A new on-chip ESD protection circuit with dual parasitic SCRstructures for CMOS VLSI

A new CMOS on-chip electrostatic discharge (ESD) protection circuit which consists of dual parasitic SCR structures is proposed and investigated. Experimental results show that with a small layout area of 8800 μ², the protection circuit can successfully perform negative and positive ESD protection with failure thresholds greater than ±1 and ±10 kV in machine-mode (MM) and human-body-mode (HBM) testing, respectively. The low ESD trigger voltages in both SCRs can be readily achieved through proper circuit design and without involving device or junction breakdown. The input capacitance of the proposed protection circuit is very low and no diffusion resistor between I/O pad and internal circuits is required, so it is suitable for high-speed applications. Moreover, this ESD protection circuit is fully process compatible with CMOS technologies     

Design and optimization of LDMOS-SCR devices with improved ESD protection performance

The lateral diffusion metal-oxide semiconductor embedded silicon controlled rectifier (LDMOS-SCR) devices with optimized structures and layouts for improving the electrostatic discharge (ESD) protection ability have been proposed. The devices are designed and fabricated in 0.25-μm, 0.35-μm and 0.5-μm Bipolar-CMOS-DMOS processes. Firstly, by designing an appropriate stripe resistance in series with the source of the LDMOS-SCR, the holding voltage of the proposed high resistance LDMOS-SCR (HRLDMOS-SCR) increases. Secondly, by inserting a floating Zener-diode into the LDMOS-SCR, the trigger voltage of the modified Zener-diode triggered LDMOS-SCR (ZTLDMOS-SCR) decreases. Finally, the ZTLDMOS-SCR is further optimized by using a ring layout and incorporating a square source resistance, resulting in a significantly improved figure of merit in comparison to traditional LDMOS-SCR devices. The optimized ZTLDMOS-SCR devices are very attractive for constructing effective and latch-up immune high voltage ESD protection solutions in power integrated circuits.     

Design and integration of novel SCR-based devices for ESD protection in CMOS/BiCMOS technologies

Robust and novel devices called high-holding low-voltage trigger silicon controlled rectifiers (HH-LVTSCRs) for electrostatic discharge (ESD) protection of integrated circuits (ICs) are designed, fabricated and characterized. The S-type current-voltage (I-V) characteristics of the HH-LVTSCRs are adjustable to different operating conditions by changing the device dimensions and terminal interconnections. Comparison between complementary n- and p-type HH-LVTSCR devices shows that n-type devices perform better than p-type devices when a low holding voltage (V/sub H/) is allowed during the on-state of the ESD protection structure, but when a relatively high holding voltage is required, p-type devices perform better. Results further demonstrate that HH-LVTSCRs with a multiple-finger layout render high levels of ESD protection per unit area, applicable in the design of ICs with stringent ESD protection requirements of over 15 kV IEC.     

Simulation of ESD protection devices in an advanced CMOS technology using a TCAD workbench based on an ESD calibration methodology

An ESD TCAD Workbench with a library of ESD and Latchup devices and circuits has been developed in a 32 nm bulk CMOS technology. The devices which were developed from process and layout information were calibrated to experimental results in the low current DC and high-current/high-temperature ESD regime. The failure currents of ESD devices correlated to the experimental data to within 15% and the failure location of the devices in TCAD were confirmed using failure analysis.     

Lateral SCR devices with low-voltage high-current triggeringcharacteristics for output ESD protection in submicron CMOS technology

