研磨硬脆材料的金刚石磁性磨料制备

运用化学复合镀法制备了用于硬脆材料研磨的金刚石磁性磨料。采用单因素实验方法研究了铁粉的装载量、金刚石磨粒的浓度以及机械搅拌的速度对金刚石相对含量的影响。通过石英玻璃的平面磁控研磨加工实验测试了制备的金刚石磁性磨料的研磨性能。结果表明,当铁粉的装载量为6 g/L,金刚石磨粒浓度为6 g/L,搅拌速度为300 r/min时,金刚石相对含量较高。金刚石磨粒在Ni-P合金镀层中粘结牢固,分散均匀。通过磁控研磨加工,石英玻璃的表面粗糙度快速地从0.709μm降低到0.138μm,证明了制备的金刚石磁性磨料具有较好的研磨性能。     

固结磨料研磨技术研究

通过对容器密封面研磨工艺性试验研究,改进创新研究出固结磨料研磨的方法,使得研磨效率、研磨质量得到了大大提高。     

游离磨料和固结磨料研磨后亚表面裂纹层深度研究

不同研磨方式加工K9玻璃产生不同的亚表面裂纹层深度,亚表面裂纹层深度的测量对确定材料下一步的加工去除量和提高加工效率具有重要意义。利用磁流变抛光斑点法测量游离磨料和固结磨料两种方式研磨后的亚表面裂纹层深度,每种研磨方式选用粒径分别为W40和W14的两种磨料。结果表明:磨粒粒径为W40和W14的游离磨料研磨后K9玻璃的亚表面裂纹层深度分别为20.1μm和3.646μm,而对应固结磨料研磨后的深度分别为3.37μm和0.837μm。固结磨料研磨在加工过程中能有效减小K9玻璃的亚表面裂纹层深度,提高加工效率和工件表面质量,改善器件的性能。     

铌酸锂晶体的研磨亚表面损伤深度

针对光学材料研磨过程引入的亚表面损伤层(SSD)深度对工件的抛光工序效率和表面质量的影响,探索了光学材料在研磨过程中的亚表面损伤规律。采用角度抛光的方法测量了软脆材料铌酸锂(LN)晶体的损伤层深度,分析了研磨方式、磨粒粒径和研磨压力对工件亚表面损伤层的影响规律。结果表明:研磨方式对损伤缺陷的影响最为显著,相同研磨条件下游离磨料研磨后的损伤层深度约为固结磨料研磨的3~4倍,游离磨料研磨后工件亚表面存在多处圆弧形裂纹,固结磨料研磨后主要显现细小裂纹和"人"字型裂纹;当磨粒粒径从W28下降到W14后,游离研磨的亚表面损伤层深度下降至原来的45%,而固结研磨的损伤层深度下降至30%;另外,研磨压力的降低有利于减小工件的亚表面损伤。该研究对LN晶体研磨方式及研磨工艺的选择具有指导意义。     

不等磨料密度的固结磨料磨具研磨

提出了一种采用固结磨料磨具进行高速研磨的方法,根据工件相对磨具的相对运动轨迹密度设计磨具磨料密度分布,在显著提高加工效率、降低加工成本同时,又提高了加工精度和加工质量     

固结磨料研磨K9玻璃表面粗糙度模型

表面粗糙度模型是研磨过程设计和工艺参数选择的重要依据,K9玻璃是应用最广泛的光学材料之一。建立研磨K9玻璃表面粗糙度模型有利于提高加工效率、节约生产成本。简化固结磨料研磨过程,基于研磨垫表面微结构,计算研磨过程中参与研磨的有效磨粒数和单颗磨粒切入工件深度,利用研磨过程中受力平衡,建立固结磨料研磨K9玻璃表面粗糙度模型。采用不同磨粒粒径和不同磨料浓度的固结磨料研磨垫以及不同压力研磨K9玻璃验证表面粗糙度模型。结果表明：固结磨料研磨K9玻璃的表面粗糙度与磨粒粒径、研磨压力1/3次方成正比,与研磨垫浓度2/9次方成反比。表面粗糙度理论值与试验值随研磨压力、磨粒粒径和研磨垫浓度的变化趋势吻合。利用该模型能够成功预测固结磨料研磨K9玻璃表面粗糙度,指导研磨过程设计及加工过程中研磨垫和工艺参数的选择,可靠性高。     

三乙醇胺在镁铝尖晶石固结磨料研磨中的作用

探索了三乙醇胺在镁铝尖晶石固结磨料研磨中的作用机理并进行了系列实验。首先,通过显微压痕实验测量了三乙醇胺和去离子水作用下镁铝尖晶石样品的硬度。然后,采用X射线光电子能谱仪(XPS)分析了三乙醇胺的化学作用机理,研究了在三乙醇胺和去离子水作用下工件表面层化学组分随深度的变化,估算了其表面软化层的厚度。最后,通过研磨实验探索了去离子水和不同浓度的三乙醇胺对材料去除率和表面质量的影响。结果表明:三乙醇胺研磨液对工件的化学作用降低了其表面层的显微硬度,形成了软化层;三乙醇胺和去离子水形成软化层的机制是其中的OH-和吸附的CO2与尖晶石基体发生了反应,而三乙醇胺形成的软化层厚度约为2nm,去离子水形成的软化层厚度小于0.65nm;采用三乙醇胺研磨液的材料去除率高于采用去离子水,但表面质量较采用去离子水的差。实验证明,三乙醇胺对工件的化学作用可以显著地提高材料去除效率。     

