Enhancement of thermal performance in double-layered microchannel heat sink with nanofluids

A three-dimensional analysis aimed at enhancing the thermal performance of a double-layered microchannel heat sink by using a nanofluid and varying the geometric parameters has been conducted. A system of fully elliptic equations that govern the flow and thermal fields are solved using the finite volume method. The analysis indicates that the dominant factors determining the thermal resistance of the channel include the type of nanofluid; particle volume fraction; geometric parameters of the channel, such as the channel number, channel width ratio, channel aspect ratio; and pumping power. The results indicate that the greatest enhancement in channel cooling can be expected when an Al₂O₃–water nanofluid is used. The thermal resistance of the channel can be minimized by properly adjusting the particle volume fraction under various pumping powers; the minimum thermal resistance depends on the geometric parameters. The study also reveals that the relationship between the thermal resistance and channel number, channel width ratio, or channel aspect ratio exhibits a decrease followed by an increase. The thermal performance of the channel can usually be improved by decreasing the channel number or channel aspect ratio, or increasing the channel width ratio. Finally, increasing the pumping power reduces the overall thermal resistance. An Al₂O₃ (1%)–water nanofluid shows an average improvement in thermal performance of 26% over that of pure water for a given pumping power. However, the design’s effectiveness declines significantly under high pumping power. In particular, the thermal resistance obtained by employing nanofluids was not necessarily lower than that of water under all pumping powers, but it can be reduced by properly adjusting the geometric parameters under optimal conditions.     

Optimum thermal design of microchannel heat sinks by the simulated annealing method

By adopting the simulated annealing method, a three-dimensional numerical simulation is executed to minimize the thermal resistance of the microchannel heat sink corresponding to the optimum specification under the fixed flow power. The depths of the microchannel heat sink in this study are fixed at either 1 cm or 2 cm. Based on the theory of the fully developed flow, the pressure drop between the inlet and exit in each single channel can be analytically derived if the flow power and the associated specification of the microchannel heat sink are fixed in advance. Then, this pressure drop will be used as the input condition to calculate the temperature distribution of the microchannel heat sink. For the first part of the optimum analysis, the fin width, and channel width are chosen as the design variables to find their optimum sizes. As to the second part of the present analysis, three design variables including channel height, fin width and channel width are individually prescribed as a suitable range to search for their optimum geometric configuration when the other specifications of the microchannel heat sink are fixed as 24 different cases.     

Optimum thermal performance of microchannel heat sink by adjusting channel width and height

A three-dimensional numerical model of the microchannel heat sink is presented to study the effects of heat transfer characteristics due to various channel heights and widths. Based on the theory of a fully developed flow, the pressure drop in the microchannel is derived under the requirement of the flow power for a single channel. The effects of two design variables representing the channel width and height on the thermal resistance are investigated. In addition, the constraint of the same flow cross section is carried out to find the optimum dimension. Finally, the minimum thermal resistance and optimal channel width with various flow powers and channel heights are obtained by using the simulated annealing method.     

Numerical Analysis of Flow and Thermal Performance of Liquid-Cooling Microchannel Heat Sinks with Bifurcation

Single-phase liquid-cooling microchannels have received great attention to remove the gradually increased heat loads of heat sinks. Proper changes of the flow path and/or heat transfer surface can result in much better thermal performance of microchannel heat sinks. In this study, a kind of rectangular straight microchannel heat sink with bifurcation flow arrangement has been designed, and the corresponding laminar flow and heat transfer have been investigated numerically. Four different configurations are considered. The effects of the bifurcation ratio (the initial channel number over the bifurcating channel number) and length ratio (the channel length before bifurcation over the bifurcation channel length) on laminar heat transfer, pressure drop, and thermal resistance are considered and compared with those of the traditional straight microchannel heat sink without bifurcation flow. The overall thermal resistances subjected to inlet Reynolds number and pumping power are compared for the five microchannel heat sinks. Results show that the thermal performance of the microchannel heat sink with bifurcation flow is better than that of the corresponding straight microchannel heat sink. The heat sinks with larger bifurcation ratio and length ratio provide much better thermal performance. It is suggested to employ bifurcation flow path in the liquid-cooling microchannel heat sinks to improve the overall thermal performance by proper design of the bifurcation position and number of channels.     

