影响镍镀层内应力的因素及排除方法

镀镍层内应力对其性能影响较大简单介绍了镀层内应力的一种定性测定方法-条形阴极法,并列出了其半定量的计算公式分析了影响镀镍层内应力的几种因素：电镀光亮剂、pH值、电流密度、温度及杂质提出了相应的排除方法,并指出重视镀液的维护与管理是有效控制镀层内应力的主要方法。     

镀镍层内应力及其测量方法

镀镍是电镀工业中应用最广泛的镀种之一,镀层的内应力是影响镀层质量的重要因素.综述了镀镍层内应力产生的原因,介绍了镀镍层内应力的测量方法,并对各种影响镀镍层内应力的因素进行了分析.     

甲磺酸电镀光亮锡-铅-铋合金工艺研究

研究了一种新型抗腐蚀和可焊性好的光亮甲磺酸锡-铅-(Pb的质量分数为2％～12％，Bi的质量分数为0．2％～1％)合金电镀工艺，探讨了溶液成分、工艺参数对镀层质量影响。本研究重点测定了镀液的电化学性能(如阴极电流效率、分散能力及深镀能力等)和镀层性能。     

几种品牌硫酸镍的电镀镍性能对比性研究

通过赫尔槽试验、偏转法、安时法等多种方法,测试了国内外市场上6种品牌硫酸镍所得镀镍层外观、内应力,镀液的电流效率、分散能力、整平能力及覆盖能力等性能,并进行对比。结果显示,金柯生产硫酸镍产生的针孔少于其它品牌,配制镀液无需预处理即可进行直接生产,其瓦特镍液获取镀层内应力最小,镀液分散能力、整平能力、覆盖能力和电流效率稍优于其它品牌硫酸镍。     

工艺条件及镀液杂质对瓦特镍镀层内应力的影响

为控制生产中瓦特镍镀层的内应力,利用条形阴极法测试了镀液的温度、pH及镀液中的杂质等对瓦特镍镀层内应力的影响。结果表明,镀镍液θ为50℃,pH为4.0时,镀层内应力最小;随着镀液中Cu~(2+)、Zn~(2+)金属杂质含量的增加,镀层内应力均增加;另外,在生产中为降低镀层的内应力,还需严格控制硫酸镍品质。     

电化学阻抗谱在电沉积研究中的应用(三)

文章的第三部分介绍了电化学阻抗谱在Ni–SiC复合镀、化学镀镍和镀层性能(耐蚀性、电化学行为和腐蚀行为)研究中的应用。     

符合RoHS、ELV欧盟指令的环保化学镀镍工艺

为了顺应RoHS、ELV指令的要求,开发了无铅/镉化学镀镍工艺。从镀层合金成分、中性盐雾实验、硬度、耐磨性、整平性、内应力、微观形貌、镀速、镀液稳定性和含磷量等方面与中磷化学镀镍工艺进行了比较。结果表明,无铅/镉化学镀镍工艺镀液更稳定,所得的镍镀层内应力稍高;硬度、耐蚀性、可焊性、附着力等性能相当;而耐磨性、耐污性、沉积速度和含磷量均高于中磷化学镀镍工艺,尤其是镀层亮度、微观结构和整平效应表现更优。     

新型滚镀镍添加剂及其电镀工艺

本文研究开发了一种组合型滚镀镍添加剂(N-100)及其电镀工艺.并对其镀液镀层性能进行了全面测试,与英国名牌滚镀镍专用添加剂进行对比.结果表明,两者性能基本相同,N-100的镀液分散能力、复盖能力、抗杂质能力和镀层孔隙率稍优;英国名牌滚镀镍添加剂的发光性能和整平能力略好.N-100的特点是在低D_k区出光速度快、镀液稳定性好,大处理周期长,耗镍量低,视零件而异,每吨滚镀件耗镍量为4～10公斤.此添加剂经历了两年来的大生产考核,性能稳定.     

中国专利信息

中国专利信息管式金属内脏化学镀镍－磷合金溶液公开号ＣＮ１１２０６０２Ａ申请人南开大学一种管式金属内脏化学镀镍一磷合金溶液（镀液）。采用复合络合剂和复合稳定剂体系的新配方，其镀液稳定性高，理化性能好、施镀效果明显，具有较高镀速，镀层致密，镀层为２．５～...     

