p-channel modulation-doped field-effect transistors based on AlSb0.9As0.1/GaSb

Operation of the first AlSbAs/GaSb p-channel modulation-doped field-effect transistor (MODFET) is reported. Devices with 1-μm gate length exhibit transconductance of 30 and 110 mS/mm at room temperature and 80 K, with respective maximum drain current densities of 25 and 80 mA/mm. The low field Hall mobility and sheet carrier density of this modulation doped structure were 260 cm²/V-s and 1.8×10 ¹² cm^-2 at room temperature and 1700 cm²/V-s and 1.4×10¹² cm^-2 at 77 K. Calculations based on these results indicate that room-temperature transconductances of 200 mS/mm or greater could be achieved. This device can be integrated with an InAs n-channel HFET for complementary circuit applications     

p-channel quantum-well heterostructure MI3SFET

A p-channel heterostructure MISFET-like device based on a quantum well with an underlying impurity layer is discussed. The device is based on an AlGaAs/GaAs heterostructure with a recessed-gate geometry and uses Zn-diffused refractory-metal contacts. The 4100 cm²/V-s hole mobility obtained in this inverted-interface structure at 77 K is comparable to that achieved in normal-interface AlGaAs/GaAs heterostructures. Transconductance and K-factor values as high as 52 mS/mm and 140 mS/V-mm, respectively, are obtained at 77 K in p-channel FETs with 2.0-μm gate lengths and 6.0-μm source-drain spacings, representing state-of-the-art values for p-HFETs at similar dimensions     

Gate-self-aligned p-channel germanium MISFETs

The authors have fabricated the first gate-self-aligned germanium MISFETs and have obtained record transconductance for germanium FETs. The devices fabricated are p-channel, inversion-mode germanium MISFETs. A germanium-oxynitride gate dielectric is used and aluminum gates, serve as the mask for self-aligned source and drain implants. A maximum room-temperature transconductance of 104 mS/mm was measured for a 0.6-μm gate length. A hole inversion channel mobility of 640 cm² /V-s was calculated using transconductance and capacitance data from long-channel devices. This large hole channel mobility suggests that germanium may be an attractive candidate for CMOS technology     

A 0.4-μm gate-length AlGaAs/GaAs P-channel HIGFET with 127-mS/mmtransconductance at 77 K

WN-gate, p-channel AlGaAs-GaAs heterostructure insulated-gate field-effect transistors (HIGFETs) fabricated on a metalorganic vapor-phase epitaxy (MOVPE) wafer are discussed. A self-aligned Mg ion implantation (80 keV, 6×10¹³ cm^-2) annealed at 850°C in an arsine atmosphere and the control of the SiO₂ sidewall dimensions allow the fabrication of p-channel HIGFETs with a gate length smaller than 0.5 μm with low subthreshold current. P-channel HIGFETs with 0.4-μm gate lengths exhibit extrinsic transconductances as high as 127 mS/mm at 77 K and 54 mS/mm at 300 K     

Realization of n-channel and p-channel high-mobility (Al,GA)As/GaAs heterostructure insulating gate FET's on a planar wafer surface

Self-aligned gate by ion implantation n-channel and p-channel high-mobility (Al,Ga)As/GaAs heterostructure insulated-gate field-effect transistors (HIGFET's) have been fabricated on the same planar wafer surface for the first time. Enhancement-mode n-channel (Al,Ga)As/GaAs HIGFET's have demonstrated extrinsic transconductances of 218 mS/mm at room temperature and 385 mS/mm at 77 K. Enhancement-mode p-channel (Al,Ga)As/GaAs HIGFET's have demonstrated extrinsic transconductances of 28 mS/mm at room temperature and 59 mS/mm at 77 K. There are the highest transconductance values ever reported on a p-channel FET device.     

High-transconductance n-type Si/SiGe modulation-doped field-effecttransistors

The authors report on the fabrication and the resultant device characteristics of the first 0.25-μm gate-length field-effect transistor based on n-type modulation-doped Si/SiGe. Prepared using ultrahigh vacuum/chemical vapor deposition (UHV/CVD), the mobility and electron sheet charge density in the strained Si channel are 1500 (9500) cm²/V-s and 2.5×10¹² (1.5×10¹² ) cm^-2 at 300 K (77 K). At 77 K, the devices have a current and transconductance of 325 mA/mm and 600 mS/mm, respectively. These values far exceed those found in Si MESFETs and are comparable to the best results achieved in GaAs/AlGaAs modulation-doped transistors     

An InAlAs/InAs MODFET

An InAs modulation-doped field-effect transistor (MODFET) using an epitaxial heterostructure based entirely on arsenides is reported. The heterostructure was grown by MBE on InP and contains a 30-Å InAs channel. A 2-μm-gate-length device displays well-behaved characteristics, showing sharp pinch-off (V_th=0.8 V) and small output conductance (5 mS/mm) at 300 K. The maximum transconductance is 170 mS mm with a maximum drain current of 312 mA/mm. Strong channel quantization results in a breakdown voltage of -9.6 V, a severalfold improvement over previous InAs MODFETs based on antimonides. Low-temperature magnetic field measurements show strong Shubnikov-de Haas oscillations which, over a certain range of gate voltage, strongly indicate that the electron channel resides in the InAs layer     

