of 5 fA (63 pA/cm²). The peak responsivity at unity gain is 93 mA/W (external quantum efficiency = 41%) at lambda = 280 nm. The excess noise factor corresponds to k = 0.1. Detection of several tens of femtowatts of ultraviolet light is reported.     

Nitride-Based ultraviolet metal-semiconductor-metal photodetectors with a low-temperature GaN layer

The GaN metal-semiconductor-metal (MSM) ultraviolet (UV) photodetectors with a low-temperature (LT)-GaN layer have been demonstrated. It was found that we could achieve a two orders of magnitude smaller, photodetector-dark current by introducing a LT-GaN layer, which could be attributed to the larger Schottky-barrier height between the Ni/Au metal contact and the LT-GaN layer. It was also found that photodetectors with the LT-GaN layer could provide a larger photocurrent to dark-current contrast ratio and a larger UV-to-visible rejection ratio. The maximum responsivity was found to be 3.3 A/W and 0.13 A/W when the photodetector with a LT-GaN layer was biased at 5 V and 1 V, respectively.     

Performance of a near-infrared GaAs metal-semiconductor-metal (MSM)photodetector with islands

A GaAs metal-semiconductor-metal (MSM) photodetector with ultrasmall gold islands deposited on its photosensitive surface is described. The interdigitated detector is fabricated on a semi-insulating substrate in a MESFET-compatible technology. Responsivity as high as 1.8 A/W is obtained at 0.86 μm and a bias voltage of 8 V. This represents over a sixfold increase with respect to responsivity of a conventional MSM photodetector. The mechanism for dark current is suggested and breakdown characteristics are presented     

UV-Enhanced a-Si:H Metal–Semiconductor–Metal Photodetector

Planar metal–semiconductor–metal (MSM) photodetectors with very thin hydrogenated amorphous silicon (a-Si) films were fabricated for the detection of ultraviolet (UV) radiation. Since DNA and proteins strongly absorb UV radiation, these detectors find application in DNA and protein detection. The performance of top and bottom electrode MSM structures with aluminum electrodes is compared. The measured results include a responsivity of 150 mA/W and an external quantum efficiency of 74% at a wavelength of 260 nm for the top electrode configuration at a bias of 2 $hbox{V}/muhbox{m}$ and a 10- $muhbox{m}$ finger spacing.      

Hg1-xCdxTe metal-semiconductor-metal (MSM)photodetectors

Metal-semiconductor-metal (MSM) detectors with active layers of Hg _1-xCd_xTe (x=0.62-0.74) and electrode spacings of 2, 4, and 6 μm have been fabricated and characterized. Direct-current measurements have shown a low dark current and high responsivity from 0.15 to 1.5 A/W at 10-V bias. The lowest values of dark current (0.16 mA cm²) were obtained for detectors which incorporated an overlayer of CdTe. For detectors without the overlayer, increasing the Cd mole fraction resulted in a decrease in the dark current and a reduction in the 300-nm responsivity. Measurements of frequency response for these detectors show a maximum loss of 8 dB to 20 GHz. These results compare favorably with high-performance MSM detectors based on In_0.53Ga_0.47As with a lattice-matched barrier layer of In_0.52Al_0.48As     

Cryogenic processed metal-semiconductor-metal (MSM) photodetectorson MBE grown ZnSe

Molecular beam epitaxy grown 0.5-μm and 2.0-μm thick undoped ZnSe on semi-insulating (100) GaAs substrates were prepared for metal-semiconductor-metal (MSM) photodetector devices. The MSM photodetectors consisted of interdigitated metal fingers with 2, 3, and 4 μm width/spacing on a wafer. A multilayer resist process was employed using polyimide and SiO₂ thin films before the pattern generation to aid in a special low temperature (LT) lift-off process. Dark current-voltage (I-V), DC photo I-V, high frequency I-V, spectral response, and frequency response techniques were employed for testing the device performance. The cryogenic processed metallization provided an improved interface between metal and semiconductor interface. The breakdown voltage in these devices is dependent on the electrode width/spacing and not on film thickness. Dark current remained at around 1 pA for a bias of ±10 V. The devices exhibited a high spectral responsivity of 0.6 (A/W) at a wavelength of 460 nm at 5 V applied bias. A maximum spectral responsivity of 1 (A/W) at an applied bias of 5 V was obtained in these devices indicating an internal gain mechanism. This internal gain mechanism is attributed to hole accumulation in ZnSe epilayers     

