共查询到19条相似文献,搜索用时 125 毫秒
1.
2.
通过在不同温度下氨化ZnO/Ga2O3膜,在Si衬底上成功制备了GaN纳米结构材料。氨化前,ZnO层和Ga2O3膜分别通过射频磁控溅射法依次溅射到Si衬底上。用X射线衍射(XRD)、红外傅里叶变换光谱(FTIR)分析了GaN晶体的结构和组分,利用扫描电子显微镜(SEM)观察了样品的形貌。通过对测试结果的分析可知在Si衬底上由ZnO挥发辅助生长出六方纤锌矿GaN纳米结构晶体,并且ZnO/Ga2O3的氨化温度对形成GaN纳米材料具有明显的影响。 相似文献
3.
考察了SiC薄膜对块体纳米结构钛力学和摩擦性能的影响。实验采用磁控溅射技术制备SiC薄膜(样品台不加温),使用划痕仪测量界面结合力,采用拉伸试验机测量拉伸性能,采用摩擦试验机测量摩擦性能(对摩件为Si3N4,干摩擦),采用SEM-EDAX观察分析微观组织。研究了薄膜(或涂层)对块体纳米材料力学性能的影响,并且获得了一种兼具高强度、良好塑性和良好摩擦学性能的纯钛金属材料。研究结果表明,SiC薄膜不仅不会降低纳米结构Ti的拉伸性能,而且能显著降低摩擦系数(从0.7到0.3),大大提升抗磨性能。 相似文献
4.
采用等离子辅助电子束蒸发,在Si(100)衬底上沉积La2O3薄膜。随后对非晶的沉积态薄膜在750℃和900℃分别退火1h。实验结果表明,采用等离子辅助电子束蒸发,可以获得非晶态的La2O3薄膜:经750℃热处理后,薄膜部分晶化:经900℃热处理后,薄膜显著晶化,晶粒尺寸明显增大,并沿(002)方向择优取向。对薄膜厶矿特性的测量结果表明,沉积态薄膜具有较小的漏电流,但随着热处理温度升高,薄膜晶化程度提高,薄膜漏电流逐渐增大:对薄膜透过率的测量结果表明,单面抛光的Si衬底上沉积La2O3薄膜,在近红外范围内有明显的增透效果,最大可达20%左右。 相似文献
5.
为获得高频、高性能金刚石声表面波器件的多层结构,在金刚石/Si衬底使用磁控溅射方法优化ZnO与SiO2薄膜沉积工艺参数,制备了具有正负温度系数组合的SiO2/ZnO/金刚石/Si多层结构,并对多层结构进行表征。结果表明:随着氩氧比增加,ZnO薄膜的沉积速率不断加快,薄膜的表面粗糙度不断增大;ZnO薄膜中的原子摩尔分数比随O2输入量的减少而逐渐接近理想的1∶1。不同氩氧比下制备的ZnO薄膜均呈(002) 面择优取向生长,其中在氩氧比7∶1时,获得了具有细小柱状晶特征、C轴择优取向程度较高的ZnO薄膜。采用最优的ZnO和SiO2薄膜沉积工艺,在金刚石/Si衬底获得了具有清晰界面的SiO2/ZnO/金刚石/Si多层结构。 相似文献
6.
7.
8.
利用热壁化学气相沉积在Si(111)衬底上获得GaN晶环,采用扫描电镜(SEM)、选择区电子衍射(SAED)、X射线衍射(XRD),光致发光(PL)谱和傅里叶红外吸收谱(FTIR)对晶环的组成、结构、形貌和光学特性进行分析。初步结果证明:在Si(111)衬底上获得择优生长的六方纤锌矿结构的GaN晶环。SEM显示在均匀的薄膜上出现直径约为10μm的5品环,由XRD和SAED的分析证实晶环呈六方纤矿多晶结构,FTIR显示GaN薄膜的主要成分为GaN,同时含有少量的C污染,PL测试表明晶环呈现不同于GaN薄膜的发光特性。 相似文献
9.
10.
