基于ARM架构的视频服务器设计

设计了一种基于ARM平台、Linux操作系统的视频监控设备。该套系统的服务器端使用了嵌入式的硬件编码传输平台,对基于ARM的网络视频监控系统进行了研究与设计。首先在对系统进行需求分析的基础上对系统硬件进行了总体设计,采用ARM9内核的GM8180芯片搭建硬件平台。通过硬件编解码芯片,在嵌入式平台上将实时采集进来的视频信号进行高质量的H.264压缩编码,并通过RTP封包进行网络传输。系统能够很好地实现监控中视频流的实时传输,能够保证视频流传输的实时、完整和高效,从而达到设计目的。     

基于NiosII的嵌入式网络视频监控系统设计

为了解决传统嵌入式网络视频监控系统处理和传输大量图像数据时速度较慢、结构复杂和成本过高的问题.设计了一种低成本嵌入式网络视频监控系统,采用FPGA的NiosⅡ双CPU架构,自定义硬件模块实现H.264视频数据压缩编码,能很好地满足视频监控系统实时性要求.     

基于S3C6410的视频监控系统的设计与实现

为了实现一种简单,可靠性高的嵌入式视频监控系统,基于三星S3C6410微处理器系统,结合嵌入式技术和图像处理技术,利用S3C6410的硬件编码模块MFC进行MPEG-4编码,采用实时传输协议通过网络进行视频传输。经局域网条件下测试,该系统采集传输视频质量较好,性能稳定,满足低成本、高可靠性的嵌入式视频监控要求。在描述系统框架的同时,更具体地说明了实现部分的关键代码示例。     

基于3G手机的视频监控系统的设计

3G网络的发展,手机将成为信息社会的核心枢纽,随时、随地地进行远程检测实时监控已成为需求.介绍了基于Micro2440开发板的手机视频监控系统,前端视频采集以ARM920t内核的嵌入式微处理器S3C2440为硬件核心,以WinCE为嵌入式实时操作系统.传输系统采用中国联通的WCDMA无线网络,应用万维网作为服务器,后端...     

电梯监控系统中的视频编解码关键技术

本文针对电梯运行环境,设计了视频监控和广告播放一体化嵌入式系统,实现了电梯监控、视频播放、网络传输等功能.为降低产品化后的硬件成本和体积,系统基于S5PV210嵌入式芯片开发以单CPU结构实现所有应用功能.为保证系统的运行效率,针对视频的采集、传输和播放,设计实现了硬件编解码技术.实验证明,利用该视频编解码技术,可使系统各功能模块高效并行工作,从而大大降低系统资源占用率,提高产品的市场竞争力.     

嵌入式多源高清视频监控系统设计与实现

针对高清视频监控系统的实际应用,基于FPGA和DSP嵌入式技术,设计并实现了一套基于FPGA和DSP嵌入式技术的多源高清视频监控系统。其中以FPGA和DSP芯片为板卡核心,采用模块化设计思想,实现了四路压缩视频流的解压缩和图像处理功能。使用SOPC构建基于NiosⅡ软核处理器的微控制器系统,实现视频的数据格式转换、缩放和叠加功能,将四路视频叠加拼接成一路视频。利用硬件编程实现视频流与辅助信息的同步,将整合后的视频数据通过PCI接口传输给上位机应用程序显示。最终通过试验给出了系统的监控效果,证明了系统的可行性和优越性。     

基于Linux的无线视频监控系统的研究

随着嵌入式技术、图像压缩技术以及无线传输技术的发展,基于嵌入式系统的无线视频监控系统已成为视频监控领域的发展趋势。文章将嵌入式系统的特点与无线传输技术相结合,研究和开发出一种基于Linux的无线视频监控系统。本嵌入式视频监控系统采用C/S架构,服务器基于ARM11处理器,搭载嵌入式Linux系统,主要实现图像的采集、压缩、预览和传输;PC机作为客户端主要实现视频图像的解压、显示以及参数设置等功能。     

移动视频监控系统的设计与实现

提出一种基于3G无线网络平台实时传输MPEG-4流媒体的策略,结合移动视频监控系统,给出总体设计框图,并对嵌入式移动视频监控系统的软件设计进行了阐述.在3G网络平台上的运行表明,该系统能在带宽有限的情况下很好地工作.     

基于i.MX27的移动视频监控终端的设计

研制了一种基于H.264移动视频监控系统,采用i.MX27芯片作为嵌入式CPU芯片,片内集成了H.264硬件编解码视频处理单元。从系统的硬件设计和软件设计两部分介绍了系统的视频采集、压缩、存储、传输及系统控制等方面设计。实验证明,该系统集成度高、成本低、功耗小、功能多而强大,在移动视频监控领域中有广泛的应用前景。     

嵌入式无线视频小车的设计与实现

随着嵌入技术的飞速发展,各式各样的嵌入式系统应用已逐渐走进我们的生活。通过设计将嵌入式的特点应用在可移动小车架构上,满足了不同监控场合的灵活性需求。在三星S3C2440型ARM芯片上移植嵌入式Linux操作系统,修改I/O驱动程序来实现对小车的方向控制,加入无线传输模块实现视频和控制信号的远程传输。通过实践实现了视频画面的无线传输和小车的远程控制,为整个系统的开发打下了良好的基础。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.