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1.
A 2 V 1.8 GHz fully integrated CMOS dual-loop frequency synthesizer is designed in a standard 0.5 /spl mu/m digital CMOS process for wireless communication. The voltage-controlled oscillator (VCO) required for the low-frequency loop is designed using a ring-type VCO and achieves a tuning range of 89% from 356 to 931 MHz and a phase noise of -109.2 dBc/Hz at 600 kHz offset from 856 MHz. With an active chip area of 2000/spl times/1000 /spl mu/m/sup 2/ and at a 2 V supply voltage, the whole synthesizer achieves a tuning range from 1.8492 to 1.8698 GHz in 200 kHz steps with a measured phase noise of -112 dBc/Hz at 600 kHz offset from 1.86 GHz. The measured settling time is 128 /spl mu/s and the total power consumption is 95 mW.  相似文献   

2.
A /spl Delta//spl Sigma/ fractional-N frequency synthesizer for the 2-GHz-range wireless communication applications is implemented in a 0.35-/spl mu/m BiCMOS process, using only CMOS components. The synthesizer achieves a close-in phase noise of -81 dBc/Hz, while the spurious tones are at -85 dBc. The synthesizer features a multiple-modulus prescaler employing the phase-switching architecture to minimize the power dissipation. The entire prescaler, including the gigahertz-speed first stages, is implemented using full-swing logic. The current source structure employed in the charge pump provides a constant output current over a wide, almost rail-to-rail output voltage range. The power dissipation of the synthesizer chip is 22.6 mW from a 2.7-V supply.  相似文献   

3.
We report on the design and performance of a /spl times/2/spl times/3/spl times/3 frequency multiplier chain to the 1.7-1.9 THz band. GaAs-based planar Schottky diodes are utilized in each stage. A W-band power amplifier, driven by a commercially available synthesizer, was used to pump the chain with 100 mW of input power. The peak measured output power at room temperature is 3 /spl mu/W at 1740 GHz. When cooled to 120 K, the chain provides more than 1.5 /spl mu/W from 1730 to 1875 GHz and produced a peak of 15 /spl mu/W at 1746 GHz.  相似文献   

4.
A fully integrated dual-band transceiver is implemented in 0.18-/spl mu/m CMOS and is compliant with the IEEE 802.11a/b/g standards. The direct-conversion transceiver occupies 12 mm/sup 2/ in a QFN-40 package. A fractional-N synthesizer operates at twice the channel frequency, covering continuously bands from 4.9 to 5.9 GHz, as well as the 2.4-GHz band. The 5- and 2.4-GHz receivers achieve a sensitivity level below -73 dBm in the 54-Mb/s mode and below -93 dBm in the 6-Mb/s mode, while consuming 230 mW. A fast RSSI-channel power-detection system allows to power-down signal processing in the listen mode. The 5- and 2.4-GHz transmitters implement a wideband Cartesian feedback loop for enhanced EVM performances and improved spectrum masks compliance. The transmitters deliver -2-dBm average power with an EVM of 3% in the 54-Mb/s mode while consuming 300 mW.  相似文献   

5.
A 1.8 GHz fractional-N frequency synthesizer implemented in 0.6 /spl mu/m CMOS with an on-chip multiphase voltage-controlled oscillator (VCO) exhibits no spurs resulting from phase interpolation. The proposed architecture randomly selects output phases of a multiphase VCO for fractional frequency division to eliminate spurious tones. Measured phase noise at 1.715 GHz is lower than -80 dBc/Hz within a 20 kHz loop bandwidth and -118 dBc/Hz at 1 MHz offset with no fractional spurs above -70 dBc/Hz. The synthesizer has a frequency resolution step smaller than 10 Hz. The chip consumes 52 mW at 3.3 V and occupies 3.7 mm/spl times/2.9 mm.  相似文献   

