MMIC的微带线中瞬态信号失真的联合时频分析

用联合时频分析的方法对微带线中传输的瞬态信号的失真进行了分析,在时频二维平面上得到了信号波形的畸变、色散、功率谱的分布,克服了传统分析方法中时域与频域相分离的缺点.应用FDTD计算出皮秒高斯脉冲在MMIC的三种典型微带结构中传输一段距离后的波形,利用Wigner-Ville分布对其进行分析,结果更清晰的显示了三种微带结构对瞬态信号传播特性的差别.     

Effects of substrate anisotropy on the dispersion of transient signals in microstrip lines

The analysis of dispersion characteristics of transient signal in microstrip lines with anisotropic substrate is developed here, with particular attention directed toward the effects of arbitrary orientations of the principal optical axis in anisotropic substrates. Numerical simulations are carried out for the propagation of transient signals, square or Guassian pulses, along microstrips with anisotropic substrates. It is shown that the dispersion characteristics is substantially affected by the change of the orientation angle of the principal optical axis in the substrate.     

High-frequency leaky-mode excitation on a microstrip line

The excitation of leaky modes (LMs) and the continuous spectrum (CS) on a microstrip line at high frequencies from a delta-gap source is studied. The delta-gap source models a practical source or discontinuity on the line. It is shown that the current excited from the source exhibits spurious effects at high frequencies due to the excitation of the CS (radiation spectrum), which may or may not be dominated by a physical LM, depending on the frequency range and the substrate permittivity. In some cases, the spurious effects are due to a physical LM, while in other cases the effects are due to the excitation of one or more "residual-wave" (RW) currents, which have not been previously studied for open microstrip lines. There are two types of RW currents: a free-space type and a surface-wave type. Depending on the frequency and the structural parameters, either of these may be the more dominant. At certain frequencies, weakly attenuated high-order LMs may also be excited, in which case spurious effects are observed out to large distances from the source     

CHARACTERISTICS OF MICROSTRIP TRANSMISSION LINES

An efficient hybrid field solution to microstrip transmission lines is presented byusing SLE and SLM modes in spectral domain.It by-passes the lengthy process of formulatingthe determinant equation for the unknown propagation constant.Compared with spectral domainadmittance approach,this method is clear in both physical and mathematical senses and may beapplied to a variety of structures.     

Calculation of inhomogeneous microstrip lines

The frequency-dependent transmission properties of in-homogeneous microstrip lines are calculated by means of a waveguide model and the generalised telegraphist's equations. Examples of theoretical and experimental results are presented.     

Crosstalk between microstrip transmission lines

Methods for prediction of crosstalk between microstrip transmission lines are reviewed and simplified for the weak-coupling case. Classical coupled transmission line theory is used for uniform lines, and potential and induced EMF methods are used for crosstalk between nonuniform lines. It is shown that the potential method is equivalent to classical coupled transmission line theory for the case of uniform lines. An experiment was performed for uniform coupled microstrip lines for frequencies from 50 MHz to 5 GHz, and good agreement between theory and measurement was obtained for both near- and far-end crosstalk     

Simple formulas for microstrip lines

A modification to earlier work is presented which allows for finite strip thickness in the calculation of microstrip impedance and line wavelength. It shows a considerable improvement in accuracy and scope over some earlier work which included strip thickness, but remains simple in form. Expressions are presented which allow calculation of Z and ?g for any microstrip geometry and relative permittivity.     

Full-wave analysis of aperture-coupled microstrip lines

Two methods are presented for the analysis of aperture-coupled microstrip lines. Assuming a quasi-transverse electromagnetic traveling wave incident on the feeding line, an expression for the wave on the coupled line is derived. First, the moment method is used and the current on the coupled line is represented by a traveling wave propagating away from the slot. In the second method, the reciprocity theorem is applied to the coupled line. Both the moment method and the reciprocity method make use of the exact Green functions and produce results that are in very close agreement. An equivalent circuit is derived and the S-parameters are computed. Theoretical results are verified with measurements     

Propagation characteristics of superconducting microstrip lines

The modified spectral-domain approach is applied to study the propagation characteristics of high temperature superconducting microstrip lines whose signal strip and ground plane are of arbitrary thickness. In this study, numerical results for effective dielectric constant, attenuation constant, and strip current distribution are presented to discuss the effects due to frequency, temperature, strip thickness, and substrate loss tangent. In particular, the conductor and dielectric attenuation constants of superconducting microstrip line are depicted separately to discuss the mechanism of the line losses. A comparison with published theoretical and experimental results is also included to check the accuracy of the new approach's results     

Attenuation distortion of transient signals in microstrip

Attenuation distortion, and combinations of dispersion and attenuation distortions, of transient signals in microstrip lines are investigated. Conduction losses are considered for the general case where the strip conductor resistivity is different from that of the ground plane. Dielectric losses are examined for commonly used isotropic substrates. Attenuation and dispersion distortions of short pulses are shown to vary as microstrip and pulse parameters are changed     

Characterization of microstrip lines near a substrate edge anddesign formulas of edge-compensated microstrip lines [MMICs]

The proximity effects of microstrip lines near a substrate's edge present a problem for effectively designing high-packing-density MMICs (monolithic microwave integrated circuits). Proximity effects of this type are analyzed using the rectangular boundary division method. It is assumed that the cross-sectional dimensions of transmission lines in the MMICs are small compared with the wavelengths to allow the use of the quasi-TEM-wave approximation. Then, the concept of edge-compensated microstrip lines to keep the characteristic impedance constant near a substrate edge is introduced to circumvent the proximity effects and to expand the interconnection flexibility of microstrip lines on MMIC substrates. The practical design parameters of edge-compensated 50-Ω microstrip lines are given in the form of numerical data and simple polynomials for CASD (computer-aided design) work with a curve-fitting procedure. Results of capacitance measurements are compared with this theory with errors of about 1% resulting     

