数字喷墨打印技术在PCB抗蚀层制作中的初步研究

随着数字喷墨打印设备和纳米油墨的不断发展,喷墨打印技术在PCB制作中得到了越来越广泛的应用。目前市场上主要包括三个方面的应用：抗蚀层、字符、阻焊。文章通过市场调研,成本评估和工艺能力评估重点研究了喷墨打印技术在线路抗蚀层制作中的应用。结果发现喷墨打印技术相对于传统的线路制作工艺具有一定的成本优势和线路制作能力。     

碳纤维复合芯软铝导线的性能及应用

为了能更好地发挥碳纤维复合芯软铝导线的性能优势,对其性能特点和工程应用进行了详细介绍。碳纤维复合芯软铝导线具有重量轻、强度高、损耗小、弛度低、载流量大、耐腐蚀、综合性能突出等特点,使其既可用于常规线路,亦可用于重覆冰、大跨越、重腐蚀等极端气候条件的线路,更适合用于超高压和特高压线路。工程实例表明,碳纤维复合芯软铝导线在新建线路和改造线路上均有良好的经济性。     

光聚合微纳3D打印技术的发展现状与趋势

光聚合微纳3D打印作为一种微纳尺度的增材制造技术,在高精度、复杂三维微纳结构的制造方面具有显著优势,已被广泛应用于微机电系统、微纳光子器件、微流体器件、生物工程领域。本文首先介绍了光聚合微纳3D打印技术的光物理/光化学原理,重点对所涉及的各种类型的打印工艺及其应用领域进行综述;然后讨论了一些前沿性的微纳3D打印方法,通过回顾和比较这些最新的技术,阐明了打印分辨率与打印效率之间的关系,以及串行扫描、并行扫描、面投影和体投影的打印模式对微纳3D打印性能的影响;最后对微纳3D打印技术进行全面总结与概述,并对其未来的发展趋势和应用前景予以展望。     

导电胶在印制电路板中的应用

本文介绍了导电胶的组成和特点及其在印制板中的应用,如用于在多层板内层埋入电阻,多层板层间互连,在底板上印刷线路等.阐述了银导电胶和铜导电胶在印制电路板应用中各自的优缺点及其应用的可能性.     

叠层片式ZnO压敏电阻器及其在ESD保护中的应用

介绍叠层片式ZnO压敏电阻器的性能特点和应用范围，论述了其对电路进行ESD保护的基本原理及其在高 线路中的最优化设置，指出其发展方向应为低电容和超低电容化。     

关于粗波分复用(CWDM)技术的应用

通过对DWDM和CWDM设备的技术、经济的比较，说明在城域网中应用CWDM的合理性。为指导实际应用，对CWDM在不同的光纤线路上应用进行了详细分析，并对CWDM的技术性能和组网技术作了简单的介绍。     

喷墨打印技术在PCB中的应用前景

文章简要的介绍了喷墨打印技术在PCB工业中的应用前景。从喷墨打印技术在PCB中应用发展来看,首先是在图形转移中应用,然后再推广应用到埋嵌无源元件和全印刷电子产品的的领域上。今后,喷墨打印技术会成为PCB工业生产的主流之一。     

纳米材料和纳米技术在印制线路板基材中的应用前景(3)--纳米复合材料对绿色印制线路基材的推动

该文综述了纳米复合材料在绿色印制线路基材中的应用前景,介绍了纳米复合材料的阻燃机理、制备和性能,应从绿色化学、可持续发展的战略高度来看待印制线路基材的绿色化,提出了纳米复合材料是印制线路 基材绿色化的必然选择。     

AT89C2051在自适应模糊PID温度控制器中的应用

介绍了以AT89C2051单片机为核心的自适应模糊PID温度控制器的设计,并将其应用到制袋机温度控制上.该系统具有线路简单、性能可靠的特点,在实际中已成功应用.     

激光辅助三维金属微打印（特邀）

当前微纳尺度的三维金属结构,由于其独特的物化性能和空间构型优势,在科学与工程领域的应用需求日益增多。由此应运而生的各种三维金属微尺度打印技术近年来相继被开发,并引起了广泛关注。在众多技术中,基于激光的三维微打印技术有着非接触加工、制造灵活性好等优势。文中综述了当前一些代表性的激光辅助三维金属微打印技术,总结了各种三维金属微打印的基本原理、技术优势及典型应用。针对高表面光滑度、高熔点、高电导率的三维金属微打印存在的挑战,介绍了超快激光制备玻璃微通道模具法辅助实现三维金属微制造的新技术。最后就三维金属微打印的未来方向和应用前景进行了探讨。     

Surface Charge Reversal Method for High‐Resolution Inkjet Printing of Functional Water‐Based Inks

Printed electronics is a rapidly growing area of research being explored for the manufacture of large‐area and cost‐effective electronic devices by the patterned application of functional inks. There are challenges associated with processing the inks compatible with inkjet printing technology and developing efficient methods to successfully obtain the desired features, particularly when it comes to metal and metal–organic complex inks. Here, a reliable method is developed to achieve a sophisticated microstructured pattern using the inkjet printing technique assisted by a surface charge reversal effect. In addition, a procedure is formulated to obtain good quality, stable metal–organic water‐based inks compatible with salts of a variety of transition metals and rare earths, without the need for additional volatile solvents. A feasible and water‐based ink formulation combined with a simple and noninvasive surface charge reversal treatment constitutes a major step toward the manufacture of high‐resolution, inorganic patterned thin films on hydrophobic substrates using inkjet printing. These outcomes lead to the path of effective fusion of inorganic and organic heterointerfaces by simples designing and printing.     