6.
This paper describes a 3-band (mode 1) multi-band-OFDM UWB synthesizer implemented in a 0.25-/spl mu/m SiGe BiCMOS process. The interference-robust, fast-hopping synthesizer uses one single-sideband (SSB) mixer for frequency shifting. A single phase-locked loop (PLL) generates the steady input signals for the SSB-mixer. Crucial in the design is a divide-by-5 frequency divider that generates quadrature signals at a frequency of 528 MHz. The 0.44 mm/sup 2/ fully integrated synthesizer consumes 52 mW from a 2.7 V supply. Out-of-band spurious tones are below -50 dBc, allowing co-operability with WLAN applications in the 2.4 GHz and 5 GHz range. The integrated phase noise is below 2/spl deg/ rms. The measured frequency transition time is well below the required 9.5 ns.  相似文献   

7.
A frequency synthesizer incorporating one single-sideband (SSB) mixer generates seven bands of clock distributed from 3 to 8GHz with 1-ns switching time. An efficient frequency synthesizing technique producing balanced bands around one center frequency is employed, and the SSB mixer uses double degeneration topology to increase the linearity. Fabricated in 0.18-/spl mu/m CMOS technology, this circuit achieves a sideband rejection of 37 dB while consuming 48 mW from a 2.2-V supply.  相似文献   

8.
A single-chip dual-band 5.15-5.35-GHz and 2.4-2.5-GHz zero-IF transceiver for IEEE 802.11a/b/g WLAN systems is fabricated on a 0.18-/spl mu/m CMOS technology. It utilizes an innovative architecture including feedback paths that enable digital calibration to help eliminate analog circuit imperfections such as transmit and receive I/Q mismatch. The dual-band receive paths feature a 4.8-dB (3.5-dB) noise figure at 5.25 GHz (2.45 GHz). The corresponding sensitivity at 54 Mb/s operation is -76 dBm for 802.11a and -77 dBm for 802.11g, both referred at the input of the chip. The transmit chain achieves output 1-dB compression at 6 dBm (9 dBm) at 5 GHz (2.4 GHz) operation. Digital calibration helps achieve an error vector magnitude (EVM) of -33 dB (-31 dB) at 5 GHz (2.4 GHz) while transmitting -4 dBm at 54Mb/s. The die size is 19.3 mm/sup 2/ and the power consumption is 260 mW for the receiver and 320 mW (270 mW) for the transmitter at 5 GHz (2.4 GHz) operation.  相似文献   

9.
This paper presents a single-chip dual-band CMOS direct-conversion transceiver fully compliant with the IEEE 802.11a/b/g standards. Operating in the frequency ranges of 2.412-2.484 GHz and 4.92-5.805 GHz (including the Japanese band), the fractional-N PLL based frequency synthesizer achieves an integrated (10 kHz-10 MHz) phase noise of 0.54/spl deg//1.1/spl deg/ for 2/5-GHz band. The transmitter error vector magnitude (EVM) is -36/-33 dB with an output power level higher than -3/-5dBm and the receiver sensitivity is -75/-74 dBm for 2/5-GHz band for 64QAM at 54 Mb/s.  相似文献   

10.
A microwatt frequency divider for the 2.5-GHz ISM band is proposed. This divider directly modulates the output in a ring oscillator by means of a switch and realizes low power consumption with low supply voltage and a wide locking range. It is fabricated using a five-layer-metal and 0.2-/spl mu/m-gate length CMOS process. The core size is 10.8/spl times/10.5 /spl mu/m/sup 2/, which is much smaller than that of a typical inductor-enhanced frequency divider. This divider operates with a supply voltage in the range from 1.8 to 0.7V, and attains minimum power consumption of 44 /spl mu/W, in which case the supply voltage is 0.7 V, the maximum operating frequency is 4.3 GHz, and the locking range is 2.3 GHz. A derivation of the frequency locking range of the divider is provided in the Appendix.  相似文献   

11.
The design of a 2.4-GHz fully integrated /spl Sigma//spl Delta/ fractional-N frequency synthesizer in a 0.35-/spl mu/m CMOS process is presented. The design focuses on the prescaler and the loop filter, which are often the speed and the integration bottlenecks of the phase-locked loop (PLL), respectively. A 1.5-V 3-mW inherently glitch-free phase-switching prescaler is proposed. It is based on eight lower frequency 45/spl deg/-spaced phases and a reversed phase-switching sequence. The large integrating capacitor in the loop filter was integrated on chip via a simple capacitance multiplier that saves silicon area, consumes only 0.2 mW, and introduces negligible noise. The synthesizer has a 9.4% frequency tuning range from 2.23 to 2.45 GHz. It dissipates 16 mW and takes an active area of 0.35 mm/sup 2/ excluding the 0.5-mm/sup 2/ digital /spl Sigma//spl Delta/ modulator.  相似文献   

