电信业新技术新业务网络数据安全分析

随着电信行业技术革新和快速迭代,5G、人工智能、大数据分析、物联网等技术的不断涌现,为电信行业数字化和智能化转型提供了技术前提和基础平台。归纳了电信行业五大重点业务类型及应用前景,以业务支撑系统、大数据平台、云计算业务、物联网业务为典型案例,结合业务特点深度分析业务管理与技术方面的网络数据安全风险,提出数据安全管理工作体系搭建、数据安全技术保障能力配备的对策与建议,为电信企业积极应对新形势、新情况和新问题提供思路。     

Review of speech technologies for telecommunications

Speech is the easiest and most expressive means that people have for communicating with each other. This paper reviews the key speech technologies and discusses the associated telecommunications applications and technical challenges. It concludes with some personal predictions about future trends and opportunities in this important, exciting and far-reaching field     

Impact of mobility on mobile telecommunications networks

This paper describes the mobility management mechanisms for mobile telecommunications networks. There are two major types of mobility: radio network mobility and core network mobility. Radio network mobility supports radio link switching of a mobile user during conversation, and core network mobility provides roaming and tunnel‐related management for packet re‐routing due to user movement. Impact of mobility on both the radio and the core networks is addressed in this paper. Also, potential research issues on these topics are discussed. Copyright © 2005 John Wiley & Sons, Ltd.     

Using distributed object technologies in telecommunications networkmanagement

The Telecommunications Management Network (TMN) has been developed as the framework to support administrations in managing telecommunications networks. It suggests the use of OSI Systems Management (OSI-SM) as the technology for management information exchanges. Distributed object technologies, such as the Common Object Request Broker architecture (CORBA), address the use of software application program interfaces (APIs) in addition to interoperable protocols. Their use in TMN has been the subject of intensive research in previous years, with most approaches focusing on interoperability aspects with OSI-SM. We examine the issues behind using distributed object technologies in TMN via a native fashion, with network elements supporting distributed objects directly, e.g., a “CORBA to the switch” approach. The proposed solution tries to maintain the full OSI-SM expressive power in a way that other solutions have not attempted before. Performance and scalability issues are considered, while the approach has been validated through implementation     

并驾齐驱的PCS芯片技术

人们一直以为,向３Ｇ（第三代移动通信）频带转移带来的竟争会将芯片业较不成熟的参与者淘汰,互相竞争的技术中肯定会有某个脱颖而出,主导新的ＰＣＳ（个人通信系统）手机市场。随着竟争的继续,虽然相关技术都在进步,但却还没有最终的胜利者,也许永远不会有。虽然硅锗（ＳＩＧｅ）技术发展势头强劲,但象砷化镓（ＧａＡｓ）和ＢＩＣＭＯＳ这样的“老”技术仍然表现出极大的潜力。随着技术的不断发展,无线手机中的芯片数量将由目前的２０片左右,减少至１０块（四片大型ＩＣ加上六片外围芯片）或更少。如何做到根本的动力来自新发展的…     

Microscopic stress simulation of non-planar chip technologies

Finite element simulations were used to study the thermo-mechanical stress state at the chip corner in a chip–package system. Accurate geometry of a non-planar chip topology was created by digitizing images obtained with a scanning electron microscope through focused ion beam cuts. Nested sub-modeling approach was utilized in order to simulate the a few microns region of interest, which is very small, compared to 1 cm package size. Available material models were used and unavailable materials were characterized. Thermal loads for the complete set of fabrication process from the wafer initialization to the final qualification phase were considered for this work. Cracks arising in passivation due to thermo-mechanical loads were a concern. Stress simulations on this chip–package system were carried out and compared between planar and non-planar geometries of the same. It was found that the accuracy of stress values largely depend on the precise geometry input for simulation. Preliminary finite element models were optimized to achieve accuracy in the simulation results. The stress measured on test chips with integrated stress cells. The simulation results are in good agreement with these experimental values. This also helped to validate the material models and simulation methodology reported in this paper.     

迈向新通信时代——兼《中国新通信》杂志创刊贺词

时光如水,在不知不觉中将我们带到了2006年。2006年,对于中国通信业来说,究竟意味着什么?是电信业务无情分流的延续?是全国范围恶性价格战的再度重演?是依然对3G牌照的苦苦期待?还是面对未来电信业何去何从的茫然失措?     

Belief functions in telecommunications and network technologies: an overview

In the last few years, evidence theory, also known as Dempster-Shafer theory or belief functions theory, have received growing attention in many fields such as artificial intelligence, computer vision, telecommunications and networks, robotics, and finance. This is due to the fact that imperfect information permeates the real-world applications, and as a result, it must be incorporated into any information system that aims to provide a complete and accurate model of the real world. Although, it is in an early stage of development relative to classical probability theory, evidence theory has proved to be particularly useful to represent and reason with imperfect information in a wide range of real-world applications. In such cases, evidence theory provides a flexible framework for handling and mining uncertainty and imprecision as well as combining evidence obtained from multiple sources and modeling the conflict between them. The purpose of this paper is threefold. First, it introduces the basics of the belief functions theory with emphasis on the transferable belief model. Second, it provides a practical case study to show how the belief functions theory was used in a real network application, thereby providing guidelines for how the evidence theory may be used in telecommunications and networks. Lastly, it surveys and discusses a number of examples of applications of the evidence theory in telecommunications and network technologies.     

