PECVD沉积SiO2和SiNX对p-GaN的影响

在等离子增强化学气相沉积法(PECVD)沉积SiO2和SiNX掩蔽层过程中，分解等离子体中浓度较高的H原子使Mg-受主钝化，同时在p-GaN材料表面发生反应形成浅施主特性的N■■空位。高能量离子轰击造成的材料深能级缺陷增多以及沉积形成致密的SiO2和SiNX材料，阻碍了H原子向外扩散，使H原子在Ni/Au电极与p-GaN的界面处聚集，造成p-GaN近表面附近区域Mg-H络合物密度的提高，空穴浓度急剧下降，导致Ni/Au透明电极I-V特性严重恶化。选择较低的射频功率(15 W,13.56 MHz)沉积模式，经过适当的退火，可以减小沉积SiO2过程对p-GaN的影响。     

Cleaning and passivation of the Si(100) surface by low temperature remote hydrogen plasma treatment for Si epitaxy

This paper presents the results of a study of the hydrogen-passivated Si(100) surface prepared by a remote hydrogen plasma treatment which serves the dual purpose of cleaning and passivating the Si(100) surface prior to low temperature Si epitaxy by Remote Plasma-enhanced Chemical Vapor Deposition (RPCVD). The remote hydrogen plasma treatment was optimized for the purposes of cleaning and passivation, respectively. To achieve a clean, defect-free substrate surface, the remote hydrogen plasma process was first optimized using Transmission Electron Microscopy (TEM) and Auger Electron Spectroscopy (AES). For hydrogen passivation, the substrate temperature was varied from room temperature to 250° C in order to investigate the degree of passivation as a function of substrate temperature by examining the amount of oxygen readsorbed on the substrate surface after air exposure. Low temperature Si expitaxy was subsequently performed on the air-exposed substrates without further cleaning to evaluate the effectiveness of the hydrogen passivation. It was found that better Si surface passivation is achieved at lower substrate temperatures as evidenced by the fact that less oxygen is observed on the surface using AES and Secondary Ion Mass Spectroscopy (SIMS) analyses. The amount of readsorbed oxygen on the H-passivated Si surface after a two hour air exposure was found to be as low as 0.1 monolayer from SIMS analysis. Using Reflection High Energy Electron Diffraction (RHEED) analysis, different surface reconstructions ((3 × 1) and (1 × 1)) were observed for H-passivated Si surfaces passivated at various temperatures, which was correlated to the results of AES and SIMS analyses. Epitaxial growth of Si films at 305° C was achieved on the air-exposed Si substrates, indicating a chemically inert Si surface as a result of hydrogen passivation. A novel electron-beam-induced-oxygen-adsorptiom phenomena was observed on the Hpassivated Si surface. Scanning Auger Microscopy (SAM) analysis was performed to study the reaction kinetics as well as the nature of Si—H bonds on the H-passivated Si surface. Preliminary results show that there is a two-step mechanism involved, and oxygen adsorption on the H-passivated Si surface due to electron beam irradiation may be due to the formation of O-H groups rather than the creation of Si—O bonds.     

Impact of nitrogen incorporation on interface states in (1 0 0)Si/HfO2

The energy distribution of (1 0 0)Si/HfO₂ interface states and their passivation by hydrogen are studied for different levels of nitrogen incorporation using different technological methods. The results are compared to those of N-free samples. The nitrogen in the (1 0 0)Si/HfO₂ entity is found to increase the trap density in the upper part of the Si band gap and to hinder the passivation of traps in molecular hydrogen in this energy range. At the same time, the passivation of fast interface traps in the lower part of the band gap proceeds efficiently, provided the thickness of the grown Si₃N₄ interlayer is kept minimal. However, the lowest achievable interface trap density below midgap is set by the presence of slow N-related states, likely related to traps in the insulator.     