Modeling of double-layer triangular microchannel heat sink based on thermal resistance network and multivariate structural optimization using firefly algorithm

Abstract

The micro-channel heat dissipation system has minor specifications and good thermal conductivity per unit, which is the best choice for heat dissipation of micro-chips. By optimizing the cross section of microchannel, the heat exchange efficiency and temperature uniformity can be effectively improved. In this article, a double-layer triangular microchannel heat sink is proposed, which uniquely combines triangular cross section and double-layer structure to obtain a better heat dissipation performance. A new thermal resistance network model is established. At the same time, the model of pressure drop in microchannel heat sink is obtained by use of fluid theory. Taking thermal resistance and pressure drop as optimization objectives, the thermal resistance of double-layer triangular microchannel heat sink is 0.284?K/W and the pressure drop is 1386.89?Pa by using the firefly algorithm based on the Pareto optimal solution set, obtaining the optimal structural parameters. The thermal-flow-solid coupling simulation analysis shows that the thermal resistance and theoretical analysis error is 5.19%, and the pressure drop and theoretical analysis error is 9.49%, which can verify the accuracy of the thermal resistance network model. This article has a guiding significance for the thermal resistance analysis and heat dissipation improvement of non-rectangular cross section microchannel heat sinks.     

Heat transfer of a parallel flow two-layered microchannel heat sink

A numerical study is conducted to predict the thermal performance of a parallel flow two-layered microchannel heat sink on heat transfer and compared to the case of counterflow for various channel aspect ratios. Findings reveal that the parallel flow configuration leads to a better heat transfer performance except for high Reynolds number and high channel aspect ratio. Further study on the horizontal rib thickness shows that lower thermal resistance can be achieved in a parallel flow two-layered microchannel heat sink with smaller thickness of middle rib.     

Experimental investigations of flow boiling heat transfer and pressure drop in straight and expanding microchannels – A comparative study

Flow boiling experiments were conducted in straight and expanding microchannels with similar dimensions and operating conditions. Deionized water was used as the coolant. The test vehicles were made from copper with a footprint area of 25 mm × 25 mm. Microchannels having nominal width of 300 μm and a nominal aspect ratio of 4 were formed by wire cut Electro Discharge Machining process. The measured surface roughness (Ra) was about 2.0 μm. To facilitate easier comparison with the straight microchannels and also to simplify the method of fabrication, the expanding channels were formed with the removal of fins at selected location from the straight microchannel design, instead of using a diverging channel. Tests were performed on both the microchannels over a range of mass fluxes, heat fluxes and an inlet temperature of 90 °C. It was observed that the two-phase pressure drop across the expanding microchannel heat sink was significantly lower as compared to its straight counterpart. The pressure drop and wall temperature fluctuations were seen reduced in the expanding microchannel heat sink. It was also noted that the expanding microchannel heat sink had a better heat transfer performance than the straight microchannel heat sink, under similar operating conditions. This phenomenon in expanding microchannel heat sink, which was observed in spite of it having a lower convective heat transfer area, is explained based on its improved flow boiling stability that reduces the pressure drop oscillations, temperature oscillations and hence partial dry out.     

Optimization design of microchannel heat sink geometry for high power laser mirror

Microchannel heat sink for high power laser mirror with water cooling was analyzed as a function of microchannel geometry and operation parameters. A comparative analysis of the thermal deformation on the mirror surface without cooling and that with cooling revealed that the maximal thermal deformation on the mirror surface could decrease from about 0.115 μm to around 0.040 μm under the laser power of 200 W/cm² by using microchannel heat sink designed. In order to enhance the performance of microchannel heat sink, the effects of channel width, channel depth, fin width, mirror thickness and cooling region were investigated. The results indicated that the heat transfer performance of the microchannel heat sink could be further improved by narrow and deep channel, narrow fin, thin mirror and large cooling region.     