电信新业务对通信业的影响

根据电信企业经营业务的时间长短,电信业务可分为传统业务和新业务。其中电信传统业务是指普通电话业务（本地网电话、国内长途电话和国际长途电话）。电信新业务是电信企业为适应社会使用电信服务的需要和通信技术的发展而兴办不久的业务。现有的电信新业务主要有：电话信息服务台业务、智能电话业务、个人通信业务、计算机数据互联业务、可视图文业务、电子信箱业务、会议电视业务和虚拟专用网业务等。可以预见,随着通信技术的进一步发展,电信业务的种类将会越来越多。电信新业务和传统业务的现状及发展趋势我国电信新业务发展迅速,而…     

Impact and preliminary results of telecommunications deregulationin Japan

Telecommunications deregulation in Japan has led to increased competition in telecommunications and expansion of the cable TV business. The number of telecommunication carriers has increased rapidly, resulting in the diversification of telecommunication services and reduction of charges. In the cable TV business, two multisystem operators appeared, and at the same time there was a dramatic increase in the number of cable TV subscribers. In this article the impact and preliminary results of telecommunications deregulation in Japan are outlined for the two cases of deregulation of interconnectivity among telecommunications carriers and that of the cable TV business     

Impact of probing procedure on flip chip reliability

Probe-after-bump is the primary probing procedure for flip chip technology, since it does not directly contact the bump pad, and involves a preferred under bump metallurgy (UBM) step coverage on the bump pads. However, the probe-after-bump procedure suffers from low throughputs and high cost. It also delays the yield feedback to the fab, and makes difficult clarification of the accountability of the low yield bumped wafer between the fab and the bumping house. The probe-before-bump procedure can solve these problems, but the probing tips may over-probe or penetrate the bump pads, leading to poor UBM step coverage, due to inadequate probing conditions or poor probing cards. This work examines the impact of probing procedure on flip chip reliability, using printing and electroplating bumpings on aluminum and copper pads. Bump height, bump shear strength, die shear force, UBM step coverage, and reliability testing are used to determine the influence of probing procedure on flip chip reliability. The experimental results reveal that bump quality and reliability test in the probe-before-bump procedure, under adequate probing conditions, differ slightly from the corresponding items in the probe-after-bump procedure. UBM gives superior step coverage of probe marks in both probe-before-bump and probe-after-bump procedures, implying that UBM achieves greater adhesion and barrier function between the solder bump and the bump pad. Both printing and electroplating bump processes slightly influence all evaluated items. The heights of probe marks on the copper pads are 40–60% lower than those on the aluminum pads, indicating that the copper pad enhances UBM step coverage. This finding reveals that adequate probing conditions of the probe-before-bump procedure are suited to sort flip chip wafers and do not significantly affect bump height, bump shear strength, die shear force, or flip chip reliability.     

Prioritizing telecommunications technologies for long-range R&D planning to the year 2006

This paper concerns telecommunications technologies prioritization for long-range R&D planning at the Korea Telecommunication Authority (KTA), which is the primary common carrier in Korea. Criteria weighting and technological importance ranking were determined by means of the Analytic Hierarchy Process as a decision aid, along with hierarchical representation and pairwise comparisons. The opinions derived from three divisions of KTA were analyzed and aggregated. Such aggregated prioritization weighting of technologies allows the corporation management to use it for funding decisions about technological aspects of its long-range planning for R&D projects during the period from 1992 to 2006; especially those concerning baseline budget level selection and the scope of research activities.<>     

无线电技术发展对频谱管理的影响和对策

阐述了当前无线电技术发展对频谱资源的巨大需求以及无线电设备激增对电磁环境的影响,分析了无线电技术发展对频谱管理和频谱使用的影响．有针对性地提出了频谱管理的相关策略和建议。     

Impact of cross-national diffusion process in telecommunications demand forecasting

New product diffusion process studies focus mainly on estimating the adoption rate of the product, within the boundaries of the targeted market. However, and especially for high technology and telecommunications products, it is very likely the case that products or services are introduced simultaneously into a number of market segments, a fact that it is rarely taken into account. Thus, the effect of market and population interaction, and the consequent co-influence in the diffusion rates is not considered. This work focuses on developing and evaluating a pertinent methodology, so as to capture this cross-national interaction influence in the diffusion process.     

A new green energy interface for telecommunications

Providing electricity to telecom tower can be realised by hybrid green energy systems than extending a power line from grid. For a hybrid energy system, it is important to develop a converter to integrate different power sources and storage elements. Conventional systems use an individual converter for individual source thus leading to a relatively complex configuration, larger component count and reduced system efficiency. To address these issues green energy interface (GEI) converter is used. In this paper, a detailed component wise analysis and performance comparison between conventional and GEI converter using Matlab/Simulink is presented. GEI converter has linear and non-linear components. So, small signal model based on state space averaged model of the GEI topology is obtained. A lab level prototype for the GEI converter with programmable interface controller is implemented and tested under various input conditions to study the performance of the converter during seasonal changes. The simulation and experimental results showed that effective operation and control strategy of the hybrid power supply system.

Abbreviations: BTS: base transceiver station; MSC: mobile switching centre; BSC: base station controller; CAPEX: capital expenditure; OPEX: operational expenditure; GEI: green energy interface     

Towards a new telecommunications industry quality standard

The quality technologies developed by Bell Communications Research (Bellcore) and adopted by its owner/clients are described. At the core of the philosophy is the concept of supplier accountability for product and service quality. A brief history of quality in the former Bell System is presented. A supplier career path for today's telecommunications suppliers is shown, and the various characteristics that accompany each phase of the buyer/supplier relationship are described. Programs that enable buyers and suppliers to achieve a long-term cooperative relationship are presented chronologically according to the phases of the product life cycle. The customer/supplier quality process, which is the newest and most comprehensive of the quality technologies available in the telecommunications field, is summarized     

芯片设计中的IP技术

从IP开发和集成两个方面入手，重点阐述了IP的基本特征，IP的设计流程及设计中的关键技术，IP集成的一般考虑及集成的关键技术，IP模块的评估与选择等，并探讨了国内IP技术发展的一些思路。