聚变堆中H刻蚀碳氢薄膜的分子动力学模拟

使用分子动力学方法模拟了低能H原子与碳氢薄膜的作用过程,以了解基于核聚变装置中等离子体与C基材料的相互作用机制。模拟中使用REBO(reactive empirical bond order)势函数来描述C-H体系中原子间的相互作用,并使用Berendsen热浴来控制体系的温度。文中着重探讨了入射能量对低能H原子刻蚀碳氢薄膜的影响,入射能量分别为0.3,1,5和10eV。模拟结果显示随着入射能量的增加,H原子的吸附率增加,C原子和H原子的刻蚀率增加。同一能量下H原子比C原子更易发生刻蚀。通过讨论发现在H原子与碳氢薄膜作用过程中,当能量大于1 eV时,由于入射的H原子先沉积在表面并与表面原子发生反应形成碳氢化合物,然后在后续入射粒子的轰击下碳氢化合物在表面发生解吸附现象,从而导致了C原子的刻蚀,因此C原子的刻蚀发生主要是化学增强的物理溅射。     

分子动力学模拟不同入射能量的SiF2与SiC的相互作用

采用分子动力学模拟方法研究了入射能量对SiF2与SiC样品表面相互作用的影响。本次模拟选择的入射初始能量分别为0.3,1,5,10和25 eV。模拟结果显示SiF2分解率与Si和F原子的沉积率有密切的关系。沉积的Si和F原子在SiC表面形成一层SixFy薄膜。随入射能量的增加,薄膜厚度先增加后减小,薄膜中Si-Si键密度增大。构成薄膜的主要成分SiFx(x=1~4)中主要是SiF和SiF2,随入射能量的增加,薄膜成分由SiF2向SiF转变。     

分子动力学模拟C+离子与聚变材料钨的相互作用

采用分子动力学方法模拟不同能量的C+离子与聚变材料钨的相互作用.模拟结果表明:当C+离子入射剂量为3.11×1016 cm-2,入射能量为50eV时,样品表面形成一层碳膜;而入射离子能量为150和250eV时,C+离子入射到样品内与钨原子共同形成碳钨混合层,样品表面没有形成碳膜;碳的沉积率随能量的增大先减小后增加,溅射率随能量的增大先增大后减小;轰击后的样品中,碳原子密度、C-W键密度及C-C键密度分布都随能量的增加逐渐向样品内移动,且C-W键分布厚度随能量的增加而逐渐增加,C-C键分布厚度几乎不随能量变化;在作用过程中极少量的钨原子发生溅射,但引起钨品格损伤严重;碳在轰击后的样品中主要以Csp3杂化形式存在.     

CH与聚变材料Be相互作用的分子动力学模拟

采用分子动力学方法模拟了不同能量的CH粒子与聚变材料Be的相互作用。根据托卡马克中的环境,入射粒子CH的模拟入射能量分别设定为低能量(1,5,10,25 eV)和高能量(50,100,150,200 eV),其中碳的沉积率随能量的增大逐渐增加,而氢的沉积率恰好相反。当CH粒子的入射能量为低能量时,Be样品表面形成一层碳氢膜;且其膜厚度越来越薄,并且形成一个厚度逐渐增加中间层;当入射能量为高能量时,样品中的Be原子溅射越来越大,入射粒子在样品中的入射深度越来越深,对样品的破坏越来越大,且会在样品中形成一个C反应层。     

基于第一性原理方法研究基团在CVD金刚石薄膜(001)表面上的生长

采用基于密度泛函理论的第一性原理方法研究CVD金刚石薄膜(001)表面的生长机理。计算清洁金刚石表面和氢(H)终止金刚石表面的构型。考察H原子和活性基团(C,CH,CH2和CH3)在清洁重构金刚石表面及在单层H终止金刚石表面上的吸附演变。结果表明:清洁金刚石表面发生了对称二聚体重构,H原子终止金刚石表面稳定了金刚石结构;基团在金刚石(001)表面吸附演变过程中,H原子起到激活石墨和萃取表面H原子产生活性位的作用;CH2基团比CH3基团能够更好地提高CVD金刚石薄膜的生长率,是薄膜生长过程中最有效基团;CH基团阻碍了薄膜的生长。     

碳16团簇与碳10团簇等在金刚石表面的吸附结构比较

用分子动力学方法模拟研究了荷能的C2、C10和C16在金刚石（001）-（2X1）表面的化学吸附过程。主要讨论了团簇大小和入射能量对沉积团簇的结构特性的影响。随着入射能量的增加,C2、C10和C16的沉积结构和自由团簇是不同的。该模拟支持了实验的结果,而且从原子尺度模拟分析了沉积机制。     

F原子与Si表面相互作用的动力学研究

采用分子动力学方法模拟了F原子与Si表面相互作用,F原子入射能量分别为0.3,1,3,5,7和9 eV。在模拟过程中,F原子的沉积率与Si表面悬键密度有关,而Si原子的刻蚀率与表面晶格结构破坏程度有关,随着Si原子刻蚀率的增加,样品高度降低。在不同能量F原子作用下,样品Si表面形成Si-F反应层。Si-F反应层的厚度随入射能量的增加而增加,其组成成分对产物有至关重要的影响。     

