Flip chip assembled MEMS inductors

High performance suspended MEMS inductors produced using a flip chip assembly approach are described. An inductor structure is fabricated on a carrier and then flip chip assembled onto a substrate to form a suspended inductor for RF-IC applications with significant improvement in Q-factor and frequency of operation over the conventional IC inductors. A spiral MEMS inductor has been successfully produced on a silicon substrate with an air gap of 26 /spl mu/m between the inductor structure and the substrate. The inductance of the device was measured to be /spl sim/2 nH and a maximum Q-factor of 19 at /spl sim/2.5 GHz was obtained after pad/connector de-embedding.     

A miniaturized Wilkinson power divider with CMOS active inductors

A miniaturized Wilkinson power divider implemented in a standard 0.18-/spl mu/m CMOS process is presented in this letter. By using active inductors for the circuit implementation, a significant area reduction can be achieved due to the absence of distributed components and spiral inductors. The power divider is designed at a center frequency of 4.5GHz for equal power dividing with all ports matched to 50/spl Omega/. Drawing a dc current of 9.3mA from a 1.8-V supply voltage, the fabricated circuit exhibits an insertion loss less than 0.16dB and a return loss better than 30dB at the center frequency while maintaining good isolation between the output ports. The active area of the miniaturized Wilkinson power divider is 150/spl times/100/spl mu/m/sup 2/, which is suitable for system integration in monolithic microwave integrated circuit (MMIC) applications.     

Experimental analysis of the effect of metal thickness on the quality factor in integrated spiral inductors for RF ICs

The effect of metal thickness on the quality (Q-) factor of the integrated spiral inductor is investigated in this paper. The inductors with metal thicknesses of 5/spl sim/22.5 /spl mu/m were fabricated on the standard silicon substrate of 1/spl sim/30 /spl Omega//spl middot/cm in resistivity by using thick-metal surface micromachining technology. The fabricated inductors were measured at GHz ranges to extract their major parameters (Q-factor, inductance, and resistance). From the experimental analysis assisted by FEM simulation, we first reported that the metal thickness' effect on the Q-factor strongly depends on the innermost turn diameter of the spiral inductor, so that it is possible to improve Q-factors further by increasing the metal thickness beyond 10 /spl mu/m.     

CMOS-compatible micromachined edge-suspended spiral inductors with high Q-factors and self-resonance frequencies

This paper reports a new category of high-Q edge-suspended inductors (ESI) that are fabricated using CMOS-compatible micromachining techniques. This structure was designed based on the concept that the current was crowded at the edges of the conducting metal wires at high frequencies due to the proximity effect. The substrate coupling and loss can be effectively suppressed by removing the silicon around and underneath the edges of the signal lines. Different from the conventional air-suspended inductors that have the inductors built on membranes or totally suspended in the air, the edge-suspended structures have the silicon underneath the center of the metal lines as the strong mechanical supports. The ESIs are fabricated using a combination of deep dry etching and anisotropic wet etching techniques that are compatible with CMOS process. For a three-turn 4.5-nH inductor, a 70% increase (from 6.8 to 11.7) in maximum Q-factor and a 57% increase (from 9.1 to 14.3 GHz) in self-resonance frequency were obtained with a 11-/spl mu/m suspended edge in 25-/spl mu/m-wide lines.     

CMOS-compatible surface-micromachined suspended-spiral inductors for multi-GHz silicon RF ICs

Fully CMOS-compatible, highly suspended spiral inductors have been designed and fabricated on standard silicon substrates (1/spl sim/30 /spl Omega//spl middot/cm in resistivity) by surface micromachining technology (no substrate etch involved). The RF characteristics of the fabricated inductors have been measured and their equivalent circuit parameters have been extracted using a conventional lumped-element model. We have achieved a high peak Q-factor of 70 at 6 GHz with inductance of 1.38 nH (at 1 GHz) and a self-resonant frequency of over 20 GHz. To the best of our knowledge, this is the highest Q-factor ever reported on standard silicon substrates. This work has demonstrated that the proposed microelectromechanical systems (MEMS) inductors can be a viable technology option to meet the today's strong demands on high-Q on-chip inductors for multi-GHz silicon RF ICs.     