Development,characterization, and processing of thin and thick inkjet-printed dielectric films

This work introduces the material and electrical characterization of two dielectric inks for use with inkjet printing fabrication and the realization of fully-printed multilayer electronic structures. The dielectric inks are categorized by the thickness of their per-layer profiles, where SU-8 polymer and poly(4-vinylphenol)-based solutions are utilized to realize thick (>4 μm) and thin (< 400 nm) inkjet-printed dielectric films, respectively. The material formulations for each ink are outlined in detail in order to achieve the desired viscosity and surface tension for optimal printing with a Dimatix inkjet printing system. Once printability and processing techniques are tuned and established, various material and electrical characterizations are performed, including printed profile measurement, multilayer profile tendencies, thermal reflow processing, UV-ozone surface energy modification, relative permittivity extraction, leakage current density, and dielectric breakdown voltage. Finally, the demonstration of fully-printed post-processed on-chip capacitors utilizing both thin and thick dielectric inks in conjunction with a silver nanoparticle-based metallic ink is presented and compared with other inkjet-printed capacitors.     

数字化文字喷印及其在PCB生产中应用

目前,数字喷墨打印技术正成为一种多样化替代传统化学蚀刻工艺直接成图的手段。配备有最新压电式喷头和UV曝光装置的前沿工业级喷墨打印机允许终端用户直接打印和固化UV墨水形成所需图形。在PCB工业中,省却传统丝印技术中的图形生成、图形转移、曝光和显影等工艺步骤已经可以实现,而且随之带来的设备、材料及工时的下降意味着更低的生产成本。文章将简介汉印科技公司对这种工业级商用打印机开发和可能应用。     

Formulation and processing of novel conductive solution inks in continuous inkjet printing of 3-D electric circuits

One of the greatest challenges for the inkjet printing electrical circuits is formulation and processing of conductive inks. In the present investigation, two different formulations of particle-free conductive solutions are introduced that are low in cost, easy to deposit, and possess good electrical properties. A novel aqueous solution consisting of silver nitrate and additives is initially described. This solution demonstrates excellent adherence to glass and polymers and has an electrical resistivity only 2.9 times that of bulk silver after curing. A metallo-organic decomposition (MOD) ink is subsequently introduced. This ink produces a close-packed silver crystal microstructure after low-temperature thermolysis and subsequent high-temperature annealing. The electrical conductance of the final consolidated trace produced with the MOD ink is very close to bulk silver. In addition, the traces produced with the MOD material exhibit excellent wear and fracture resistance. When utilized in a specialized continuous inkjet (CIJ) printing technology system, both particle-free solution inks are able to produce conductive traces in three dimensions. The importance of three-dimensional (3-D) printing of conductive traces is finally discussed in relation to the broad range of applications in the freeform fabrication industry.     

Low‐Temperature‐Processed Printed Metal Oxide Transistors Based on Pure Aqueous Inks

Additive patterning of transparent conducting metal oxides at low temperatures is a critical step in realizing low‐cost transparent electronics for display technology and photovoltaics. In this work, inkjet‐printed metal oxide transistors based on pure aqueous chemistries are presented. These inks readily convert to functional thin films at lower processing temperatures (T ≤ 250 °C) relative to organic solvent‐based oxide inks, facilitating the fabrication of high‐performance transistors with both inkjet‐printed transparent electrodes of aluminum‐doped cadmium oxide (ACO) and semiconductor (InO_x ). The intrinsic fluid properties of these water‐based solutions enable the printing of fine features with coffee‐ring free line profiles and smoother line edges than those formed from organic solvent‐based inks. The influence of low‐temperature annealing on the optical, electrical, and crystallographic properties of the ACO electrodes is investigated, as well as the role of aluminum doping in improving these properties. Finally, the all‐aqueous‐printed thin film transistors (TFTs) with inkjet‐patterned semiconductor (InO_x ) and source/drain (ACO) layers are characterized, which show ideal low contact resistance (R _c < 160 Ω cm) and competitive transistor performance (µ _lin up to 19 cm² V^?1 s^?1, Subthreshold Slope (SS) ≤150 mV dec^?1) with only low‐temperature processing (T ≤ 250 °C).     

Ring-Edged Bank Array Made by Inkjet Printing for Color Filters

A mask-free inkjet printing (IJP) process has been developed to fabricate color filters. The coffee ring effect was used to create a ring-edged bank array with fine structures by IJP of poly(methylmethacrylate). After the color filtering inks were deposited in the banks, a color filter panel was made without any transitional photolithography process. The resulting color coordinates of the three primary colors on the chromaticity diagram are (0.70, 0.30), (0.33, 0.60) and (0.14, 0.09), respectively, covering 67.8% of the National Television System Committee standard. This process can be used with flexible substrates to produce low-cost inkjet printed color filters.     