DBD-PECVD法制备CN薄膜的结构及性能研究

使用自行设计的真空系统,采用介质阻挡放电等离子体增强化学气相沉积(DBD-PECVD)法,分别以CH4/N2、C2H2/N2、C2H4/N2混合气体作为反应气体,在单晶硅片上成功制备了CN薄膜.FTIR结果证实了薄膜中碳氮原子结合成化学键,Raman结果说明薄膜中含有类金刚石结构,AFM结果表明薄膜粗糙度随放电气压的升高而逐渐增大.三种混合气体沉积的CN薄膜,以CH4/N2的沉积速度最慢,薄膜表面粗糙度最小,含H量最少;C2H2/N2的沉积速度最快,薄膜表面粗糙度最大.     

薄膜生长的计算机模拟

建立了一个比较合理的三维模型,并通过模拟成像和定量计算研究了薄膜生长过程中的两个重要问题,早期成核与表面粗糙度.结果表明,薄膜的长生过程是原子吸附、迁移、脱附、连带等微观过程的积累.随着衬底温度的升高或入射率的降低,沉积在衬底上的原子逐步由各自独立的离散型分布向聚集状态转变形成岛核,并由二维岛核向三维岛核转变.衬底温度越高、入射率越低,成核尺寸越大.存在一个最佳成核温度,成核率出现一个极大值.随着衬底温度的升高,薄膜的粗糙度先降低后来又增加.存在一个生长转变温度Tr,薄膜的粗糙度达到极小值.当衬底温度小于Tr时,入射率越大,薄膜的粗糙度越大.当衬底温度大于Tr时,入射率越大,粗糙度越小.薄膜生长的主要微观机理是原子热运动对薄膜生长的影响.     

原子层外延生长Ⅲ-Ⅴ族化合物薄膜机理的研究进展

介绍了用于外延生长Ⅲ-Ⅴ族化合物薄膜的原子层外延(ALE)的国内外进展。以GaAs为例,讨论了ALE生长Ⅲ-Ⅴ族化合物的表面反应机理。GaAs的ALE表面反应机理主要有两种:一种是吸附质阻挡机理,即Ga-(CH3)3在表面发生热解,最终Ga(CH3)x(x=1或2)在表面吸附,依靠Ga(CH3)x中CH3的空间位阻效应,表面反应自动停止;另一种是选择性吸附机理,即Ga(CH3)3在表面热解后形成的吸附物质是Ga原子,当表面完全覆盖一层Ga原子,即表面Ga原子饱和,表面反应自动停止。还介绍了ALE生长中的气相反应以及H原子对ALE生长过程的影响。     

HFCVD金刚石膜过程的气氛模拟与分析

对热丝法化学气相沉积金刚石膜过程的气氛进行了模拟与分析。使用GRI－Mech3.0甲烷燃烧过程C／H／O／N四元体系热化学反应机理和动力学数据，模拟并分析了HFCVD金刚石膜的C／H气相化学反应，通过对反应流的简单模拟得到了衬底位置气相组成，结果与前人实验数据吻合，探讨了灯丝温度、碳源浓度和碳源种类等因素变化对衬底位置气相组成的影响。结果表明甲基是金刚石膜生长最主要的前驱基团，其作用远高于乙炔，而超平衡态原子氢的存在对金刚石膜的质量至关重要。     

Molecular dynamics modeling of microstructure evolution during growth of amorphous carbon films

Summary Classical molecular dynamics simulations, using Brenner's bond-order interatomic potential model, is used to study the bonding microstructure formation during quench from liquid and during growth on a diamond surface. For a 64-atom quench simulation we find 56 sp³- and 8 sp²-bonded carbon atoms, in qualitative agreement with tight-binding simulations. The growth of amorphous carbon films was simulated by depositing carbon and hydrogen atoms onto a diamond surface at energies up to 100 eV The simulated films are amorphous with a maximal density near the deposition energies (20–40 eV) used to grow films on magnetic disks. Lower deposition energies yield open graphitic structures, while much higher deposition energies cause the surface to ablate, leading to a poorly defined interface. The hardness calculated from the densest simulated films is about twice that found experimentally.     

Modelling of boron nitride: Atomic scale simulations on thin film growth

Molecular-dynamics simulations on ion-beam deposition of boron nitride are presented. A realistic Tersoff-like potential energy functional for boron nitride, which was specially fitted to ab initio-data, has been used. The impact of energetic boron and nitrogen atoms on a c-BN target is simulated with energies ranging from 10 to 600 eV. The structural analysis of the grown films shows that a loose, dominantly sp²-bonded structure arises at high ion flux. In no case the formation of a sp³-bonded phase is observed, but the obtained films partially reveal textured basal planes as found in experiment. Two different growth regimes are identified for ion energies above and below 100 eV.     