钝化处理在消除多晶Si薄膜缺陷中的应用

介绍了消除多晶Si太阳电池薄膜中缺陷的各种钝化方法,主要包括利用氢等离子体、SiNx∶H薄膜、Se单原子层、二元(Al2O3)x(TiO2)1-x合金、SiO2/Si/SiO2量子阱以及湿法化学反应所实现的对缺陷进行有效钝化处理等方法;基于本研究领域的最新进展,对各种方法的优缺点进行了分析归纳。指出H钝化可获得较好的钝化效果,但在后续热处理过程中,Si—H键会由于温度过高而断裂,致使氢离子离开表面而使钝化效果变差;SiNx∶H氮化物薄膜可以有效阻挡氢的外扩散,保持钝化效果的稳定性,还可以起到对光的减反射作用。研制具有较低的光反射率、非平衡载流子的高收集效率以及低界面态密度的薄膜和提高薄膜的机械强度是当前科学工作者应该关注的课题。     

钝化前表面预处理对AlGaN/GaN HEMTs性能的影响

提出一种新的钝化技术--采用盐酸和氢氟酸混合预处理溶液(HF:HCI:H2O=1:4:20)对AIGaN/GaNHEMTs进行表面预处理后冉淀积Si3N4钝化,研究了新型钝化技术对AlGaN/GaN HEMTs性能的影响并分析其机理.与用常规方法钝化的器件相比,经过表面顶处理再钝化,成功地抑制了 AIGaN/GaN HEMTs肖特基特性的恶化,有效地增强抑制电流崩塌效应的能力,将GaN基HEMTs的输出功率密度提高到5.2W/mm,并展现良好的电学可靠性.通过X射线光电子谱(XPS)检测预处理前后的AIGaN表面,观察到经过预处理后的AIGaN表面氧元素的含量大幅度下降.表面氧元素的含量下降,能有效地降低表面态密度和表面电荷陷阱密度,被认为是提高AIGaN/GaN HEMTs性能的主要原因.     

Improved Ge Surface Passivation With Ultrathin SiOX Enabling High-Mobility Surface Channel pMOSFETs Featuring a HfSiO/WN Gate Stack

To realize high-mobility surface channel pMOSFETs on Ge, a 1.6-nm-thick SiO_X passivation layer between the bulk Ge substrate and HfSiO gate dielectric was introduced. This approach provides a simple alternative to epitaxial Si deposition followed by selective oxidation and leads to one of the highest peak hole mobilities reported for unstrained surface channel pMOSFETs on Ge: 332 cm² middotV^-1middots^-1 at 0.05 MV/cm-a 2times enhancement over the universal Si/SiO₂ mobility. The devices show well-behaved output and transfer characteristics, an equivalent oxide thickness of 1.85 nm and an I_ON/I_OFF ratio of 3times10³ without detectable fast transient charging. The high hole mobility of these devices is attributed to adequate passivation of the Ge surface     

Natural passivation of the perovskite layer by oxygen in ambient air to improve the efficiency and stability of perovskite solar cells simultaneously

For the hybrid organic-inorganic halide perovskite (HHPs) material, oxygen passivation could enhance the photoluminescence intensity, while it also deteriorates the stability of HHPs film or device. It is a challenge how to use oxygen passivation to improve the efficiency and stability of the HHPs solar cells simultaneously. Here we reported a novel and simple method for natural passivation of the perovskite layer with oxygen in ambient air by exclusion of light illumination. The HHPs solar cells were fabricated by deposition of hole transport layer after oxygen passivation. By optimizing the passivation conditions, the power conversion efficiency of the solar cells increases to 20.1% from 17.3% for those without passivation. Meanwhile, the stability of the HHPs solar cells with passivation was improved. This work is the first report applying oxygen passivation to improve the efficiency and stability of HHPs solar cells simultaneously.     