Extremely high transconductance Ge/Si0.4Ge0.6p-MODFET's grown by UHV-CVD

Ge-channel modulation-doped field-effect transistors (MODFET's) with extremely high transconductance are reported. The devices were fabricated on a compressive-strained Ge/Si_0.4Ge_0.6 heterostructure with a Hall mobility of 1750 cm²/Vs (30,900 cm²/Vs) at room temperature (77 K). Self-aligned, T-gate p-MODFET's with L_g=0.1 μm displayed an average peak extrinsic transconductance (g(m_ext)) of 439 mS/mm, at a drain-to-source bias voltage (V_ds) of -0.6 V, with the best device having a value of g(m_ext)=488 mS/mm. At 77 K, values as high as g(m_ext)=687 mS/mm were obtained at a bias voltage of only V_ds=-0.2 V. These devices also displayed a unity current gain cutoff frequency (f_T) of 42 GHz and maximum frequency of oscillation (f_max) of 86 GHz at V_ds=-0.6 V and -1.0 V, respectively     

High speed p-type SiGe modulation-doped field-effect transistors

We report on the fabrication and characterization of high-speed p-type modulation-doped field-effect transistors (MODFETs) with 0.7-μm and 1-μm gate-lengths having unity current-gain cut-off frequencies (f_T) of 9.5 GHz and 5.3 GHz, respectively. The devices were fabricated on a high hole mobility SiGe heterostructure grown by ultra-high-vacuum chemical vapor deposition (UHV-CVD). The dc maximum extrinsic transconductance (g_m) is 105 mS/mm (205 mS/mm) at room temperature (77 K) for the 0.7-μm gate length devices. The fabricated devices show good pinch-off characteristics and have a very low gate leakage current of a few μA/mm at room temperature and a few nA/mm at 77 K     

Self-aligned p-channel MISFET with a low-temperature-grown GaAsgate insulator

A new p-channel GaAs metal-insulator-semiconductor field-effect transistor (MISFET) using low-temperature-grown (LTG) GaAs as the gate insulator is demonstrated. Neither the GaAs conducting channel nor the gate insulator was doped, and a Be self-aligned implant was used to lower the source and drain series resistance. For a MISFET with a 1.5-μm gate length, the transconductance is 22 mS/mm and the maximum drain current is 120 mA/mm obtained at -8 V of gate bias. The measured unity-current-gain cut-off frequency f_T is 2.0 GHz     

High-transconductance InAs/AlSb heterojunction field-effecttransistors with δ-doped AlSb upper barriers

The authors report the fabrication and temperature-dependent characterization of InAs/AlSb quantum-well heterojunction field-effect transistors (HFETs). Devices with electron sheet concentrations of 3.8×10¹² cm^-2 and low-field electron mobilities of 21000 cm²/V-s have been realized through the use of Te δ-doping sheets in the upper AlSb barrier. One device with a 2.0-μm gate length showed a peak extrinsic transconductance of 473 mS/mm at room temperature. Gate leakage current, operating current density, and extrinsic transconductance were found to decrease with decreasing temperature     

SiGe pMOSFET's with gate oxide fabricated by microwave electroncyclotron resonance plasma processing

A new process, electron cyclotron resonance (ECR) microwave plasma oxidation, has been developed to produce a gate-quality oxide directly on SiGe alloys. One μm Al gate Si_0.86Ge_0.15 p-metal-oxide-semiconductor field-effect-transistors (pMOSFET's) with ECR-grown gate oxide have been fabricated. It is found that saturation transconductance increases from 48 mS/mm at 300 K to 60 mS/mm at 77 K. Low field hole mobilities of 167 cm²/V-s at 300 K and 530 cm ²/V-s at 77 K have been obtained     

A GaAs gate heterojunction FET

A new semiconductor-insulator-semiconductor field-effect transistor has been fabricated. The device consists of a heavily doped n-type GaAs gate with undoped (Al,Ga)As as the gate insulator, on an undoped GaAs layer. This structure gives the device a natural threshold voltage near zero, well suited for low-voltage logic. The threshold voltage is, to first order, independent of Al mole fraction and thickness of the (Al,Ga)As layer. The layers were grown by MBE and devices fabricated using a self-aligned technique involving ion-implantation and rapid thermal annealing. A transconductance of 240 mS/mm and a field-effect mobility of about 100 000 cm²/V-s were achieved at 77 K.     