采用直流磁控溅射石墨靶、中频磁控溅射碳化硅靶以及离子源辅助的复合沉积技术,制备出膜层质量优异、摩擦因数和磨损率较低的具有不同Si含量的无氢掺硅类金刚石薄膜。使用XPS、拉曼光谱仪、台阶仪、纳米硬度计、SEM、EDS以及球盘式摩擦磨损试验仪测试并表征薄膜的微观结构、力学性能和摩擦学性能。研究表明,该技术能够成功制备出无氢掺硅类金刚石薄膜;随着SiC靶功率密度的增加,薄膜中Si的含量和sp3键的含量逐渐增加,其纳米硬度和弹性模量先增大后减小,摩擦因数由0.277降低至0.066,但其磨损率从6.29×10-11 mm3/Nm增加至1.45×10-9 mm3/Nm;当SiC靶功率密度为1.37W/cm2时,薄膜的纳米硬度与弹性模量分别达到最大值16.82GPa和250.2GPa。 相似文献
11.
DONG Zhihua XUE Chengshan ZHUANG Huizhao GAO Haiyong TIAN Deheng and WU Yuxin Institute of Semiconductors Shandong Normal University Jinan China 《稀有金属(英文版)》2006,25(1)
A novel and simple method was employed to synthesize GaN films on porous silicon (PS) substrates. GaN films were obtained through the reaction between NH3 and Ga2O3 films deposited on the substrates with magnetron sputtering. Since GaN and PS are all good materials for luminescence, it is expected to obtain some new properties from GaN on PS. The samples were analyzed with X-ray diffraction (XRD) to identify crystalline structure. Fourier transmit infrared (FTIR) spectrum was used to analyze the chemical state of the samples. The films were observed with scanning electron microscopy (SEM) and were found to consist of many big crystal grains. Photoluminescence (PL) spectrum was used to illuminate the optical property of the GaN films. 相似文献
12.
Chee Yong Fong Sha Shiong Ng Fong Kwong Yam Haslan Abu Hassan Zainuriah Hassan 《金属学报(英文版)》2015,28(3):362
In this research,the growth of GaN thin films on c-plane sapphire(0001) substrates via two-step method without the assist of buffer layer and catalysts was demonstrated.First,gallium oxide(Ga_2O_3) thin films were deposited on sapphire substrates by radio frequency magnetron sputtering method.The deposited Ga_2O_3 thin films were then nitridated at various temperatures.In this research,attention is focused on the influence of nitridation temperatures on the structural and optical properties of the synthesized GaN thin films.It is revealed that 950 ℃ is the optimal nitridation temperature for synthesizing hexagonal wurtzite GaN thin film with preferential(0002) growth direction. 相似文献
13.
研究了Ga2O3/Al2O3膜反应自组装制备GaN薄膜。首先利用磁控溅射法在硅衬底上制备Ga2O3/Al2O3膜,再将Ga2O3/Al2O3膜在高纯氨气气氛中氨化反应得到了GaN薄膜。用X射线衍射(XRD),X光光电子能谱(XPS)、扫描电镜(SEM)、透射电镜(TEM)和荧光光谱(PL)对样品进行结构、组分、形貌和发光特性的分析。测试结果表明:用此方法得到了六方纤锌矿结构的GaN晶体膜。 相似文献
14.
ZHUANGHuizhao GAOHaiyong XUEChengshan WANGShuyun DONGZhihua HEJianting 《稀有金属(英文版)》2005,24(2):110-114
GaN nanorods have successfully been synthesized on Si(111) substrates via ammoniating ZnO/Ga2O3 films at 950℃. Ga2O3 thin films and ZnO middle layers were deposited in turn on Si(111) substrates by r.f. magnetron sputtering system. ZnO volatilized at 950℃ in the ammonia ambience and Ga2O3 reacted to NH3 to fabricate GaN nanorods in the later ammoniating process. The volatilization of ZnO layers played an important role in the fabrication. The structure and composition of the GaN nanorods were studied by X-ray diffraction (XRD) and Fourier transform infrared spectrophotometer (FTIR). The orphology ofGaN nanorods was investigated using scanning electron microscopy (SEM) and transmission electronic microscope (TEM). The analyses of measured results revealed that GaN nanorods with hexagonal wurtzite stxucture were prepared by this method. 相似文献
15.