High-Detectivity Nitride-Based MSM Photodetectors on InGaN–GaN Multiquantum Well With the Unactivated Mg-Doped GaN Layer

InGaN-GaN multiquantum-well (MQW) metal-semiconductor-metal (MSM) photodetectors (PDs) with the unactivated Mg-doped GaN cap layer were successfully fabricated. It was found that we could achieve a dark current by as much as six orders of magnitude smaller by inserting the unactivated Mg-doped GaN cap layer. For MSM photodetectors with the unactivated Mg-doped GaN cap layer, the responsivity at 380 nm was found to be 0.372 A/W when the device was biased at 5 V. The UV-to-visible rejection ratio was also estimated to be around 1.96 times 10³ for the photodetectors with the unactivated Mg-doped GaN cap layer. With a 5-V applied bias, we found that minimum noise equivalent power and normalized detectivity of our PDs were 4.09 times 10^-14 W and 1.18 times 10¹³ cmmiddotHz^0.5W^-1, respectively. Briefly, incorporating the unactivated Mg-doped GaN layer into the PDs beneficially brings about the suppression of dark current and a corresponding improvement in the device characteristics.     

Visible blind p-i-n ultraviolet photodetector fabricated on 4H-SiC

The 4H-SiC visible blind p-i-n ultraviolet (UV) photodetector has been designed, fabricated and characterized. The dark I-V characteristics of the detector were carried out at room temperature. It was found that the photocurrent of detector was at least two orders of magnitude higher than the dark current. The photon response spectrum of the detector was measured and calibrated. The ratio of responsivity at 275 nm to that at 375 nm was nearly 100, which implied that the photodetector has a great improved visible blind performance.     

High performance of Fe:InP/InGaAs metal/semiconductor/metalphotodetectors grown by metalorganic vapor phase epitaxy

An InGaAs metal-semiconductor-metal (MSM) photodetector with an Fe-doped InP Schottky barrier enhancement layer is described. With 5-V bias, the detector has negligible low-frequency gain, a low dark current of 200 nA, a responsivity of 0.3 A/W, and an impulse response with a 1/ e fall time of 65 ps, corresponding to a 3 dB bandwidth of 2.5 GHz. The device layer structure is a very attractive candidate for integration with high-performance InGaAs/InP FETs     

高阻p型硅大面积四象限探测器的研制

采用PIN结构,研制出高阻p型硅大面积四象限探测器。详细介绍了器件结构设计和制作工艺。对器件响应时间、象限串扰、暗电流和响应度等参数进行了计算与分析。实验结果表明,器件响应度达到0.45A/W（λ=1.06μm）,暗电流小于50nA（Vr=135V）,象限间串扰低于2.5%。     

光伏型硅X射线探测器

介绍了垂直多结器件的结构,给出了热迁移制结的工艺条件和结果,特别介绍了处理器件电极引线的隔离线方法,解决了经过热迁移掺杂后光刻电极套不准的难题,以及把所有p型区域连接起来的问题,达到了敏感区金属零遮挡的目的.同时分析了工艺条件对器件性能的影响.通过对敏感区和无效区的计算和对比,对器件的几个电流参数进行了详细的计算;对两种靶材的标识谱在器件内产生的光电子的收集效率做了计算,对器件的光谱响应度也作了计算和分析;同时对器件窗口材料的选择进行了详细讨论;最后叙述对器件进行的实验验证,通过对金属模板上模拟缺陷的测量,证明器件有足够的灵敏度和分辨率.     

