垂直结构GaN基LED的侧壁优化技术

为了提升垂直结构LED提取效率,针对器件侧壁出光的研究越发引起研究人员的关注。由于GaN的高折射率,大部分有源区发出的光线将被限制在GaN层内横向传输。对不同刻蚀倾角侧面的光提取效率进行分析模拟,模拟结果显示,LED的提取效率可以通过侧壁倾斜角度的优化得以提升。实验结果表明,特定侧壁倾角器件的提取效率相比较垂直侧壁提高了18.75%,电致发光光谱测试(EL)结果表明,实验结论与理论计算值基本吻合。本结论对垂直结构GaN基LED器件的优化设计与性能提升有重要指导意义。     

垂直结构GaN基LEDs热压键合应力损伤分析

热压键合是垂直结构LED制备的关键工艺步骤,通过TEM,PL,Raman等测试手段,探讨热压键合造成的应力损伤、GaN材料缺陷、LED内量子效率以及反向漏电间的内在联系,研究以键合引起的应力诱导垂直结构GaN基LED光电特性的退化机制,探讨应力损伤对垂直结构GaN基LED光电特性的影响.实验结果表明,热压键合过程会在GaN材料内产生GPa量级的残余应力,在量子限制strark效应作用下,GaN材料辐射复合效率发生明显退化;同时热压键合应力还会诱发GaN材料位错密度的增加,最终导致LED反向漏电增大.     

导电胶粘接可伐载板工艺的仿真与优化

导电胶是一种很有潜力的互连材料,其粘接可靠性是制约其应用的主要因素。基于对某混频模块粘接失效的分析,探索温度试验条件及载板尺寸对可伐载板粘接可靠性的影响。通过仿真和试验设计,研究不同温度试验条件下不同尺寸载板在粘接界面处的应力分布情况,并优化了可伐载板粘接工艺。结果表明,温度试验条件越严苛,载板尺寸越大,可伐载板粘接可靠性越差,可采取环氧绝缘胶加固或柔性导电胶粘接的方式对其粘接工艺进行优化。     

纸基柔性RFID标签金属天线制备

纸张基材具备的多孔特性使其表面的液体材料产生了渗透、扩散等现象,因此在纸基的表面利用化学镀形成RFID标签金属天线极为困难。针对这个问题,文中采用氯化亚锡胶体溶液对纸张表面进行处理以避免转印油墨渗透。为进一步提高RFID标签天线金属层的导电性和附着力,采用壳聚糖溶液处理纸张基板表面以引入对催化离子具有吸附性的功能基团。SEM、XRD、EDS和附着力测试证明,文中所制备RFID标签天线的金属层表面具有致密、结晶度高、附着力良好、电阻率低(2.58×10 ^-8 Ω·cm)且机械性能良好(1 000次弯曲)等优点。     

各向异性导电胶粘结工艺技术研究

分析了影响各向异性导电胶粘结可靠性的各因素,通过正交实验优化工艺参数,并在150℃高温贮存以及-65℃～150℃温度循环后对导电胶的剪切强度和接触电阻进行了可靠性实验。结果表明:影响ACA可靠性的主要因素导电粒子体积比例为15%,粘结温度200℃,时间10s,粘结压力为39.2N时,导电胶的剪切强度为286.2N,凸点的接触电阻为35mΩ。在可靠性试验后,导电胶的剪切强度满足GJB548B-2005的要求,接触电阻变化率小于5%。     

利用平片蓝宝石衬底制备高功率垂直结构LED

在平片蓝宝石衬底上,通过引入AlN缓冲层,优化成核层与粗糙层的生长条件,生长出了表面平整的GaN薄膜,晶体质量得到显著提升。通过引入AlN缓冲层,将X射线衍射(XRD)下样品(002)面的半高宽(FWHM)由232″降低至148″;通过减薄成核层厚度、提升粗糙层生长压力,将样品(102)面和(100)面的FWHM分别由243″和283″降低至169″和221″。研究了不同成核层和粗糙层的生长参数对GaN薄膜表面形貌的影响,随着(102)面和(100)面FWHM的降低,表面平整度亦得到改善,粗糙度由约3.8 nm下降到约1.6 nm。利用优化后的底层条件生长了高质量GaN薄膜,在3.5 A/mm^2电流密度下,与参考样品相比,制备出的LED样品的光输出功率由863 mW提升至942 mW,提升了约9%。     