Transformation of interface states in silicon-on-insulator structures under annealing in hydrogen atmosphere

Changes induced by annealing the spectrum of states on a Si/SiO₂ interface obtained by direct bonding and on a Si(substrate)/〈thermal SiO₂〉 interface in silicon-on-insulator (SOI) structures were investigated by charge-related deep-level transient spectroscopy. The structures were formed by bonding silicon wafers and slicing one of the wafers along a plane weakened by hydrogen implantation. The SOI structures were annealed at 430°C for 15 min in hydrogen, which corresponded to the conventional mode of passivation of the Si/SiO₂-interface states. The passivation of interface states by hydrogen was shown to take place for the Si/〈thermal SiO₂〉 interface, as a result of which the density of traps substantially decreased, and the continuous spectrum of states was replaced by a band of states in the energy range E _c=0.1–0.35 eV within the entire band. For the traps on the bonded Si/SiO₂ interface, the transformation of the centers occurs; namely, a shift of the energy-state band is observed from E _c=0.17–0.36 to 0.08–0.22 eV. The trapping cross section decreases by about an order of magnitude, and the density of traps observed increases slightly.     

Effect of nanoimprinted surface relief on Si and Ge nucleation and ordering

Surface relief formed by nanoimprinting and etching into a thermally grown SiO₂ layer on Si was used to position the initial nuclei formed by chemically vapor deposited Si and Ge. By controlling the deposition conditions, the surface diffusion length was adjusted to be comparable to or larger than the spacing between features, thus favoring nucleation adjacent to steps, rather than random nucleation. Random nucleation was further suppressed by a two-stage deposition process. Ge nucleation on oxide by chemical vapor deposition was enhanced by coating the oxide surface with an organic self-assembled monolayer (SAM) and by the nanoimprinted surface relief. The nanoimprinted surface relief also provides long-range order in the SAM.     

Diamond Like Carbon Film Deposited on Porous Silicon as Passivation Coating

By depositing diamond like carbon(DLC)film with radio frequency plasma chemical vapor deposition(RFPCVD)method,a new surface passivation technique for photoluminescence porous silicon(PS)has been studied.The surface microstructure and photoelectric properties of both porous silicon and DLC coated PS have been analyzed by using AFM,FTIR and PL spectrometers.The results show the DLC film with dense and homogenous nanometer grains can be deposited on the PS used as passivation coating as it can terminate oxide reaction on the surface of the PS.Furthermore,certain ratio of hydrogen existed in the DLC film can be improved to form hydride species on the DLC/PS interface as the centers of the luminescence so that the DLC coating is of benefit not only to the passivation of the PS but also to the improvement of its luminescent intensity.     

Bulk and surface passivation of silicon solar cells accomplished by silicon nitride deposited on industrial scale by microwave PECVD

Bulk and surface passivation by silicon nitride has become an indispensable element in industrial production of multicrystalline silicon (mc‐Si) solar cells. Microwave PECVD is a very effective method for high‐throughput deposition of silicon nitride layers with the required properties for bulk and surface passivation. In this paper an analysis is presented of the relation between deposition parameters of microwave PECVD and material properties of silicon nitride. By tuning the process conditions (substrate temperature, gas flows, working pressure) we have been able to fabricate silicon nitride layers which fulfill almost ideally the four major requirements for mc‐Si solar cells: (1) good anti‐reflection coating (refractive index tunable between 2·0 and 2·3); (2) good surface passivation on p‐type FZ wafers (S_eff<30 cm/s); (3) good bulk passivation (improvement of IQE at 1000 nm by 30% after short thermal anneal); (4) long‐term stability (no observable degradation after several years of exposure to sunlight). By implementing this silicon nitride deposition in an inline production process of mc‐Si solar cells we have been able to produce cells with an efficiency of 16·5%. Finally, we established that the continuous deposition process could be maintained for at least 20 h without interruption for maintenance. On this timescale we did not observe any significant changes in layer properties or cell properties. This shows the robustness of microwave PECVD for industrial production. Copyright © 2005 John Wiley & Sons, Ltd.     

