异质栅非对称Halo SOI MOSFET

为了抑制异质栅SOI MOSFET的漏致势垒降低效应，在沟道源端一侧引入了高掺杂Halo结构．通过求解二维电势Poisson方程，为新结构器件建立了全耗尽条件下表面势和阈值电压解析模型，并对其性能改进情况进行了研究．结果表明，新结构器件比传统的异质栅SOI MOSFETs能更有效地抑制漏致势垒降低效应，并进一步提高载流子输运效率．新结构器件的漏致势垒降低效应随着Halo区掺杂浓度的增加而减弱，但随Halo区长度非单调变化．解析模型与数值模拟软件MEDICI所得结果高度吻合．     

全耗尽异质栅单Halo SOI MOSFET二维模型

为了抑制深亚微米SOI MOSFET的短沟道效应,并提高电流驱动能力,提出了异质栅单Halo SOI MOSFET器件结构,其栅极由具有不同功函数的两种材料拼接而成,并在沟道源端一侧引入Halo技术.采用分区的抛物线电势近似法和通用边界条件求解二维Poisson方程,为新结构器件建立了全耗尽条件下的表面势及阈值电压二维解析模型.对新结构器件与常规SOI MOSFET性能进行了对比研究.结果表明,新结构器件能有效抑制阈值电压漂移、热载流子效应和漏致势垒降低效应,并显著提高载流子通过沟道的输运速度.解析模型与器件数值模拟软件MEDICI所得结果高度吻合.     

一种非对称双栅应变硅HALO掺杂沟道MOSFET阈值电压解析模型

提出了一种非对称双栅应变硅HALO掺杂沟道金属氧化物半导体场效应管结构.该器件前栅和背栅由两种不同功函数的金属构成,沟道为应变硅HALO掺杂沟道,靠近源区为低掺杂区域,靠近漏区为高掺杂区域.采用分区的抛物线电势近似法和通用边界条件求解二维泊松方程,分别求解了前背栅表面势、前背栅表面电场及前背栅阈值电压,建立了双栅器件的表面势、表面电场和阈值电压解析模型.详细讨论了物理参数对解析模型的影响.研究结果表明,该器件能够很好的抑制短沟道效应、热载流子效应和漏致势垒降低效应.模型解析结果与DESSIS仿真结果吻合较好,证明了该模型的正确性.     

异质栅非对称Halo SOI MOSFET亚阈值电流模型

在沟道源端一侧引入高掺杂Halo结构的异质栅SOI MOSFET,可以有效降低亚阈值电流.通过求解二维泊松方程,为该器件建立了亚阈值条件下的表面势模型.利用常规漂移.扩散理论,在表面势模型的基础上,推导出新结构器件的亚阈值电流模型.为了求解简单,文中给出了一种分段近似方法,从而得到表面势的解析表达式.结果表明,所得到的表面势解析表达式和确切解的结果高度吻合.二维器件数值模拟器ISE验证了通过表面势解析表达式得到的亚阈值电流模型,在亚阈值区二者所得结果吻合得很好.     

异质栅非对称Halo SOI MOSFET亚阈值电流模型

在沟道源端一侧引入高掺杂Halo结构的异质栅SOI MOSFET,可以有效降低亚阈值电流.通过求解二维泊松方程,为该器件建立了亚阈值条件下的表面势模型.利用常规漂移.扩散理论,在表面势模型的基础上,推导出新结构器件的亚阈值电流模型.为了求解简单,文中给出了一种分段近似方法,从而得到表面势的解析表达式.结果表明,所得到的表面势解析表达式和确切解的结果高度吻合.二维器件数值模拟器ISE验证了通过表面势解析表达式得到的亚阈值电流模型,在亚阈值区二者所得结果吻合得很好.     