A benchmark study of commercially available copper nanoparticle inks for application in organic electronic devices

A set of three commercial copper nanoparticle based inkjet inks has been benchmarked with respect to their potential to form conducting printed structures for future applications in organic electronic devices. Significant differences were observed in terms of jetting properties, spreading behaviour and line formation on a number of relevant substrates. The inks' stabilities against oxidation were investigated, inkjet printed patterns were subjected to photonic flash sintering and their electrical properties characterized. As a result, optimized conditions for printing and post-deposition processing were determined. Photonic flash sintering, which is a roll-to-roll compatible manufacturing process, allowed a significant reduction in sintering time. Flash sintering was performed in the presence of air, thereby excluding the necessity for processing under inert atmosphere. One product was identified which showed satisfactory performances regarding all tested features: stable jet formation, well-defined definition of the printed structures and high electrical conductivity (20% of the value of bulk Cu). The obtained results can be considered as a promising step towards the future application of Cu inks in organic electronic devices.     

Fabrication,Characterization, and Printing of Conductive Ink Based on Multi Core–Shell Nanoparticles Synthesized by RAPET

In the current research, conductive patterns are deposited on different substrates by direct inkjet printing of conductive inks based on metal@carbon and bimetal@carbon core–shell nanoparticles synthesized by the RAPET (reaction under autogenic pressure at elevated temperatures) technique. Various co‐solvents and additives are examined for production of stable conductive ink. The morphology of the deposited layers is characterized by optical and scanning electron microscopy measurements. The stability of the prepared inks is examined by dynamic light scattering measurements. The electrical resistivity is measured by a four‐point probe system and calculated using the geometric dimensions. The results obtained are very promising and indicate that the conductivity of the deposited layers is close to that of bulk metals and higher than most results published so far. Moreover, the importance and advantages of the protective carbon layer that prevents metal oxidation is demonstrated.     

Tuning the viscosity of halogen free bulk heterojunction inks for inkjet printed organic solar cells

For the solution processing of organic photovoltaics on an industrial scale, the exclusion of halogenated solvents is a necessity. However, the limited solubility of most semiconducting polymer/fullerene blends in non-halogenated solvents results in ink formulations with low viscosities which poses limitations to the use of roll-to-roll compatible deposition processes, such as inkjet printing. We propose to add polystyrene as a rheological modifier to increase the viscosity of bulk heterojunction (BHJ) non-halogenated inks. The printing and performance of P3HT/PCBM photoactive layer inks are characterized as a function of polystyrene concentration and three different molecular weights. Addition of 1 wt% polystyrene provided a near two-fold gain in viscosity, with the largest viscosity gains coming from the polymer with the highest molecular weight. However, this coincided with greater viscoelastic behavior, which reduced the jetting performance of the inks. Differences in solvent compatibility of the polystyrene/P3HT/PCBM ternary blend resulted in phase separation upon layer drying, whereby polystyrene segregated to the layer-air interface to form an isolated domain or network like topology. Nevertheless, a 1.7-fold increase in dynamic viscosity was obtained for devices with printed BHJ layers containing polystyrene at the expense of a 20% reduction in OPV performance. The improved viscosity and good printing behavior achieved with small additions of polystyrene demonstrates its potential to overcome the limited viscosity resulting from typical non-halogenated ink formulations for semiconducting polymers. These results offer a step forward to the industrialization of inkjet printing as an effective deposition technique for functional layers of organic electronics.     

Ion‐Conductive,Viscosity‐Tunable Hexagonal Boron Nitride Nanosheet Inks

Liquid‐phase exfoliation of layered solids holds promise for the scalable production of 2D nanosheets. When combined with suitable solvents and stabilizing polymers, the rheology of the resulting nanosheet dispersions can be tuned for a variety of additive manufacturing methods. While significant progress is made in the development of electrically conductive nanosheet inks, minimal effort is applied to ion‐conductive nanosheet inks despite their central role in energy storage applications. Here, the formulation of viscosity‐tunable hexagonal boron nitride (hBN) inks compatible with a wide range of printing methods that span the spectrum from low‐viscosity inkjet printing to high‐viscosity blade coating is demonstrated. The inks are prepared by liquid‐phase exfoliation with ethyl cellulose as the polymer dispersant and stabilizer. Thermal annealing of the printed structures volatilizes the polymer, resulting in a porous microstructure and the formation of a nanoscale carbonaceous coating on the hBN nanosheets, which promotes high wettability to battery electrolytes. The final result is a printed hBN nanosheet film that possesses high ionic conductivity, chemical and thermal stability, and electrically insulating character, which are ideal characteristics for printable battery components such as separators. Indeed, lithium‐ion battery cells based on printed hBN separators reveal enhanced electrochemical performance that exceeds commercial polymer separators.