The heat transfer characteristics of liquid cooling heatsink containing microchannels

This paper numerically and experimentally investigates the heat transfer performance and characteristics of liquid cooling heatsink containing microchannels. The effects of channel geometry and pressure drop between the entrance and exit of heatsink on the heat transfer performance are studied. The geometrical parameters include aspect ratio and cross-sectional porosity of the channels. The height of the microchannels is considered constant. The aspect ratio is set from 1.67 to 14.29 and the porosity is from 25% to 85%. The imposed pressure drop ranges between 490 and 2940 Pa. It is found that the aspect ratio corresponding to the lowest effective thermal resistance is changed with respect to the pressure drop. It is also noticed that the value of effective thermal resistance is almost a constant for cross-sectional porosity in the range of 53%–75%. The effective thermal resistance is increased when cross-sectional porosity is deviated from this range. In addition, the increasing of pressure drop enhances heat transfer performance for channels of high aspect ratio more than those of low aspect ratio.     

Numerical simulation of fluid flow and heat transfer in a microchannel heat sink with offset fan-shaped reentrant cavities in sidewall

The paper is focused on the investigation of fluid flow and heat transfer characteristics in a microchannel heat sink with offset fan-shaped reentrant cavities in sidewall. In contrast to the new microchannel heat sink, the corresponding conventional rectangular microchannel heat sink is chosen. The computational fluid dynamics is used to simulate the flow and heat transfer in the heat sinks. The steady, laminar flow and heat transfer equations are solved in a finite-volume method. The SIMPLEX method is used for the computations. The effects of flow rate and heat flux on pressure drop and heat transfer are presented. The results indicate that the microchannel heat sink with offset fan-shaped reentrant cavities in sidewall improved heat transfer performance with an acceptable pressure drop. The fluid flow and heat transfer mechanism of the new microchannel heat sink can attribute to the interaction of the increased heat transfer surface area, the redeveloping of the hydraulic and thermal boundary layers, the jet and throttling effects and the slipping over the reentrant cavities. The increased heat transfer surface area and the periodic thermal developing flow are responsible for the significant heat transfer enhancement. The jet and throttling effects enhance heat transfer, simultaneously increasing pressure drop. The slipping over the reentrant cavities reduces pressure drop, but drastically decreases heat transfer.     

Numerical study of the inlet/outlet arrangement effect on microchannel heat sink performance

In this study, fluid flow and heat transfer in microchannel heat sinks are numerically investigated. The three-dimensional governing equations for both fluid flow and heat transfer are solved using the finite-volume scheme. The computational domain is taken as the entire heat sink including the inlet/outlet ports, inlet/outlet plenums, and microchannels. The particular focus of this study is the inlet/outlet arrangement effects on the fluid flow and heat transfer inside the heat sinks.The microchannel heat sinks with various inlet/outlet arrangements are investigated in this study. All of the geometric dimensions of these heat sinks are the same except the inlet/outlet locations. Because of the difference in inlet/outlet arrangements, the resultant flow fields and temperature distributions inside these heat sinks are also different under a given pressure drop across the heat sink. Using the averaged velocities and fluid temperatures in each channel to quantify the fluid flow and temperature maldistributions, it is found that better uniformities in velocity and temperature can be found in the heat sinks having coolant supply and collection vertically via inlet/outlet ports opened on the heat sink cover plate. Using the thermal resistance, overall heat transfer coefficient and pressure drop coefficient to quantify the heat sink performance, it is also found these heat sinks have better performance among the heat sinks studied. Based on the results from this study, it is suggested that better heat sink performance can be achieved when the coolant is supplied and collected vertically.     

Conjugate heat transfer in fractal-shaped microchannel network heat sink for integrated microelectronic cooling application

The hydrodynamic and thermal characteristics of fractal-shaped microchannel network heat sinks are investigated numerically by solving three-dimensional N–S equations and energy equation, taking into consideration the conjugate heat transfer in microchannel walls. It is found that due to the structural limitation of right-angled fractal-shaped microchannel network, hotspots may appear on the bottom wall of the heat sink where the microchannels are sparsely distributed. With slight modifications in the fractal-shaped structure of microchannels network, great improvements on hydrodynamic and thermal performance of heat sink can be achieved. A comparison of the performance of modified fractal-shaped microchannel network heat sink with parallel microchannels heat sink is also conducted numerically based on the same heat sink dimensions. It is found that the modified fractal-shaped microchannel network is much better in terms of thermal resistance and temperature uniformity under the conditions of the same pressure drop or pumping power. Therefore, the modified fractal-shaped microchannel network heat sink appears promising to be used for microelectronic cooling in the future.     

