共查询到18条相似文献,搜索用时 218 毫秒
1.
天然金刚石刀具的研磨及其刃口半径检测技术 总被引:3,自引:0,他引:3
指出了天然金刚石刀具的刃口锋利度对现代超精密切削加工的重要影响,介绍了国内外天然金刚石刀具研磨技术的发展现状,以及我国金刚石刀具刃磨技术中普遍存在的问题。详细叙述了对刃磨后刀具刃口半径检测的几种可行方法,展望了刃口半径检测技术的前景。 相似文献
2.
3.
4.
5.
6.
7.
金刚石刀具是超精密切削的重要工具,其刃口锋利度的好坏对工件切削质量有着直接影响。基于AFM的金刚石刀具刃口锋利度检测是目前的主要方法,但是由于AFM仪器本身、扫描参数设置以及刀具状况、外界干扰等多种影响因素的作用,将导致金刚石刀具纳米级锋利度的检测产生多种误差。以圆弧刃金刚石刀具为测量对象,深入分析各个因素的影响过程,进行了理论分析和实验过程,提出了抑制和修正方法。研究表明,通过上述研究和措施的实施,可以提高锋利度的检测精度,为金刚石刀具高质量评价体系的建立提供理论和方法支持。 相似文献
8.
通过立式旋转钝化机对硬质合金立铣刀进行刃口钝化,研究了钝化速度、钝化时间、磨粒粒度、磨粒类型等钝化参数对钝圆半径的影响规律,采用数学回归方法建立钝圆半径的数学模型,并通过方差分析验证了该预测模型的正确性,为刀具钝化刃口优化和实现高速高效切削加工奠定基础。 相似文献
9.
硬质合金刀具是切削高温合金等难加工材料的常用工具,其刃口形状会对加工性能产生重要影响,钝圆半径与形状因子是目前刃口形状的常用特征参数。为研究刃口形状对加工高温合金时切削力的影响,使用硬质合金刀具对Inconel 718高温合金开展侧铣试验。试验结果表明,形状因子相同但钝圆半径不同的刃口所产生的切削力不同,钝圆半径相差越小其产生的切削力偏差越小。当钝圆半径一致且形状因子K>1时,加工所产生的切削力随形状因子的增大而增大。刃口的钝圆半径越小,其形状因子对切削力的影响越显著。本文提出了研究刃口形状时应同时考虑钝圆半径与形状因子的重要性,并研究了形状因子对切削力的影响,对合理选择刃口的形状有重要意义。 相似文献
10.
11.
A method, which is referred to as the edge reversal method, is proposed for precision measurement of the cutting edge radius of single point diamond tools. An indentation mark of the cutting edge which replicates the cutting edge geometry is firstly made on a soft metal substrate surface. The cutting edge of the diamond tool and its indentation mark, which is regarded as the reversal cutting edge, are then measured by utilizing an atomic force microscopy (AFM), respectively. The cutting edge radius can be accurately evaluated through removing the influence of the AFM probe tip radius, which is comparable to the cutting edge radius, based on the two measured data without characterization of the AFM probe tip radius. The results of measurement experiments and uncertainty analysis are presented to demonstrate the feasibility of the proposed method. 相似文献
12.
The measurement and evaluation technology of high precision diamond tools is critically important for supporting the ultra-precision machining. In practical cutting process, the edge profile quality of the diamond tool, including sharpness, micro defects, roughness and tip arc waviness, greatly affects the cutting quality. It is very difficult to measure and evaluate the diamond tool edge profile due to the high precision of tool edge profile and complexity of various measurement parameters. In this paper, an integrated method for measurement and characterization of diamond tools is proposed, which is based on an Atomic Force Microscope (AFM) module. Multiple technical indexes of diamond tools are obtained and validated based on the presented research and cutting experiments, and the evaluation model for each technical index is also proposed. The integrated measurement equipment, including an AFM, precision adjustment device and aerostatic bearings, has been established based on the accuracy requirement of measurement parameters. The edge sharpness, micro defects, surface roughness and tip arc waviness have been obtained based on the evaluation model and experimental data. The experimental results show that the measurement accuracy meets the requirements of the comprehensive evaluation of the diamond tool edge profile. The research work will also contribute to the development of ultra-precision machine. 相似文献
13.