12.
A stabilization technique is presented that relaxes the tradeoff between the settling speed and the magnitude of output sidebands in phase-locked frequency synthesizers. The method introduces a zero in the open-loop transfer function through the use of a discrete-time delay cell, obviating the need for resistors in the loop filter. A 2.4-GHz CMOS frequency synthesizer employing the technique settles in approximately 60 /spl mu/s with 1-MHz channel spacing while exhibiting a sideband magnitude of -58.7 dBc. Designed for Bluetooth applications and fabricated in a 0.25-/spl mu/m digital CMOS technology, the synthesizer achieves a phase noise of -112 dBc/Hz at 1-MHz offset and consumes 20 mW from a 2.5-V supply.  相似文献   

13.
This paper presents the design and implementation of an L1/L2 dual-band global positioning system (GPS) receiver. Dual-conversion with a low-IF architecture was used for dual-band operation. The receiver is composed of an RF preamplifier, down-conversion mixers, a variable-gain channel filter, a 2-bit analog-to-digital converter, and the full phase-locked-loop synthesizer including an on-chip voltage controlled oscillator. Fabricated in a 0.18-/spl mu/m CMOS technology, the receiver exhibits maximum gain of 95 dB and noise figures of 8.5 and 7.5 dB for L1 and L2, respectively. An on-chip variable-gain channel filter provides IF image rejection of 20 dB and gain control range over 60 dB. The receiver consumes 19 mW from a 1.8-V supply while occupying a 2.6-mm/sup 2/ die area including the ESD I/O pads.  相似文献   

14.
By using focused ion beam lithography high performance 1.55-/spl mu/m emitting distributed Bragg reflector lasers were realized suitable for high-speed optical telecommunication. Threshold currents of 8 mA and continuous-wave efficiencies of 0.37 W/A for 600-/spl mu/m-long devices were achieved. Stable single-mode emission with sidemode suppression ratios of > 40 dB were observed for the entire operation range. By relative intensity noise measurements an intrinsic 3-dB modulation frequency of > 10 GHz was estimated for a single-mode output power of 23 mW.  相似文献   

15.
Reports on the CW power performance at 20 and 30 GHz of 0.25 /spl mu/m /spl times/ 100 /spl mu/m AlGaN/GaN high electron mobility transistors (HEMTs) grown by MOCVD on semi-insulating SiC substrates. The devices exhibited current density of 1300 mA/mm, peak dc extrinsic transconductance of 275 mS/mm, unity current gain cutoff (f/sub T/) of 65 GHz, and maximum frequency of oscillation (f/sub max/) of 110 GHz. Saturated output power at 20 GHz was 6.4 W/mm with 16% power added efficiency (PAE), and output power at 1-dB compression at 30 GHz was 4.0 W/mm with 20% PAE. This is the highest power reported for 0.25-/spl mu/m gate-length devices at 20 GHz, and the 30 GHz results represent the highest frequency power data published to date on GaN-based devices.  相似文献   

16.
A W-band InAs/AlSb low-noise/low-power amplifier   总被引:1,自引:0,他引:1  
The first W-band antimonide based compound semiconductor low-noise amplifier has been demonstrated. The compact 1.4-mm/sup 2/ three-stage co-planar waveguide amplifier with 0.1-/spl mu/m InAs/AlSb high electron mobility transistor devices is fabricated on a 100-/spl mu/m GaAs substrate. Minimum noise-figure of 5.4dB with an associated gain of 11.1 dB is demonstrated at a total chip dissipation of 1.8 mW at 94 GHz. Biased for higher gain, 16/spl plusmn/1 dB is measured over a 77-103 GHz frequency band.  相似文献   