SOI CMOS器件研究

利用0.35μm工艺条件实现了性能优良的小尺寸全耗尽的器件硅绝缘体技术(SOI)互补金属氧化物半导体(FD SOI CMOS)器件,器件制作采用双多晶硅栅工艺、低掺杂浓度源/漏(LDD)结构以及突起的源漏区。这种结构的器件防止漏的击穿,减小短沟道效应(SCE)和漏感应势垒降低效应(DIBL);突起的源漏区增加了源漏区的厚度并减小源漏区的串联电阻,增强了器件的电流驱动能力。设计了101级环形振荡器电路,并对该电路进行测试与分析。根据在3V工作电压下环形振荡器电路的振荡波形图,计算出其单级门延迟时间为45ps,远小于体硅CMOS的单级门延迟时间。     

SOI CMOS器件研究

利用0．35μm工艺条件实现了性能优良的小尺寸全耗尽的器件硅绝缘体技术（SOI）互补金属氧化物半导体（FD SOI CMOS）器件,器件制作采用双多晶硅栅工艺、低掺杂浓度源／漏（LDD）结构以及突起的源漏区。这种结构的器件防止漏的击穿,减小短沟道效应（SCE）和漏感应势垒降低效应（DIBL）;突起的源漏区增加了源漏区的厚度并减小源漏区的串联电阻,增强了器件的电流驱动能力。设计了101级环形振荡器电路,并对该电路进行测试与分析。根据在3V工作电压下环形振荡器电路的振荡波形图,计算出其单级门延迟时间为45ps,远小于体硅CMOS的单级门延迟时间。     

Halo LDD结构多晶硅薄膜晶体管的模拟研究

提出了多晶硅薄膜晶体管的一种Halo LDD新结构,这种结构是在基于LDD结构的基础上,在沟道靠近源、漏端引入高掺杂的Halo区.并利用工艺和器件模拟软件对该Halo LDD P-Si TFT的电学特性进行了分析,并将其与常规结构、LDD结构和Halo结构进行了比较.发现Halo LDD结构的P-si TFT能有效地降低泄漏电流、抑制阈值电压漂移和Kink效应;减少因尺寸减小后所带来的一系列问题.     

Halo结构器件研究综述

随着集成电路产业的迅速发展,CMOS工艺已进入≥22nm特征尺寸的研究。讨论了Halo结构在当前工艺尺寸等比例缩小挑战背景下的应用情况。与传统长沟器件结构进行了比较,指出由于短沟效应(SCE)和漏致势垒降低(DIBL)效应需要专门工艺来克服,Halo注入通过在沟道两侧形成高掺杂浓度区,达到对SCE和DIBL进行有效抑制的目的,现已成为备受关注的结构。针对有关Halo的研究内容进行综述,并对其在CMOS工艺等比例缩小进程中所起的作用进行评述,对Halo的发展趋势进行了展望。     

双栅掺杂隔离肖特基MOSFET的解析模型

通过考虑肖特基势垒降低效应求解三段连续的二维泊松方程,建立了双栅掺杂隔离肖特基MOSFET亚阈值区全沟道连续的电势模型。在该电势模型的基础上,推导了阈值电压模型和漏致势垒降低效应的表达式;研究了掺杂隔离区域不同掺杂浓度下的沟道电势分布,分析了沟道长度和厚度对短沟道效应的影响。结果表明,掺杂隔离区域能改善肖特基MOSFET的电学特性;对于短沟道双栅掺杂隔离肖特基MOSFET,适当减小沟道宽度能有效抑制短沟道效应。     

Investigation of the Electrical and Thermal Performance of SOI MOSFETs with Modified Channel Engineering

In this paper, we present a novel type of channel doping engineering, using a graded doping distribution, that improves the electrical and thermal performance of silicon-on-insulator (SOI) metal–oxide–semiconductor field effect transistors (MOSFETs), according to simulations that we have performed. The results obtained include a reduction in the self-heating effect, a reduction in leakage currents due to the suppression of short-channel effects (SCEs), and a reduction in hot-carrier degradation. We term the proposed structure a modified-channel-doping SOI (MCD-SOI) MOSFET. The main reason for the reduction in the self-heating effect is the use of a lower doping density near the drain region in comparison with conventional SOI MOSFETs with a uniform doping distribution. The most significant reason for the leakage current reduction in the MCD-SOI structure is the high potential barrier near the source region in the weak inversion state. The SCE factors, including the drain-induced barrier lowering, subthreshold swing, and threshold voltage roll-off, are improved. A highly reliable structure is achieved owing to the lower doping density near the drain region, which reduces the peak electric field and the electron temperature.     