一种新型芯片粘接用导电银胶的性能研究

制备了一种由环氧树脂基体、咪唑类固化剂、微米级银粉和活性稀释剂体系构成的导电银胶。该导电银胶的常温体积电阻率为3.7×10~(-4)Ω·cm,搁置寿命大于48 h,粘度适中,耐热散热性能良好。将该导电银胶应用在3种引线框架并考察其可靠性,结果表明导电银胶与无镀层框架的粘接性最好,但在高温时各框架的粘接性相差不大。同时考察了该导电银胶应用于LGA封装的芯片粘接效果,封装后界面无气泡和分层现象。     

基于LCP柔性衬底的MEMS V型梁结构的设计制备与表征

为探索在复杂环境应用中柔性衬底弯曲对V型梁结构力学特性的影响,提出了一种基于LCP柔性衬底弯曲条件下MEMS V型梁结构的力学分析方法,对柔性MEMS V型梁器件的弯曲特性从软件仿真和实验验证两个方面进行深入的研究。揭示了MEMS V型梁衬底发生弯曲后,对器件驱动性能的影响。实验结果表明,当柔性衬底弯曲曲率从0增大到33.3 m^-1,V型梁热驱动器的驱动电流逐渐增大,测量值与仿真值的误差小于6.0%,与理论模型相符。     

LCP柔性基板的薄膜电阻制作技术

针对液晶聚合物(LCP)柔性基板高频电子封装应用需求,采用一种薄膜溅射工艺直接在LCP柔性基板上制作TaN薄膜电阻,研究不同等离子体预处理方式对LCP表面形貌和LCP表面薄膜金属膜层附着强度的影响,进一步研究溅射气压和氮气体积分数等参数对电阻性能的影响,考察LCP柔性基板上的TaN薄膜电阻精度及电阻温度系数(TCR),...     

Liquid Metal Droplets Wrapped with Polysaccharide Microgel as Biocompatible Aqueous Ink for Flexible Conductive Devices

Nanometerization of liquid metal in organic systems can facilitate deposition of liquid metals onto substrates and then recover its conductivity through sintering. Although having broader potential applications, producing stable aqueous inks of liquid metals keeps challenging because of rapid oxidation of liquid metal when exposing to water and oxygen. Here, a biocompatible aqueous ink is produced by encapsulating alloy nanodroplets of gallium and indium (EGaIn) into microgels of marine polysaccharides. During sonicating bulk EGaIn in aqueous alginate solution, alginate not only facilitates the downsizing process via coordination of their carboxyl groups with Ga ions but also forms microgel shells around EGaIn droplets. Due to the deceasing oxygen‐permeability of microgel shells, aqueous ink of EGaIn nanodroplets can maintain colloidal and chemical stability for a period of >7 d. Crosslinked alginate‐gel with tunable thickness can retard the generation and release of toxic cations, thereby affording high biocompatibility. The soft alginate shells also enable to recover electric conductivity of EGaIn layers by “mechanical sintering” for applications in microcircuits, electric‐thermal actuators, and wearable sensors, offering huge potential for electronic tattoos, artificial limbs, electric skins, etc.     

再流焊高温对导电胶粘接工艺可靠性影响研究

该文描述了H20E导电胶粘接工艺优化为先粘接固化再回流焊接工艺流程后过程经过高温冲击,对该工艺流程下环氧胶粘接强度、电气连接可靠性进行验证.通过剪切强度评价、可靠性试验考核、接触电阻测试统计分析、电容粘接界面切面微观金相研究,表明工艺流程优化为先粘接再回流焊接,H20E导电胶粘接工艺满足可靠性需求.     

Stretchable Conductive Composites Based on Metal Wools for Use as Electrical Vias in Soft Devices

Soft devices can be bent, stretched, and compressed reversibly, but conventional wires are rigid. This work describes stretchable composites that are easily fabricated with simple tools and commodity materials, and that can provide a strategy for electrical wiring that meets certain needs of soft devices. These composites are made by combining metal wool and elastomeric polymers. Embedding fine (average fiber width ≈25 μm) steel wool (or other metal wools) in a silicone polymer creates an electrically conductive path through the nonconductive elastomer. This composite is flexible, stretchable, compressible, inexpensive, and simple to incorporate into the bodies of soft devices. It is also electrically anisotropic, and shows maximum conductivity along the majority axis of the fibers, but maximum extension perpendicular to this axis. The utility of this composite for creating an electrically conductive path through an elastomer was demonstrated in several devices, including: a soft, solderless breadboard, a soft touch sensor, and a soft strain gauge.     