无钠离子镀镍工艺的应用与维护

一、概述镍镀层具有悠久的应用历史,人们对镍镀层认识从感性到理性也就越来越深入,越来越丰富,在国外对镀镍溶液成份研究表明,溶液中钠离子对镀镍层结构有较大的影响。早在本世纪七十年,在英、美,有关文献中已明确指出,镀液中的钠离子会使镍镀层产生呈层状纤维结构,因而镀层内应力高、结合力差、脆性大。为避免钠离子对镍镀层结构的影响,国外一般都已采用不含钠离子的镀镍工艺。但在我国却仍有相当多的镀镍溶液采用含钠离子的工     

Effect of trimethylamine borane (TMAB) bath concentration on electrodeposited Ni–B/TiC nanocomposite coatings

In this study, stainless steel material was coated with Ni–B alloy-based, TiC particle reinforced composite film using electrochemical deposition method. The properties of the obtained Ni–B/TiC nanocomposite coatings were investigated in terms of the effect of trimethylamine borane (TMAB) bath concentration, which is a boron source. In addition, the data of pure Ni, Ni–B alloy and stainless steel are presented together for comparison. According to the cyclic voltammogram (CV) analysis, it is seen that TMAB contributes to increasing the deposition rate. In the crystal structure analysis, the effect of TMAB was weaker at low TiC bath concentrations, while the effect of TMAB was more dominant at high TiC bath contents. The crystal grain size values of nanocomposite coatings vary between 5.8 and 16.8 nm, and these values decrease up to 86% when compared to the crystal grain size of the pure Ni coating. Although the increase in TMAB initially causes an increase in the microhardness of nanocomposite coatings, when the TMAB value was further increased, it was observed that the microhardness decreased even more compared to the previous initial value. The highest hardness value was obtained in the sample produced at 5 g/l TiC and 6 g/l TMAB bath contents, and this value was 817 HV. Compared to this value, it was observed that the hardness of pure Ni was 65% lower. It was observed that TMAB did not have significant effect on the coating morphology, but the increase in TMAB caused an increase B content and a decrease in the TiC content in the nanocomposite coating. Furthermore, it was revealed that the increase in TMAB bath concentration caused an improvement on corrosion resistance. The corrosion current of the composite sample with 9 g/l TMAB concentration, which showed the best corrosion performance, decreased by 85% compared to pure nickel.     

铝合金及钢铁件化学镀镍的应用配方探讨

针对生产实践,提出了一种铝合金及钢铁件化学镀镍配方。研究了该配方中各成分(包括主盐、还原剂、加速剂、络合剂、稳定剂等)对镀液性能的影响。对镀速和镀层厚度进行了测定,并与电镀进行了效果比较。实践表明,镀液中的各成分都会影响到镀层效果,评价镀液性能必须综合考虑各项因素。     

镍-碳化钨纳米复合镀层的制备与性能

采用电镀的方法制备出Ni-WC纳米复合镀层,镀液组成为:NiSO4·7H2O 250 g/L,NiCl2·6H2O 30 g/L,H3BO3 30 g/L,光亮剂0.1 g/L,纳米WC颗粒5～ 30 g/L,表面活性剂及分散剂适量.研究了温度、电流密度及pH对复合镀层外观的影响,得到最佳电镀工艺条件为:温度50～55...     

酸性锌镍合金电镀工艺参数对镀层镍含量的影响

研究了采用弱酸性氯化物体系电镀锌镍合金时镀液的镍锌比、温度、氯化铵含量,以及阴极电流密度、电镀方式等工艺参数对镀层镍含量的影响.结果表明,镀液镍锌比、温度、阴极电流密度对镀层镍含量影响较明显,氯化铵含量及磁力搅拌对镀层镍含量几乎无影响,采用脉冲电镀可以显著提高镀层镍含量.     

Effect of stress on the passivation of Si-DLC coating as stent materials in simulated body environment

DLC coating can be used for vascular stents to prevent the stainless steel substrate from eluting Ni and Cr by plastic deformation and corrosion environment. The stress corrosion cracking (SCC) of Si-diamond-like carbon (Si-DLC) coated on 316L stainless steel was studied in a simulated body environment of a deaerated 0.89 wt.% NaCl electrolyte at 37 °C. This paper investigated the effect of Si-DLC coating on the SCC of 316L SS by slow-strain-rate test (SSRT), constant load test (CLT), and electrochemical impedance spectroscopy (EIS). The EIS data were monitored for the elastic and plastic regions under CLT to determine the electrochemical behavior of the passive film during SCC phenomena. The Si-DLC coated steel exhibited more ductility than uncoated steel and less susceptibility to SCC in this environment. According to X-ray photoelectron spectroscopy (XPS) analysis, the film repassivation occurs due to the presence of the silicon oxide layer on the Si-DLC film surface.     

