天然金刚石刀具的研磨及其刃口半径检测技术

指出了天然金刚石刀具的刃口锋利度对现代超精密切削加工的重要影响,介绍了国内外天然金刚石刀具研磨技术的发展现状,以及我国金刚石刀具刃磨技术中普遍存在的问题。详细叙述了对刃磨后刀具刃口半径检测的几种可行方法,展望了刃口半径检测技术的前景。     

用原子力显微镜扫描测量金刚石刀具刃口半径

介绍了应用原子力显微镜（ＡＦＭ）扫描测量超精密加工用金刚石刀具刃口半径的方法,给出了测量图象和测量结果。该方法可提高金刚石刀具刃口半径的测量精度,对进一步分析刃口参数对超精密加工表面质量的影响具有一定指导意义。     

硬质合金钻头刃口钝圆及其半径的测量

指出了硬质合金钻头刃口钝圆对切削加工的影响,说明了硬质合金钻头刃口钝圆的重要性,简要介绍了刃口钝圆的方法及常规的测量方法,提出了在Matlab中用最小二乘法拟合的数据处理方法来获得刀口钝圆半径值.与传统测量方法相比,此方法避免了常规测量方法所产生的人为的不确定因素,减少了由于测量系统的精确度引起的误差,可以准确地判断是否达到钝化参数的要求,对优化刀具结构设计、提高切削性能、增加刀具使用寿命有重要的作用和实际意义.     

钝化参数对刀具刃口钝圆半径影响的研究

刀具刃口钝化通过消除刃口上的微观缺口,改变切削刃的微观形貌,实现增加刀具的寿命,提升刀具的切削性能,使已加工零件获得更好地表面质量的目的。基于立式旋转钝化特点,获得了刀具刃口的运行轨迹。对硬质合金刀具采取立式旋转钝化的方式进行钝化,通过刀具钝化实验,并通过扫描电子显微镜对钝化后的刀具刃口钝圆半径进行测量,研究刀具转速和钝化时间对刀具刃口钝圆半径的影响规律,为优化刀具钝化工艺参数和提高刀具刃口钝化效率提供依据。     

金刚石刀具刃口轮廓新型检测方法与技术

研究了原子力显微镜扫描方式及原子力微探针坐标方式的刃口轮廓测量技术。原子力探针新型检测方法与技术可以在亚微米尺度内很好地克服传统测量方法精确度低的缺点，而且操作简便，为目前超精密加工领域中金刚石刀具研磨技术水平的提高提供了有利的技术手段。     

利用散射光测量有椭圆形刃口的金刚石刀具锋利度的原理

本文提出了利用光学原理测量具有椭圆形刃口的金刚石刀具锋利度的方法，即通过测量刀刃表面的散射光的强度分布，从而获得刀刃几何形状的信息。文中首次提出了刀刃轮廊的椭圆模型，从理论上推导出了椭圆刀刃轮廊散射光的强度分布。     

数控铣编程刀具半径补偿和长度补偿

刀具中心轨迹与工作轨迹常不重合。通过刀具补偿功能指令,数控铣床系统可以根据输入补偿量或者实际的刀具尺寸,使数控铣床自动加工出符合程序要求的零件。刀具半径补偿即根据按轮廓编制的程序和预先设定的偏置参数,实时自动生成刀具中心轨迹的功能成为刀具半径补偿功能。     

基于原子力显微镜扫描的金刚石刀具纳米刃口轮廓测量方法研究

基于扫描探针理论,本文介绍了一种超精神加工金刚石刀具刃口锋锐轮廓的测量方法,给出了测量图象并分析了测量结果,首次对金刚石刀具刃口轮廓参数进行了ＡＦＭ扫描原理下的初步评定。这一方法可提高金刚石刀具刃口锋锐度的测量准确度,对进一步分析刃口参数如何影响超精密加工表面质量具有指导意义。     

刀具刃口半径对超声振动辅助车削影响研究

基于商业有限元软件Deform2D,以航空Al6061为研究材料,采用J-C本构模型,建立超声振动辅助车削有限元模型,分析刀具刃口半径改变时等效应变、等效应变率、等效应力、温度和切削力的变化规律。研究结果表明,刀具刃口半径的变化对最大等效应变、最大等效应变率的影响最大,对最高温度的影响次之,对最高等效应力的影响最小;超声振动辅助车削过程中,由于X方向为切削方向,故X方向的平均切削力比Y方向的平均切削力要大得多,且随着刀具刃口半径的增大而先增大、后减小,而Y方向的平均切削力由于Y向振动的影响,无特定变化规律。     

金刚石车刀前角与切削刃钝圆半径对单晶硅加工表层质量的影响

在对单晶硅的超精密切削加工中,为了优化金刚石刀具参数以利于实现其塑性域切削,运用线弹性断裂力学和有限元法对在不同的刀具前角和切削刃钝圆半径下切削区域的应力场分布和微裂纹扩展规律进行了计算仿真研究,并在此基础上进行了单晶硅的金刚石切削试验以验证仿真分析。结果表明,采用前角范围为-15°～-25°的车刀进行切削有利于抑制原子级尺寸裂纹初步扩展成微裂纹,因此可以提高加工时的脆塑转变临界切深值,有利于实现塑性域切削;而且,切削刃钝圆半径越小加工时的微裂纹就越不易扩展,因此也就容易实现单晶硅的塑性域车削,得到高质量的金刚石切削加工表面。     

数控加工刀尖圆弧半径补偿原理及刀补指令使用技巧

根据数控加工高精度制造的需要,从刀具实际几何角度分析编程刀尖点与切削刃切削点不重合而产生加工误差的几种情况和原因,阐明根据数控系统的补偿原理减小这种误差的基本方法和G41,G42,G40指令的应用技巧,对优化编制数控加工程序、保证加工精度有积极作用.通过半径补偿能消除车削右端面、锥面及圆弧时发生少切或过切的现象.     