Very low surface recombination velocity of crystalline silicon passivated by phosphorus‐doped a‐SicxNy:H(n) alloys

Hydrogenated and phosphorus‐doped amorphous silicon carbonitride films (a‐SiC_xN_y:H(n)) were deposited by plasma‐enhanced chemical vapor deposition (PECVD) on crystalline silicon surface in order to explore surface passivation properties. Very silicon‐rich films yielded effective surface recombination velocities at 1 sun‐illumination as low as 3 cm s⁻¹ and 2 cm s⁻¹ on 1 Ω cm p‐ and n‐type crystalline silicon substrates, respectively. In order to use them as anti‐reflection coating, we increased alternatively either the carbon or nitrogen content of these films. Also, a combination of passivation and antireflective films was analyzed. Finally, we explored the passivation stability under high‐temperature steps. Copyright © 2007 John Wiley & Sons, Ltd.     

Al/LB绝缘膜/Si结构界面态研究

I—V特性法表明单层LB聚酰亚胺膜(～0.5nm)MIS结构的界面态密度为10~(12)～10~(13)cm~(-2)eV~(-1)。对11和41层LB聚酰亚胺膜,DLTS测试得到的界面态密度分别为10~(12)～10~(13)和10~(11)～10~(12)cm~(-2)eV~(-1)。所有结果表明,在硅禁带中央附近具有较大的界面态密度。     

Spatially separated atomic layer deposition of Al2O3, a new option for high‐throughput Si solar cell passivation

A next generation material for surface passivation of crystalline Si is Al₂O₃. It has been shown that both thermal and plasma‐assisted (PA) atomic layer deposition (ALD) Al₂O₃ provide an adequate level of surface passivation for both p‐ and n‐type Si substrates. However, conventional time‐resolved ALD is limited by its low deposition rate. Therefore, an experimental high‐deposition‐rate prototype ALD reactor based on the spatially separated ALD principle has been developed and Al₂O₃ deposition rates up to 1.2 nm/s have been demonstrated. In this work, the passivation quality and uniformity of the experimental spatially separated ALD Al₂O₃ films are evaluated and compared to conventional temporal ALD Al₂O₃, by use of quasi‐steady‐state photo‐conductance (QSSPC) and carrier density imaging (CDI). It is shown that spatially separated Al₂O₃ films of increasing thickness provide an increasing surface passivation level. Moreover, on p‐type CZ Si, 10 and 30 nm spatial ALD Al₂O₃ layers can achieve the same level of surface passivation as equivalent temporal ALD Al₂O₃ layers. In contrast, on n‐type FZ Si, spatially separated ALD Al₂O₃ samples generally do not reach the same optimal passivation quality as equivalent conventional temporal ALD Al₂O₃ samples. Nevertheless, after “firing”, 30 nm of spatially separated ALD Al₂O₃ on 250 µm thick n‐type (2.4 Ω cm) FZ Si wafers can lead to effective surface recombination velocities as low as 2.9 cm/s, compared to 1.9 cm/s in the case of 30 nm of temporal ALD Al₂O₃. Copyright © 2011 John Wiley & Sons, Ltd.     

Al-enhanced PECVD SiNx induced hydrogen passivation in string ribbon silicon

The effectiveness of manufacturable gettering and passivation technologies is investigated for their ability to improve the quality of a promising Si photovoltaic material. The results of this study indicate that a lifetime enhancement of 30 μs is attained when a backside screen-printed aluminum layer and a thin film of SiN_x, applied by plasma-enhanced chemical vapor deposition (PECVD), are simultaneously annealed at 850°C in a lamp-heated belt furnace. Based on the results of this study, a model is proposed to describe the Al-enhanced SiN_x induced hydrogen defect passivation in String Ribbon silicon due to the simultaneous anneal. According to this model, three factors play an important role: i) the release of hydrogen from the SiN_x film into the substrate; ii) the retention of hydrogen at defect sites in silicon; and iii) the generation of vacancies at the Al−Si interface due to the alloying process which increases the incorporation of hydrogen and creates a chemical potential gradient which enhances the migration of hydrogen in the substrate. A PC1D device simulation indicates that screen-printed cell efficiencies approaching 16% can be achieved if the gettering and passivation treatments examined in this study are employed, the substrate thickness is reduced, and a high-quality surface passivation scheme is applied.     