基于研磨加工参数的亚表面损伤预测理论和试验研究

为实现研磨亚表面损伤深度的无损、快速和准确检测,并预测研磨参数对亚表面损伤深度的影响规律,针对光学材料研磨加工过程建立基于研磨加工参数的亚表面损伤深度预测模型.使用磁流变抛光斑点技术测量K9玻璃在不同研磨条件下的亚表面损伤深度,对上述预测模型进行试验验证.最后,提出以提高光学零件加工效率为目的的研磨加工策略.研究表明:建立的研磨亚表面损伤深度预测模型能够通过研磨加工参数对亚表面损伤深度进行有效的预测;研磨亚表面损伤深度与磨粒粒度、研磨盘硬度和研磨压强成正比关系,与研磨速度和研磨液浓度成反比关系;磨粒粒度对亚表面损伤深度的影响最显著,研磨压强的影响次之,研磨盘硬度、研磨速度和研磨液浓度的影响较小;为提高光学零件加工效率,建议在研磨过程中选取较高的研磨速度和较浓的研磨液,以在降低亚表面损伤深度的同时提高材料去除效率.     

固结磨料研磨蓝宝石单晶过程中研磨液的作用

开展了固结磨料研磨单晶蓝宝石面板的实验研究,探索了不同研磨液对材料去除速率和工件表面质量的影响。分析了研磨液对蓝宝石表面的化学作用,探索了固结磨料研磨蓝宝石晶体的材料去除机理。实验显示:使用W14镀镍金刚石固结磨料研磨蓝宝石单晶,研磨液仅为去离子水时,材料去除率(MRR)为149.8nm/min、表面粗糙度(Ra)为76.2nm;而研磨液中加入2%的乙二醇后,相应的MRR为224.1nm/min,Ra为50.7nm。用光电子能谱仪(XPS)分析了工件表面,结果表明含有乙二醇的研磨液能够增加蓝宝石工件表面的活性。得到的结果显示:在溶液中加入乙二醇有利于表面软化层的生成并增加蓝宝石表面的活性,说明研磨液对蓝宝石单晶研磨效率的提升和表面质量的改善具有促进作用。     

碳化硼研磨后蓝宝石晶体的亚表面损伤

介绍了蓝宝石材料的亚表面损伤形成机制。考虑碳化硼磨料可产生较小亚表面损伤的优点,本文基于游离磨料研磨方式,研究了不同粒度碳化硼磨料研磨后蓝宝石晶体的亚表面损伤。利用KOH化学腐蚀处理技术,对研磨后的样品进行了刻蚀;通过特定的腐蚀坑图像间接反映了蓝宝石晶体的亚表面损伤形貌特征,获得了W20、W10和W5碳化硼磨料产生的亚表面损伤深度,得到了在不同刻蚀时间下蓝宝石亚表面损伤形貌、表面粗糙度和刻蚀速率。研究结果显示:游离碳化硼磨料研磨造成的蓝宝石晶体的亚表面损伤密度相当显著,但损伤深度并不大,其随磨料粒度的增大而增大,W20、W10和W5粒度的磨料研磨后产生的亚表面损伤深度分别为7.4,4.1和2.9μm,约为磨料粒度的1/2。得到的结果表明采用碳化硼磨料研磨有利于获得低亚表面损伤的蓝宝石晶片,而采用由大到小的磨料逐次研磨可以快速获得低亚表面损伤的蓝宝石晶片。     

研磨压力对固结聚集体磨料垫自修正影响

固结磨料研磨过程中磨料的微破碎是实现固结磨料垫自修正特性的主要途径,研磨压力是影响磨粒微破碎的关键参数。选用单晶金刚石和聚集体金刚石作为磨粒制备固结磨料垫,在15 kPa压力下以石英玻璃为加工对象进行研磨实验,比较两者的材料去除率及加工稳定性;制备了4种陶瓷结合剂含量的聚集体金刚石,并制备成固结聚集体金刚石磨料垫,探索了不同压力下的固结聚集体金刚石磨料垫的自修正性能;分析了研磨后的工件表面粗糙度和表面微观形貌。结果表明:采用固结聚集体金刚石磨料垫,研磨后工件表面粗糙度低,去除效率稳定;在15~21 kPa的压力下,结合剂含量次高的聚集体金刚石研磨效率高,材料去除率达到8.94~12.43μm/min,加工性能较稳定,研磨后的工件表面粗糙度R a在60 nm左右;在3.5~7 kPa压力下,结合剂含量次低的聚集体金刚石研磨性能较稳定,材料去除率在2.67~3.12μm/min,研磨后的表面粗糙度R a在40 nm左右。高结合剂含量的聚集体金刚石磨粒更适合高研磨压力条件,而低结合剂的聚集体金刚石磨粒更适合于低研磨压力。     