High-transconductance p-channel AlGaAs/GaAs HFETs with low-energyberyllium and fluorine co-implantation self-alignment

The fabrication and electrical characteristics of p-channel AlGaAs/GaAs heterostructure FETs with self-aligned p⁺ source-drain regions formed by low-energy co-implantation of Be and F are reported. The devices utilize a sidewall-assisted refractory gate process and are fabricated on an undoped AlGaAs/GaAs heterostructure grown by MOVPE. Compared with Be implantation alone, the co-implantation of F⁺ at 8 keV with 2×10¹⁴ ions/cm² results in a 3× increase in the post-anneal Be concentration near the surface for a Be⁺ implantation at 15 keV with 4×10¹⁴ ions/cm². Co-implantation permits a low source resistance to be obtained with shallow p⁺ source-drain regions. Although short-channel effects must be further reduced at small gate lengths, the electrical characteristics are otherwise excellent and show a 77-K transconductance as high as 207 mS/mm for a 0.5-μm gate length     

Enhancement-mode metal/(Al,Ga)As/GaAs buried-interface field-effect transistor (BIFET)

Undoped Al0.5Ga0.5As is used as an insulator layer in the fabrication of MIS-type buried-interface field-effect transistors (BIFETs). The devices had a 2.5 ?m-long gate and an insulator layer 1000 ? thick. When operated in an accumulation mode the transconductance and maximum current increased from 21 mS/mm and 77 mA/mm at 300 K to 40 mS/mm and 138 mA/mm at 77 K, respectively. The maximum possible 77 K transconductance is calculated as approximately 130 mS/mm. These preliminary experimental results are the best yet reported for a GaAs MIS-type device and represent the first report of enhanced device performance at cryogenic temperatures as a result of an increased electron saturation velocity.     

A self-aligned enhancement-mode AlGaAs/InP MISFET

An enhancement-mode insulated-gate field-effect transistor (FET) has been fabricated by a self-aligned technique on semi-insulating InP substrate with an AlGaAs gate barrier grown by molecular beam epitaxy (MBE). A device with a gate length of 1 µm exhibited a transconductance of 134 mS/mm and a threshold voltage of 0.9 V. The characteristics are insensitive to light down to 77 K and hysteresis is completely absent. The performance of this device shows that the fabrication of enhancement-mode devices on severely lattice-mismatched heterostructures is feasible.     

Planar-doped n-type InAlAs/InGaAs MODFETs on InP(311)A substratesby molecular beam epitaxy

N-type doping of silicon in InAlAs/InGaAs/InP modulation-doped field effect transistor (MODFET) structures grown by molecular beam epitaxy (MBE) for the (311)A orientation has been achieved by using the planar-doping technique. An electron mobility as high as 50000 cm² V-s with a sheet carrier concentration of 1.9×10¹²/cm² at 77 K is reported. MODFETs with 1.2-μm gate length exhibit an extrinsic transconductance of 400 mS/mm and a maximum drain current of 485 mA/mm. The results are comparable to those of MODFETs grown on (100) InP substrates. The results point to the possibility of making p-n multi layer structures with all-silicon doping     

Model and analysis of a delta-doping field-effect transistors utilizing an InGaP/GaAs camel-gate structure

In this paper, the performances of a new δ-doping field-effect transistor utilizing an InGaP/GaAs camel-gate structure by theoretical and experimental analysis will be reported. An analytical model related to drain saturation current, transconductance, potential barrier height, gate-to-source depletion capacitance, and unit current gain frequency is developed to explain the device performances. The employments of n⁺-GaAs/p⁺-InGaP/n-GaAs heterostructure gate and the δ-doping channel with heavy-doping level were used to improve transconductance linearity and enhance current drivability. For a 1×100 μm² device, the experimental results show that a drain saturation current of 1120 mA/mm, a maximum transconductance of 240 mS/mm, and a large V_gs swing larger than 3.5 V with the transconductance higher than 200 mS/mm are obtained. In addition, the measured unit current gain frequency f_t is 22 GHz. These experimental results are consistent with theoretical analysis.     

Selectively doped n+ InP/n? GaInAs heterostructure prepared using chloride transport vapour-phase epitaxy

A field-effect transistor with a 2 ?m Au gate was fabricated on a selectively doped InP/GaInAs heterostructure grown using chloride transport vapour-phase epitaxy. Complete pinch-off was observed, and transconductance of 90 and 160 mS/mm were measured at 295 and 77 K, respectively. From analysis of the drain I/V characteristic, two-dimensional electron gas at the interface was revealed to be the dominant factor for the channel current. This is the first report of a successful preparation of an n+ InP/n? GaInAs heterostructure for the selectively doped field-effect transistor.     

1-μm Enhancement Mode GaAs N-Channel MOSFETs With Transconductance Exceeding 250 mS/mm

In this letter, 1-mum GaAs-based enhancement-mode n-channel devices with channel mobility of 5500 cm²/Vmiddots and g _m exceeding 250 mS/mm have been fabricated. The measured device parameters including threshold voltage V_th, maximum extrinsic transconductance g_m, saturation current I_dss , on-resistance R_on, and gate current are 0.11 V, 254 mS/mm, 380 mA/mm, 4.5 Omegamiddotmm, and < 56 pA for a first wafer and 0.08 V, 229 mS/mm, 443 mA/mm, 4.5 Omegamiddotmm, and < 90 pA for a second wafer, respectively. With an intrinsic transconductance g_mi of 434 mS/mm, GaAs enhancement-mode MOSFETs have reached expected intrinsic device performance