SOI technology for radio-frequency integrated-circuit applications

This paper presents a silicon-on-insulator (SOI) integration technology, including structures and processes of OFF-gate power nMOSFETs, conventional lightly doped drain (LDD) nMOSFETs, and spiral inductors for radio frequency integrated circuit (RFIC) applications. In order to improve the performance of these integrated devices, body contact under the source (to suppress floating-body effects) and salicide (to reduce series resistance) techniques were developed for transistors; additionally, locally thickened oxide (to suppress substrate coupling) and ultra-thick aluminum up to 6 /spl mu/m (to reduce spiral resistance) were also implemented for spiral inductors on high-resistivity SOI substrate. All these approaches are fully compatible with the conventional CMOS processes, demonstrating devices with excellent performance in this paper: 0.25-/spl mu/m gate-length offset-gate power nMOSFET with breakdown voltage (BV/sub DS/) /spl sim/ 22.0 V, cutoff frequency (f/sub T/)/spl sim/15.2 GHz, and maximal oscillation frequency (f/sub max/)/spl sim/8.7 GHz; 0.25-/spl mu/m gate-length LDD nMOSFET with saturation current (I/sub DS/)/spl sim/390 /spl mu/A//spl mu/m, saturation transconductance (g/sub m/)/spl sim/197 /spl mu/S//spl mu/m, cutoff frequency /spl sim/ 25.6 GHz, and maximal oscillation frequency /spl sim/ 31.4 GHz; 2/5/9/10-nH inductors with maximal quality factors (Q/sub max/) 16.3/13.1/8.95/8.59 and self-resonance frequencies (f/sub sr/) 17.2/17.7/6.5/5.8 GHz, respectively. These devices are potentially feasible for RFIC applications.     

High-performance inductors on plastic substrate

Wafer-transfer technology (WTT) has been applied to transfer RF inductors from a silicon wafer to an opaque plastic substrate (FR-4). By completely eliminating silicon substrate, the high performance of integrated inductors (Q-factor > 30 for inductance /spl sim/3 nH with resonant frequency /spl sim/23 GHz) has been achieved. Based on the analysis of a modified /spl pi/-network model, our results suggest that the performance limitation is switched from being a synthetic mechanism of substrate and metal-ohmic losses on low resistivity Si-substrate to merely a metal-ohmic loss on FR-4. Thus, the inductor patterns, which are optimized currently for RFICs on silicon wafer, can be further optimized to take full advantage of the WTT on new substrate from the newly obtained design freedom.     

An adaptive impedance tuning CMOS circuit for ISM 2.4-GHz band

The difficulties encountered in matching an antenna to its optimal impedance are reduced with an adaptive 0.35-/spl mu/m CMOS circuit based on several switched shunt capacitors arranged in capacitor banks and on a few external series inductors. As high-quality inductors are difficult to obtain in CMOS, the inductors are placed either in an low-temperature cofired ceramic (LTCC) substrate or is a lumped component outside the core circuit. The circuits, presented here through a range of simulations, are optimized to function within the ISM 2.4-GHz band, but the general approach employed to improve matching can be used for other frequency bands as well. The circuits discussed provide a VSWR/spl les/2 match for every impedance with VSWR/spl les/5. There is a 1-dB power loss for a perfect 50 /spl Omega//spl rarr/50 /spl Omega/ transformation, a break-even point at VSWR=1.5, and a 3-dB increase in delivered power for VSWR= 4.3.     

Switched resonators and their applications in a dual-band monolithic CMOS LC-tuned VCO

A switched resonator concept, which can be used to reduce the size of multiple-band RF systems and which allows better tradeoff between phase noise and power consumption, is demonstrated using a dual-band voltage-controlled oscillator (VCO) in a 0.18-/spl mu/m CMOS process. To maximize Q of the switched resonator when the switch is on, the mutual inductance between the inductors should be kept low and the switch transistor size should be optimized. The Q factor of switched resonators is /spl sim/30% lower than that of a standalone inductor. The dual-band VCO operates near 900 MHz and 1.8 GHz with phase noise of -125 and -123dBc/Hz at a 600-kHz offset and 16-mW power consumption. Compared to a single-band 1.8-GHz VCO, the dual-band VCO has almost the same phase noise and power consumption, while occupying /spl sim/37% smaller area.     

Saddle add-on metallization for RF-IC technology

A cost-effective add-on process module for reducing ohmic losses of radio-frequency (RF) inductors and interconnects in RF/BiCMOS and RF/CMOS technologies built on CMOS logic processes is proposed. The module is based on the local thickening of the top metal layer of the thin CMOS interconnects through copper (Cu) electroplating in selected areas. The combination of dense Cu-interconnects in the CMOS logic sections, of thick Cu top-level wiring through local Cu electroplating in the RF sections, and of aluminum (Al) capping of the bond pads provides an optimum tradeoff between packaging requirements, quality of passive components and interconnects, and cost. A special wet-etch process sequence for removal of the Cu-seed and adhesion films from the exposed top metal layer is described. A record quality factor of /spl sim/13 for a 10-nH inductor on a conventional 5-/spl Omega/-cm silicon substrate is demonstrated.     