基于PFC3D的研磨片研磨过程离散元仿真

针对研磨片研磨过程中工件表面粗糙峰去除和研磨片磨粒涂覆层磨粒脱落的问题,将离散元技术应用到研磨片研磨过程微观表面变化研究中。以PFC3D软件为平台,对研磨片的研磨过程进行了建模与仿真,将模型简化为理想梯形凸起的粗糙峰层和磨粒-结合剂混合层的相互接触摩擦过程,通过双轴试验表征了模型微观参数,开展了单元接触点不平衡力的变化规律、单元脱落过程、磨粒涂覆层中结合剂结合强度以及砂结比对研磨过程的影响分析。研究结果表明,接触点处的不平衡力呈现散射样式逐步减弱,不平衡力峰值为5.9×103N;磨粒平行粘结强度为723 Pa,砂结比为1∶6时研磨效果最好,粗糙峰可以有效去除,表层钝化磨粒可以有效脱落。     

Kinematics and trajectory analysis of the fixed abrasive lapping process in machining of interdigitated micro-channels on bipolar plates

The fixed abrasive lapping process is presented to investigate its ability and accuracy in machining of interdigitated micro-channels on bipolar plates that are used in the proton exchange membrane fuel cell. A kinematical equation to describing the relative movement between the fixed abrasive lapping plate and workpiece is developed and used to numerically simulate the trajectories of a single diamond abrasive and fixed diamond abrasives with 17 different arraying forms, respectively. It is shown that the lapping trajectory can be superposed periodically when the rotation ratio is a rational number. By assessing the uniformity of lapping trajectories and opening ratio of the bipolar plate the optimized rotation ratio is obtained which is 1:1, and the best arraying form of the fixed diamond abrasives on the lapping plate has been obtained as well that is the arraying form of C4. Then, a set of fixed abrasive lapping tests were conducted to explore its ability in machining of interdigitated micro-channels on bipolar plates. It is found that larger material removal rate can be achieved by employing bigger lapping pressure and higher rotation speed for both copper and stainless steel samples considered in this study. The maximum cell power density is found to be about 165 mW cm⁻² by testing the performance of a single micro fuel cell with a bipolar plate characterized by interdigitated micro-channels that shows a good cell performance.     

光学镜片亚表面损伤形成数值模拟与分析

针对当前光学镜片亚表面损伤的研究重点主要集中在加工工艺参数及磨粒粒径、分布等方面的现状,基于脆性材料压痕断裂理论,深入分析了加工过程所导致光学镜片亚表面损伤,对不同锐度角的磨粒在相同载荷不同加工速度下与光学镜片表面间的抛光过程进行了微观动态仿真。获得了在不同加工参数作用下磨头与镜片表面间的摩擦接触、应力应变分布及亚表面损伤等情况,归纳出亚表面损伤裂纹深度、亚表面损伤空穴深度、体积去除率、表面破损率、磨粒锐度角及磨抛速度等相关参数之间的关系,并得出如下结论：当磨粒锐度角为54°~58°,加工速度为7～8m/s时,加工后的镜片在保证一定加工效率的同时,产生的亚表面损伤及表面破损率最小。     

Chemo-mechanical grinding by applying grain boundary cohesion fixed abrasive for monocrystal sapphire

This paper presents a novel fixed abrasive tool namely grain boundary cohesion fixed abrasive pellet (GBCFAP) which is able to provide higher finishing efficiency as well as better surface/subsurface quality of sapphire substrate during the chemo-mechanical grinding (CMG) process. The manufacturing procedures of GBCFAP are introduced in detail in this paper. It is found that the sintering temperature plays an important role to the strength of GBCFAP, and the strength of GBFCAP could be flexibly adjusted by sintering temperature. The experiment result suggests that the recommended sintering temperature ranges from 600 to 650 °C according to current CMG conditions. Meanwhile, comparing with conventional resin bound CMG wheel, 600 °C sintered GBCFAP CMG wheel performs better in terms of material removal rate and surface/subsurface quality since the chemical effect and mechanical effect during CMG process are well balanced. Meanwhile, the solid phase reaction between sapphire and Cr₂O₃ abrasive is demonstrated by TEM observation and XPS quantification.     

A micromechanical model for inelastic ductile damage prediction in polycrystalline metals for metal forming

This paper deals with micromechanical modeling of ductile damage and its effects (coupling) on the plastic behavior of FCC polycrystalline metallic materials. The ‘fully coupled’ constitutive equations are written in the framework of rate-dependent polycrystalline plasticity where a ‘ductile’ damage variable has been introduced at a crystallographic slip system (CSS) scale in order to describe the material degradation by initiation, growth and coalescence of microdefects inside the aggregate. Both, theoretical and numerical (FEA) aspects of the proposed micromechanical coupled model are presented. The ability of the obtained model to predict the plastic strain localization, due to the ductile damage effect, in the classical tensile test is carefully analyzed. Application is also made to the fracture prediction in deep drawing of a cylindrical cup using a thin sheet. Finally, some concluding remarks and perspectives are pointed out.