A high-current PMOS-trigger lateral SCR (HIPTSCR) device and a high-current NMOS-trigger lateral SCR (HINTSCR) device with a lower trigger voltage but a higher trigger current are proposed to improve ESD robustness of CMOS output buffer in submicron CMOS technology. The lower trigger voltage is achieved by inserting short-channel thin-oxide PMOS or NMOS devices into the lateral SCR structures. The higher trigger current is achieved by inserting the bypass diodes into the structures of the HIPTSCR and HINTSCR devices. These HIPTSCR and HINTSCR devices have a lower trigger voltage to effectively protect the output transistors in the ESD-stress conditions, but they also have a higher trigger current to avoid the unexpected triggering due to the electrical noise on the output pad when the CMOS ICs are in the normal operating conditions. Experimental results have verified that the trigger current of the proposed HIPTSCR (HINTSCR) is increased up to 225.5 mA (218.5 mA). But, the trigger voltage of the HIPTSCR (HINTSCR) remains at a lower value of 13.4 V (11.6 V). The noise margin against the overshooting (undershooting) voltage pulse on the output pad, without accidentally triggering on the HINTSCR (HIPTSCR), can be greater than VDD+12 V (VSS -12 V). These HIPTSCR and HINTSCR devices have been practically used to protect CMOS output buffers with a 4000-V (700-V) HEM (MM) ESD robustness but only within a small layout area of 37.6×60 μm² in a standard 0.6-μm CMOS technology without extra process modification     

寄生电阻对高压器件ESD性能的影响

本文从理论上分析了衬底寄生电阻以及漏端镇流电阻对高压LDMOS器件ESD特性的影响。文中采用了多种结构对上述参数进行优化,并将其在0.35μm BCD工艺下进行试验,测试结果表明增加寄生电阻可以有效地提高器件的ESD泄放能力,最优结构的二次击穿电流由原始器件的0.75A增大到3.5A,即泄放电流增加了367%。     

Design of 2.4-GHz T/R switch with embedded ESD protection devices in CMOS process

As CMOS processes advanced, the integration of radio-frequency (RF) integrated circuits was increasing. In order to protect the fully-integrated RF transceiver from electrostatic discharge (ESD) damage, the transmit/receive (T/R) switch of transceiver frond-end should be carefully designed to bypass the ESD current. This work presented a technique of embedded ESD protection device to enhance the ESD capability of T/R switch. The embedded ESD protection devices of diodes and silicon-controlled rectifier (SCR) are generated between the transistors in T/R switch without using additional ESD protection device. The design procedure of RF circuits without ESD protection device can be simplified. The test circuits of 2.4-GHz transceiver frond-end with T/R switch, PA, and LNA have been integrated and implemented in nanoscale CMOS process to test their performances during RF operations and ESD stresses. The test results confirm that the embedded ESD protection devices can provide sufficient ESD protection capability and it is free from degrading circuit performances.     

ESD issues in advanced CMOS bulk and FinFET technologies: Processing,protection devices and circuit strategies

The ESD performance of several CMOS bulk and SOI technologies is reviewed. The ESD area-efficiency of FinFETs is put in relation to bulk and SOI. CMOS bulk technologies have improved over the past generations owing to the possibility of reduced ESD layout dimensions. While having observed It2 values of less than 2 mA/μm² in 130 nm technology, we are able to obtain almost 4 mA/μm² in 45 nm. Downscaling will shift the challenge for a robust ESD design from the ESD protection device in the IO cell to the metal routing and voltage clamping in the supply tree. This will increase cost and effort for ESD protection of modern IC’s in spite of improvement in It2.For FinFET technologies, the influence of device layout, electrical operation modes and processing is discussed. The initially extremely low ESD values of FinFETs have been strongly improved by overall process maturity and added process features. The ESD levels of FinFET technologies are now scalable up to the levels compliant with full IC design constraints. While the area-performance is still about two times lower than in bulk CMOS, it is much better than anticipated earlier.In light of the challenges ahead for technology and circuit applications, the impact on ESD protection strategies is studied. Classical protection approaches are critically examined regarding the latest technology developments and new requirements for IO interface circuits. A switch from bulk to FinFET technology is still regarded as a major disruption for product architecture and thus ESD.     