Metal-defined polymeric variable optical attenuator

A variable optical attenuator (VOA) based on a metal-defined polymeric optical waveguide has been demonstrated for the first time. The metal film stressor deposited on top of the upper cladding layer not only produces the refractive index change within the core layer, but also acts as a thin-film heater allowing thermal tuning of the optical power within a metal-defined optical waveguide. Fabricated devices exhibit greater than 25 dB of optical attenuation with an applied electrical current of /spl sim/40 mA at 1550-nm wavelength. The switching speed of the VOA exhibits 800 /spl mu/s of rising and 720 /spl mu/s of falling time.     

High Q multilayer spiral inductor on silicon chip for 5/spl sim/6 GHz

High Q-values of spiral inductors at frequency around 5/spl sim/6 GHz have been achieved with a multilayer spiral (MLS) structure on a high loss silicon substrate. Compared to a one-layer spiral (OLS) inductor, the Q-value of a 4-nH inductor has been improved by about 80% at 5.65 GHz. The impact of the structure on Q-value and resonant frequency has been analyzed, which shows that an optimal height for the via of MLS inductors should be considered when inductors are designed. The fabrication process is compatible with Cu/SiO/sub 2/ interconnect technology.     

Integrated solenoid inductors with patterned, sputter-deposited Cr/Fe/sub 10/Co/sub 90//Cr ferromagnetic cores

Ferromagnetic (FM) films suitable for implementation in between interconnect layers of a standard CMOS fabrication process are demonstrated to yield considerable size reduction of monolithic radio frequency (RF) inductors, leading to lower cost. The deposition of a FM Cr(5 nm)/Fe/sub 10/Co/sub 90/(500 nm)/Cr(15 nm) stack is performed by magnetron sputtering at room temperature under a dc magnetic field of /spl sim/ 10 mT along the magnetic easy-axis. A lift-off technique, using a four-layer shadow mask, is used for pattern transfer to the magnetic stack to circumvent apparent difficulties in the patterning of FM films. A series of solenoid-type inductors with FM cores are demonstrated and compared to control devices with air cores. A more than eight-fold enhancement of the inductance and a seven-fold improvement of the quality factor are achieved.     

PCB integrated inductors for low power DC/DC converter

This paper discusses the use of printed circuit board (PCB) integrated inductors for low power DC/DC buck converters. Coreless, magnetic plates and closed core structures are compared in terms of achievable inductance, power handling and efficiency in a footprint of 10 /spl times/ 10 mm/sup 2/. The magnetic layers consist of electroplated NiFe, so that the process is fully compatible with standard PCB process. Analytic and finite element method (FEM) methods are applied to predict inductor performance for typical current waveforms encountered in a buck converter. Conventional magnetic design procedures are applied to define optimum winding and core structures for typical inductor specifications. A 4.7 /spl mu/H PCB integrated inductor with dc current handling of up to 500 mA is presented. This inductor is employed in a 1.5 W buck converter using a commercial control integrated circuit (IC). The footprint of the entire converter measures 10 /spl times/ 10 mm/sup 2/ and is built on top of the integrated inductor to demonstrate the concept of integrated passives in power electronic circuits to achieve ultra flat and compact converter solutions.     

New 5.8-GHz circularly polarized retrodirective rectenna arrays for wireless power transmission

This paper proposes two new circularly polarized retrodirective rectenna arrays, including a 2 /spl times/ 2 array and a 4 /spl times/ 4 array. A proximity-coupled microstrip ring antenna is used as the retrodirective rectenna array element, which can automatically block harmonic signals up to the third order from reradiating by the rectifying circuit. These arrays are printed on a Rogers Duroid 5880 substrate of /spl epsiv//sub r/=2.2 with a two-layer structure, with a total thickness of 1.5748 mm (or 62 mil). The new retrodirective rectenna array can track the incoming power source signals automatically and is less sensitive to the power incident angle variations, i.e., main-beam alignment deviation. It can provide a nearly constant dc output voltage within /spl plusmn/10/spl deg/ and 90% dc output voltage within /spl plusmn/45/spl deg/. The conversion efficiencies of the two arrays are 73.3% and 55%, respectively, when the power density is 10 mW/cm/sup 2/. The retrodirective rectenna array can be used in the low-power density applications for microwave wireless power transmissions.     