An edge reversal method for precision measurement of cutting edge radius of single point diamond tools

A method, which is referred to as the edge reversal method, is proposed for precision measurement of the cutting edge radius of single point diamond tools. An indentation mark of the cutting edge which replicates the cutting edge geometry is firstly made on a soft metal substrate surface. The cutting edge of the diamond tool and its indentation mark, which is regarded as the reversal cutting edge, are then measured by utilizing an atomic force microscopy (AFM), respectively. The cutting edge radius can be accurately evaluated through removing the influence of the AFM probe tip radius, which is comparable to the cutting edge radius, based on the two measured data without characterization of the AFM probe tip radius. The results of measurement experiments and uncertainty analysis are presented to demonstrate the feasibility of the proposed method.     

铣削加工中心刀具半径补偿的应用

阐述了刀具半径补偿的基本原理及在铣削中心加工编程中使用半径补偿时应注意的问题和建议。     

金刚石刀具刀尖圆弧波纹度的测量及评价

为实现金刚石刀具刀尖圆弧波纹度超精密测量,构建了基于原子力显微镜(AFM)和精密回转轴系的刀尖圆弧轮廓测量系统,研究了刀尖圆弧波纹度评价方法和控制测量系统引入误差的策略。提出了评价刀尖圆弧波纹度时截止波长的确定原则和方法,并介绍了刀尖圆弧波纹度测量原理及评价流程。讨论了精密回转轴系径向回转误差的测量和评定、刀具安装偏心和偏角误差的控制和原子力扫描系统Z向非线性误差的校准方法。最后,在构建的测量系统上测量了了金刚石刀具刀尖圆弧波纹度并对测量不确定度进行了分析。实验测量显示:所评价金刚石刀具的刀尖圆弧波纹度为0.106μm,测量不确定度为23.8nm,表明所构建的测量系统基本满足金刚石刀具刀尖圆弧波纹度纳米级测量及评价的需求,测量结果稳定可靠、精度高。     

Investigation of the effect of cutting tool edge radius on material separation due to ductile fracture in machining

This paper investigates the interaction between cutting tool edge radius and material separation due to ductile fracture based on Atkins’ model of machining. Atkins’ machining model considers the energy needed for material separation in addition to energies required for shearing at the primary shear zone and friction at the secondary shear zone. However, the effect of cutting tool edge radius, which becomes significant at microcutting conditions, was omitted. In this study, the effect of cutting tool edge radius is included in the model and its influence on material separation is investigated. A modification to the solution methodology of Atkins’ machining model is proposed and it is shown that the shear yield stress and the fracture toughness of the work material can be calculated as a function of uncut chip thickness.     

The upper bound of tool edge radius for nanoscale ductile mode cutting of silicon wafer

For ductile mode cutting of brittle materials, such as silicon wafers, the undeformed chip thickness has to be smaller than the tool edge radius. In practical application, for high production rate, the undeformed chip thickness is expected to be as large as possible. Therefore, the tool edge radius is expected to be as large as possible. In this study, the upper bound of the tool edge radius is investigated through cutting experiments.     

A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers

Ductile mode cutting of silicon wafers can be achieved under certain cutting conditions and tool geometry. An experimental investigation of the critical undeformed chip thickness in relation to the tool cutting edge radius for the brittle-ductile transition of chip formation in cutting of silicon wafers is presented in this paper. Experimental tests for cutting of silicon wafers using diamond tools of different cutting edge radii for a range of undeformed chip thickness are conducted on an ultra-precision lathe. Both ductile and brittle mode of chip formation processes are observed in the cutting tests. The results indicate that ductile cutting of silicon can be achieved at certain values of the undeformed chip thickness, which depends on the tool cutting edge radius. It is found that in cutting of silicon wafers with a certain tool cutting edge radius there is a critical value of undeformed chip thickness beyond which the chip formation changes from ductile mode to brittle mode. The ductile-brittle transition of chip formation varies with the tool cutting edge radius. Within the range of cutting conditions in the present study, it has also been found that the larger the cutting edge radius, the larger the critical undeformed chip thickness for the ductile-brittle transition in the chip formation.     

数控车刀尖R补偿的分析和应用

分析数控车削加工中的刀尖R补偿,详细说明刀尖R补偿的原理与使用方法。     

正确使用刀具半径补偿功能

大部分数控机床都具有刀具半径补偿功能，这就使编程人员可以直接根据零件图纸进行编程，而不必考虑刀具半径的尺寸因素。这里结合实例对刀具半径补偿的用途、过切情况、使用时应注意的问题进行了简单的分析。     

Polishing of single point diamond tool based on thermo-chemical reaction with copper

This paper describes a new polishing method for diamond cutting tools. The method is based on the principle of oxidization of copper and deoxidization of copper oxide by carbon. A diamond tool was brought into contact with a copper plate, heated in air to a range of 323–523 K. The depth of the removed layer of diamond increased almost linearly with contact time and reached approximately 7 nm after 6 h. In this erosion process, pre-existing microcracks on the diamond surface were reduced. In comparison with the mechanically polished tool, the thermo-chemically polished tool was highly resistant to chipping and yielded a significant rise in tool life.