Ladder-shaped network for ESD protection of millimetre-wave CMOS ICs

A compact ladder-shaped electrostatic discharge (ESD) protection circuit is presented for millimetre-wave integrated circuits (ICs) in CMOS technology. Multiple shorted shunt stubs form a ladder network together with series stubs as ESD protection that discharges current/voltage pulses caused by an ESD event, while at the same time the network is embedded as part of the matching circuit for a normal operation. A 60 GHz low-noise amplifier using a 90 nm CMOS process is demonstrated with the proposed ESD protection methodology that introduces less than 1 dB insertion loss. Owing to the ESD current distribution through multiple shorted stubs, the proposed methodology is useful to millimetre-wave ICs with advanced CMOS technology that suffers from higher sheet resistance of the metal layers.     

Optimization of on-chip ESD protection structures for minimal parasitic capacitance

Diodes are key components in on-chip electrostatic discharge (ESD) protection design. As the operating frequency of the microchip being protected against the ESD continues to increase, the parasitic capacitance associated with the diodes in the ESD structure starts to impose problems for RF operation. This paper presents a systematic approach to optimize the diode structure for minimal parasitic capacitance based on the requirements of breakdown voltage and heat dissipation. Device simulator Atlas with mix-mode simulation capability is calibrated against measurement data and used to carry out the optimization. An optimized diode structure with a parasitic capacitance of less than 30 fF at an operating frequency of 10 GHz and ESD charging voltage of 1 kV has been suggested. Furthermore, a case study to implement and optimize the ESD protection structure based on an existing 0.13-μm CMOS technology has been presented and verified.     

ESD reliability and protection schemes in SOI CMOS output buffers

The electrostatic discharge (ESD) protection capability of SOI CMOS output buffers has been studied with Human Body Model (HBM) stresses. Experimental results show that the ESD voltage sustained by SOI CMOS buffers is only about half the voltage sustained by the bulk NMOS buffers. ESD discharge current in a SOI CMOS buffer is found to be absorbed by the NMOSFET alone. Also, SOI circuits display more serious reliability problem in handling negative ESD discharge current during bi-directional stresses. Most of the methods developed for bulk technology to improve ESD performance have minimal effects on SOI. A new Through Oxide Buffer ESD protection scheme is proposed as an alternative for SOI ESD protection. In order to improve ESD reliability, ESD protection circuitries can be fabricated on the SOI substrate instead of the top silicon thin film, after selectively etching through the buried oxide. This scheme also allows ESD protection strategies developed for bulk technology to be directly transferred to SOI substrate.<>     

Characteristics of ESD protection devices operated under elevated temperatures

In this paper, characteristics of electrostatic discharge (ESD) protection devices operating under ESD stress and various ambient temperatures are investigated. The devices considered are a P +/NW diode and several silicon controlled rectifiers (SCRs) including Lateral SCR (LSCR), Modified Lateral SCR (MLSCR), No Snapback SCR (NS-SCR), Low Voltage Triggering SCR (LVTSCR), and P-Substrate Triggered SCR (PSTSCR) fabricated in a 0.35 μm BCD (Bipolar-CMOS-DMOS) technology. Measurements are conducted using the Barth 4002 transmission line pulse (TLP) tester and the Signatone S1060 heating module, and the TLP I–V characteristics are analyzed in details. TCAD simulation is carried out and underlying physical mechanisms related to the effect of temperature on key ESD parameters are provided.     

一种CMOS新型ESD保护电路设计

金属氧化物半导体(MOS)器件的缩放技术使集成电路芯片面临着严重的静电放电(ESD)威胁,而目前采用的ESD保护电路由于电流集边效应等原因,普遍存在着抗静电能力有限、占用较大芯片面积等问题。根据全芯片ESD防护机理,基于SMIC 0.18μm工艺设计并实现了一种新型ESD保护电路,其具有结构简单、占用芯片面积小、抗ESD能力强等特点。对电路的测试结果表明,相对于相同尺寸栅极接地结构ESD保护电路,新型ESD保护电路在降低35%芯片面积的同时,抗ESD击穿电压提升了32%,能够有效保护芯片内部电路免受ESD造成的损伤和降低ESD保护电路的成本。     

Damped transient power clamps for improved ESD protection of CMOS

Small transient power clamps that include inverters may oscillate and disengage during an HBM ESD event. A transient power clamp created in a 0.25 μm process revealed an interesting solution to the problem. Adding a resistance to the final inverter may improve ESD performance.     

