共查询到20条相似文献,搜索用时 62 毫秒
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<正>北京化工大学采用聚醚胺(D230、D400、T403)和聚醚胺(D2000)作为混合固化剂,研制出具有高弹性高伸长率的环氧树脂(EP)胶粘剂。当D2000质量为25g时,该胶粘剂的拉伸强度为20.69MPa,断裂伸长率为44.10%。 相似文献
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耐热环氧灌注胶的研制及应用 总被引:2,自引:0,他引:2
研究了耐热环氧灌注胶 ,并应用于井温 90~ 12 0℃潜油电机定子部位的灌注 ,结果表明使用混合树脂、液体酸酐及改性促进剂可以满足灌注工艺和耐 15 0℃的使用要求。 相似文献
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采用硫脲改性3种不同分子质量的聚醚胺制备环氧固化剂,通过红外光谱、固化剂的粘度和胺值、固化干燥时间、固化物力学性能测试等研究了反应温度对产物结构,聚醚胺分子质量对固化剂性能、固化剂用量和固化时间对体系性能的影响。结果表明,改性反应温度应不高于130℃,较高分子质量的D2000不适于硫脲改性,低分子质量的聚醚胺硫脲改性固化剂在-10℃下16~18 h即可达到实干。以聚醚胺D230和D400改性的固化剂具有良好的低温固化性能和力学性能,在-10℃下固化7 d后的压缩强度分别为70 MPa和64 MPa,拉伸强度分别为46 MPa和45 MPa,剪切强度分别为14 MPa和13 MPa。 相似文献
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改性环氧树脂制备的热固性环氧沥青材料性能 总被引:1,自引:1,他引:1
采用改性环氧树脂和脂肪族多元羧酸固化剂(由C22:三元酸和二聚脂肪酸固化剂复配而成)及石油沥青制备了热固性环氧沥青材料。通过力学性能测试、DSC及扫描电镜研究了沥青含量对环氧沥青固化物拉伸性能、玻璃化温度、固化反应活性及相结构的影响。结果表明,沥青质量分数为44%的环氧沥青固化物的拉伸强度达8.37MPa,断裂伸长率达223.50%,玻璃化温度22.25℃,吸水率为0.2%。随着沥青含量的增加,沥青作为分散相的粒径越来越大,因而环氧沥青材料的拉伸强度降低。沥青含量的增加对固化物的玻璃化温度没有显著的影响。有沥青的环氧固化体系的反应活化能要小于无沥青的环氧固化体系。 相似文献
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A kind of novel aromatic amine bis(4‐nonyl‐2,5‐diamine‐penoxyl)alkylate (RAn) as curing agents for epoxy resins were prepared through three steps of reactions using nonyl phenol and dibromoalkylate as materials. Dynamic mechanical analysis (DMA) indicated that the secondary relaxation for the resins cured by RAn were generated by the nonyls in RAn molecules when temperature was below ?50°C. Comparing with other reference resins, the enhancement for toughness of RAn cured‐resins were at least 15%, which were contributed by such secondary relaxation. Furthermore, stiffness of the networks and thermal properties of the resins were not influent by the flexible groups (nonyl) in RAn after curing, since the groups were located only in the branched chains of the networks. The mechanical and thermal properties of the new material have been significantly enhanced. The relevant method and procedure developed through this research have been granted Chinese patent recently (Yang and Gong, Chin. Pat. CN1978483A, 2007). © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009 相似文献
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环氧树脂固化剂的改性研究 总被引:7,自引:0,他引:7
以异佛尔酮二胺和1,6-己二胺为原料,加入适量自制的催化剂,在190℃反应2.5 h,即制成新型环氧树脂固化剂(简称YFJA)。将其按不同比例添加到传统固化剂二氨基二苯甲烷(简称DDM)和甲基四氢苯酐(简称Me-THPA)中,通过对固化物的冲击强度、拉伸强度和力学损耗等性能的检测分析,发现当自制固化剂添加量为固化剂总量的50%时,体系的力学性能达到最佳效果,冲击强度最高可提高346.5%,拉伸强度可提高73.0%。 相似文献
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高温固化环氧树脂胶粘剂的研究 总被引:1,自引:0,他引:1
以酚醛环氧树脂(F-51)、不同种类的固化剂和填料等为主要原料,配制不同的EP(环氧树脂)双组分复合材料修补用胶粘剂。采用单因素试验法优选出制备EP胶粘剂的较佳工艺条件。结果表明:当m(F-51)∶m(固化剂PA651)=100∶55、m(气相白炭黑)∶m(高岭土)=15∶80时,制成的EP双组分胶粘剂可在较高温度(室温/1 d→170℃/1 h)条件下固化,其剪切强度为13.8 MPa、压缩强度为85.1 MPa和压缩模量为5.7 GPa,并且其凝胶时间较长、流动性控制性较好、耐介质浸泡性和操作方便性俱佳,完全满足复合材料修补用胶粘剂的使用要求。 相似文献
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目前可用于水下粘接的EP(环氧树脂)胶粘剂用水下固化剂种类不多,主要是一些憎水类改性胺固化剂(如810和301P等)。以不同种类的水下固化剂作为试验对象,着重探讨了水下固化剂的本体黏度、相应水下EP胶粘剂的某些性能(如水下凝胶时间、水下拉伸剪切强度及水下压缩强度等)。研究结果表明:水下EP胶粘剂的适宜凝胶时间为1h左右;水膜隔离胶粘剂/被粘物的界面问题只影响拉伸剪切强度,而不影响压缩剪切强度,故水下固化剂的憎水性良好时,相应EP胶粘剂的压缩强度相对较高,但其钢/钢拉伸剪切强度会受到一定的影响;810和301P具有一定的憎水性,并且相应EP胶粘剂的水下凝胶时间均为1h左右,故不同黏度的810和301P复配可制得综合性能更好的水下EP胶粘剂。 相似文献
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One-component epoxy adhesives have great promising prospects in industrial applications. However, it faces the challenge to reduce the activity of curing agents for achieving long-term storage and controlled release. Microencapsulation is a feasible and effective solution. In this paper, multi-polyaniline (MPAN) was successfully encapsulated with polyetherimide (PEI), a thermoplastic resin, as the shell material by using solvent evaporation method with dichloromethane (DCM) as solvent. The impacts of different preparation parameters on the structure and properties of microcapsules were investigated by single variable control method. It is found that the resulted microcapsules under the optimal process parameters, namely PVA concentration 1 wt%, core/shell mass ratio 1:1 and stirring rate 700 rpm, exhibits a smooth and dense spherical surface with an average particle size concentrated around 17.8 μm. Compared with the pure curing agent, the encapsulated curing agent effectively prolonged the shelf life of the epoxy adhesive at 40°C for at least 60 days, indicating excellent storage stability. The microencapsulated MPAN curing agent prepared in our research is of potential applications in the fields of electronic component bonding, potting and circuit board sealing due to its high storage stability and encapsulation efficiency (74%). 相似文献