Forced convective heat transfer across a pin fin micro heat sink

This paper investigates heat transfer and pressure drop phenomena over a bank of micro pin fins. A simplified expression for the total thermal resistance has been derived, discussed and experimentally validated. Geometrical and thermo-hydraulic parameters affecting the total thermal resistance have been discussed. It has been found that very low thermal resistances are achievable using a pin fin heat sink. The thermal resistance values are comparable with the data obtained in microchannel convective flows. In many cases, the increase in the flow temperature results in a convection thermal resistance, which is considerably smaller than the total thermal resistance.     

3-Dimensional numerical optimization of silicon-based high performance parallel microchannel heat sink with liquid flow

A full 3-dimensional (3D) conjugate heat transfer model has been developed to simulate the heat transfer performance of silicon-based, parallel microchannel heat sinks. A semi-normalized 3-dimensional heat transfer model has been developed, validated and used to optimize the geometric structure of these types of microheat sinks. Under a constant pumping power of 0.05 W for a water-cooled microheat sink, the optimized geometric parameters of the structure as determined by the model were a pitch of 100 μm, a channel width of 60 μm and a channel depth of about 700 μm. The thermal resistance of this optimized microheat sink was calculated for different pumping powers based on the full 3D conjugate heat transfer model and compared with the initial experimental results obtained by Tuckerman and Pease in 1981. This comparison indicated that for a given pumping poser, the overall cooling capacity could be enhanced by more than 20% using the optimized spacing and channel dimensions. The overall thermal resistance was 0.068 °C/W for a pumping power of 2 W.     

Effect of tip clearance on the cooling performance of a microchannel heat sink

In this paper, the effect of tip clearance on the cooling performance of the microchannel heat sink is presented under the fixed pumping power condition. The thermal resistance of a microchannel heat sink is defined for evaluating its cooling performance. The effect of tip clearance is numerically investigated by increasing tip clearance from zero under the fixed pumping power condition. From the numerical results, the optimized tip clearance is determined, for which the thermal resistance has a minimum value. Finally, we show that the presence of tip clearance can improve the cooling performance of a microchannel heat sink when tip clearance is smaller than a channel width.     

Optimal design of geometric parameters of double-layered microchannel heat sinks

This work uses an optimization procedure consisting of a simplified conjugate-gradient method and a three-dimensional fluid flow and heat transfer model to investigate the optimal geometric parameters of a double-layered microchannel heat sink (DL-MCHS). The overall thermal resistance R_T is the objective function to be minimized, and the number of channels N, channel width ratio β, lower channel aspect ratio α_l, and upper channel aspect ratio α_u are the search variables. For a given bottom area (10 × 10 mm) and heat flux (100 W/cm²), the optimal (minimum) thermal resistance of the double-layered microchannel heat sink is about R_T = 0.12 °C/m²W. The corresponding optimal geometric parameters are N = 73, β = 0.50, α_l = 3.52, and, α_u = 7.21 under a total pumping power of 0.1 W. These parameters reduce the overall thermal resistance by 52.8% compared to that yielded by an initial guess (N = 112, β = 0.37, α_l = 10.32, and α_u = 10.93). Furthermore, the optimal thermal resistance decreases rapidly with the pumping power and then tends to approach an constant value. As the pumping power increases, the optimal values of N, α_l, and α_u increase, whereas the optimal β value decreases. However, increasing the pumping power further is not always cost-effective for practical heat sink designs.     