Circuit and process design considerations for ESD protection in advanced CMOS processes

This paper reviews many of the important issues for building ESD protection with NMOS transistors containing silicided diffusions and lightly doped drain junctions. The impact of device process parameters, such as gate length, side-wall spacer and silicided, graded junctions, on NMOS ESD performance are discussed. More recent process advances, such as LATID and halo implants, are also reviewed. Several varieties of circuits for triggering NMOS protection transistors under ESD conditions are covered.     

Low temperature characterization of silicon CMOS devices

A brief review of the main physical results concerning the low temperature characterization of Si CMOS devices is presented. More specifically, the carrier mobility law, saturation velocity, short channel effects, impact ionization phenomenon, hot carrier effects and parasitic leakage current are discussed.     

SPICE level implementation of physics of filamentation in ESD protection devices

In this work, we build circuit models to understand the physics of electro-thermal instability and associated thermal runway in advanced ESD protection devices under filamentation. The circuit building methodology takes into account, the instability arising out of inhomogeneous triggering of 2 − D planar bipolar and looks into inherent instability causing the 3 − D phenomenon. Subsequently, the electro-thermal coupling is analyzed to get SPICE model, as we develop a physics based methodology to comprehend the 3 − D localization in the device. Furthermore, we understand the instability through appropriate modeling of localization behavior using area factor (α) and related electro-thermal circuit models.     

High frequency analytical modelling and performance comparison of nanoscale SOI MOS structures

A generalized high frequency analytical model of nanoscale Semiconductor-On-Insulator (SOI) MOS structure, valid for different competitive nanoscale SOI MOS structures is developed. Interface roughness and trap-charge effects are incorporated in addition to different common short channel effects to make the model valid for SOI structures with non-native gate dielectrics. Analytical models for threshold voltage, current-voltage, conductance, cut-off frequency and noise factor have been derived starting from basic 2D Poisson’s equation with some innovative modifications. Performances of three competitive MOSFET structures – Silicon-On-Insulator (SiOI), Germanium-On-Insulator (GeOI) and Gallium arsenide-On-Insulator (GaOI) have been simulated and compared. It has been found that the overall performance of the structure is determined by combined effects of different material, structural and operation parameters, which may or may not improve the performance of the structure when considered individually. As an example, when higher channel mobility of GaAsOI tries to improve its performance, lower intrinsic carrier concentration, higher interface roughness, trap-charge etc. try to limit its performance. This work demonstrated that a trade-off or parameter optimization is vital for effective selection of one structure over others.     

Analysis on the dependence of layout parameters on ESD robustness of CMOS devices for manufacturing in deep-submicron CMOS process

The layout dependence on ESD robustness of NMOS and PMOS devices has been experimentally investigated in details. A lot of CMOS devices with different device dimensions, layout spacings, and clearances have been drawn and fabricated to find the optimized layout rules for electrostatic discharge (ESD) protection. The main layout parameters to affect ESD robustness of CMOS devices are the channel width, the channel length, the clearance from contact to poly-gate edge at drain and source regions, the spacing from the drain diffusion to the guard-ring diffusion, and the finger width of each unit finger. Non-uniform turn-on effects have been clearly investigated in the gate-grounded large-dimension NMOS devices by using EMMI (EMission MIcroscope) observation. The optimized layout parameters have been verified to effectively improve ESD robustness of CMOS devices. The relations between ESD robustness and the layout parameters have been explained by both transmission line pulsing (TLP) measured data and the energy band diagrams.     

Influence of parasitic structures on the ESD performance of a pure bipolar process

The purpose of this work is to show that parasitic structures greatly affect the ESD performance of a bipolar process. More especially, the existence of a parasitic diode in parallel to the protection transistor in the input stages of a pure bipolar IC leads to a low ESD performance for HBM stresses, while the ESD performance for MM stresses is high. Suppression of this diode significantly increases the ESD performance for both types of stresses.