Use of porous silicon antireflection coating in multicrystallinesilicon solar cell processing

The latest results on the use of porous silicon (PS) as an antireflection coating (ARC) in simplified processing for multicrystalline silicon solar cells are presented. The optimization of a PS selective emitter formation results in a 14.1% efficiency multicrystalline (5×5 cm²) Si cell with evaporated contacts processed without texturization, surface passivation, or additional ARC deposition. Specific attention is given to the implementation of a PS ARC into an industrially compatible screen-printed solar cell process. Both the chemical and electrochemical PS ARC formation method are used in different solar cell processes, as well as on different multicrystalline silicon materials. Efficiencies between 12.1 and 13.2% are achieved on large-area (up to 164 cm² ) commercial Si solar cells     

提高Si量子点发光强度的途径

探讨了提高Si量子点发光强度的可能途径。这些方法主要包括:采用高密度和小尺寸的有序Si量子点、光学微腔结构、表面钝化处理技术和稀土发光中心掺杂。     

Localized interface trap generation in SILO-isolated MOSFETs duringPECVD nitride passivation

The authors report the generation of interface traps during the plasma-enhanced chemical vapor deposition of silicon nitride passivation in MOS structures that utilize a sealed-interface local oxidation scheme (SILO) for device isolation. These traps are highly localized at the boundaries between gate and field oxides, causing enhanced subthreshold conduction. Localized interface traps of this type were not observed in identical MOS structures that use conventional LOCOS (local oxidation of silicon) isolation and were eliminated by thermal anneals at 450°C. Anneals in hydrogen ambients resulted in enhanced rates of hot-carrier-induced degradation. The high densities and localized nature of these anomalous traps make possible a novel mode of device operation in which source-drain conduction is strongly modulated by substrate bias     

Passivation of GaAs FET's with PECVD silicon nitride films ofdifferent stress states

The passivation of GaAs MESFETs with plasma-enhanced chemical-vapor-deposited (PECVD) silicon nitride films of both compressive and tensile stress is reported. Elastic stresses included in GaAs following nitride passivation can produce piezoelectric charge density, which results in a shift of MESFET characteristics. The shift of MESFET parameters due to passivation was found to be dependent on gate orientation. The experiments show that nitride of tensile stress is preferable for MESFETS with [011-bar] oriented gates. The shifts in V_TH,I_DSS, and G_M of the devices before and after nitride passivation are less than 5% if the nitride of appropriate stress states are used for passivation. The breakdown voltage of the MESFETs after nitride deposition was also studied. It is found that the process with higher hydrogen incorporation tends to reduce the surface oxide and increase the breakdown voltage after nitride deposition. In addition, the passivation of double-channel HEMTs is reported for the first time     

Surface nanocrystalline Si structure and its surface passivation for highly efficient black Si solar cells

19.5% conversion efficiency crystalline silicon (Si) solar cells having simple structure without antireflection coating have been fabricated using the surface structure chemical transfer method which produces a nanocrystalline Si layer simply by contacting catalytic platinum with Si wafers in hydrogen peroxide plus hydrofluoric acid solutions. The reflectivity becomes less than 3% after the surface structure chemical transfer method due to formation of black Si. Deposition of phosphosilicate glass and heat treatment at 925 °C performed for formation of pn‐junction effectively passivate the nanocrystalline Si surface. With this phosphosilicate glass passivation plus the hydrogen treatment at 400 °C, the internal quantum efficiency is greatly improved and reaches 81% at a wavelength of 400 nm. Analysis of ellipsometry data shows that incident light with wavelength shorter than 400 nm is almost completely absorbed by the nanocrystalline Si layer. The high internal quantum efficiency for short wavelength light is attributed to effective surface passivation and the nanocrystalline Si layer band‐gap energy which decreases with the distance from the top of the network structure of the nanocrystalline Si layer. Copyright © 2017 John Wiley & Sons, Ltd.