Optimal thermal design of microchannel heat sinks with different geometric configurations

In this study, three-dimensional models of microchannel heat sinks (MCHSs) with different geometric configurations (such as single-layered- (SL), double-layered- (DL) or tapered-(T)-channels) are constructed by an optimization procedure. This procedure integrates a direct problem solver with a simplified conjugate-gradient method as the optimizer. The overall thermal resistance of an MCHS is the objective function to be minimized with respect to geometric parameters, such as the number of channels, channel width ratio, channel aspect ratio and tapered ratios, as the search variables. The optimal thermal resistance is found to decrease in the following order: the initial guess parallel channel (IGP channel), SL-, DL- and T-channel designs. In addition, the T-channel design has the minimum temperature difference and the most uniform temperature distribution, followed by the DL-, SL- and IGP-channel designs. Moreover, the optimal thermal resistance reduces with the pumping power for the various channel configuration designs, and the lowest thermal resistance corresponds to the T-channel design. The larger the pumping power, the larger the decrement in thermal resistance. Therefore, the optimal T-channel is the best MCHS design when considering thermal resistance and temperature distribution uniformity.     

Optimization of thermal performances and pressure drop of rectangular microchannel heat sink using aqueous carbon nanotubes based nanofluid

The present work focuses on analytical optimization of a rectangular microchannel heat sink using aqueous carbon nanotubes based nanofluid as coolant. The particles weight concentration used in this study is 0.01%. The density, the thermal conductivity and the rheological behavior of the nanofluid are experimentally investigated in order to evaluate the thermal resistance and the pumping power in microchannel under laminar flow. An analytical approach of optimization scheme was applied; it is compiled from a systematic thermal resistance model as an analysis method and the elitist non-dominated sorting genetic algorithm (NSGA2). The effects of the temperature, the channel aspect ratio, the channel wall ratio and the use of aqueous carbon nanotubes based nanofluid on the thermal resistance and the pumping power are investigated. The optimized results showed that use of the nanofluid as a working fluid reduce the total thermal resistance and can enhance significantly the thermal performances of the working fluid at high temperatures.     

基于Workbench的固体电蓄热装置换热通道参数优化

为了解决固体电蓄热装置储释热过程的温度分布均匀性问题,需要对蓄热体换热通道结构参数开展优化设计。根据对称性建立了表征空气与蓄热材料传热过程的传热单元,以传热单元平均温度最大和压力损失最小为优化目标,基于ANSYS Workbench的响应面优化模块对蓄热砖的几何参数(高度、宽度、厚度)和换热通道宽度开展优化设计。结果表明：恒定入口流速下,换热通道高度和宽度的增加,对传热单元平均温度的提高影响较小,但是换热通道宽度对压力损失的改变有显著影响;蓄热砖宽度或高度对于蓄热过程平均温度的改变影响明显,水平方向蓄热砖宽度由15 mm增加到40 mm平均温度降低约7.5 K,竖直方向蓄热砖高度由15 mm增加到30 mm整体蓄热温度线性降低(降温幅度7.5 K),竖直方向蓄热砖高度为20 mm、入口温度1 023 K时升温速度达到297.5 K/h;通过传热单元结构参数敏感性分析可知,设计换热通道选择的蓄热砖宽度和高度均不宜过大。     

Constructal cooling channels for micro-channel heat sinks

This paper documents the geometric optimisation of a three-dimensional micro-channel heat sink. The objective is to minimise the peak temperature from the walls to the coolant fluid. The optimisation is performed numerically by using the finite volume method. The numerical simulation was carried out on a unit cell with volume ranging from 0.1 mm³ to 0.9 mm³ and pressure drop between 10 kPa and 75 kPa. The axial length of the micro-channel heat sink was fixed at 10 mm. The cross-sectional area of the micro-channel heat sink is free to morph with respect to the degree of freedoms provided by the aspect ratio and the solid volume fraction. The effect of the total solid volume fraction and the pressure drop on the aspect ratio, channel hydraulic diameter and peak temperature is investigated. The numerical results show that the degrees of freedom have a strong effect on the peak temperature and the maximum thermal conductance. The optimal geometric characteristics obtained numerically (the aspect ratio and the optimal channel shape (hydraulic diameter)) are reported and compared with those obtained from approximate relationships using scale analysis. The predicted trends are found to be in good agreement with the numerical results.