GaN MSM UV photodetectors with titanium tungsten transparent electrodes

GaN metal-semiconductor-metal (MSM) ultraviolet photodetectors with titanium tungsten (TiW) transparent electrodes were fabricated and characterized. It was found that the 10-nm-thick TiW film deposited with a 300-W RF power can still provide a reasonably high transmittance of 75.1% at 300 nm, a low resistivity of 1.7/spl times/10/sup -3/ /spl Omega//spl middot/cm and an effective Schottky barrier height of 0.773 eV on u-GaN. We also achieved a peak responsivity of 0.192 A/W and a quantum efficiency of 66.4% from the GaN ultraviolet MSM photodetector with TiW electrodes. With a 3-V applied bias, it was found that minimum noise equivalent power and maximum D/sup */ of our detector were 1.987/spl times/10/sup -10/ W and 6.365/spl times/10/sup 9/ cmHz/sup 0.5/W/sup -1/, respectively.     

A novel high-speed silicon MSM photodetector operating at 830 nmwavelength

A novel high-speed silicon photodetector that operates at a wavelength of 830 nm is reported. It consists of a Metal-Semiconductor-Metal (MSM) detector that is fabricated on a 5-μm thick silicon membrane. The detector has a measured -3 dB bandwidth of 3 GHz at 10 V, which is almost one order of magnitude larger than the reported bandwidth of conventional silicon MSM detectors as measured at 830 nm. The DC responsivity is 0.17 A/W, corresponding to an internal quantum efficiency of 60.5% and an external quantum efficiency of 25.4%. The large bandwidth and good responsivity at the wavelength of interest, combined with its low operating voltage and compatibility with most silicon integrated circuit technologies, make this detector a promising candidate for monolithic optoelectronic receiver circuits for use in short distance optical communication systems and computer interconnects     

Fabrication of MSM photoconductor on porous Si using micromachined silicon mask

An MSM photoconductive detector has been fabricated from porous silicon using a micromachined silicon mask instead of photolithography. This approach allows damage to porous silicon that can be caused by chemical processing to be avoided. The interdigitated pattern of the silicon mask with a finger spacing of approximately 150 mu m and finger width of 50 mu m was made using silicon micromachining. The fabricated MSM porous silicon photoconductive detector, which exhibits responsivities of better than 0.5 A/W at the wavelength of the He-Ne laser (6280 AA) and a dark current of 950 nA at 10 V, is very promising as an optoelectronic device.<>     

AlGaN MSM紫外探测器

用通过MOCVD生长的未掺杂的n-Al0．3Ga0．7N制备了金属-半导体-金属 (MSM)结构紫外探测器。器件在2．5V偏压时的暗电流为1pA,在6．5V偏压时的暗电流为1nA．在1V偏压下和298nm波长处,探测器的电流响应率为0.038A／W,在300nm 波长处有陡峭的截止边,这与文献中介绍的AlxGa1-xN探测器在x=0．3时截止波长为 300nm相一致。     

Reducing dark current in a high-speed Si-based interdigitated trench-electrode MSM photodetector

The authors have studied higher dark-current temperature dependence in a trench-electrode Si-based metal-semiconductor-metal (MSM) photodetector which has a hydrogenated intrinsic amorphous silicon (i-a-Si:H) dark-current suppression layer. The poor dark-current temperature-dependence performance could be improved significantly by reducing the number of trap states in the depletion region of the reverse-biased crystalline/amorphous Si heterojunction. To reduce the trap states, a modified plasma-enhanced chemical vapor deposition (PECVD) system, which reduced the ion bombardment on the Si substrate, was employed to deposit an i-a-Si:H layer. Moreover, since fewer trap states in a photodetector will result in a degradation of the fall time of the temporal response of the device, a Ti electrode, which has a lower Schottky barrier height (0.62 eV) than that (0.84 eV) of the previous Cr electrode used with i-a-Si:H, was employed for compensation. The device obtained exhibited very good dark-current stability and temporal response. The dark current only increased from 6 to 34 nA, when the operating temperature was increased from room temperature (R. T.) to 57/spl deg/C, much lower than that of the previously reported 3-V bias voltage one (from 22 to 209 nA). Device responsivity and quantum efficiency also showed obvious improvement, both at R. T. (0.192 A/W and 0.29) and 57/spl deg/C (0.213 A/W and 0.32, respectively) and were higher than those previously reported (0.174 A/W and 0.26, at 57/spl deg/C).