Chirped delay lines in microstrip technology

In this paper, we report on a design method for chirped delay lines (CDLs) in microstrip technology. They consist in a continuously varying strip width, so that the coupling location between the quasi-TEM microstrip mode and the same but counter-propagating mode is linearly distributed in frequency. High delay×bandwidth products, over frequency ranges of several gigahertzs, can be obtained following this procedure. Experimental data confirm the design method. Real-time Fourier analysis of wideband pulses can be performed using these CDLs     

Grounding microstrip lines with via holes

Grounding microstrip circuits with via holes is an established technology and modeling isolated via holes with analytical models is well known. However, the availability of electromagnetic field solvers provides an opportunity to model via holes and the metallization surrounding them in a more realistic fashion. Calculated equivalent inductances for single and double via hole configurations are presented. A microstrip interdigital filter with grounded resonators provides experimental verification     

Shunt posts in microstrip transmission lines

Shunt posts in microstrip transmission lines are analyzed by employing the planar waveguide model. A multiple expansion method with greatly enhanced efficiency and accuracy has been achieved with the development of very fast algorithms for the computation of Schloemilch-type series. The method applies to perfectly conducting imperfectly conducting, and composite shunt posts. This approach is compared with the standard point matching technique for perfectly conducting posts. The two methods are found to be in excellent agreement in regions of overlapping applicability. A fairly wide range of computed data is utilized to develop the tools needed to incorporate the post into various microstrip circuit applications. As one application, a procedure is developed for using this post to obtain effective short-circuiting qualities over a broad frequency range. As a second application, the possibility of creating filtering devices is explored using both multiple metallic post structures and single dielectric posts     

交叉耦合微带带通滤波器

针对无线通信系统小型化的要求,设计了一种带有交叉耦合的带通滤波器,该滤波器采用带过孔的终端短路式耦合线为谐振单元,同时加入了交叉耦合线改善滤波特性;整个结构紧凑,具有插入损耗低、选择性高、带外抑制度佳等特点,实测结果与仿真吻合较好,中心频率为4.2 GHz,3 d B带宽为400 MHz,驻波比小于1.5,体积仅为8 mm×6 mm×0.7 mm。     

Characteristics of microstrip transmission lines withhigh-dielectric-constant substrates

An efficient numerical code is developed from a full-wave analysis in the Fourier transform domain to determine the characteristics of a single-strip or multistrip coplanar transmission line. Modes of both even and odd symmetries are included. The impedance of the transmission line is calculated using the power-current equivalent model. Coupling constants between the even and the odd modes are also calculated. Results are provided for a shielded two-strip coupled microstrip transmission line on high-dielectric-constant substrate such as lanthanum aluminate with applications to superconducting transmission lines     

传输线网络瞬态响应灵敏度分析

在传输线网络瞬态响应灵敏度分析之中,提出了一种基于NILT的新的分析方法。该方法将传输线及其效应连同电子元器件及单元电路作为一个整体,根据传输线在电路中的拓扑关系,将传输线网络瞬态响应灵敏度分析问题转化为求解传输线网络瞬态响应问题,以及传输线ABCD矩阵对电路参数的偏导数问题。通过将ABCD矩阵进行级数展开,极大地简化了ABCD矩阵对电路参数偏导数的计算以及传输线网络瞬态响应灵敏度的分析。本文方法不需要对耦合传输线进行解耦,具有简单、精确、高效等特点,算例结果表明了本文方法的有效性。     

Coupling between two microstrip lines through apertures

An analysis of coupling between two microstrip transmission lines, coupled together through small apertures in the common ground plane, is presented. The experimental results compare well with theory.     

Pulse distortion on multilayer coupled microstrip lines

The distortion of pulses due to dispersion and coupling on generalized planar microstrip is investigated. A simple, general form for the Green's function is obtained by solving the boundary value problem separately for the TE and TM modes. The mechanism of even/odd-mode distortion is discussed and numerical results are presented illustrating its effect. The design of structures with low even/odd-mode distortion is considered. Results for pulse distortion on this type of microstrip are also included     

Embedded microstrip interconnection lines for gigahertz digitalcircuits

Transmission line structures are needed for the high-performance interconnection lines of GHz integrated circuits (ICs) and multichip modules (MCMs), to minimize undesired electromagnetic wave phenomena and, therefore, to maximize the transmission bandwidth of the interconnection lines. In addition, correct and simple models of the interconnection lines are required for the efficient design and analysis of the circuits containing the interconnection lines. In this paper, we present electrical comparisons of three transmission line structures: conventional metal-insulator-semiconductor (MIS) and the embedded microstrip structures-embedded microstrip (EM) and inverted embedded microstrip (IEM). In addition, we propose closed-form expressions for the embedded microstrip structures EM and IEM and validate the expressions by comparing with empirical results based on S-parameter measurements and subsequent microwave network analysis. Test devices were fabricated using a 1-poly and 3-metal 0.6 μm Si process. The test devices contained the conventional MIS and the two embedded microstrip structures of different sizes. The embedded microstrip structures were shown to carry GHz digital signals with less loss and less dispersion than the conventional MIS line structures. S-parameter measurements of the test devices showed that the embedded microstrip structures could support the quasi-TEM mode propagation at frequencies above 2 GHz. On the other hand, the conventional MIS structure showed slow-wave mode propagation up to 20 GHz. More than 3-dB/mm difference of signal attenuation was observed between the embedded microstrip structures and the conventional MIS structure at 20 GHz. Finally, analytical RLCG transmission line models were developed and shown to agree well with the empirical models deduced from S-parameter measurements