金属基板用高导热胶膜的研究

本实验首先通过韧性树脂改性环氧,制备了一种覆铜板用胶膜树脂,用该树脂制备的胶膜具有高达2.67N/mm的剥离强度,并且具备较高的柔韧性和耐热性。将高导热无机填料通过复配方式均匀分散到该胶液中,得到了一种高导热胶膜,该胶膜可应用于金属基覆铜板上,并且具有2.45W/M·K热导率,1.05～1.1N/mm剥离强度,同时还具有较好的电气强度,耐热性。     

A Review on the Physical Mechanisms That Limit the Reliability of GaN-Based LEDs

We review the failure modes and mechanisms of gallium nitride (GaN)-based light-emitting diodes (LEDs). A number of reliability tests are presented, and specific degradation mechanisms of state-of-the-art LED structures are analyzed. In particular, we report recent results concerning the following issues: 1) the degradation of the active layer induced by direct current stress due to the increase in nonradiative recombination; 2) the degradation of LEDs submitted to reverse-bias stress tests; 3) the catastrophic failure of advanced LED structures related to electrostatic discharge events; 4) the degradation of the ohmic contacts of GaN-based LEDs; and 5) the degradation of the optical properties of the package/phosphors system of white LEDs. The presented results provide important information on the weaknesses of LED technology and on the design of procedures for reliability evaluation. Results are compared with literature data throughout the text.     

聚酰亚胺型导电胶装片固化工艺的研究

本文讨论了聚酰亚胺型导电胶在装片固化时可能产生孔洞的类型及机理,在些基础上确定了随芯片尺寸的增大需对固化工艺进行相应调整的基本原则,并提出了不同尺寸芯片的固化工艺曲线。     

Fabrication of YBCO Coated Conductors on Biaxial Textured Metal Substrate by All-Sputtering

CeO2/YSZ/CeO2 buffer layers were prepared on biaxial textured Ni-5at.%W substrate by direct-current magnetron reactive sputtering with the optimum process. YBCO thin films were deposited on CeO2/YSZ/CeO2 buffered Ni-5at.%W substrate at temperature ranging from 500℃ to 700℃ by diode de sputtering. By optimizing substrate temperature, pure c-axis oriented YBCO films were obtained. The mierostruetures of CeO2/YSZ/CeO2 buffer layers were characterized by X-ray diffraction. A smooth, dense and crack-free surface morphology was observed with scanning electron microscopy. The critical current density Jc about 0.75 MA/cm2 at 77 K was obtained.     

适合于制作绝缘体上硅的硅片粘合技术及其应用

本文介绍了将我们开发的硅片粘合技术与传统Ｖ形槽隔离工艺相结合而研制成功的一种新的介质隔离方法。文中指出了传统Ｖ形槽介质隔离方法的不足，给出了新的介质隔离方法的工艺路线，介绍了该方法在抗辐照集成稳压器中的应用。     

Study of the Formation of Bubbles in Rigid Substrate-Flexible Substrate Bonding Using Anisotropic Conductive Films and the Bubble Effects on Anisotropic Conductive Film Joint Reliability

The formation of process-related bubbles that become entrapped inside the anisotropic conductive film (ACF) layer during bonding processes remains an issue. The formation of these bubbles is strongly influenced by the process variables, such as bonding pressure and bonding temperature. Therefore, bonding process variables of bonding temperature, bonding pressure, and type of flexible substrate (FS) were changed in order to investigate the effects of the changes as they concern the formation of bubbles. According to the results, the tendency toward bubble formation was closely related to these three factors. The bubble area increased as the bonding temperature increased. Moreover, the shape and tendency of bubbles coincided with temperature distribution in␣the ACF layer. Two different types of FS, each with different surface roughnesses and energies, were used. The bubbles formed only on the FS with the larger roughness and lower surface energy. According to the results from a surface energy measurement of FS types using goniometry, a FS with a higher surface energy is favorable for a bubble-free assembly, as the higher surface energy provides better wettability. In addition, in order to investigate the effect of bubbles on the reliability of ACF joints, the pressure cooker test (PCT) was performed, and all samples with bubbles electrically failed after 72 h of a PCT, as the process-related bubbles provided a moisture penetration path and entrapment site for moisture. However, all type 1 test vehicles (TVs) survived even after 120 h of a PCT. Therefore, Ar and O₂ plasma treatments were performed on the FS with the lower surface energy in order to improve the surface energies and wettability. Following this, the bubbles were successfully removed at rigid substrate (RS)–FS bonding joints using ACFs.