采样保持电路中全差分增益提高放大器设计

介绍了一种全差分增益增强CMOS运算放大器的设计和实现。该放大器用于12位20 MHz采样频率的流水线模/数转换器(A/D)的采样保持电路。为了实现大的输入共模范围,采用折叠式共源共栅放大器。主放大器采用开关电容共模反馈电路,辅助放大器则采用简单的连续时间共模反馈电路。该放大器采用CMOS 0.5μm工艺,电源电压为3.3 V。Cadence Spectre仿真结果显示,在负载为6 p F的情况下,其增益为99 d B,单位增益带宽为318 MHz,相位裕度为53°。     

全差分增益提高运算放大器的分析与设计

通过增益提高技术,一个全差分增益提高套筒式共源共栅运算放大器被提出和设计。该运算放大器得主运算放大器是由全差分套筒式共源共栅放大器构成,并带有一个开关电容共模反馈电路。而增益提高放大器是由全差分析叠式共源共栅放大器构成,它的共模反馈电路是连续时间反馈电路。该运算放大器采用中芯国际0．35μmixed-signal CMOS工艺设计,运算放大器的直流增益可达到129dB,而单位增益频率为161MHz。     

一种带增益提高技术的高增益CMOS运算放大器的设计

给出了一种用在高速高精度流水线型模数转换器中的具有高增益和高单位增益频率的全差动CMOS运算放大器的设计,电路结构主要采用折叠式共源共栅结构,并采用增益提高技术提高放大器的增益。共模反馈电路由开关电容共模反馈电路实现。模拟结果显示,其开环直流增益可达到106 dB,在负载电容为2 pF时单位增益频率达到了167 MHz,满足了对模数转换器的高速度和高精度的要求。     

一种高性能共模反馈CMOS运算放大器

介绍了一种具有高增益,高电源抑制比(CMRR)和大带宽的两级共源共栅运算放大器。此电路在两级共源共栅运算放大器的基础上增加共模反馈电路,以提高共模抑制比和增加电路的稳定性。电路采用0.35μm标准CMOS工艺库,在Cadence环境下进行仿真。结果显示,该放大器增益可达到101 dB,负载电容为10 pF时,单位增益带宽大约为163 MHz,共模抑制比可达101dB,电路功耗仅为0.5 mW。     

一种采用增益增强技术的全差分运放设计和实现

设计了一种采用增益增强技术并带有共模反馈的全差分运算放大器.该运算放大器主要由三个折叠式共源共栅结构的运放、一个偏置电路和一个共模反馈电路组成.运算放大器采用chartered 0.35 μm CMOS工艺实现,仿真结果表明运放开环增益为106.8 dB,单位增益带宽为58 MHz,相位裕度为79°(负载Cload=1 pF).对流片运放进行测试和分析,运算放大器测试指标和仿真指标基本接近,较好达到预先的设计要求.     

一种高共模抑制比轨到轨全差分运算放大器

针对传统全差分运算放大器电路存在输入输出摆幅小和共模抑制比低的问题,提出了一种高共模抑制比轨到轨全差分运算放大器电路。电路的输入级采用基于电流补偿技术的互补差分输入对,实现较大的输入信号摆幅;中间级采用折叠式共源共栅结构,获得较大的增益和输出摆幅;输出级采用共模反馈环路控制的A类输出结构,同时对共模反馈环路进行密勒补偿,提高电路的共模抑制比和环路稳定性。提出的全差分运算放大器电路基于中芯国际(SMIC) 0.13μm CMOS工艺设计,结果表明,该电路在3.3 V供电电压下,负载电容为5 pF时,可实现轨到轨的输入输出信号摆幅;当输入共模电平为1.65 V时,直流增益为108.9 dB,相位裕度为77.5°,单位增益带宽为12.71 MHz;共模反馈环路增益为97.7 dB,相位裕度为71.3°;共模抑制比为237.7 dB,电源抑制比为209.6 dB,等效输入参考噪声为37.9 nV/Hz^1/2@100 kHz。     

一种高增益带宽CMOS全差分运算放大器的设计

介绍了一种采用折叠式共源共栅结构的高增益带宽全差分运算放大器的设计和实现,详细讨论了折叠式共源共栅放大器的电路结构、共源共栅偏置电路,以及开关电容共模反馈电路(SCCMFB).电路的设计基于CSMC 0.5μm DPTM 5V混合信号工艺.仿真结果表明,该电路在5V电源电压下具有64 dB直流开环增益、155 MHz单位增益带宽.通过在一款ADC电路中流片验证,该放大器达到设计指标要求.     

基于前馈gmf的共模反馈稳定性增强电路

基于0.13 μm CMOS工艺,提出并设计了一种应用于三级全差分运算放大器中的新型共模反馈电路。将具有密勒补偿结构的典型两级全差分结构和源随器结构作为三级运算放大器的放大级,通过在共模反馈电路中引入前馈通路,产生的两个零点提高运放的稳定性,解决了传统共模反馈电路中多个极点难以补偿的问题。仿真结果表明,在1.2 V电源电压下,共模下增益为70.4 dB,单位增益带宽为56 MHz,相位裕度为85.5°。相比于传统无前馈电路,新型共模反馈电路的单位增益带宽和相位裕度分别提高了8.2 MHz和17.4°。具有这种共模反馈结构的运算放大器可以实现较低的电源电压和较好的相位裕度。     

一种高单位增益带宽CMOS全差分运算放大器

设计并讨论了一种高单位增益带宽CMOS全差分运算放大器。由于折叠共源共栅结构电路具有相对高的单位增益带宽以及开关电容共模反馈电路稳定性好、对运放频率特性影响小等优点,故设计的放大器采用了折叠共源共栅结构以及开关电容共模反馈电路技术,并达到了高单位增益带宽的设计目的。基于TSMC0·25μmCMOS工艺,仿真结果表明,在2·5V的单电源电压下,运算放大器的直流开环增益为70dB,单位增益带宽为500MHz。     

一种全差分增益自举运算放大器的设计

设计实现了一种具有高增益大带宽的全差分增益自举运算放大器,适用于高速高精度流水线模数转换器采保电路的应用.增益自举放大器的主放大器和子放大器均采用折叠共源共栅式全差分结构,并且主放大器采用开关电容共模反馈来稳定输出电压.该放大器工作在3.0 V电源电压下,单端负载为2pF,采用0.18Wn CMOS工艺库对电路进行仿真,结果显示该放大器的直流增益可达到112dB,单位增益带宽为1.17GHz.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks     

Call for Papers—Feature Topic,Vol.12,No.7,2015

正Information Centric Networking Information-Centric Networking(ICN) is an emerging direction in Future Internet architecture research,gaining significant tractions among academia and industry.Aiming to replace the conventional host-to-host communication model by a data-centric model,ICN treats data content as the first