Flip-Chip-Assembled Air-Suspended Inductors

This paper discusses high-performance planar suspended inductors for hybrid integration with microwave circuits. The inductors are fabricated using a silicon surface micromachining foundry process and assembled using flip-chip bonding. The silicon substrate is removed, leaving a metal inductor suspended 60 mum above the microwave substrate, thus reducing the parasitic capacitance and loss. Various rectangular, octagonal, and circular inductor geometries with one to five windings are designed with inductance values between 0.65 and 16 nH to demonstrate the flexibility of this technique. Measured self-resonant frequencies are between 5 and 34.8 GHz, with quality factors from 45 to 100. Equivalent circuits extracted from measurement for each inductor type show good agreement with measured impedance and full-wave simulations over frequency. The dc current handling limit is 200 mA     

Air-core photonic-bandgap fiber-optic gyroscope

We report the demonstration of the first air-core photonic-bandgap fiber gyroscope. Because the optical mode in the sensing coil travels largely through air, which has much smaller Kerr, Faraday, and thermal constants than silica, far lower dependencies on power, magnetic field, and temperature fluctuations are predicted. With a 235-m fiber coil, we observe a minimum detectable rotation rate of /spl sim/2.7/spl deg//h and a long-term stability of /spl sim/2/spl deg//h, which are consistent with the Rayleigh backscattering coefficient of the fiber and comparable to that measured with a conventional fiber.     

Turn-on voltage investigation of GaAs-based bipolar transistors with Ga/sub 1-x/In/sub x/As/sub 1-y/N/sub y/ base layers

The fundamental lower limit on the turn on voltage of GaAs-based bipolar transistors is first established, then reduced with the use of a novel low energy-gap base material, Ga/sub 1-x/In/sub x/As/sub 1-y/N/sub y/. InGaP/GaInAsN DHBTs (x/spl sim/3y/spl sim/0.01) with high p-type doping levels (/spl sim/3/spl times/10/sup 19/ cm/sup -3/) and dc current gain (/spl beta//sub max//spl sim/68 at 234 /spl Omega///spl square/) are demonstrated. A reduction in the turn-on voltage over a wide range of practical base sheet resistance values (100 to 400 /spl Omega///spl square/) is established relative to both GaAs BJTs and conventional InGaP/GaAs HBTs with optimized base-emitter interfaces-over 25 mV in heavily doped, high dc current gain samples. The potential to engineer turn-on voltages comparable to Si- or InP-based bipolar devices on a GaAs platform is enabled by the use of lattice matched Ga/sub 1-x/In/sub x/As/sub 1-y/N/sub y/ alloys, which can simultaneously reduce the energy-gap and balance the lattice constant of the base layer when x/spl sim/3y.     

Impact of compositionally graded base regions on the DC and RF properties of reduced turn-on voltage InGaP-GaInAsN DHBTs

Built-in drift fields are employed to enhance the performance of GaAs-based heterojunction bipolar transistors (HBTs) with reduced turn-on voltage. Specifically, we explore in detail the dc and RF device property improvements enabled by using compositionally graded GaInAsN base layers. Experimental results are compared to predictions of the standard drift-diffusion base transport model employing a finite exit velocity. In large area devices, graded base samples with built-in fields of /spl sim/7 kV/cm (i.e. 40 meV over 500 /spl Aring/) typically have a dc current gain 1.8/spl times/ larger than constant base composition samples. In small area devices, the peak cut-off frequency is typically 10%-15% higher than constant composition samples. These results are shown to agree reasonably well with predictions, thereby demonstrating that analytical drift-diffusion based models can be extended to HBTs with GaInAsN base layers.     

RF MEMS switch integrated on printed circuit board with metallic membrane first sequence and transferring

This letter reports, for the first time, on RF MEMS switches integrated on flexible printed circuit boards (i.e., FR-4) using transfer technology. The devices were first processed on Si-substrate using a modified MEMS sequence and subsequently transferred onto an FR-4 substrate by thermal compressive bonding, mechanical grinding, and wet removal of silicon. The switches were demonstrated with flat metal membrane (top electrode), precisely controlled gap between the membrane and bottom electrode, low insertion loss (/spl les/ 0.15 dB at 20 GHz), and high isolation (/spl sim/ 21 dB at 20 GHz). This technology shows the potential to monolithically integrate RF MEMS components with other RF devices on organic substrate for RF system implementation.