Deposition of amorphous CN(x) materials in BrCN plasmas: exploring adhesion behavior as an indicator of film properties

Adhesion and delamination behavior of amorphous carbon nitride (a-CN(x)) is critical to development of wear resistant materials and protective coatings. Here, the composition and delamination behavior of a-CN(x) films was explored utilizing BrCN, CH?CN, and CH? as film precursors, either alone or in combination with one another. Film delamination depends on film thickness and plasma composition as well as post deposition treatment conditions. Delamination is not observed with films deposited from 100% CH?CN discharges, whereas films of similar thickness deposited from 100% BrCN plasmas delaminate almost immediately upon exposure to atmosphere. Exploration of these differences in delamination behavior is discussed relative to contributions of humidity, hydrocarbon species, and ion bombardment during deposition in conjunction with compositional studies using X-ray photoelectron spectroscopy (XPS).     

Carbonaceous alumina films deposited by MOCVD from aluminium acetylacetonate: a spectroscopic ellipsometry study

Spectroscopic ellipsometry was used to characterize carbonaceous, crystalline aluminium oxide films grown on Si(100) by low-pressure metal organic chemical vapour deposition, using aluminium acetylacetonate as the precursor. The presence of carbon in the films, attributed to the use of a metalorganic precursor for the deposition of films, was identified and analysed by secondary ion mass spectroscopy and X-ray photoelectron spectroscopy, for the elemental distribution and the chemical nature of the carbon in the films, respectively. Ellipsometry measurements over the photon energy range 1.5–5 eV were used to derive the pseudo-dielectric function of the aluminium oxide-containing films. Multi-layer modelling using linear regression techniques and the effective medium approximation were carried out to extract the structural details of the specimens. The excellent fit between the simulated and experimental optical data validates the empirical model for alumina-containing coatings grown by MOCVD.     

Low Resistance Polycrystalline Diamond Thin Films Deposited by Hot Filament Chemical Vapour Deposition

Polycrystalline diamond thin films with outgrowing diamond (OGD) grains were deposited onto silicon wafers using a hydrocarbon gas (CH4) highly diluted with H2 at low pressure in a hot filament chemical vapour deposition (HFCVD) reactor with a range of gas flow rates. X-ray diffraction (XRD) and SEM showed polycrystalline diamond structure with a random orientation. Polycrystalline diamond films with various textures were grown and (111) facets were dominant with sharp grain boundaries. Outgrowth was observed in flowerish character at high gas flow rates. Isolated single crystals with little openings appeared at various stages at low gas flow rates. Thus, changing gas flow rates had a beneficial influence on the grain size, growth rate and electrical resistivity. CVD diamond films gave an excellent performance for medium film thickness with relatively low electrical resistivity and making them potentially useful in many industrial applications.     

Effect of some growth parameters on vacuum-deposited CulnSe2 films

P-type copper indoselenide (CulnSe₂) thin films were vacuum-deposited on glass substrates by a single-source thermal evaporation technique under different conditions of preparation. The structural properties of the films were investigated by X-ray diffraction and transmission electron microscopy and diffraction techniques. The dark resistivity of the deposited films was investigated as a function of film thickness, deposition rate and substrate temperature. The conductivity activation energy ranges from 0.851 to 1.01 eV depending on the deposition rate. Single-phase and stoichiometric CulnSe₂ films could be deposited at low deposition rates (less than 4 nms^–1). Higher deposition rates led to multiphase films containing InSe, ln₂Se₃, CuSe and Cu₃Se₂ in addition to CulnSe₂.     

Characterization of low-k dielectric SiCOH films deposited with decamethylcyclopentasiloxane and cyclohexane

Ultra low-k dielectric SiCOH films were deposited with decamethylcyclopentasiloxane (DMCPSO, C10H30O5Si5) and cyclohexane (C6H12) precursors by plasma-enhanced chemical vapor deposition at the deposition temperature between 25 and 200 degrees C and their chemical composition and deposition kinetics were investigated in this work. Low dielectric constants of 1.9-2.4 were obtained due to intrinsic nanoscale pores originating from the relatively large ring structure of DMCPSO and to the relatively large fraction of carbon contents in cyclohexane. Three different deposition regions were identified in the temperature range. Deposition rates increased with temperature below 40 degrees C and decreased as temperature increased to 75 degrees C with apparent activation energies of 56 kJ/mol x K at < 40 degrees C, -26 kJ/mol x K at 40-100 degrees C, respectively. In the temperature region of 40-100 degrees C hydrocarbon deposition and decomposition process compete each other and decomposition becomes dominant, which results in apparent negative activation energy. Deposition rates remain relatively unaffected with further increases of temperature above 100 degrees C. FTIR analysis and deposition kinetic analysis showed that hydrocarbon deposition is the major factor determining chemical composition and deposition rate. The hydrocarbon deposition dominates especially at lower temperatures below 40 degrees C and Si-O fraction increases above 40 degrees C. We believe that dielectric constants of low-k films can be controlled by manipulating the fraction of deposited hydrocarbon through temperature control.