锡、镍对高硅钢表面热浸镀锌层生长的影响

研究了Zn-Sn和Zn-Sn-Ni浴中高硅钢(含Si0.36%)表面镀锌层的生长和微观组织变化,探讨了Sn和Ni抑制高硅钢镀层快速生长的原因。结果表明,含Sn锌浴能抑制高硅钢表面镀锌层的快速生长,抑制效果随锌浴中Sn含量的增加而增强。当锌浴中的Sn含量达5%时,高硅钢镀锌层的生长方式发生了改变,由反应扩散控制变为扩散控制。高硅钢在Zn-Sn或Zn-Sn-Ni浴中镀锌时,镀锌层的ζ/η界面形成了Sn或Sn和Ni富集区,在一定程度上阻滞了Fe-Zn扩散。锌浴中添加微量的Ni能显著减少Sn用量,当锌浴中Ni的添加量为0.06%时,Sn的用量可从3%降到1.5%。     

电沉积Ni-P合金镀层耐蚀性的研究

研究了不同磷含量的Ni-P合金镀层在NaCl介质中的耐腐蚀性能。通过浸泡实验,得出不同磷含量的Ni-P合金镀层在w（NaCl）=5%和饱和NaCl溶液中的腐蚀数据,同时还与纯镍镀层、化学镀Ni-P合金镀层、1Cr18Ni9Ti不锈钢以及A3钢进行了比较。     

装饰性锡锌镍三元合金代镍工艺研究

研究了装饰性电镀锡锌镍三元合金代镍工艺。采用赫尔槽试验探讨了主盐、添加剂、溶液温度和pH对镀层镍含量、镀层外观及镀液稳定性的影响。结果表明:该工艺操作方便,镀液分散能力和覆盖能力好,所得锡锌镍合金镀层结晶细致,光亮,类似镍层,其耐蚀性明显优于锌镀层,适用于钢铁件高耐蚀装饰性电镀。     

钢铁基体无氰镀铜结合力的研究进展

无氰镀铜的研究应用已取得一定的进展和成效,但在钢铁基体上镀铜仍存在结合力差的问题。阐述了影响结合强度的主要因素,并归纳和总结了近年来国内外在钢铁基体上无氰镀铜结合力的几种解决方法及相关理论。从络合剂、表面活性剂和电镀电源三方面,就该问题的研究方向提出了设想。     

SAE 1045 steel/WC-Co/Ni-Cu-Ni/SAE 1045 steel joints prepared by dynamic diffusion bonding: Microelectrochemical studies in 0.6 M NaCl solution

Corrosion of SAE 1045 steel/WC-Co/Ni-Cu-Ni/SAE 1045 steel interfaces was investigated in 0.6 M NaCl solution using an electrochemical microcell, which enables local electrochemical characterization at the micrometer scale. Two pieces of steel, one with a WC-Co coating covered with Ni (12 μm) and Cu (5 μm) layers, and the other with a Ni (15 μm) layer, were welded by dynamic diffusion bonding. A WC-Co coating was applied to the steel by the high velocity oxygen-fuel process, and Ni-Cu and Ni layers by electroplating. Polarization curves were recorded using an electrochemical microcell. Different regions of welded samples were investigated, including steel, cermet coating, and steel/cermet and steel/Ni-Cu-Ni/cermet interfaces. Optical and electronic microscopes were employed to study the corroded regions. Potentiodynamic polarization curves obtained using the microcell revealed that the base metal was more susceptible to corrosion than the cermet. In addition, cermet steel/cermet and steel/Ni-Cu-Ni/cermet joints exhibited different breakdown potentials. Steel was strongly corroded in the regions adjacent to the interfaces, while the cermet was less corroded. Iron oxides/hydroxides and chloride salts were the main corrosion products of steel. After removal of the superficial layer of corrosion products, iron oxides were mainly observed. Chloride ions were detected mainly on a copper-enriched layer placed between two Ni-enriched layers.