基于二维电势分布的一种新型复合多晶硅栅LDMOS阈值电压模型

本文提出了一种新型的复合多晶硅栅LDMOS结构.该结构引入栅工程的概念,将LDMOST的栅分为n型多晶硅栅和p型多晶硅栅两部分,从而提高器件电流驱动能力,抑制SCEs(short channel effects )和DIBL(drain-induced barrier lowering).通过求解二维泊松方程建立了复合多晶硅栅LDMOST的二维阈值电压解析模型.模型考虑了LDMOS沟道杂质浓度分布和复合栅功函数差的共同影响,具有较高的精度.与MEDICI数值模拟结果比较后,模型得以验证.     

Full quantum simulation study of a nano tri-material double gate silicon-on-insulator MOSFET

We present 2D full quantum simulation based on the self-consistent solution of 2D Poisson–Schrödinger equations, within the nonequilibrium Green’s function formalism, for a novel multiple region silicon-on-insulator (SOI) MOSFET device architecture – tri-material double gate (TMDG) SOI MOSFET. This new structure has three materials with different work functions in the front gate, which show reduced short-channel effects such as the drain-induced barrier lowering and subthreshold swing, because of a step function of the potential in the channel region that ensures the screening of the drain potential variation by the gate near the drain. Also, the quantum simulations show the new structure significantly decreases leakage current and drain conductance and increases on–off current ratio and voltage gain as compared to conventional and dual material DG SOI MOSFET.     

Analysis of temperature-induced saturation threshold voltage degradation in deep-submicrometer ultrathin SOI MOSFETs

This paper presents a systematic study of the temperature lowering influence on the saturation threshold voltage degradation in ultrathin deep-submicrometer fully depleted silicon-on-insulator (SOI) MOSFETs. It is observed that the difference between the threshold voltage obtained with low and high drain bias, increases at lower temperatures for nMOSFETs, whereas it is weakly temperature-dependent for pMOSFETs. Experimental results and two-dimensional numerical simulations are used to support the analysis. The influence of applied back gate bias on threshold voltage variation is also studied. It is demonstrated that the higher doping level into the body region provided by the halo ion implantation associated to the floating-body increases both the multiplication factor and the parasitic bipolar gain as the temperature is lowered contributing to the threshold voltage degradation. The absence of halo implantation efficiently improves this degradation. The use of double gate structure, even with high body doping level, suppress the saturation threshold voltage degradation in cryogenic operation.     

全耗尽SOI MOSFETs阈值电压解析模型

提出了一种新的全耗尽SOI MOSFETs阈值电压二维解析模型.通过求解二维泊松方程得到器件有源层的二维电势分布函数,氧化层-硅界面处的电势最小值用于监测SOI MOSFETs的阈值电压.通过对不同栅长、栅氧厚度、硅膜厚度和沟道掺杂浓度的SOI MOSFETs的MEDICI模拟结果的比较,验证了该模型,并取得了很好的一致性.     

Drain-induced barrier lowering in buried-channel MOSFET's

In the literature, it is unclear whether or not buried-channel (BC) MOSFETs are less resistant to drain-induced barrier lowering than surface-channel MOSFETs. The authors clarify this confusion and experimentally demonstrate the relationship between the threshold voltage and channel length reduction for normally-on (inverting) BC-MOSFETs. The results are compared with similar measurements on surface-channel MOSFETs. It is shown that BC-MOSFETs are more prone to drain-induced barrier lowering than surface-channel MOSFETs. A simple analytic model is derived for the subthreshold current in small-geometry BC-MOSFETs. The model shows good agreement with experimental measurements and with subthreshold currents obtained using a two-dimensional numerical simulator     

异质栅全耗尽型应变硅 SOI MOSFET二维解析模型*

本文首次并建立了异质栅全耗尽型应变Si SOI (DMG SSOI) MOSFET的二维表面势沿沟道变化的模型．并对该结构的MOSFET的短沟道效应SCE (short channel effect),热载流子效应HCE(hot carrier effect),漏致势垒降低DIBL (drain induced barrier lowering)和载流子传输效率进行了研究．该模型中考虑以下参数：金属栅长,金属栅的功函数,漏电压和Ge在驰豫SiGe中的摩尔组分．结果表明沟道区的表面势引进了阶梯分布,正是这个阶梯分布的表面势抑制了SCE,HCE和DIBL．同时,应变硅和SOI(silicon-on-insulator)结构都能提高载流子的传输效率,特别是应变硅能提高载流子的传输效率．此外阈值电压模型能者正确表明阈值电压随栅长比率L2/L1减小或应变Si膜中Ge摩尔组分的降低而升高．数值模拟器ISE验证了该模型的正确性．