A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers 总被引:1,自引:1,他引:1
K. Liu X. P. Li M. Rahman K. S. Neo X. D. Liu 《The International Journal of Advanced Manufacturing Technology》2007,32(7-8):631-637
Ductile mode cutting of silicon wafers can be achieved under certain cutting conditions and tool geometry. An experimental
investigation of the critical undeformed chip thickness in relation to the tool cutting edge radius for the brittle-ductile
transition of chip formation in cutting of silicon wafers is presented in this paper. Experimental tests for cutting of silicon
wafers using diamond tools of different cutting edge radii for a range of undeformed chip thickness are conducted on an ultra-precision
lathe. Both ductile and brittle mode of chip formation processes are observed in the cutting tests. The results indicate that
ductile cutting of silicon can be achieved at certain values of the undeformed chip thickness, which depends on the tool cutting
edge radius. It is found that in cutting of silicon wafers with a certain tool cutting edge radius there is a critical value
of undeformed chip thickness beyond which the chip formation changes from ductile mode to brittle mode. The ductile-brittle
transition of chip formation varies with the tool cutting edge radius. Within the range of cutting conditions in the present
study, it has also been found that the larger the cutting edge radius, the larger the critical undeformed chip thickness for
the ductile-brittle transition in the chip formation. 相似文献
14.
金刚石刀具刀尖几何形状对超精密切削加工质量的影响 总被引:1,自引:0,他引:1
指出超精密切削实际上是刀具刀尖部分与工件的相互作用,分析了金刚石刀具刀尖几何形状和切削刃的锋利度对超精密切削加工质量的影响。认为正确地选择刀尖部分几何形状和修光刃钝圆半径是获得高质量加工表面的有力保证。 相似文献
15.
Investigation of the effect of cutting tool edge radius on material separation due to ductile fracture in machining 总被引:2,自引:0,他引:2
Yi?it Karpat 《International Journal of Mechanical Sciences》2009,51(7):541-2374
This paper investigates the interaction between cutting tool edge radius and material separation due to ductile fracture based on Atkins’ model of machining. Atkins’ machining model considers the energy needed for material separation in addition to energies required for shearing at the primary shear zone and friction at the secondary shear zone. However, the effect of cutting tool edge radius, which becomes significant at microcutting conditions, was omitted. In this study, the effect of cutting tool edge radius is included in the model and its influence on material separation is investigated. A modification to the solution methodology of Atkins’ machining model is proposed and it is shown that the shear yield stress and the fracture toughness of the work material can be calculated as a function of uncut chip thickness. 相似文献
16.
金刚石刀具刃口轮廓新型检测方法与技术 总被引:1,自引:0,他引:1
研究了原子力显微镜扫描方式及原子力微探针坐标方式的刃口轮廓测量技术。原子力探针新型检测方法与技术可以在亚微米尺度内很好地克服传统测量方法精确度低的缺点,而且操作简便,为目前超精密加工领域中金刚石刀具研磨技术水平的提高提供了有利的技术手段。 相似文献
17.
18.
Ultra precision diamond cutting is a very efficient manufacturing method for optical parts such as HOE, Fresnel lenses, diffraction
lenses, and others. During micro cutting, the rake angle is likely to become negative because the tool edge radius is considerably
large compared to the sub-micrometer-order depth of cut. Depending on the ratio of the tool edge radius to the depth of cut,
different micro-cutting mechanism modes appear. Therefore, the tool edge sharpness is the most important factor which affects
the qualities of machined parts. That is why diamond, especially monocrystal diamond which has the sharpest edge among all
other materials, is widely used in micro-cutting. The majar issue is regarding the minimum (critical) depth of cut needed
to obtain continuous chips during the cutting process. In this paper, the micro machinability near the critical depth of cut
is investigated in micro grooving with a diamond tool. The experimental results show the characteristics of micro-cutting
in terms of cutting force ratio (Fx/Fy), chip shape, surface roughness, and surface hardening near the critical depth of cut. 相似文献