SUNZhencui CAOWentian WEIQinqin WANGShuyun XUEChengshan SUNHaibo 《稀有金属(英文版)》2005,24(2):194-199
Hexagonal GaN films were prepared by nitriding Ga2O3 films with flowing ammonia. Ga2O3 films were deposited on Ga-diffused Si (111) substrates by radio frequency (r.f.) magnetron sputtering. This paper have investigated the change of structural properties of GaN films nitrided in NH3 atmosphere at the temperatures of 850, 900, and 950℃ for 15 min and nitrided at the temperature of 900℃ for 10, 15, and 20 rain, respectively. X-ray diffraction (XRD), scanning electron microscopy (SEM), transmission electron microscopy (TEM) and X-ray photoelectron spectroscopy (XPS) were used to analyze the structure, surface morphology and composition of synthesized samples. The results reveal that the as-grown films are polycrystalline GaN with hexagonal wurtzite structure and GaN films with the highest crystal quality can be obtained when nitrided at 900℃ for 15 min. 相似文献
16.
用射频磁控溅射工艺在室温扩镓硅衬底上沉积Ga2O3膜,然后在氨气气氛下氮化Ga2O3膜得到GaN微米带,用X射线衍射(XRD)、扫描电镜(SEM)、选区电子衍射(SAED)、X射线光电子能谱(XPS)及光致发光谱(PL)对薄膜样品进行了结构、表面形貌、组分及发光特性分析.SEM图像显示直径约为100 nm~300 nm微米带随机分布在GaN薄膜表面.XRD、XPS及SAED分析表明GaN微米带呈六方闪锌矿多晶结构,择优沿[001]方向生长.P1显示了可能由量子限制效应引起的发光峰,其相对于报道的GaN晶体发光峰有显著蓝移. 相似文献
17.
氮化铝薄膜结构和表面粗糙度的研究 总被引:6,自引:0,他引:6
采用直流磁控溅射的方法,在Si(111)基片上沉积AIN(100)面择优取向薄膜,研究了溅射功率对AIN薄膜结构及表面粗糙度的影响。结果表明,随着溅射功率的增加,沉积速率增大,但薄膜结构择优取向度变差,表面粗糙度增大,这说明要制备择优取向良好、表面粗糙度小的AIN薄膜,需选择较小的溅射功率。 相似文献
18.
采用SP0806AS中频磁控溅射镀膜机,在硅(100)和高速钢基体上,采用双石墨靶在不同功率下沉积了类金刚石薄膜.研究表明,在功率为5~7 kW下薄膜具有较低的ID/IG比;所得薄膜表面平整,粗糙度Ra值在1.5~2.8 nm之间,薄膜厚度随功率增加而增大;在100~200 nm Ti膜作为过渡层条件下,薄膜纳米硬度和弹性模量随功率增加呈先增大后减小趋势,硬度/杨氏模量比值先增大后减小,当功率为7 kW时具有较高值;划痕实验临界载荷随功率增加先增大后减小,最大可大于50 N;薄膜的摩擦系数较小,平均摩擦系数可小于0.15;在50 g载荷下,薄膜磨穿的时间超过300 min.确定SP0806AS中频磁控溅射镀膜机沉积类金刚石薄膜的最佳功率范围是5~7 kW. 相似文献
19.
磁控溅射制备Ni-Mn-Ga磁性形状记忆合金薄膜 总被引:1,自引:0,他引:1
本文采用直流磁控溅射的方法,分别在Si、Cu和NaCl基底上沉积了Ni-Mn-Ga薄膜,研究了不同基底、不同溅射条件和热处理对薄膜成分、组织形貌及结构的影响。结果表明,当溅射功率为22.5W,靶基距为40mm,溅射氮气压为0.1Pa时为最佳工艺参数。Si基片上薄膜比较致密均匀,Cu基片上薄膜则较为疏松,Naa基片上薄膜表面分布着团簇颗粒,但三种薄膜均可见明显的岛状结构,表明薄膜的形成为核生长型机制。热处理前的薄膜具有部分非晶存在。 相似文献