17.
This work presents a shared fractional-N synthesizer used by two dual-band 802.11 radios integrated on a single chip for 2/spl times/2 multiple-input multiple-output (MIMO) applications. Additional 2/spl times/2 MIMO chips can be used in a system by phase synchronizing the signal paths through a bidirectional LO porting scheme developed for this application. This synthesizer was fully integrated with the exception of an off-chip loop filter. The synthesizer is a /spl Delta//spl Sigma/-based fractional-N frequency synthesizer with three on-chip LC tuned VCOs to cover the entire frequency bands specified in the IEEE 802.11a/b/g and Japanese WLAN standards. The radio uses a variable IF frequency so that both the RF LO and IF LO can be derived from a single synthesizer saving chip area and power. The synthesizer includes a programmable second/third-order /spl Delta//spl Sigma/ noise shaper, a phase frequency detector, a differential charge pump, and a 6-bit multimodulus divider (MMD). The nominal jitter from 100 Hz to 10 MHz is 0.63-0.86/spl deg/ rms in the 5-GHz band and 0.35-0.43/spl deg/ rms in the 2.4-GHz band. The maximum frequency deviation of the synthesizer when enabling the transmitter is less than 150 kHz and the frequency error settles to 2 kHz in less than 12 /spl mu/s. For MIMO applications requiring more than two full paths, a single synthesizer on one die can be used to generate the LOs for all other radios integrated in different dies.  相似文献   

18.
Using a 3.5-/spl mu/m gate length complementary metal-oxide-semiconductor/silicon-on-sapphire technology, a single-chip, radiation-hardened, direct digital frequency synthesizer has been developed. The circuit is a critical component of a fast-tuning wideband frequency synthesizer for spread spectrum satellite communications. During each clock period the chip generates a new digitized sample of a sine wave, whose frequency is variable in 2/SUP 20/ steps from DC to one-half the clock frequency. Operation at up to 7.5 MHz is possible in a worst-case environment, including ionizing radiation levels up to 3/spl times/10/SUP 5/ rads(Si). A computationally efficient algorithm was chosen, resulting in 12-bit output precision with only 1084 logic gates and 3840 bits of on-chip read-only memory. The accuracy of the algorithm is sufficient to maintain in-band spurious frequency components below -65 dBc. At 300 mW, the chip replaces an MSI implementation which uses 25 integrated circuits and consumes 3.5 W.  相似文献   

19.
The authors describe the circuit design and the process utilized to fabricate a 1.2 GHz 380-mW divide-by-20/21/22/23/24 GaAs circuit aimed at frequency synthesizer applications. The circuit consists of a 5/6 prescaler, a divide-by-4 circuit, and a four-channel multiplexer. The circuit has been implemented with BFL gates fabricated with 0.7-/spl mu/m planar self-aligned normally-on MESFETs. Further improvement can be expected by utilizing DCFL gates instead. A maximum frequency of 2.5 GHz and an internal active power of 50 mW have been simulated. Consequently the normally-off (N-OFF) GaAs circuit would exhibit a speed by power product four times lower than that of equivalent Si ECL dividers based in bipolar processes being developed today.  相似文献   

20.
A /spl Sigma//spl Delta/ fractional-N frequency synthesizer targeting WCDMA receiver specifications is presented. Through spurs compensation and linearization techniques, the PLL bandwidth is significantly extended with only a slight increase in the integrated phase noise. In a 0.18-/spl mu/m standard digital CMOS technology a fully integrated prototype with 2.1-GHz output frequency and 35 Hz resolution has an area of 3.4 mm/sup 2/ PADs included, and it consumes 28 mW. With a 3-dB closed-loop bandwidth of 700 kHz, the settling time is only 7 /spl mu/s. The integrated phase noise plus spurs is -45 dBc for the first WCDMA channel (1 kHz to 1.94 MHz) and -65 dBc for the second channel (2.5 to 6.34 MHz) with a worst case in-band (unfiltered) fractional spur of -60 dBc. Given the extremely large bandwidth, the synthesizer could be used also for TX direct modulation over a broad band. The choice of such a large bandwidth, however, still limits the spur performance. A slightly smaller bandwidth would fulfill WCDMA requirements. This has been shown in a second prototype, using the same architecture but employing an external loop filter and VCO for greater flexibility and ease of testing.  相似文献   

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